JPH08159635A - Cooling device for electronic component parts - Google Patents
Cooling device for electronic component partsInfo
- Publication number
- JPH08159635A JPH08159635A JP30194594A JP30194594A JPH08159635A JP H08159635 A JPH08159635 A JP H08159635A JP 30194594 A JP30194594 A JP 30194594A JP 30194594 A JP30194594 A JP 30194594A JP H08159635 A JPH08159635 A JP H08159635A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- electronic component
- refrigerant
- cooling
- temperature sensor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品を直接、または
間接的に冷却する電子部品の冷却装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cooling device for electronic components, which cools electronic components directly or indirectly.
【０００２】[0002]
【従来の技術】電子部品等発熱する電子機器の冷却装置
の一例が実開平２−５５０７２号公報に掲載されてい
る。2. Description of the Related Art An example of a cooling device for an electronic device such as an electronic component that generates heat is disclosed in Japanese Utility Model Laid-Open No. 2-55072.
【０００３】この公報記載の装置について図３を参照し
て詳細に説明する。The apparatus described in this publication will be described in detail with reference to FIG.
【０００４】図３を参照すると、この冷却装置は内部に
複数の通路１１を平行して形成した放熱板１２０と、こ
の通路１１の入口に取付けられた冷却媒体導入室３０、
この導入室３０に冷却媒体１１０である水を送り込むた
めのポンプ７０、このポンプ７０で送り出される冷却媒
体１１０を溜める貯槽８０、通路１１の出口に取付けら
れたバイメタルからなる流量調整板２０、この流量調整
板２０を介して排出される冷却媒体１１０を排出する冷
却媒体排出室５０、およびこの排出室５０から排出され
る冷却媒体を冷却し貯槽８０に再び戻す熱交換器９０を
備えている。Referring to FIG. 3, the cooling device includes a heat radiating plate 120 in which a plurality of passages 11 are formed in parallel, a cooling medium introduction chamber 30 attached to an entrance of the passages 11, and
A pump 70 for sending water as the cooling medium 110 into the introduction chamber 30, a storage tank 80 for storing the cooling medium 110 sent by the pump 70, a flow rate adjusting plate 20 made of bimetal attached to the outlet of the passage 11, and this flow rate. The cooling medium discharge chamber 50 for discharging the cooling medium 110 discharged via the adjusting plate 20 and the heat exchanger 90 for cooling the cooling medium discharged from the discharge chamber 50 and returning it to the storage tank 80 again are provided.
【０００５】[0005]
【発明が解決しようとする課題】上述の冷却装置では、
通路１１を介してあたためられた冷却媒体１１０の温度
をバイメタルやベローズ１３０で感知して流量調整をし
ている。このため、冷却すべき電子機器１００の温度は
ハウジング１１およびハウジング１１内の通路を介して
与えられる冷却媒体１１０を介さないと測定できない。
この測定結果に基づいて冷却媒体の流量が調整されるた
め冷媒は無駄な量を流すこともあり、冷却効率も悪くな
るという欠点がある。In the above-described cooling device,
The temperature of the cooling medium 110 heated through the passage 11 is detected by the bimetal or the bellows 130 to adjust the flow rate. For this reason, the temperature of the electronic device 100 to be cooled cannot be measured without passing through the housing 11 and the cooling medium 110 provided through a passage in the housing 11.
Since the flow rate of the cooling medium is adjusted based on the measurement result, there is a disadvantage that the refrigerant may flow an unnecessary amount and the cooling efficiency is deteriorated.
【０００６】さらに、上述の冷却装置の測定では、冷却
すべき電子機器１００の温度上昇が測定のタイミングで
は間に合わないような場合、冷却すべき電子機器１００
の破壊を防止できない。Further, in the above-described measurement of the cooling device, if the temperature of the electronic device 100 to be cooled does not rise in time for the measurement, the electronic device 100 to be cooled can be cooled.
Can not prevent the destruction of
【０００７】さらに、上述の冷却装置における流量調整
板や冷却媒体循環手段の故障が発生しても、その故障を
誰も気がつかないという欠点もある。Further, even if a failure occurs in the flow rate adjusting plate or the cooling medium circulating means in the above-described cooling device, there is a disadvantage that no one notices the failure.
【０００８】本発明の目的は、最小限の冷却媒体を流す
ことにより効率的な冷却をするようにした電子部品の冷
却装置を提供することにある。An object of the present invention is to provide a cooling device for an electronic component in which cooling is performed efficiently by flowing a minimum amount of a cooling medium.
【０００９】本発明の他の目的は、被冷却媒体である電
子部品の温度上昇による破壊を防止するようにした電子
部品の冷却装置を提供することにある。Another object of the present invention is to provide a cooling device for an electronic component which prevents the electronic component as a cooling medium from being destroyed due to a rise in temperature.
【００１０】本発明の他の目的は、冷媒供給系の故障の
検出を確実にし、警報の信頼性を向上するようにした電
子部品の冷却装置を提供することにある。It is another object of the present invention to provide a cooling device for an electronic component which ensures detection of a failure in a refrigerant supply system and improves reliability of an alarm.
【００１１】本発明の他の目的は、電子部品対応の冷媒
供給系の一部を有することにより、冷却効率を向上する
ようにした電子部品の冷却装置を提供することにある。It is another object of the present invention to provide a cooling device for an electronic component having a part of a refrigerant supply system for the electronic component so as to improve the cooling efficiency.
【００１２】[0012]
【課題を解決するための手段】本発明の第１の装置は、
電子部品を冷却するために冷媒を該電子部品毎に供給す
るノズルと、このノズルから供給される冷媒により冷却
されるべき電子部品に装着された温度センサと、この温
度センサで測定された温度情報に基づいて、前記ノズル
に与えられる冷媒の流量を調整する流量調整バルブとを
含む。The first device of the present invention comprises:
A nozzle that supplies a coolant to each electronic component to cool the electronic component, a temperature sensor mounted on the electronic component that is to be cooled by the coolant supplied from the nozzle, and temperature information measured by the temperature sensor Flow rate adjusting valve for adjusting the flow rate of the refrigerant given to the nozzle based on the above.
【００１３】本発明の第２の装置は、前記第１の装置に
おける前記ノズルが冷媒を前記電子部品の冷却用放熱器
に供給することを特徴とする。A second apparatus of the present invention is characterized in that the nozzle in the first apparatus supplies a refrigerant to a radiator for cooling the electronic component.
【００１４】本発明の第３の装置は、前記第１の装置ま
たは前記第２の装置において、前記温度センサで測定さ
れた温度情報が所定の温度以上になったとき警報信号を
発生するとともに、前記流量調整バルブの流量調整を制
御する制御回路を含む。In a third device of the present invention, in the first device or the second device, an alarm signal is generated when the temperature information measured by the temperature sensor exceeds a predetermined temperature, and A control circuit for controlling the flow rate adjustment of the flow rate adjusting valve is included.
【００１５】本発明の第４の装置は、前記第１の装置、
前記第２の装置または前記第３の装置において、前記流
量調整バルブを流れる冷媒の流路のバイパスとして冷媒
を流すバイパス流路を含む。A fourth device of the present invention is the first device,
In the second device or the third device, a bypass flow passage through which the refrigerant flows is provided as a bypass of the flow passage of the refrigerant flowing through the flow rate adjusting valve.
【００１６】本発明の第５の装置は、前記第１の装置に
おいて、前記ノズル、前記温度センサおよび前記流量調
整バルブは前記電子部品対応に設けられたことを特徴と
する。A fifth device of the present invention is characterized in that, in the first device, the nozzle, the temperature sensor, and the flow control valve are provided corresponding to the electronic components.
【００１７】本発明の第６の装置は、前記第１の装置ま
たは前記第５の装置において、前記流量調整バルブに冷
媒を供給する空気流路と、この空気流路に流す冷媒を装
置周辺の温度を基準として冷却する冷却器とを含む。A sixth apparatus according to the present invention is the same as the first apparatus or the fifth apparatus, wherein an air flow path for supplying a refrigerant to the flow rate adjusting valve and a refrigerant flowing in the air flow path are provided around the apparatus. And a cooler for cooling based on temperature.
【００１８】本発明の第７の装置は、前記第６の装置に
おいて、前記冷却器に与える冷媒をためる冷媒溜と、こ
の冷媒溜にためられた冷媒が所定の圧力で前記ノズルに
流れるように外部から取り入れた冷媒を圧縮する加圧器
とを含む。A seventh device of the present invention is the device of the sixth device, wherein a refrigerant reservoir for accumulating the refrigerant to be supplied to the cooler and a refrigerant accumulated in the refrigerant reservoir flow to the nozzle at a predetermined pressure. And a pressurizer for compressing the refrigerant taken from the outside.
【００１９】本発明の第８の装置は、前記第７の装置に
おいて、前記加圧器は前記冷媒溜に取り付けられた圧力
センサの圧力に基づいて加圧することを特徴とする。An eighth apparatus of the present invention is characterized in that, in the seventh apparatus, the pressurizer pressurizes based on the pressure of a pressure sensor attached to the refrigerant reservoir.
【００２０】本発明の第９の装置は、前記第６の装置に
おいて、前記冷却器は前記加圧器の冷媒取入口に設けら
れた温度センサで感知された温度に基づいて冷媒を冷却
することを特徴とする。In a ninth aspect of the present invention, in the sixth aspect, the cooler cools the refrigerant based on a temperature detected by a temperature sensor provided at a refrigerant intake of the pressurizer. Features.
【００２１】[0021]
【実施例】次に本発明の実施例について図面を参照して
詳細に説明する。Embodiments of the present invention will now be described in detail with reference to the drawings.
【００２２】図１を参照すると、本発明の第１の実施例
は、被冷却部品系および冷却部品系を備えている。Referring to FIG. 1, a first embodiment of the present invention comprises a system to be cooled and a system to cool.
【００２３】被冷却部品系は、冷却すべき電子部品１，
およびこの電子部品１に装着され、この電子部品１の温
度を検出し検出結果である温度情報を出力する本発明の
第１の実施例の特徴の１つでもある温度センサ２を備え
ている。The cooled component system is an electronic component 1 to be cooled.
A temperature sensor 2 which is one of the features of the first embodiment of the present invention, which is mounted on the electronic component 1 and detects the temperature of the electronic component 1 and outputs temperature information as a detection result, is provided.
【００２４】冷媒供給系は、冷却すべき電子部品１に噴
射する空気をためる冷媒溜６，この冷媒溜６の圧力セン
サで電子部品１冷却用として噴射するため十分な圧力か
否かを感知し、所定の圧力以下であると判定されたとき
には外部から供給される冷媒である空気を加圧する加圧
器５，この加圧器５に設置された温度センサにより測定
された温度を基準として電子部品１を冷却するために必
要な温度に冷媒を冷却する冷却器７，この冷却器７から
与えられる冷媒である空気を送る空気流路９，この空気
流路９を介して送られる空気を電子部品１に噴射するノ
ズル３，このノズル３に与えられる空気の供給量を調節
する流量調整バルブ４，このバルブ４に供給される空気
をバルブ４のバイパスとして流すバイパス流路１０，お
よび温度センサ２からの温度情報によりバルブ４の開度
を制御する制御回路８を備えている。In the refrigerant supply system, a refrigerant reservoir 6 for accumulating air to be injected into the electronic component 1 to be cooled is sensed by a pressure sensor of the refrigerant reservoir 6 as to whether or not the pressure is sufficient to inject the electronic component 1 for cooling. When it is determined that the pressure is equal to or less than the predetermined pressure, the electronic component 1 is pressurized based on the temperature measured by the temperature sensor mounted on the pressurizer 5 which pressurizes the air which is the refrigerant supplied from the outside. A cooler 7 for cooling the refrigerant to a temperature required for cooling, an air passage 9 for sending air as a refrigerant provided from the cooler 7, and air sent through the air passage 9 to the electronic component 1. Nozzle 3 for jetting, flow rate adjusting valve 4 for adjusting the amount of air supplied to nozzle 3, bypass flow path 10 for flowing air supplied to valve 4 as a bypass for valve 4, and temperature sensor 2 And a control circuit 8 for controlling the opening of the valve 4 by the temperature information et.
【００２５】次に本発明の第１の実施例の動作について
図面を参照して詳細に説明する。Next, the operation of the first embodiment of the present invention will be described in detail with reference to the drawings.
【００２６】図１を参照すると、電子部品を冷却するた
めの冷媒は加圧器５により加圧された後、冷媒溜６を通
って冷却器７に送られる。冷媒の温度は冷却器７によ
り、任意の温度を設定することが可能である。本実施例
において説明の便宜上冷媒の温度は装置の周囲温度とし
て説明する。冷媒としてはフッ素系化合物の一種である
不活性物質や純水などの液体状の冷媒が有利であるが、
冷却系全体を閉ループ化する必要があるなど取り扱いが
難しい。本実施例では冷却供給系の構造を簡素化した、
空気を冷媒に使用した実施例を説明する。加圧器５によ
り加圧され、冷却器７により温度調節された空気はあら
かじめ作成された空気流路９を通って流量調整バルブ４
に送られる。流量調整バルブ４は、電子部品１に取り付
けられた温度センサ２からの信号を受けた制御回路８に
よって開度が制御される。流量調整バルブ４の近傍に
は、本発明の第１の実施例の特徴の１つであるバイパス
流路１０が設置されている。このバイパス流路１０は、
前記バルブ４の開度に関わらず、加圧空気と電子部品近
傍空気との圧力差とバイパス流路１０の流路断面積によ
って決まる空気の量を電子部品１に供給する働きをす
る。このバイパス流路１０の働きにより、流量調整バル
ブ４が故障によって完全に閉じてしまった場合でも被冷
却部品の破壊を防ぐための冷却能力を残すことができる
ので、冷却系統の異常の時でも電子部品１を破壊する確
率を低くすることができる。Referring to FIG. 1, the refrigerant for cooling the electronic components is pressurized by the pressurizer 5 and then sent to the cooler 7 through the refrigerant reservoir 6. The temperature of the refrigerant can be set to any temperature by the cooler 7. In the present embodiment, for convenience of description, the temperature of the refrigerant will be described as the ambient temperature of the device. As the refrigerant, a liquid refrigerant such as an inert substance or pure water, which is a kind of fluorine compound, is advantageous,
It is difficult to handle because the entire cooling system needs to be closed loop. In this embodiment, the structure of the cooling supply system is simplified,
An example in which air is used as the refrigerant will be described. The air pressurized by the pressurizer 5 and temperature-controlled by the cooler 7 passes through a previously created air flow path 9 and flows through the flow control valve 4.
Sent to The opening of the flow control valve 4 is controlled by a control circuit 8 which receives a signal from the temperature sensor 2 attached to the electronic component 1. A bypass flow passage 10, which is one of the features of the first embodiment of the present invention, is installed near the flow rate adjusting valve 4. This bypass channel 10 is
Regardless of the opening degree of the valve 4, the electronic component 1 is supplied with an amount of air determined by the pressure difference between the pressurized air and the air near the electronic component and the cross-sectional area of the bypass channel 10. By the function of the bypass passage 10, even if the flow control valve 4 is completely closed due to a failure, the cooling capacity for preventing the destruction of the component to be cooled can be left. The probability of breaking the component 1 can be reduced.
【００２７】次に、電子部品に供給される冷媒量を決定
する、本発明の第１の実施例の特徴の他の１つでもある
制御回路８の動作について図面を参照して詳細に説明す
る。Next, the operation of the control circuit 8, which is another feature of the first embodiment of the present invention, which determines the amount of refrigerant supplied to the electronic components, will be described in detail with reference to the drawings. .
【００２８】制御回路８は、電子部品１，特に温度セン
サ２の装着部分の温度が予め設定された温度，この実施
例では被冷却部品が動作する最高温度以下に収まるよう
に流量調整バルブ４の開度を、温度センサ２からの温度
情報に基づきフィードバック制御する。すなわち、電子
部品１，特に温度センサ２の装着部分の温度が、予め設
定された被冷却部品の動作最高温度より高い場合、制御
回路８は温度センサ２の取り付けられている電子部品１
へ冷媒を供給する経路に取り付けられている流量調整バ
ルブ４に当該バルブを開くための信号を発信する。バル
ブの開度は温度センサ２の装着部分の温度（Ｔ1 ）が、
設定温度（Ｔset ）に近づくように制御される。The control circuit 8 controls the flow control valve 4 so that the temperature of the electronic component 1, especially the temperature of the mounting portion of the temperature sensor 2, is kept below the preset temperature, in this embodiment, the maximum temperature at which the component to be cooled operates. The opening is feedback-controlled based on the temperature information from the temperature sensor 2. That is, if the temperature of the electronic component 1, particularly the temperature of the mounting portion of the temperature sensor 2, is higher than a preset maximum operation temperature of the component to be cooled, the control circuit 8 sets the electronic component 1
A signal for opening the valve is sent to the flow rate adjusting valve 4 attached to the path for supplying the refrigerant to the. The opening degree of the valve is determined by the temperature (T 1 ) of the mounting part of the temperature sensor 2,
Control is performed so as to approach the set temperature (Tset).
【００２９】さらに、本発明の第１の実施例における制
御回路８および流量調整バルブ４の関連動作について図
面を参照して詳細に説明する。Further, the related operation of the control circuit 8 and the flow control valve 4 in the first embodiment of the present invention will be described in detail with reference to the drawings.
【００３０】図１を参照すると、制御回路８からバルブ
を開くための信号を受けた流量調整バルブ４は、まず受
信信号に従いバルブを開いて冷媒を電子部品１に供給す
る。次に、制御回路８は温度センサ２からの温度情報を
逐次取り込み、温度センサ２の装着部分の温度が設定温
度（Ｔset ）になるまで冷媒供給量を増加させる信号、
すなわちバルブの開度を大きくする信号を発信する。流
量調整バルブの開度は、設定温度と温度センサ部分の温
度との差によって調節する。Referring to FIG. 1, upon receiving a signal for opening the valve from the control circuit 8, the flow control valve 4 first opens the valve according to the received signal to supply the refrigerant to the electronic component 1. Next, the control circuit 8 sequentially takes in the temperature information from the temperature sensor 2, and increases the refrigerant supply amount until the temperature of the mounting portion of the temperature sensor 2 reaches the set temperature (Tset).
That is, a signal for increasing the opening of the valve is transmitted. The opening of the flow rate adjusting valve is adjusted by the difference between the set temperature and the temperature of the temperature sensor part.
【００３１】冷媒供給量の増加によって電子部品１が冷
却され、温度センサ２の装着部分の温度が下がる。予め
設定した温度まで温度センサ２装着部分の温度が低下し
た時は、制御回路８は、流量調整バルブ４の開度を狭め
て電子部品１に供給する冷媒量を減らし、温度センサ２
の装着部分の温度が設定温度と同じになるように流量調
整バルブ４の開度を制御する。これは、電子部品１の温
度が設定温度まで下がったことにより、温度上昇を防ぐ
だけの冷却能力を供給すれば電子部品１は故障や誤動作
の確率が非常に低くなるという経験則に基づいている。
なんらかの原因によって温度センサ２装着部分の温度が
再び上昇して設定温度を超えたときには、流量調整バル
ブ４の開度を大きくして冷媒の流量を増やし、温度セン
サ２の装着部分の温度が設定温度と同じになるように流
量調整バルブ４の開度を調節する。The electronic component 1 is cooled by the increase of the coolant supply amount, and the temperature of the mounting portion of the temperature sensor 2 is lowered. When the temperature of the portion where the temperature sensor 2 is attached falls to a preset temperature, the control circuit 8 narrows the opening of the flow rate adjusting valve 4 to reduce the amount of refrigerant supplied to the electronic component 1,
The opening degree of the flow control valve 4 is controlled so that the temperature of the mounting portion becomes the same as the set temperature. This is based on an empirical rule that, when the temperature of the electronic component 1 has dropped to the set temperature, the probability of failure or malfunction of the electronic component 1 becomes extremely low if a cooling capacity sufficient to prevent the temperature rise is supplied. .
When the temperature of the mounting portion of the temperature sensor 2 rises again and exceeds the set temperature for some reason, the opening of the flow rate adjusting valve 4 is increased to increase the flow rate of the refrigerant, and the temperature of the mounting portion of the temperature sensor 2 is set to the set temperature. The opening degree of the flow rate adjusting valve 4 is adjusted so as to be the same as.
【００３２】次に、流量調整バルブ４を全開しても温度
の時間変化値が正の値を示す、すなわち温度が上昇する
場合に、制御回路８は、流量調整バルブ４，空気流路
９，および冷媒供給系統を形成する加圧器５，冷媒溜６
および冷却器７の少なくとも１つの部分の故障と判定し
て警報信号を発生させる。この警報信号は電源回路など
の周辺の装置に発信されて、異常発生時のシステム停止
等の必要な操作の引き金に利用できる。本発明の第１の
実施例では、上述の警告信号の発生の記載より前に記載
されたステップを経ることにより、電子部品１に過不足
のない冷却能力を提供できる。Next, when the temperature change value shows a positive value even when the flow control valve 4 is fully opened, that is, when the temperature rises, the control circuit 8 controls the flow control valve 4, the air flow path 9, And a pressurizer 5 and a refrigerant reservoir 6 forming a refrigerant supply system
And it is determined that at least one portion of the cooler 7 has failed, and an alarm signal is generated. This alarm signal is transmitted to a peripheral device such as a power supply circuit, and can be used for triggering necessary operations such as stopping the system when an abnormality occurs. In the first embodiment of the present invention, the electronic component 1 can be provided with an adequate cooling capacity by going through the steps described before the description of the generation of the warning signal.
【００３３】次に本発明の第２の実施例について図面を
参照して詳細に説明する。Next, a second embodiment of the present invention will be described in detail with reference to the drawings.
【００３４】図２を参照すると、第１の実施例と比較し
て第２の実施例の特徴は、電子部品をより効率的に冷却
するため電子部品１に放熱器１１を取り付けたことにあ
る。この特徴により電子部品１から空気への熱伝達は効
率よく行われる。Referring to FIG. 2, a feature of the second embodiment is that a radiator 11 is attached to the electronic component 1 in order to cool the electronic component more efficiently as compared with the first embodiment. . Due to this feature, heat transfer from the electronic component 1 to the air is performed efficiently.
【００３５】本発明の第２の実施例は、第１の実施例と
同様に被冷却部品系および冷却供給系を備えている。The second embodiment of the present invention includes a cooled component system and a cooling supply system as in the first embodiment.
【００３６】この被冷却部品系は、冷却すべき電子部品
１，この電子部品１に装着され、この電子部品１の温度
を検出する温度センサ２，および電子部品１に取り付け
られた放熱器１１を備えている。This cooled component system includes an electronic component 1 to be cooled, a temperature sensor 2 attached to the electronic component 1 for detecting the temperature of the electronic component 1, and a radiator 11 attached to the electronic component 1. I have it.
【００３７】冷媒供給系は、冷却すべき電子部品１に取
り付けられた放熱器１１に冷媒である空気を噴射するた
め、空気をためる冷媒溜６，この冷媒溜６の圧力センサ
で放熱器１１に所定の圧力で冷媒を供給できる圧力にあ
るか否かを検出し、所定の圧力以下のときは外部から供
給される冷媒である空気を加圧する加圧器５，この加圧
器５の冷媒取入口に設置された温度センサによりその温
度を検出し、電子部品１のセンサ２がこの温度を測定す
るように冷媒である空気を冷却する冷却器７，この冷却
器７から与えられる空気を流すための空気流路９，この
空気流路９を介して放熱器１１に送られた空気を噴射す
るため放熱器１１対応、もし放熱器１１のない場合には
電子部品１対応に設けられたノズル３，このノズル３に
与えられる冷媒である空気の供給量を調節する流量調整
バルブ４，このバルブ４近傍に設けられバルブ４の入口
と出口を共通に用いられ、第１の実施例と同じ働きをす
るバイパス流路１０，および温度センサ２からの温度情
報によりバルブ４の開度を制御する制御回路８を備えて
いる。The refrigerant supply system injects the refrigerant air to the radiator 11 attached to the electronic component 1 to be cooled. The refrigerant reservoir 6 stores the air. A pressurizer 5 for detecting whether or not the pressure is such that the refrigerant can be supplied at a predetermined pressure. When the pressure is lower than the predetermined pressure, the pressurizer 5 pressurizes the air as the refrigerant supplied from the outside. A cooler 7 that cools air serving as a refrigerant so that the sensor 2 of the electronic component 1 measures this temperature by an installed temperature sensor, and air for flowing air supplied from the cooler 7. The flow path 9 corresponds to the radiator 11 for injecting the air sent to the radiator 11 through the air flow path 9. If the radiator 11 is not provided, the nozzle 3 is provided for the electronic component 1. With the refrigerant given to nozzle 3 Flow control valve 4 for adjusting the supply amount of air to be supplied, a bypass passage 10 provided near the valve 4 and commonly using the inlet and outlet of the valve 4 and having the same function as in the first embodiment, and a temperature sensor The control circuit 8 controls the opening degree of the valve 4 based on the temperature information from the controller 2.
【００３８】次に本発明の第２の実施例の動作について
図面を参照して詳細に説明する。Next, the operation of the second embodiment of the present invention will be described in detail with reference to the drawings.
【００３９】図２を参照すると、放熱器１１を冷却する
ための冷媒である水は、加圧器５により加圧されたあ
と、冷媒溜６を介して冷却器７に与えられる。冷媒の温
度は冷却器７により任意の温度に設定できる。この実施
例では、説明の便宜上、第１の実施例と同様に冷媒の温
度は装置の周囲温度として説明する。Referring to FIG. 2, water as a refrigerant for cooling the radiator 11 is pressurized by the pressurizer 5 and then supplied to the cooler 7 via the refrigerant reservoir 6. The temperature of the refrigerant can be set to an arbitrary temperature by the cooler 7. In this embodiment, for convenience of explanation, the temperature of the refrigerant will be described as the ambient temperature of the device as in the first embodiment.
【００４０】加圧器５により加圧され、冷却器７により
温度調節された冷媒は空気流路９を通って流量調整バル
ブ４に送られる。バルブ４の開度は制御回路８により制
御される。この制御は、電子部品１に装着された温度セ
ンサ２からの温度情報に基づいて行われる。流量調整バ
ルブ４の近傍には、本発明の第２の実施例の特徴の１つ
でもあるバイパス流路１０が設けられている。このバイ
パス流路１０は、バルブ４の開度とは無関係に加圧空気
と電子部品近傍空気との圧力差とバイパス流路１０の流
路断面積によって決定される空気の量を放熱器１１に供
給する働きをする。このバイパス流路２０の働きによ
り、流量調整バルブ４が故障により完全に閉じてしまっ
た場合でも被冷却部品の破壊を防ぐための冷却能力を残
すことができる。このため、冷却系統の異常の時でも電
子部品１を破壊する確率を低くすることができる。The refrigerant pressurized by the pressurizer 5 and temperature-controlled by the cooler 7 is sent to the flow control valve 4 through the air passage 9. The opening of the valve 4 is controlled by the control circuit 8. This control is performed based on temperature information from a temperature sensor 2 mounted on the electronic component 1. In the vicinity of the flow control valve 4, a bypass flow path 10, which is one of the features of the second embodiment of the present invention, is provided. The bypass passage 10 supplies to the radiator 11 the amount of air determined by the pressure difference between the pressurized air and the air near the electronic component and the passage cross-sectional area of the bypass passage 10 regardless of the opening degree of the valve 4. Acts to supply. By the action of this bypass flow passage 20, even if the flow rate control valve 4 is completely closed due to a failure, it is possible to leave the cooling capacity for preventing the destruction of the cooled parts. Therefore, the probability of destroying the electronic component 1 can be reduced even when the cooling system is abnormal.
【００４１】次に、電子部品に供給される冷媒量を決定
する制御回路８の動作について図面を参照して詳細に説
明する。Next, the operation of the control circuit 8 for determining the amount of refrigerant supplied to the electronic components will be described in detail with reference to the drawings.
【００４２】図２を参照すると、電子部品１の動作する
最高温度以下に収まるように流量調整バルブ４の開度を
温度センサ２からの温度情報に基づきフィードバック制
御する。すなわち、温度センサ２の装着部分の温度が電
子部品１の動作最高温度より高い場合、制御回路８は温
度センサ２の取り付けられている電子部品１上の放熱器
１に冷媒を供給する空気流通路９に取り付けられている
流量調整バルブ４に当該バルブを開くための信号を発信
する。バルブの開度は温度センサ２の装着部分の温度
（Ｔ1 ）が、設定温度（Ｔset ）に近づくよう制御され
る。Referring to FIG. 2, the opening degree of the flow control valve 4 is feedback-controlled based on the temperature information from the temperature sensor 2 so as to stay below the maximum temperature at which the electronic component 1 operates. That is, when the temperature of the mounting portion of the temperature sensor 2 is higher than the maximum operation temperature of the electronic component 1, the control circuit 8 supplies the refrigerant to the radiator 1 on the electronic component 1 to which the temperature sensor 2 is mounted. A signal for opening the flow control valve 4 attached to the valve 9 is transmitted. The opening of the valve is controlled so that the temperature (T 1 ) of the mounting portion of the temperature sensor 2 approaches the set temperature (Tset).
【００４３】さらに、本発明の第２の実施例における制
御回路８および流量調整バルブ４の関連動作について図
面を参照して詳細に説明する。Further, the related operation of the control circuit 8 and the flow control valve 4 in the second embodiment of the present invention will be described in detail with reference to the drawings.
【００４４】図２を参照すると、制御回路８からの指示
信号に従い、流量調整バルブ４はまず冷媒を放熱器１１
に供給する。次に、制御回路８は温度センサ２からの温
度情報を逐次取り込み、温度センサ２の装着部分の温度
が設定温度（Ｔset ）になるまで冷媒供給量を増加させ
る信号、すなわちバルブの開度を大きくする信号を発信
する。流量調整バルブの開度は、設定温度と温度センサ
部分の温度との差によって調節する。Referring to FIG. 2, according to an instruction signal from the control circuit 8, the flow control valve 4 first causes the refrigerant to radiate
Supply to. Next, the control circuit 8 sequentially takes in the temperature information from the temperature sensor 2 and increases the refrigerant supply amount until the temperature of the mounting portion of the temperature sensor 2 reaches the set temperature (Tset), that is, increases the valve opening. Send a signal to The opening of the flow rate adjusting valve is adjusted by the difference between the set temperature and the temperature of the temperature sensor part.
【００４５】冷媒供給量の増加によって放熱器１１が冷
却され、放熱器１１を取り付けた電子部品１の温度セン
サ２装着部分の温度が下がる。温度センサ２装着部分の
温度が、予め設定された温度まで低下した時、制御回路
８は流量調整バルブ４の開度を狭めて放熱器１１に供給
する冷媒量を減らし、放熱器１１に取り付けられた電子
部品１の温度センサ装着部分の温度が設定温度と同じに
なるように流量調整バルブ４の開度を制御する。これ
は、電子部品１の温度が設定温度まで下がったことによ
り、温度上昇を防止するだけの冷却能力を供給すれば電
子部品１は故障や誤動作の確率が非常に低くなるという
経験則に基づいている。何らかの原因によって電子部品
１の温度センサ２装着部分の温度が再び上昇して設定温
度を超えたときには、流量調整バルブ４の開度を大きく
して冷媒の流量を増加し、電子部品１の温度センサ２装
着部分の温度が設定温度と同じになるように流量調整バ
ルブ４の開度を調節する。The radiator 11 is cooled by the increase in the supply amount of the refrigerant, and the temperature of the electronic component 1 mounted with the radiator 11 at the temperature sensor 2 mounting portion decreases. When the temperature of the temperature sensor 2 mounting portion decreases to a preset temperature, the control circuit 8 reduces the amount of refrigerant supplied to the radiator 11 by narrowing the opening of the flow control valve 4 and is attached to the radiator 11. The opening of the flow control valve 4 is controlled such that the temperature of the temperature sensor mounting portion of the electronic component 1 becomes the same as the set temperature. This is based on an empirical rule that, since the temperature of the electronic component 1 has dropped to the set temperature, if the cooling capacity sufficient to prevent the temperature rise is supplied, the probability of failure and malfunction of the electronic component 1 becomes extremely low. I have. When the temperature of the temperature sensor 2 mounting portion of the electronic component 1 rises again and exceeds the set temperature for some reason, the opening degree of the flow control valve 4 is increased to increase the flow rate of the refrigerant, and the temperature sensor of the electronic component 1 is increased. (2) Adjust the opening of the flow control valve 4 so that the temperature of the mounting portion becomes the same as the set temperature.
【００４６】次に、流量調整バルブ４を全開しても温度
の時間変化値が正の値を示す、すなわち温度が上昇する
場合に、制御回路８は流量調整バルブ４，空気流路９お
よび冷媒供給系統を形成する加圧器５，冷媒溜６および
冷却器７の少なくとも１つの部分の故障と判定して警報
信号を発生させる。この警報信号は電源回路などの周辺
の装置に発信されて、異常発生時のシステム停止等の必
要な操作の引き金に利用できる。Next, when the temperature change value shows a positive value even when the flow control valve 4 is fully opened, that is, when the temperature rises, the control circuit 8 controls the flow control valve 4, the air flow path 9 and the refrigerant. It is determined that at least one of the pressurizer 5, the refrigerant reservoir 6, and the cooler 7 forming the supply system has failed, and an alarm signal is generated. This alarm signal is transmitted to a peripheral device such as a power supply circuit, and can be used for triggering necessary operations such as stopping the system when an abnormality occurs.
【００４７】[0047]
【発明の効果】本発明は、被冷却部品である電子部品１
の温度を直接測定し、測定された温度に基づいて被冷却
部品に供給する冷媒の量を調節することに特徴の１つが
ある。この特徴により本発明では、使用する冷媒の量を
最小限に収めることができ、効率的な冷却ができる。The present invention provides an electronic component 1 which is a component to be cooled.
Is directly measured, and the amount of the refrigerant supplied to the component to be cooled is adjusted based on the measured temperature. Due to this feature, in the present invention, the amount of refrigerant to be used can be minimized, and efficient cooling can be achieved.
【００４８】本発明は、被冷却部品である電子部品１の
温度を直接測定し、その測定された温度に基づいて制御
回路８がその温度の異常を検出することも特徴の１であ
る。この特徴により本発明では空気流路９の詰まりや、
流量調整バルブ４の故障等の冷媒供給系の不具合によっ
て電子部品１の冷却が不可能または困難となっても、そ
の故障を確実に検出し警報信号で知らせることができ
る。この結果本発明は警報の信頼性を向上できる。The present invention is also characterized in that the temperature of the electronic component 1 to be cooled is directly measured, and the control circuit 8 detects an abnormality in the temperature based on the measured temperature. Due to this feature, in the present invention, clogging of the air flow path 9 and
Even if the cooling of the electronic component 1 becomes impossible or difficult due to a failure of the refrigerant supply system such as a failure of the flow control valve 4, the failure can be reliably detected and notified by an alarm signal. As a result, the present invention can improve the reliability of the alarm.
【００４９】本発明は流量調整バルブ４の流路のバイパ
スとしてバイパス流路１０を設けたことも特徴の１つで
ある。The present invention is also characterized in that a bypass passage 10 is provided as a bypass for the passage of the flow regulating valve 4.
【００５０】本発明では、故障で流量調整バルブ４が完
全に閉じてしまっても、被冷却部品の破壊を防止するた
めの冷却能力を残すことができる。この結果、本発明は
冷却系統の異常の時でも電子部品１の破壊される確率を
低くすることができる。In the present invention, even if the flow rate adjusting valve 4 is completely closed due to a failure, it is possible to leave the cooling capacity for preventing the destruction of the parts to be cooled. As a result, the present invention can reduce the probability that the electronic component 1 will be destroyed even when the cooling system is abnormal.
【００５１】本発明は、ノズル３，バルブ４，センサ２
および制御回路８を電子部品対応に設けることにより、
各電子部品が要求する冷却能力を過不足なく電子部品に
与えることができる。The present invention relates to a nozzle 3, a valve 4, a sensor 2
And by providing the control circuit 8 corresponding to the electronic component,
The cooling capacity required by each electronic component can be given to the electronic component without excess or deficiency.
【図１】本発明の第１の実施例を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.
【図２】本発明の第２の実施例を示す図である。FIG. 2 is a diagram showing a second embodiment of the present invention.
【図３】従来技術の一例を示す図である。FIG. 3 is a diagram showing an example of a conventional technique.
１ 電子部品 ２ 温度センサ ３ ノズル ４ 流量調整バルブ ５ 加圧器 ６ 冷媒溜 ７ 冷却器 ８ 制御回路 ９ 空気流路 １０ バイパス流路 １１ 放熱器 REFERENCE SIGNS LIST 1 electronic component 2 temperature sensor 3 nozzle 4 flow control valve 5 pressurizer 6 refrigerant reservoir 7 cooler 8 control circuit 9 air flow path 10 bypass flow path 11 radiator
Claims (4)
するノズルと、 このノズルから供給される冷媒により冷却されるべき電
子部品に装着された温度センサと、 この温度センサで測定された温度情報に基づいて、前記
ノズルに与えられる冷媒の流量を調整する流量調整バル
ブとを含むことを特徴とする電子部品の冷却装置。1. A nozzle for supplying electronic component cooling refrigerant to each electronic component, a temperature sensor mounted on an electronic component to be cooled by the refrigerant supplied from the nozzle, and a temperature measured by the temperature sensor. A cooling device for an electronic component, comprising: a flow rate adjusting valve that adjusts a flow rate of a refrigerant given to the nozzle based on information.
用放熱器に供給することを特徴とすることを特徴とする
請求項１記載の電子部品の冷却装置。2. The cooling device for electronic parts according to claim 1, wherein the nozzle supplies the cooling medium to a radiator for cooling the electronic parts.
所定の温度以上になったとき警報信号を発生するととも
に、前記流量調整バルブの流量調整を制御する制御回路
を含むことを特徴とする請求項１または請求項２記載の
電子部品の冷却装置。3. A control circuit for generating a warning signal when the temperature information measured by the temperature sensor exceeds a predetermined temperature and controlling the flow rate adjustment of the flow rate adjusting valve. The electronic device cooling device according to claim 1 or 2.
のバイパスとして冷媒を流すバイパス流路を備えたこと
を特徴とする請求項１，２または３記載の電子部品の冷
却装置。4. The cooling device for an electronic component according to claim 1, further comprising a bypass flow passage through which a coolant flows as a bypass of a flow passage of the coolant flowing through the flow rate adjusting valve.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6301945A JP2643878B2 (en) | 1994-12-06 | 1994-12-06 | Electronic component cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6301945A JP2643878B2 (en) | 1994-12-06 | 1994-12-06 | Electronic component cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08159635A true JPH08159635A (en) | 1996-06-21 |
| JP2643878B2 JP2643878B2 (en) | 1997-08-20 |
Family
ID=17903008
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6301945A Expired - Fee Related JP2643878B2 (en) | 1994-12-06 | 1994-12-06 | Electronic component cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2643878B2 (en) |
Cited By (5)
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| WO2001020962A1 (en) * | 1999-09-13 | 2001-03-22 | Hewlett-Packard Company | Spray cooling system |
| WO2005059996A1 (en) * | 2003-12-15 | 2005-06-30 | Sony Computer Entertainment Inc. | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| JP2007334142A (en) * | 2006-06-16 | 2007-12-27 | Ｎｅｃディスプレイソリューションズ株式会社 | Gas injection cooling system and projection-type display apparatus |
| JP2012042978A (en) * | 2011-11-07 | 2012-03-01 | Ｎｅｃディスプレイソリューションズ株式会社 | Projection display device |
| CN112236004A (en) * | 2020-10-15 | 2021-01-15 | 中国建筑第八工程局有限公司 | One-way heat conducting device |
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| WO2005059996A1 (en) * | 2003-12-15 | 2005-06-30 | Sony Computer Entertainment Inc. | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| KR100775717B1 (en) * | 2003-12-15 | 2007-11-09 | 가부시키가이샤 소니 컴퓨터 엔터테인먼트 | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| US7369409B2 (en) | 2003-12-15 | 2008-05-06 | Sony Computer Entertainment Inc. | Apparatus, method, and control program for cooling electronic devices |
| CN100390978C (en) * | 2003-12-15 | 2008-05-28 | 索尼计算机娱乐公司 | Electronic device cooler, electronic device cooling method, and electronic device cooling control program |
| JP2007334142A (en) * | 2006-06-16 | 2007-12-27 | Ｎｅｃディスプレイソリューションズ株式会社 | Gas injection cooling system and projection-type display apparatus |
| JP2012042978A (en) * | 2011-11-07 | 2012-03-01 | Ｎｅｃディスプレイソリューションズ株式会社 | Projection display device |
| CN112236004A (en) * | 2020-10-15 | 2021-01-15 | 中国建筑第八工程局有限公司 | One-way heat conducting device |
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|---|---|
| JP2643878B2 (en) | 1997-08-20 |
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