JPH08156081A - Manufacture of carrier tape - Google Patents

Abstract

PURPOSE: To provide a method for manufacturing a carrier tape in which the cost can be reduced by improving the molding speed of the tap useful to convey and store a chip-shaped small-sized electronic component. CONSTITUTION: A male mold 2a and a female mold 2b are chamfered at the corners of 0.1 to 0.2mm by using a thermoplastic resin sheet. A mold 1 in which the surface of the mold 2a for forming a container 1a of a carrier tape 1 is formed with a corrugated uneven part of 1 to 10μm is held at a predetermined temperature in the range of 40 to 80 deg.C by press molding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a carrier tape useful for carrying and storing chip type small electronic parts such as capacitors, resistors, transistors and diodes.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 3, a carrier tape has a resin sheet a, which is a material, heated at a temperature of 80 to 100 ° C. in a preheating portion b and then stored with electronic parts by press molding or vacuum molding (c). It has been manufactured by a method of forming a storage part d for storing and transferring it with a transfer device e. Further, a carrier tape made by punching out paper has been used exclusively for chip-type small electronic components.

[0003]

This molding method requires heating time until the resin sheet of the material reaches the softening temperature and cooling time in the mold for molding the storage part, There was a limit to the molding speed, which was an obstacle to lowering the carrier tape price (processing cost). Therefore, I have used carrier tape made by punching inexpensive paper,
There were cases where the mounting machine clogged the vacuum holes for adsorbing electronic components due to paper dust, or contaminated the clean room with paper dust. The present invention solves these problems, and provides a method for manufacturing a carrier tape which can improve the molding speed of a carrier tape useful for carrying and storing chip-type small electronic components and can cope with a price decrease. is there.

[0004]

According to the present invention, a thermoplastic resin sheet is used, and the corners of the male and female dies are chamfered to have a radius of 0.1 to 0.2 mm, and the surface of the male die forming the storage portion is 1 to 10 μm.
The method for producing a carrier tape, characterized in that the die provided with the embossed pattern-like unevenness is held at a constant temperature in the range of 40 to 80 ° C., and the storage portion of the carrier tape is formed by press molding. Is.

The present invention will be described in detail below with reference to FIGS. FIG. 1 is an explanatory view schematically showing an example of the present invention, FIG. 2 (a) is an explanatory view showing details of a mold in FIG. 1, and FIG. 2 (b) is a corner portion of a male mold in FIG. 2 (a). FIG. In these figures, 1 is a carrier tape, 1a is a housing part thereof, 2 is a mold, 2a is a male type, 2b is a female type, 2c is a male and female type corner (chamfered portion), and 2d is a grain pattern. The unevenness 3 is a transfer device.
According to the present invention, the thermoplastic resin sheet is press-molded without preheating to form the accommodation portion 1a of the carrier tape 1, the feed hole is opened, and the molded carrier tape 1 is transferred by the transfer device 3 in a fixed amount. The carrier tape is manufactured by continuously performing the operation in conjunction with the molding machine.

At this time, the die assists the expansion of the thermoplastic resin sheet when molding the housing portion, and prevents the die of the housing portion from being separated from the die, impairing dimensional stability. In order to suppress the temperature rise due to friction, a heat medium such as hot water is circulated in the mold to maintain a constant temperature within the range of 40 to 80 ° C. At this time, if the temperature of the mold is less than 40 ° C, perforations are likely to occur on the side surface of the storage part where the thermoplastic resin sheet is stretched, and if the temperature exceeds 80 ° C, the thermoplastic resin sheet becomes too soft and the formed carrier When the tape is transferred by a fixed amount, the release from the mold becomes poor and the rampage is likely to occur.

In order to improve the elongation of the thermoplastic resin sheet when molding the storage portion, chamfers of R 0.1 to 0.2 mm are made on the corners 2c of the male mold 2a and the female mold 2b of the mold to make the male mold 2a. A mold is used in which the male mold 2a, which is the surface that comes into contact with the thermoplastic resin sheet and the chamfered curved surface, are provided with a textured pattern of irregularities of 1 to 10 μm [Fig.
(B)]. If there is no chamfering or R is less than 0.1 mm, holes are likely to be opened in the side surface of the storage part, and if R is more than 0.2 mm, the seating of the inserted electronic component becomes poor. By providing the unevenness of the texture pattern, the followability of the thermoplastic resin sheet to the male mold when molding the storage part is improved, and for example, a thermoplastic resin sheet with a thickness of 0.2 to 0.4 mm can have a depth of 2.0. Press molding that can be squeezed to near mm can be performed.

The material of the thermoplastic resin sheet used in the present invention is one or two or more blends selected from vinyl chloride resin, polypropylene, polyethylene, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyarylate and the like. Among them, alloys are preferable, and among these, polycarbonate and polyarylate are preferable from the viewpoint of moldability. This thermoplastic resin sheet usually has a thickness of 0.2 to 0.4 mm and may be provided with a conductive layer on the surface if necessary.

[0009]

Among the thermoplastic resin sheets, the polyarylate or polycarbonate resin is particularly transparent, has an elongation suitable for press molding, and does not whiten (whiten) the storage portion during molding. The carrier tape obtained by the present invention does not cause any dimensional deformation of the storage portion even if it is left in an environment of a temperature of 60 ° C. for 24 hours or more. Since the heating time until the softening temperature of the thermoplastic resin sheet or the cooling time in the mold for molding the heating means such as a heater and the housing is not required, the mechanical capacity of the press molding machine is limited. The molding speed can be increased. The carrier tape obtained by the present invention is suitable for chip-type small electronic parts having a height of 2.0 mm or less.

[0010]

EXAMPLES Specific embodiments of the present invention will be described below with reference to Examples and Comparative Examples. (Example 1) Polycarbonate resin sheet having a thickness of 0.3 mm: Panlite film (trade name of Teijin Ltd.) having a width of 8 mm, a bottom dimension of a storage portion of 1.9 × 3.5 mm and a depth of 1.3
mm carrier tape with male and female corners of R0.15mm
Chamfered on the surface of the male mold that forms the storage part, and the unevenness of 5 μm was provided on the surface, and hot water of 60 ° C was circulated to maintain a constant temperature. , 2
It was possible to continuously and stably manufacture at a molding speed of 50 shots / minute.

(Example 2) A carrier tape was molded in the same manner as in Example 1 except that a polyarylate resin sheet having a thickness of 0.3 mm was used in place of the polycarbonate resin sheet. did it.

Comparative Example 1 A carrier tape was molded in the same manner as in Example 1 except that the corners of the male mold and the female mold were chamfered to be R0.05 mm. It was

Comparative Example 2 A carrier tape was molded in the same manner as in Example 1 except that the corners of the male mold and the female mold were chamfered to R0.25 mm. became. When a small electronic component was put in this carrier tape, the electronic component was uncomfortable to sit on.

[0014]

When a carrier tape having the same size as that of the above-described embodiment is manufactured by the conventional molding method, the molding speed of 80 shots / minute is obtained with the above-mentioned mold for taking 15 pieces, but in the present invention, it is about three times as high. Since it can be manufactured at a molding speed of 240 shots / minute, processing costs can be reduced. Further, since the thermoplastic resin sheet is not heated to the softening point, it is possible to reduce the dimensional deviation due to the heat shrinkage of the material itself.

[Brief description of drawings]

FIG. 1 is an explanatory diagram schematically showing an example of the present invention.

2 (a) is an explanatory view showing details of the mold in FIG. 1, and FIG. 2 (b) is an enlarged explanatory view of a corner portion of the male mold in FIG. 2 (a).

FIG. 3 is an explanatory view schematically showing a conventional manufacturing method.

[Explanation of symbols]

1 ... Carrier tape, 1a ... Storage part, 2 ...
Mold, 2a ... male, 2b ... female, 2c ... male corner (chamfered portion), 2d ... texture-shaped irregularities, 3 ... transport device, a ... thermoplastic resin sheet b ... preheating section, c ... Molding machine, d ... Storage section, e
... Transfer device.

Claims (1)

[Claims] 1. A thermoplastic resin sheet is used to chamfer the corners of a male mold and a female mold to have a radius of R 0.1 to 0.2 mm, and the surface of the male mold forming a storage portion is provided with unevenness of a grain pattern of 1 to 10 μm. Hold the mold at a constant temperature within the range of 40-80 ℃,
A method of manufacturing a carrier tape, characterized in that the storage portion of the carrier tape is formed by press molding.