JPH08156007A - Forming of resin molding and resin holding - Google Patents

Forming of resin molding and resin holding

Info

Publication number
JPH08156007A
JPH08156007A JP33075394A JP33075394A JPH08156007A JP H08156007 A JPH08156007 A JP H08156007A JP 33075394 A JP33075394 A JP 33075394A JP 33075394 A JP33075394 A JP 33075394A JP H08156007 A JPH08156007 A JP H08156007A
Authority
JP
Japan
Prior art keywords
resin
rubber
molding
based material
mixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33075394A
Other languages
Japanese (ja)
Inventor
Koji Komura
浩司 香村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Araco Co Ltd
Original Assignee
Araco Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Araco Co Ltd filed Critical Araco Co Ltd
Priority to JP33075394A priority Critical patent/JPH08156007A/en
Publication of JPH08156007A publication Critical patent/JPH08156007A/en
Pending legal-status Critical Current

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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE: To cause a mixing ratio to change partially in the case different types of material are mixed to form a resin molding. CONSTITUTION: A rubber material comprising a rubber ingredient containing a magnetic material and a resin material comprising polypropylene 21 as a main material are mixed, and this mixture is injected into a molding chamber 13. Then before being cured, the rubber ingredient is attracted by a magnet part 11a. Thus it is possible to change the mixing ratio of the materials easily in the cross-section structure of a resin bumper. The surface of the bumper is composed of a hard thin film layer 21 as a main material, so that it is hard and almost scrath-free, and as a whole, the bumper is of a soft resin contain ing a large amount of the rubber ingredient 23.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ゴム系材料と樹脂系材
料とを成形して構成される樹脂成型品の成型方法および
当該成型方法にて形成される樹脂成型品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for molding a resin molded product formed by molding a rubber material and a resin material, and a resin molded product formed by the molding method.

【0002】[0002]

【従来の技術】近年、自動車においては樹脂材料にて成
型した樹脂バンパが使用されている。樹脂バンパは耐衝
撃性が要求されるため、ゴム材料を混合して成型されて
いる。一方、予め樹脂材料を着色しておいて成型後の塗
装を省略することが知られているが、メタリック色の場
合は混合するアルミ粉と上記ゴム材料との相性が悪く、
そのまま混合して成型すると光沢が低下してしまう。
2. Description of the Related Art In recent years, resin bumpers made of a resin material have been used in automobiles. Since the resin bumper is required to have impact resistance, it is molded by mixing rubber materials. On the other hand, it is known that the resin material is colored in advance and coating after molding is omitted, but in the case of a metallic color, compatibility between the aluminum powder to be mixed and the rubber material is poor,
When mixed and molded as it is, the gloss decreases.

【0003】このため、従来は、図3及び図4に示すよ
うに、アルミ粉を混合した樹脂材料にて表面層1を成型
するとともに、ゴム材料を混合した樹脂材料にて内側層
2を成型してサンドイッチ構造の樹脂バンパ3を製造し
ていた。
Therefore, conventionally, as shown in FIGS. 3 and 4, the surface layer 1 is molded with a resin material mixed with aluminum powder, and the inner layer 2 is molded with a resin material mixed with a rubber material. And a resin bumper 3 having a sandwich structure was manufactured.

【0004】[0004]

【発明が解決しようとする課題】上述した従来の樹脂バ
ンパの場合、次のような課題があった。サンドイッチ構
造とするため、ゴム材料を混合した内側層の厚みが薄
く、耐衝撃性に劣る。アルミ粉を混合した表面層の場
合、単一層の場合に比べて薄くせざるを得ないため、金
型内に充填させるときに部分的に流動速度の差が生じ、
図5に示すように速度差の生じている部分でアルミ粉4
の向きが変化し、いわゆるウェルド模様が発生してしま
う。
The above-mentioned conventional resin bumper has the following problems. Since it has a sandwich structure, the thickness of the inner layer mixed with the rubber material is small and the impact resistance is poor. In the case of the surface layer mixed with aluminum powder, it has to be made thinner than the case of a single layer, so that a difference in the flow rate partially occurs when filling in the mold,
As shown in Fig. 5, aluminum powder 4
The orientation changes, and a so-called weld pattern occurs.

【0005】本発明は、上記課題にかんがみてなされた
もので、異種の材料を混合して樹脂成型品を成型する場
合に、部分的に混合割合を変化させることが容易な樹脂
成型品の成型方法の提供を目的とする。
The present invention has been made in view of the above problems, and when a resin molded product is molded by mixing different materials, it is easy to partially change the mixing ratio. The purpose is to provide a method.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するた
め、請求項1にかかる発明は、ゴム系材料と樹脂系材料
とを成型して構成される樹脂成型品の成型方法におい
て、上記ゴム系材料と上記樹脂系材料の一方に磁性材料
を含ませるとともに含有品と他方とを混合して金型内に
充填し、硬化する前に磁力にて上記含有品を所定方向に
引き寄せて成型している。
In order to achieve the above object, the invention according to claim 1 is a method for molding a resin molded article which is formed by molding a rubber material and a resin material. A magnetic material is included in one of the material and the resin-based material, and the contained product and the other are mixed and filled in a mold, and the contained product is attracted in a predetermined direction by magnetic force before molding and molded. There is.

【0007】また、請求項2にかかる発明は、請求項1
に記載の樹脂成型品の成型方法において、上記ゴム系材
料に上記磁性材料を含有せしめ、上記樹脂系材料にアル
ミ粉を混合させて成型している。さらに、請求項3にか
かる発明は、ゴム系材料と樹脂系材料とを成型して構成
される樹脂成型品において、上記ゴム系材料に磁性材料
を含ませるとともにこの含有品と上記樹脂系材料とを混
合して金型内に充填し、硬化する前に磁力にて上記含有
品を所定方向に引き寄せ、上記樹脂成型品の表面に上記
ゴム系材料の混合率が少ない樹脂系材料の薄膜層を形成
して構成してある。
The invention according to claim 2 is based on claim 1.
In the method for molding a resin-molded article described in (1), the magnetic material is contained in the rubber-based material, and aluminum powder is mixed with the resin-based material for molding. Furthermore, in the invention according to claim 3, in a resin molded product formed by molding a rubber-based material and a resin-based material, a magnetic material is included in the rubber-based material, and the contained product and the resin-based material are Is mixed and filled in a mold, and before being cured, the contained product is attracted in a predetermined direction by magnetic force, and a thin film layer of a resin-based material having a small mixing ratio of the rubber-based material is formed on the surface of the resin-molded product. It is formed and configured.

【0008】[0008]

【作用】上記のように構成した請求項1にかかる発明に
おいては、混合するゴム系材料と樹脂系材料の一方に磁
性材料を含ませてあり、混合して金型内に充填するとと
もに硬化する前に磁石などで磁力をあてると、磁性材料
を含んだ側が磁石の側に引き寄せられるため、引き寄せ
られる側はその成分が多い層となり、反対の側ではその
成分が少ない層となる。また、上記のように構成した請
求項2にかかる発明においては、ゴム系材料に磁性材料
を含有せしめてあるため、磁石の側にゴム系材料を多く
含んだ層が形成され、ゴム系材料が引き寄せられる側と
反対の側にアルミ粉が多く含まれる樹脂層が形成され
る。
In the invention according to claim 1 configured as described above, the magnetic material is contained in one of the rubber-based material and the resin-based material to be mixed, and the magnetic material is mixed and filled in the mold and cured. When a magnetic force is applied before with a magnet or the like, the side containing the magnetic material is attracted to the side of the magnet, so that the attracted side is a layer having a large amount of the component and the opposite side is a layer having a small amount of the component. In the invention according to claim 2 configured as described above, since the rubber-based material contains the magnetic material, a layer containing a large amount of the rubber-based material is formed on the magnet side, and the rubber-based material is A resin layer containing a large amount of aluminum powder is formed on the side opposite to the attracted side.

【0009】さらに、上記のように構成した請求項3に
かかる発明においては、ゴム系材料に磁性材料を含ませ
ておいて樹脂系材料とを混合し、金型内に充填して硬化
前に磁力でゴム系材料を引き寄せることにより、一面側
にゴム系材料の混合割合が少ない樹脂層が形成される。
すなわち、樹脂成型品の表面にはゴム系材料の混合率が
少ない樹脂系材料の薄膜層が形成される。
Further, in the invention according to claim 3 configured as described above, the magnetic material is contained in the rubber material, the resin material is mixed with the magnetic material, and the mixture is filled in the mold before being cured. By attracting the rubber-based material with a magnetic force, a resin layer having a small mixing ratio of the rubber-based material is formed on one surface side.
That is, a thin film layer of a resin material having a low mixing ratio of the rubber material is formed on the surface of the resin molded product.

【0010】[0010]

【発明の効果】以上説明したように本発明は、混合する
異種の材料の一方に含ませた磁性材料を引きつけること
によって樹脂成型品における材料の分布割合を部分的に
変化させることが可能な樹脂成型品の成型方法を提供す
ることができる。
As described above, according to the present invention, it is possible to partially change the distribution ratio of the material in the resin molded product by attracting the magnetic material contained in one of the different materials to be mixed. A molding method of a molded product can be provided.

【0011】また、請求項2にかかる発明によれば、一
面にゴム系材料を多く含む層を形成するとともに他面に
はアルミ粉が多く含まれるようにすることができる。さ
らに、請求項3にかかる発明によれば、一面側にゴム系
材料を多く集中させ、他面側にゴム系材料の混合率が少
ない樹脂系材料の薄膜層を形成した樹脂成型品を提供す
ることができる。これらによれば、樹脂成型品の内部で
樹脂系材料とゴム系材料の混合割合が異なる層を容易に
形成でき、当初の樹脂系材料とゴム系材料の混合割合に
応じて層の厚さも容易に薄くしたり厚くすることができ
る。
According to the second aspect of the present invention, it is possible to form a layer containing a large amount of rubber material on one surface while containing a large amount of aluminum powder on the other surface. Further, according to the invention of claim 3, there is provided a resin molded product in which a large amount of a rubber-based material is concentrated on one surface side and a thin film layer of a resin-based material having a small mixing ratio of the rubber-based material is formed on the other surface side. be able to. According to these, it is possible to easily form a layer in which the mixing ratio of the resin material and the rubber material is different inside the resin molded product, and the layer thickness can be easily adjusted according to the mixing ratio of the original resin material and the rubber material. It can be thin or thick.

【0012】樹脂成型品が樹脂バンパの場合において
は、表面層にゴム系材料を少しか含まない樹脂層が形成
されることにより表面だけが硬くて傷つきにくくするこ
とができる。また、全体の厚みを維持するのであれば、
表面層が薄くなった分ゴム系材料が厚くなって耐衝撃性
が増す。一方、耐衝撃性を維持すべくゴム系材料を多く
含む層の厚みを同一にし、表面層だけを薄くすることも
でき、このときは全体の厚みを薄くすることができる。
さらに、従来のように層ごとに薄く成型するのではない
ため、金型への充填時に部分的な流動速度の差も生じ難
く、ウェルド模様も生じない。なお、ゴム系材料の薄膜
層を形成することも容易であり、表面の滑りどめ加工な
どにおいて有用である。
When the resin molded product is a resin bumper, a resin layer containing a small amount of a rubber material is formed on the surface layer, so that only the surface is hard and is not easily scratched. Also, if you want to maintain the overall thickness,
The thinner the surface layer is, the thicker the rubber material is and the more the impact resistance is increased. On the other hand, in order to maintain impact resistance, it is also possible to make the layers containing a large amount of rubber-based material the same in thickness and thin only the surface layer, in which case the overall thickness can be reduced.
Further, since the layers are not thinly formed as in the conventional case, it is difficult to cause a partial difference in the flow rate when filling the mold, and a weld pattern does not occur. In addition, it is easy to form a thin film layer of a rubber-based material, and it is useful in surface slipping processing and the like.

【0013】[0013]

【実施例】以下、図面にもとづいて本発明の実施例を説
明する。図1は本発明の一実施例にかかる樹脂成型品の
成型方法で使用される金型の断面構造を示しており、図
2は成型される樹脂バンパの断面構造を示している。図
において、金型10は、凸形状のコア型11と凹形状の
キャビティ型12とから構成されている。コア型11
は、成型面に沿って内部に電磁石部11aを備えてお
り、外部より通電したときに成型面を磁力線が貫通する
ようになっている。言い換えれば、成型面に対してN極
あるいはS極が対面するように装着されている。本実施
例においては、コア型11の側に電磁石部11aを備え
ているが、必要に応じてキャビティ型12の側に備える
こともできるし、さらには、金型外に装着しておく構成
とすることもできる。いずれの場合も、磁性材料を含有
する成分を引き寄せたい方向に向けて磁力線が成型面を
通過するように配設すればよい。むろん、電磁石のみな
らず、耐熱性の永久磁石を利用することもできる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a sectional structure of a mold used in a method for molding a resin molded product according to an embodiment of the present invention, and FIG. 2 shows a sectional structure of a resin bumper to be molded. In the figure, a mold 10 is composed of a convex core mold 11 and a concave cavity mold 12. Core type 11
Has an electromagnet portion 11a inside along the molding surface so that magnetic lines of force penetrate through the molding surface when electricity is applied from the outside. In other words, the N pole or the S pole is mounted so as to face the molding surface. In this embodiment, the electromagnet portion 11a is provided on the core die 11 side, but it may be provided on the cavity die 12 side if necessary, and further, it may be attached outside the die. You can also do it. In any case, it may be arranged so that the magnetic force lines pass through the molding surface in the direction in which the component containing the magnetic material is desired to be drawn. Of course, not only electromagnets but also heat-resistant permanent magnets can be used.

【0014】一方、キャビティ型12内には成型面に開
口する樹脂の射出路12aを形成してあり、この射出路
12aは開口部においてゲート部12a1となり、他の
経路においてライナー部12a2となっている。コア型
11とキャビティ型12との間に形成される成型室13
は本実施例において樹脂バンパ20の形状となってお
り、図示しない射出成型機にてコア型11とキャビティ
型12とを保持し、上記射出路12aより溶融樹脂を充
填し、硬化後、両型11,12を開いて樹脂成型品であ
る樹脂バンパ20を取り出すようになっている。これら
の型11,12については、基本的には通常の樹脂成型
を行なう金型と同様であり、型形状、射出路について
は、成型品に応じて適当に決められる。
On the other hand, in the cavity mold 12, there is formed a resin injection path 12a which opens to the molding surface. The injection path 12a becomes the gate portion 12a1 at the opening and the liner portion 12a2 at the other path. There is. Molding chamber 13 formed between core mold 11 and cavity mold 12
Is the shape of the resin bumper 20 in this embodiment, holds the core mold 11 and the cavity mold 12 by an injection molding machine (not shown), fills the molten resin through the injection passage 12a, and after curing, The resin bumper 20 which is a resin molded product is taken out by opening 11 and 12. These molds 11 and 12 are basically the same as the molds for performing ordinary resin molding, and the mold shape and injection path are appropriately determined according to the molded product.

【0015】射出路12aを介して充填される溶融樹脂
は、ポリプロピレン21を主としてアルミ粉22を混合
した樹脂系材料と、磁性材料を含有させたゴム成分23
からなるゴム系材料とを混合して構成されている。本実
施例においては、ゴム成分23であるゴム系材料の側に
磁性材料を含有させているが、必要に応じて樹脂系材料
の側に磁性材料を含有させるようにしても良い。また、
樹脂系材料としてポリプロピレン21を利用している
が、樹脂成型品の使用目的に応じて素材を変えることが
できる。さらに、樹脂系材料とゴム系材料については、
必ずしも一種類のものに限定されず、他種類の材料を混
合するようにしても良い。
The molten resin filled through the injection passage 12a is a resin material containing polypropylene 21 mainly mixed with aluminum powder 22, and a rubber component 23 containing a magnetic material.
It is constituted by mixing with a rubber-based material consisting of. In this embodiment, the magnetic material is contained on the rubber material side which is the rubber component 23. However, the magnetic material may be contained on the resin material side as required. Also,
Polypropylene 21 is used as the resin material, but the material can be changed according to the purpose of use of the resin molded product. Furthermore, regarding resin-based materials and rubber-based materials,
The material is not necessarily limited to one type, and other types of materials may be mixed.

【0016】次に、本実施例の成型手順を説明する。樹
脂成型機にコア型11とキャビティ型12とをセット
し、両型11,12を閉じ合わせて上記樹脂系材料とゴ
ム系材料とを混合した溶融樹脂を射出路12aより成型
室13内に充填する。樹脂バンパ20は一層で形成され
ることになるため、成型室13の厚みは十分にあり、充
填時に溶融樹脂は滑らかに充填されていき、部分的な流
動速度に大きな差異は生じない。従って、アルミ粉22
の向きが局部的に変化するウェルド模様が生じることは
ない。
Next, the molding procedure of this embodiment will be described. The core mold 11 and the cavity mold 12 are set in the resin molding machine, and the molds 11 and 12 are closed to fill the molding chamber 13 with the molten resin obtained by mixing the resin material and the rubber material through the injection passage 12a. To do. Since the resin bumper 20 is formed of a single layer, the molding chamber 13 has a sufficient thickness, the molten resin is smoothly filled at the time of filling, and a large difference does not occur in the partial flow velocity. Therefore, the aluminum powder 22
There is no weld pattern in which the direction of is locally changed.

【0017】溶融樹脂を充填後、硬化する前に電磁石部
11aに通電する。電磁石部11aに通電すると、成型
室13内で磁性材料を含んだゴム成分23がコア型11
の側に引き付けられる。すなわち、図2に示すように、
樹脂バンパ20の断面においてはコア型11に接する面
の側にゴム成分23が引きつけられ、樹脂の分布割合に
おいてゴム成分23が多くなっている。すなわち、コア
型11に接する面の側ではゴム系材料の混合割合が大き
い層を形成し、キャビティ型12に接する面の側では樹
脂系材料の混合割合が大きい層を形成している。このと
き、図においては、キャビティ型12の側における樹脂
系材料の混合割合が大きい層の厚みを誇張して描いてあ
る。現実には、ゴム成分23をほとんど含まないポリプ
ロピレン21の薄膜層が形成されており、表面だけが硬
くて全体的にはゴム成分23によって柔らかで耐衝撃性
能の大きい樹脂バンパ20となっている。
After the molten resin is filled and before being cured, the electromagnet portion 11a is energized. When the electromagnet portion 11a is energized, the rubber component 23 containing the magnetic material in the molding chamber 13 becomes
Be attracted to. That is, as shown in FIG.
In the cross section of the resin bumper 20, the rubber component 23 is attracted to the side in contact with the core mold 11, and the rubber component 23 is large in the distribution ratio of the resin. That is, a layer having a large mixing ratio of the rubber material is formed on the side in contact with the core mold 11, and a layer having a large mixing ratio of the resin material is formed on the side in contact with the cavity mold 12. At this time, in the drawing, the thickness of the layer in which the mixing ratio of the resin material is large on the side of the cavity mold 12 is exaggeratedly drawn. In reality, a thin film layer of polypropylene 21 containing almost no rubber component 23 is formed, and only the surface is hard, and the rubber component 23 as a whole makes the resin bumper 20 soft and large in impact resistance.

【0018】アルミ粉22とゴム成分23の相性は良く
ないが、ゴム成分23がコア型11の側に引き寄せられ
るときに相対的にアルミ粉22がキャビティ型12の側
に押しやられ、表面に集まって光沢の劣化は生じない。
ところで、磁性材料を電磁石にて引き寄せて樹脂材料の
一面側に集める技術が特開昭62−198423号公報
に開示されている。同公報に示す技術は、単に樹脂材料
に磁性材料を含有させるものであり、磁性材料を一面側
に寄せて他面側の発色性を向上させている。すなわち、
単一の樹脂層内での磁性材料を寄せ集める技術である。
The compatibility between the aluminum powder 22 and the rubber component 23 is not good, but when the rubber component 23 is drawn toward the core mold 11, the aluminum powder 22 is relatively pushed toward the cavity mold 12 side and gathers on the surface. The gloss does not deteriorate.
By the way, Japanese Patent Laid-Open No. 62-198423 discloses a technique of attracting a magnetic material with an electromagnet and collecting it on one side of a resin material. The technique disclosed in the publication simply involves adding a magnetic material to a resin material, and the magnetic material is brought closer to one surface side to improve the color developability on the other surface side. That is,
This is a technology for gathering magnetic materials in a single resin layer.

【0019】これに対し、本発明では、異種の材料をよ
り分けて材料同士の混合割合を適切にするという大きな
差異がある。特に、一方の材料の膜厚については、通常
の樹脂成型では得られない程度、すなわち、射出成型レ
ベルから塗装レベルへという薄膜化を容易に行うことが
できる。このように、磁性材料を含有させたゴム成分2
3からなるゴム系材料とポリプロピレン21を主とする
樹脂系材料とを混合して成型室13に射出し、硬化する
前に電磁石部11aでゴム系材料を引き寄せることによ
り、樹脂バンパ20の断面構造において材料の混合割合
を容易に変化させることができる。ここにおいて、表面
はポリプロピレン21を主とする硬い薄膜層が形成さ
れ、表面は硬くて傷つき難く、全体的にはゴム成分23
の多い柔らかな樹脂バンパ20となる。
On the other hand, in the present invention, there is a big difference in that different kinds of materials are further divided so that the mixing ratio of the materials is appropriate. In particular, the film thickness of one of the materials can be easily reduced to a level that cannot be obtained by ordinary resin molding, that is, from the injection molding level to the coating level. Thus, the rubber component 2 containing the magnetic material
The rubber-based material composed of 3 and a resin-based material mainly composed of polypropylene 21 are mixed and injected into the molding chamber 13, and the rubber-based material is attracted by the electromagnet portion 11a before being cured. In, it is possible to easily change the mixing ratio of the materials. Here, a hard thin film layer mainly composed of polypropylene 21 is formed on the surface, and the surface is hard and is not easily scratched.
It becomes a soft resin bumper 20 with many.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例にかかる樹脂成型品の成型方
法で使用する金型の概略断面図である。
FIG. 1 is a schematic cross-sectional view of a mold used in a method for molding a resin molded product according to an embodiment of the present invention.

【図2】樹脂バンパの断面図である。FIG. 2 is a sectional view of a resin bumper.

【図3】従来の樹脂バンパの斜視図である。FIG. 3 is a perspective view of a conventional resin bumper.

【図4】従来の樹脂バンパの断面図である。FIG. 4 is a sectional view of a conventional resin bumper.

【図5】従来の樹脂バンパにおけるウェルド模様の発生
状況を示す説明図である。
FIG. 5 is an explanatory diagram showing a generation state of a weld pattern in a conventional resin bumper.

【符号の説明】[Explanation of symbols]

10…金型 11…コア型 11a…電磁石部 12…キャビティ型 13…成型室 20…樹脂バンパ 21…ポリプロピレン 22…アルミ粉 23…ゴム成分 10 ... Mold 11 ... Core type 11a ... Electromagnet part 12 ... Cavity type 13 ... Molding chamber 20 ... Resin bumper 21 ... Polypropylene 22 ... Aluminum powder 23 ... Rubber component

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B29K 503:06 B29L 31:30 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location B29K 503: 06 B29L 31:30

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 ゴム系材料と樹脂系材料とを成型して構
成される樹脂成型品の成型方法において、 上記ゴム系材料と上記樹脂系材料の一方に磁性材料を含
ませるとともにこの含有品と他方とを混合して金型内に
充填し、硬化する前に磁力にて上記含有品を所定方向に
引き寄せることを特徴とする樹脂成型品の成型方法。
1. A method of molding a resin molded product formed by molding a rubber-based material and a resin-based material, wherein one of the rubber-based material and the resin-based material contains a magnetic material and A method for molding a resin molded product, characterized in that the other product is mixed and filled in a mold, and before being cured, the contained product is attracted in a predetermined direction by magnetic force.
【請求項2】 上記請求項1に記載の樹脂成型品の成型
方法において、上記ゴム系材料に上記磁性材料を含有せ
しめ、上記樹脂系材料にアルミ粉を混合させたことを特
徴とする樹脂成型品の成型方法。
2. The resin molding method according to claim 1, wherein the rubber material contains the magnetic material, and the resin material is mixed with aluminum powder. How to mold the product.
【請求項3】 ゴム系材料と樹脂系材料とを成型して構
成される樹脂成型品において、 上記ゴム系材料に磁性材料を含ませるとともにこの含有
品と上記樹脂系材料とを混合して金型内に充填し、硬化
する前に磁力にて上記含有品を所定方向に引き寄せ、上
記樹脂成型品の表面に上記ゴム系材料の混合率が少ない
樹脂系材料の薄膜層を形成したことを特徴とする樹脂成
型品。
3. A resin molded product formed by molding a rubber-based material and a resin-based material, wherein the rubber-based material contains a magnetic material, and the product containing the magnetic material is mixed with the resin-based material. It is characterized in that it is filled in a mold, and before being hardened, the contained product is attracted in a predetermined direction by a magnetic force, and a thin film layer of a resin material having a small mixing ratio of the rubber material is formed on the surface of the resin molded product. Molded resin products.
JP33075394A 1994-12-06 1994-12-06 Forming of resin molding and resin holding Pending JPH08156007A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33075394A JPH08156007A (en) 1994-12-06 1994-12-06 Forming of resin molding and resin holding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33075394A JPH08156007A (en) 1994-12-06 1994-12-06 Forming of resin molding and resin holding

Publications (1)

Publication Number Publication Date
JPH08156007A true JPH08156007A (en) 1996-06-18

Family

ID=18236172

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33075394A Pending JPH08156007A (en) 1994-12-06 1994-12-06 Forming of resin molding and resin holding

Country Status (1)

Country Link
JP (1) JPH08156007A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111329605A (en) * 2020-03-10 2020-06-26 上海长瑞医疗科技有限公司 3D tooth model preparation method and system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111329605A (en) * 2020-03-10 2020-06-26 上海长瑞医疗科技有限公司 3D tooth model preparation method and system

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