JPH08150518A - Bulk case - Google Patents

Abstract

PURPOSE: To prevent generation of fine particles due to contact between chip parts in a bulk case, by rotatably providing an impeller having pairs of plate- like blades in the bulk case so as to prevent unnecessary agitation to the chip parts in the case. CONSTITUTION: During agitation for electronic chip parts located at an inlet part by air jetted from a part agitating nozzle, blades of impellers 11, 11 provided in a bulk case 1 serve as walls for restraining the agitation of the electronic chip parts. With this arrangement, the agitation of the electronic chip parts can be restrained. Accordingly, almost no contact between electronic chip parts occurs in the bulk case even during the agitation by the jetted air. Thereby, generation of fine particles due to contact is very rare.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a novel bulk case. Specifically, in a bulk case that is detachably mounted in a bulk cassette for supplying chip components to an electronic component mounting device and that stores the bulked chip components,
When the chip parts are agitated by the air for supplying the chip parts, it is possible to prevent the generation of fine particles for contacting the chip parts by preventing unnecessary agitation of the chip parts in the bulk case, An object of the present invention is to provide a bulk case in which blackening of a chip component due to adhesion of fine particles to the chip component is prevented in advance, and thus defective soldering of the chip component to a printed circuit board is prevented.

[0002]

2. Description of the Related Art A high speed chip component mounting machine for mounting electronic component chips on a printed circuit board is known. This will be briefly described with reference to FIGS. 6 to 9.

Reference numeral a is a high-speed chip component mounting machine, which is provided with a component supply device b for supplying electronic components chips in a bulked state, that is, in an unloaded state, to a printed circuit board at a substantially central portion. c is a moving base of the component supplying device b, and a large number of bulk cassettes d,
.. are arranged in the moving direction of the moving base c.

The bulk cassette d is known, and an engaging portion (not shown) at its front end is engaged with the front end of the moving base c, and a clamp pawl e provided at its rear end is operated by a clamp lever f. Is attached to the moving base c by engaging with the rear end of the moving base c.

Reference numeral g denotes a bulk case, and a large number of electronic component chips h, h, ... Are stored in the bulk case g. The bulk case g is provided with a thin box-shaped storage part i and an engagement part j for connecting the bulk cassette d, and the electronic component chips h, h, ... Are stored in the storage part i. ing. An opening k is formed in the front end surface of the engaging portion j, and the opening k is opened and closed by a shutter 1 slidably provided in the storage portion i.

The bulk case g is attached to the bulk cassette d with its engaging portion j engaged with the guide portion m of the bulk cassette d, and the shutter 1 is slid to open the opening k. In this way, the bulk case g is set in the bulk cassette d.

Thus, the electronic component chips h, h, ... From the opening k of the bulk case g to the entrance o of the chute n.
Leading to. Then, when the feed lever p of the bulk cassette d is pressed downward by a pressing portion (not shown), positive pressure air is supplied from the air supply port q, and the air is supplied through the air supply passage r to the component stirring nozzle s and the component chute. , Which are jetted from the nozzle t and located at the inlet o, are agitated, one of them falls into the chute n, and the dropped electronic component chip h is the above-mentioned component. The air jetted from the chute nozzle t sends the air to the component supply unit u.

The electronic component chips h, h, ... Supplied to the component supply unit u are taken out by the suction nozzles v, v, ... And mounted on the printed circuit board.

[0009]

In the bulk cassette d, when the electronic component chips h, h, ... Are sent to the component supply section u of the bulk cassette d, they are jetted from the component chute nozzle t. The electronic component chip h whose air is located at the entrance o of the chute n,
Since the inlets o and the interior of the bulk case g are communicated with each other, the air extends into the bulk case g and the electrons located in the storage portion i of the bulk case g. The component chips h, h, ... Are also agitated.

The stirring of the electronic component chips h, h, ... In the bulk case g is unnecessary, and the stirring causes the generation of fine particles due to the contact between the electronic component chips h, h ,. The fine particles are electronic component chips h,
By attaching to the electronic component chip h,
h, ... turn black. Then, when the electronic component chips h, h, ... With fine particles attached thereto are mounted on a printed circuit board and soldered, soldering failure occurs due to deterioration of so-called solder wettability, resulting in failure of the printed circuit board. I was letting it.

[0011]

SUMMARY OF THE INVENTION The bulk case of the present invention comprises:
In order to solve the above-mentioned problems, a bulk case detachably mounted in a bulk cassette for supplying a chip component to an electronic component mounting apparatus, the impeller having a plurality of pairs of plate-shaped blades therein. Is rotatably provided.

In order to solve the above-mentioned problems, another bulk case of the present invention is a bulk case detachably attached to a bulk cassette for supplying a chip component to an electronic component mounting apparatus. A resistance rod extending in the thickness direction of the bulk case is provided inside.

[0013]

Therefore, according to the bulk case of the present invention, when the chip component is agitated by the air for supplying the chip component, the blades of the impeller function as walls for the agitation of the chip component in the bulk case. Unnecessary agitation on the chip components in the case is suppressed, and therefore, fine particles for contacting the chip components in the bulk case are hardly generated, and the fine particles are attached to the chip components to prevent the chip components from contacting each other. Blackening is prevented in advance, and eventually, defective soldering of chip components to a printed circuit board does not occur.

According to another bulk case of the present invention,
When the chip parts are agitated by the air for supplying the chip parts, the resistance rod functions as a wall against the agitation of the chip parts in the bulk case, so that unnecessary agitation of the chip parts in the bulk case is suppressed, and , There is almost no generation of fine particles for contact between the chip components in the bulk case, and the blackening of the chip components due to the adhesion of the fine particles to the chip components is prevented in advance. It does not cause defective soldering.

[0015]

The details of the bulk case of the present invention will be described below with reference to the illustrated embodiments.

1 to 4 show the first bulk case of the present invention.
1 shows an example of the implementation of the above.

In the figure, reference numeral 1 is a bulk case, and 2 is an accommodating portion thereof.

The accommodating portion 2 is composed of an outer casing 3 having a flat box shape, and the outer casing 3 is formed of transparent plastic so that the electronic component chips accommodated therein can be visually recognized from the outside. ing.

An engaging portion 4 serving as a connecting portion for connecting to the bulk cassette is integrally formed at one end of the storage portion 2. The engagement portion 4 is formed with an opening 5 for communicating the inside and outside of the storage portion 2, and is opened and closed by a shutter 6.

Reference numeral 7 denotes a knob provided at the base end of the shutter 6, which is located in a facing hole 8 formed on the upper surface. The bulk electronic component chips 9, 9, ... Are housed in the bulk case 1. When the bulk case 1 is attached to the bulk cassette 10, the shutter 6 is opened and the opening 5 is opened, so that the electronic component chips 9, 9, ...
Will be supplied within 0.

Impellers 11 and 11 are composed of a cylindrical shaft portion 11a and a plurality of pairs of blades 11b, 11b, ... Protruding from the outer periphery of the shaft portion 11a at equal intervals. The shaft portion 11a has an insertion hole 11c extending in the axial direction thereof.
Is pierced.

Reference numerals 12 and 12 denote mounting screws, which are inserted through insertion holes 11c formed in the shaft portion 11a through insertion holes (not shown) formed in one side surface of the outer casing 3 to form the outer casing 3.
It is screwed into a female screw (not shown) provided on the inner surface of the other side surface portion of the. As a result, the impellers 11, 11 are rotatably attached inside the bulk case 1.

When the bulk case 1 is attached to the bulk cassette 10, the electronic component chips 9, 9, ...
.. is supplied to the inlet portion 14 of the chute 13 serving as a component transport path.

Then, when the pressing portion of the component mounting machine (not shown) presses the feed lever 15, the electronic component chips 9, 9, ... Are supplied to the individual component supplying portion 16.
That is, when the feed lever 15 is pressed, positive pressure air is supplied from a positive pressure air supply device (not shown) connected to the air supply port 17, and the positive pressure air causes the electronic component chips 9, 9 ,. It is supplied to the component supply unit 16 through the chute 13.

Reference numeral 18 denotes an air supply path extending from the air supply port 17 toward the inside.
Is branched at its tip into two parts, one of which is connected to a component stirring nozzle 19 which is opened on the lower surface of the inlet portion 14 of the chute 13 and the other of which is directed to the component supply portion 16 side on the lower surface of the middle portion of the chute 13. It is connected to the component chute nozzle 20 which is opened. Reference numeral 21 is a check valve inserted in a position near the air supply port 17 of the air supply passage 18 for preventing backflow of the air supplied into the air supply passage 18 to the air supply port 17 side. belongs to.

However, when positive pressure air is supplied from the air supply port 17, the air is jetted from the component stirring nozzle 19 and the component chute nozzle 20 through the air supply passage 18, and is positioned at the inlet portion 14. The electronic component chips 9, 9, ... Are being agitated, and one of them falls onto the chute 13 and is sent to the component supply unit 16 by the air jetted from the component chute nozzle 20. To be

By the way, the above-mentioned component stirring nozzle 19
The air jetted from is necessary to drop the electronic component chips 9, 9, ... Located in the inlet portion 14 into the stirring chute 13, but the air blown from the chute inlet portion 14 into the bulk cassette 10 Unnecessary air reaches the inside of the bulk case 1.

However, the above-mentioned impellers 11, 11 are provided in the bulk case 1, and the impellers 11b, 11b, ... Of the impellers 11, 11 have electronic component chips 9, 9 ,.
... Electronic component chips 9, 9 in the bulk case 1 to function as walls for suppressing agitation.
Stirring is suppressed. Therefore, in the bulk case 1, the chip components 9, 9, ...
..Almost no contact between them and generation of fine particles due to the contact.

The impellers 11 and 11 have shaft portions 11a and 11
Since it rotates around a, it does not hinder the supply of the electronic component chips 9, 9, ... From the inside of the bulk case 1 to the bulk cassette 10.

Further, the blade 11 is considered in consideration of the rotation balance.
A plurality of pairs of b, 11b, ... Are formed, and their lengths and thicknesses are set within a range that does not impair the above-mentioned function of the present invention.

Further, the number of impellers 11 mounted in the bulk case 1 is set within a range that does not hinder the supply of the electronic component chips 9, 9, ... From the bulk case 1 to the bulk cassette 10. Just go.

FIG. 5 shows an example 1A of an embodiment of the second bulk case of the present invention.

Compared with the bulk case 1, only the parts of the impellers 11 and 11 of the bulk case 1A are changed, and the other parts are the same as those of the bulk case 1, so only the changed parts will be described in detail. However, the other parts are given the same reference numerals as the same parts in the bulk case 1 and the description thereof is omitted.

Numerals 22, 22, ... Are cylindrical resistance rods, which are provided so as to project from the inner surface of one side surface portion of the outer casing 3 of the bulk case 1A toward the other side surface portion, and Are staggered.

The resistance rods 22, 22, ... Are made of a metal material, but other materials may be used as long as they have excellent conductivity.

The air jetted from the component stirring nozzle 19 reaches the inside of the bulk case 1 from the chute inlet 14 through the inside of the bulk cassette 10. However, in the bulk case 1A, the resistance rods 22, 22, ...
.. are provided, and the resistance rods 22, 22, ... function as walls for suppressing the stirring of the electronic component chips 9, 9 ,. 9, ... Stirring is suppressed. Therefore, in the bulk case 1, there is almost no contact between the chip components 9, 9, ... Due to agitation of air, and there is almost no generation of fine particles due to the contact.

The cylindrical shape of the resistance rods 22, 22, ... Does not hinder the supply of the electronic component chips 9, 9, ... From the bulk case 1 to the bulk cassette 10. However, any shape may be used as long as it does not hinder the supply.

Further, in order to exert the function of the present invention, it is appropriate that the number of resistance rods 22, 22, ... Is 6 or more.

[0039]

As is apparent from the above description, the bulk case of the present invention is a bulk case detachably mounted on a bulk cassette for supplying chip components to an electronic component mounting apparatus. It is characterized in that an impeller having a plurality of pairs of plate-shaped blades is rotatably provided inside.

Therefore, according to the bulk case of the present invention, when the chip parts are agitated by the air for supplying the chip parts, the blades of the impeller function as walls for the agitation of the chip parts in the bulk case. Unnecessary agitation of the chip components in the case is suppressed, that is, fine particles for contacting the chip components in the bulk case are hardly generated, and the fine particles are attached to the chip components to prevent the chip components from contacting each other. Blackening is prevented in advance, and eventually, defective soldering of chip components to a printed circuit board does not occur.

According to another bulk case of the present invention,
A bulk case detachably mounted in a bulk cassette for supplying a chip component to an electronic component mounting apparatus, wherein a resistance rod extending in the thickness direction of the bulk case is provided therein.

Therefore, according to another bulk case of the present invention, when the chip part is agitated by the air for supplying the chip part, the resistance rod functions as a wall for the agitation of the chip part in the bulk case. Unnecessary agitation of the chip components in the case is suppressed, that is, fine particles for contacting the chip components in the bulk case are hardly generated, and the fine particles are attached to the chip components to prevent the chip components from contacting each other. Blackening is prevented in advance, and eventually, defective soldering of chip components to a printed circuit board does not occur.

It should be noted that the shapes and structures of the respective parts shown in the above-mentioned embodiments are merely examples of the embodiment when carrying out the present invention, and the technical scope of the present invention is limited thereby. It should not be construed in a conventional way.

[Brief description of drawings]

1 shows an example of an implementation of the first bulk case of the present invention together with FIG. 2, and is a perspective view.

FIG. 2 is an enlarged perspective view showing an impeller.

FIG. 3 is a schematic perspective view showing a bulk cassette.

FIG. 4 is an enlarged cross-sectional view showing a part of the internal mechanism of the bulk cassette.

FIG. 5 shows an example of implementation of the second bulk case of the present invention, which is a perspective view.

6 is a schematic view of a component mounting machine together with FIG. 7, and is a perspective view.

FIG. 7 is a side view.

FIG. 8 is an enlarged sectional view showing a part of an internal mechanism of a conventional bulk cassette.

FIG. 9 is a perspective view showing a conventional bulk case.

[Explanation of symbols]

 1 Bulk Case 9 Electronic Component Chip (Chip Component) 10 Bulk Cassette 11 Impeller 11b Impeller 1A Bulk Case 22 Resistance Rod

Claims (5)

[Claims] 1. A bulk case detachably mounted in a bulk cassette for supplying chip components to an electronic component mounting apparatus, wherein an impeller having a plurality of pairs of plate-shaped blades is rotatable therein. A bulk case characterized by being provided. 2. The bulk case according to claim 1, wherein a plurality of the impellers are provided. 3. A bulk case detachably mounted in a bulk cassette for supplying a chip component to an electronic component mounting apparatus, wherein a resistance rod extending in the thickness direction of the bulk case is provided therein. Characteristic bulk case. 4. The bulk case according to claim 3, wherein a plurality of the resistance rods are provided. 5. The bulk case according to claim 3, wherein the resistance rod has a cylindrical shape.