JPH0814586B2 - Method of manufacturing probe card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Field of Industrial Application) The present invention relates to a method for manufacturing a probe card.

(Prior Art) Conventionally, in a semiconductor manufacturing process, in order to inspect a semiconductor chip formed on a semiconductor wafer, a probe contact end of a probe card is connected to an electrode pad of each chip on which a conductor pattern is formed, Various electric characteristics are measured and inspected. As a method of manufacturing such a probe card, for example, there is a method disclosed in Japanese Patent Publication No. 54-23798. According to this publication, an opening is provided in a printed wiring board, a base member is attached substantially concentrically with the opening, and a large number of probe needles are cantilevered and supported by the base member. At the time of this manufacturing, insert the tips into the holes of the sheet so that the tips of the probe needles are aligned in a plane orthogonal to each other, and the tips of the probe needles, that is, the contact edges with the DUT are set at predetermined positions. Was. In this positioning, since the probe needle is extremely fine, the operator inserts it into the hole of the probe needle positioning sheet and fixes the position while monitoring the tip of the probe needle with a microscope.

(Problems to be Solved by the Invention) However, in the conventional method of fixing the position of the probe needle tip, that is, the contact end with the object to be inspected, the probe needle tip and the hole of the positioning sheet are extremely small, so the working time is long. In addition, the operator's skill is required, and since the work is performed while looking at the microscope, fatigue is high and it is difficult to work continuously for a long time.

Further, it is conceivable that positioning is performed by a robot hand or the like with reference to a reference surface provided on the probe needle, but if the probe needle is gripped by the robot hand or the like,
Since the probe needle has length and bending during manufacturing, even if the probe needle grips a predetermined position with the robot hand, the contact end of the probe needle is not always in a fixed position, so a highly accurate probe Making cards was difficult.

The present invention has been made to solve the above problems, and can speed up the positioning work by automatically and accurately positioning the contact end of the probe.
Accordingly, it is an object of the present invention to provide a method of manufacturing a probe card that can automate the manufacturing of the probe card.

[Structure of Invention]

(Means for Solving Problems) The probe card manufacturing method of the present invention, when manufacturing the probe card, when positioning the probe in space so that the contact end of the probe is at a predetermined mounting position, the gripping means After gripping the reference surface of the probe with the first and second imaging means from the two sides of the side surface of the probe and the front surface of the contact end of the probe, the imaging pattern from the two directions is recognized. , Comparing these recognition patterns with a predetermined reference pattern,
The probe is positioned by moving the gripping means based on the result of the comparison so that each imaging pattern matches the reference pattern, and the position is stored in the storage device.

Further, in the present invention, it is possible to attach the probe to a predetermined position of the support for the probe card by applying a correction necessary for positioning the probe from the information of the probe stored in the storage device. preferable.

(Operation and Effect) According to the present invention, when the probe is positioned in space so that the contact end of the probe becomes a predetermined mounting position in manufacturing the probe card, the reference surface of the probe is gripped by the gripping means, The first and second image capturing means images the probe from two sides of the side surface of the probe and the front surface of the contact end of the probe to recognize the image capturing patterns from the two directions, and then the recognition patterns are determined by a predetermined reference. The probe is positioned by comparing the pattern with the pattern, and moving the gripping means based on the comparison result to match each imaging pattern with the reference pattern, and the position is stored in the storage device. Even if there is a manufacturing error in itself, the imaging patterns from the two directions obtained by the first and second imaging means are used as the basis. The contact end of the probe can be accurately positioned in conformity with the quasi-pattern, and the working operation efficiency of the device can be improved by storing this position in the storage device. Therefore, according to the present invention, the positioning of the contact end of the probe can be performed automatically and accurately to speed up the positioning work, and the operating efficiency of the device can be improved by storing the position. Therefore, the manufacture of the probe card can be automated.

Further, in the present invention, by applying the correction necessary for positioning of the probe from the information of the probe stored in the storage device, the probe is attached to the predetermined position of the support for the probe card. , It is possible to speed up the work by automating the work of attaching the probe to the support.

(Example) Next, the manufacturing method of the probe card of this invention is demonstrated with reference to drawings.

As shown in FIG. 5, the probe card (1) has printed wirings (2), that is, printed wiring (2) made of a conductive material in an insulating state, on a circular insulating substrate made of an insulating material such as synthetic resin. For example, a substantially circular opening (4) is provided around the center of the substrate (3). One end of the printed wiring (2) is connected to a terminal (5) connected to a tester (not shown), and the other end is connected to a probe, for example, a probe needle (6). or,
A support ring (7) made of, for example, ceramics and electrically insulating concentrically with the opening (4) is adhered to the printed circuit board (3). The support ring (7) is
It has an opening similar to the opening (4) provided on the printed circuit board (3), and has a conical truncated taper surface on one side. Further, on this taper surface, for example, radial grooves that are slightly wider than the outer diameter of the probe needle (6) and slightly deeper than the outer diameter of the probe needle (6) are provided. The probe needle (6) is attached to the groove with solder or adhesive. Here, one end of the probe needle (6) is connected to the printed wiring (2) formed on the printed circuit board (3), and the printed wiring (2) is connected.
It can be electrically connected to a tester (not shown) through a terminal (5) connected to the tester. The probe needle (6) has a diameter of, for example, 250 μm and is made of a conductive material such as tungsten, and the contact end (8), which is a contact portion with the object to be inspected, has a tapered shape, for example. The diameter at the end position is, for example, 50 μm. Further, it is bent in advance at a predetermined angle, for example 100 °, at a position of, for example, 250 μm from the contact end (8) of the probe needle (6).

Further, at a predetermined position of the probe needle (6), for example, one end of the connection position with the printed circuit board (3), a reference point for confirming the position of the tip of the probe needle (6) in the bending direction is used. The surface (9), that is, the flat surface (9) is formed at a predetermined position (see FIG. 1). Therefore, if the flat surfaces (9) are aligned for many probe needles (6), the tips of the probe needles (6) will be aligned.

As described above, when the probe card (1) is manufactured, the contact end (8) of the probe needle (6) has an array pattern of the electrode pads of the IC chip formed on the device under test, for example, a semiconductor wafer, It is necessary to attach each probe needle (6) to the support ring (7) so that they coincide. An apparatus for recognizing the position of the contact end (8) of each probe needle (6) will be described with reference to FIG.

This device is provided with a robot hand (10) as a gripping means, which can grip and take out the probe needles (6) one by one from a large number of probe needles (6) housed in a tray stocker (not shown). This Robot Hand (10)
Moves the robot hand (10) horizontally, vertically or X
It is engaged with a drive device (11) capable of axial rotation about the Y and Z directions and the longitudinal direction of the probe needle (6), that is, θ rotation. Further, a control device (12) capable of highly controlling the movement of the robot hand (10) such as the position and direction by the drive device (11) is connected to the drive device (11). The grip portion of the probe needle (6) of the robot hand (10) has a shape corresponding to the reference surface (9) of the probe needle (6), and the gripped probe needle (6) has a contact end (8). The directions are aligned. Probe needle here (6)
Is imaged by the first and second ITV cameras (13) and (14) as first and second imaging means provided at two locations.
Since the probe needle (6) is installed in a space within a predetermined range, the first ITV camera (13) is placed at a horizontal position where almost the entire side surface of the probe needle (6) can be imaged. It is set up. That is, the imaging range (A) of the first ITV camera (13) is set in consideration of the manufacturing error in the longitudinal direction that may occur during manufacturing of the probe needle (6) and the error in the gripping position by the robot hand (10). It was done. Further, a second ITV camera (14) having a high magnification is arranged vertically downward toward a reference range (B) in a predetermined space. A pattern recognition device (15) is provided for performing pattern recognition processing on the imaging output from these ITV cameras (13) (14). With this pattern recognition device (15), the contact end (8) of the probe needle (6) is positioned in the horizontal X direction and the vertical Z direction from the imaged output of the first ITV camera (13), and the second The contact end (8) of the probe (6) is positioned in the rotation θ direction based on the imaged output of the ITV camera (14). The shape and contact end (8) position of each probe needle (6) positioned by the above mechanism are stored in the storage device (16). A device for attaching the probe needle (6) to a predetermined position of the support ring (7) while positioning the tip (8) of the probe needle (6) from the stored information of the storage device (16) is also configured. ing. As shown in FIG. 2, this device is provided with a second robot hand (17) which holds the probe needle (6) at a predetermined position. The second robot hand (17) is capable of axial rotation, that is, θ rotation about the horizontal direction, the vertical direction, that is, the X, Y, Z directions and the longitudinal direction of the probe needle (6). The operation of the second robot hand (17) is performed by the storage device (1
It receives the output signal from 6) and is controlled by the second control device (18). Further, in the downward direction of the probe needle (6) held by the second robot hand (17), an XY table (19) configured to be rotatable in the XYZ directions and within the Z axis.
Is provided. A mounting jig (20) for mounting the support ring (7) is provided on the XY table (19). Further, a laser irradiation device (21) is provided so as to irradiate and output a laser beam perpendicularly to the probe needle (6) mounting surface of the support ring (7) mounted on the mounting jig (20). .

Next, a method for manufacturing a probe card from the positioning of the contact end (8) of the probe needle (6) by the above-mentioned apparatus will be described.

From the tray stocker (not shown) in which a plurality of probe needles (6) are arranged according to a predetermined program, the first probe needle (6) is referred to by the reference surface (9) by the robot hand (10). Automatically grip and take out. At this time, the directions of the contact ends (8) of the probe needles (6) are substantially aligned unless the probe needles (6) have an error such as bending. Then, the probe hand (6) is conveyed within a predetermined reference range by the robot hand (10). At this position, the side surface of the probe terminal (1) is imaged from the horizontal direction by the first ITV camera (13). This image pickup output signal is binarized and supplied to the pattern recognition device (15). Here, the image pickup output is compared with a preset reference pattern, and the robot hand (10) is moved by the drive device (11) so that the two coincide with each other by the control device (12).

This movement is performed for positioning the probe needle (6) in the longitudinal direction, that is, the X direction and in the height direction, that is, the Z direction. For example, since the lengths of the probe needles (6) are not the same due to manufacturing error or the like, even if the robot hand (10) is installed at a predetermined position, as shown in FIGS. The contact end (8) of 6) is within the imaging range (A) of the first ITV camera (13), but the second ITV
It may be outside the imaging reference range (B) of the camera (14). At this time, as shown in FIGS. 3C and 3D, the contact end (8) of the probe needle (6) is placed in the imaging reference range (B) of the second ITV camera (14) so that the above pattern is formed. Perform recognition operation. After aligning the contact end (8) of the probe needle (6) in the longitudinal direction and the height direction by the first ITV camera (13) as described above, the second ITV camera (14)
Position by. This second ITV camera (14)
As shown in FIG. 4, the positioning is performed in the axial rotation about the longitudinal direction of the probe needle (6), that is, in the θ rotation direction, and pattern recognition is performed in the same manner as the first ITV camera (13). . For example, as shown in FIG. 4 (A), when the θ rotation direction of the probe needle (6) is deviated due to the bending of the probe needle (6), the imaging output of the second ITV camera (14) is binary. It is converted into a pattern and compared with a reference pattern expected by the pattern recognition device (15). In this comparison, since the two do not match, a signal from the control device (12) is received and the robot hand (10) is rotated by θ by the drive device (11).
The pattern is recognized by rotating them so that both of them coincide with each other and the contact end (8) of the probe needle (6) faces a predetermined direction as shown in FIG. 4 (B). Here, the result of the pattern recognition of the first and second ITV cameras (13) and (14), that is, the position of the contact end (8) of the probe needle (6) is set to the robot hand (10).
The recognition result is stored in the storage device (16). After that, the probe needle (6) is stored in a predetermined position of a tray stocker (not shown) from the robot hand (10) by a predetermined operation.

Perform the positioning operation as described above with one probe needle (6)
Repeatedly store the books in the specified tray stocker.

Next, the probe needle (6) stored in this tray stocker is attached to the support ring (7). At the time of this attachment, first, the support ring (7) is set on the mounting jig (20) on the XY table (19) with the positioning and the direction strictly regulated. In addition, the support ring (7) is pre-filled with a solder having a shape that does not hinder the insertion of the probe needle (6), such as powder solder or solder cream, into the groove provided in the support ring (7). Use what has been done. With the support ring (7) set, the second robot hand (17) grasps and takes out the probe needle (6) stored in the tray stocker while being positioned. Then, the position information of the contact end (8) of the probe needle (6) is supplied from the storage device (16) to the second control device (18). From this information the second control device (18)
Then, the second robot hand (17) is moved to position the contact end (8) of the probe needle (6) at the reference position in space.

On the other hand, when the second robot hand (17) grips the first probe, the XY table (19) drops the probe needle (6) vertically downward from the reference position. 6) is inserted into a predetermined concave groove, and rotation and movement in the X, Y, Z directions are performed and waiting is performed so that the contact end thereof has a predetermined positional relationship with the support ring (7).

When the groove is moved to the groove position after the above positioning, the second
When the robot hand (17) of FIG. 1 is in agreement with the servo control and then descends vertically by a predetermined distance by the numerical control, the probe needle (6) is moved in the space of the concave groove of the support ring (7). Can be set to float from the bottom and sides. In this state, the solder is solidified.

When the solder is melted in the groove in advance, the laser irradiation device (21) irradiates a laser beam for a short time into the groove into which the probe needle (6) is inserted, and The probe needle (6) melts the solder and the support ring (7)
It is solidified and fixed while maintaining the state of being inserted and positioned in the groove.

Then, the second robot hand (17) releases the first probe needle (6), returns to the original position, and grips the second probe needle (6). On the other hand, in the XY table, the probe needle (6) is inserted into the second groove and the contact end (8) thereof is supported by the numerical control when the probe descends vertically from the reference position by a predetermined distance. The rotation and movement of the body ring (7) are controlled so that the body ring (7) and the body ring (7) have a predetermined relative positional relationship. Then, the same operation as in the case of the first probe needle (6) described above is repeated, and the probe needle (6) is fixed in the adjacent groove of the support ring (7).

In this way, when the probe needle (6) is fixed in all the grooves of the support ring (7), the above operation is completed. Then, the support ring (7) is removed from the mounting jig (20) together with the probe needles (6), and the probe needles (6) are drilled in the printed circuit board (3) so as to match the pattern of the printed wiring (2). The window is provided with the adhesive, and the window is attached. The attachment to the printed circuit board (3) is positioned so as to be located at the center formed by the end portion of the conductive pattern printed on the circuit board. Subsequently, the rear end of the probe needle (6) and the corresponding printed wiring (2) conductor pattern on the printed circuit board are soldered to complete the probe card.

As described above, since the probe needle is moved to the predetermined position from the two-direction pattern on the side surface of the probe needle and the front surface of the contact end of the probe needle to perform positioning, the occurrence of the probe needle during manufacturing The contact end of the probe needle can be positioned according to the manufacturing error of the probe needle itself. It is also possible to remove the non-standard probe needle in advance.

Further, in the device for positioning the contact end of the probe needle and the device for attaching the probe needle to the support ring, by manufacturing the probe card via the storage device, it becomes possible to improve the operation rate of each device, Total management speeds up the production of probe cards.

The present invention is not limited to the above embodiment, and for example, pattern recognition in two directions, that is, the side surface of the entire probe needle and the front surface of the probe needle contact end may be simultaneously performed. Further, in the device for positioning the contact end of the probe needle and the device for attaching the probe needle to the support ring, the probe card was manufactured through the storage device, but the same robot hand was connected continuously without the storage device. Positioning to attachment may be performed by operation.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a conceptual diagram for positioning a contact end of a probe needle for explaining one embodiment of the method of the present invention, and FIG. 2 shows the probe needle positioned in FIG. A conceptual view of the device attached to the support ring, FIGS. 3 and 4 are explanatory views of the positioning of FIG. 1, and FIG. 5 is a view of a probe card manufactured from the device of FIG. 1 and FIG. Is. 1 ... Probe card, 6 ... Probe needle 8 ... Contact end, 10 ... Robot hand 13 ... First ITV camera, 14 ... Second ITV camera 15 ... Pattern recognition device, 16 ... Memory apparatus

Claims (2)

[Claims] 1. When manufacturing a probe card, when positioning the probe in space so that the contact end of the probe is at a predetermined mounting position, the reference surface of the probe is gripped by gripping means, and the side surface of the probe and After the probe is imaged by the first and second imaging means from two directions in front of the contact end of the probe to recognize the imaging patterns from the two directions, these recognition patterns are compared with a predetermined reference pattern, A method for manufacturing a probe card, characterized in that the probe is positioned by moving the gripping means based on the comparison result so as to match each imaging pattern with the reference pattern, and the position is stored in a storage device. 2. The probe is attached to a predetermined position of a support for a probe card by applying correction necessary for positioning of the probe from information of the probe stored in the storage device. The first claim
A method for manufacturing a probe card according to the item.