JPH08145387A - Floor heating system - Google Patents

Abstract

PURPOSE: To provide a floor heating system in which the surface temperature of the floor can be uniformly held and the temperature can be easily controlled by eliminating the circulation of a heating medium liquid by a pump. CONSTITUTION: A seamless pipe 1 is arranged in a wavy state at the underfloor of a room A. Both the ends 2, 3 of the pipe 1 are connected to an expansion tank 4. A heating medium liquid is sealed in the pipe 1. A little liquid is also filled in the tank 4. The pipe 1 is contained in a groove provided in a heat insulating panel 5, and a heating wire 7 is so contained in the same groove as to be brought into contact with the pipe 1. Both the ends of the wire 7 are connected to a power source. It is operated by an operation panel near the tank 4. An aluminum tape 8 is so adhered as to bring the pipe 1 into contact with the wire 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to floor heating for heating a room by providing a heating material under the floor, and more particularly to a system for the entire floor heating.

[0002]

2. Description of the Related Art In conventional floor heating, a heat medium liquid stored in a heating tank is heated by a heater having a gas or electricity as a heat source, and the heat medium liquid heated to a high temperature is circulated under the floor to radiate heat. In order to achieve this, a pipe for circulating the heat transfer medium liquid is arranged under the floor, and the heat transfer medium liquid is pressurized by a pump to flow in the pipe. Further, in such a circulation type floor heating system, as the heat transfer medium liquid, a liquid having a relatively low specific heat and good fluidity and capable of withstanding a high temperature is selected and used.

[0003]

However, in the floor heating system as described above, the heating medium liquid once heated to a high temperature in the heating tank is circulated in the circulation pipe to radiate heat under the floor. Therefore, there is an inevitable temperature difference between the heat radiation by the heat medium liquid immediately after being sent from the heating tank and the heat radiation by the heat medium liquid immediately before being returned to the heating tank. In the room, there was a case where the surface temperature of the floor was significantly different, and it was difficult to heat the floor. Further, since the heating medium liquid is forcedly circulated by being pressurized by a pump, the fluidity of the heating medium liquid determines the capacity of the pump. Some of them have high viscosity characteristics at low temperatures, so that the size of the pump must be increased, resulting in high running cost. Furthermore, since floor heating warms the surface of the floor by radiating heat medium liquid,
Adjustment of the temperature of the heat carrier liquid and the surface temperature of the floor is complicated,
The mechanism for controlling the floor surface temperature was complicated.

In view of the above points, the present invention provides a floor heating system capable of keeping the surface temperature of the floor uniform and facilitating the temperature control by not circulating the heat medium liquid by the pump. The purpose is to

[0005]

DISCLOSURE OF THE INVENTION According to the present invention, a pipe filled with a catalyst having a low specific heat and a high boiling point and having a high specific heat or a low thermal conductivity as the temperature rises is arranged under the floor. However, the gist is a floor heating system characterized in that a heating wire is attached to this pipe.

According to the present invention, an endless pipe filled with a catalyst having a low specific heat and a high boiling point and having a high specific heat or a low thermal conductivity as the temperature rises is arranged under the floor, and a heating wire is provided. The gist is a floor heating system characterized by being attached to this pipe.

According to the present invention, a seamless pipe filled with a low specific heat and high boiling point heat medium liquid whose specific heat becomes high or its thermal conductivity becomes small as the temperature rises is arranged under the floor. The gist of a floor heating system is characterized in that both ends of this pipe are connected to an expansion tank and a heating wire is attached to this seamless pipe.

According to the present invention, a heat insulating panel is buried between a floor plate and a finishing floor, and a catalyst having a low specific heat and a high boiling point is filled with a catalyst having a high specific heat or a low thermal conductivity as the temperature rises. A gist of the floor heating system is characterized in that the pipe is arranged in the heat insulation panel, and a heating wire is attached to the pipe.

According to the present invention, a heat insulating panel is buried between a floor plate and a finishing floor, and a catalyst having a low specific heat and a high boiling point is filled with a catalyst having a high specific heat or a low thermal conductivity as the temperature rises. A gist of the floor heating system is characterized in that the endless pipe thus arranged is arranged in the heat insulation panel, and a heating wire is attached to the pipe.

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, and among heat medium liquids having a low specific heat and a high boiling point, the specific heat becomes high or the thermal conductivity becomes small as the temperature rises. A floor heating system is characterized in that a seamless pipe filled with a material is arranged in the heat insulation panel, both ends of the pipe are connected to an expansion tank, and heating wires are attached to the seamless pipe. And

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, and a catalyst having a low specific heat and a high boiling point is filled with a catalyst having a high specific heat or a low thermal conductivity as the temperature rises. Disposed in the heat insulation panel, the heating wire is attached to this pipe, only in the above pipe, or
A floor heating system is characterized in that an aluminum tape is attached so as to come into contact with a pipe and a heating wire.

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, and a catalyst having a low specific heat and a high boiling point is filled with a catalyst having a high specific heat or a low thermal conductivity as the temperature rises. The endless pipe thus arranged is arranged in the heat insulation panel, the heating wire is attached to this pipe, and the aluminum tape is attached only to the above pipe or so as to abut the pipe and the heating wire. The main feature is the floor heating system.

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, and among the heat medium liquids having a low specific heat and a high boiling point, the specific heat becomes high or the thermal conductivity becomes small as the temperature rises. A seamless pipe filled with things is arranged in the heat insulating panel, both ends of this pipe are connected to an expansion tank, and heating wires are attached to this seamless pipe only to the above pipe, or a pipe and a heating wire. A floor heating system is characterized in that an aluminum tape is attached so as to abut on the floor heating system.

In the present invention, a floor board, a heat insulating sheet, and a heat insulating panel are sequentially provided on a joist, a continuous pipe is arranged in the heat insulating panel, and then a finishing floor is stretched on the floor heating. In the system, a pipe filled with a low specific heat and high boiling point catalyst having a high specific heat or a low thermal conductivity as the temperature rises is arranged in the heat insulating panel, and the heating wire is connected to the pipe. The gist is a floor heating system characterized by being attached to the.

It is preferable that the heating wire is provided below the pipe so as to continuously abut in the axial direction thereof. It is preferable that the heating wire is provided beside the pipe so as to continuously abut in the axial direction. It is preferable that the heating wire is a bundle of a plurality of heating wires. The heating wire is preferably composed of a plurality of closed circuits. The heat carrier liquid is preferably an ethylene glycol-based heat carrier liquid.

[0016]

With the above-mentioned structure, the heat generated by the heating wire is transmitted to the pipe and further to the catalyst in the pipe. Floor heating can be efficiently performed by the heat radiated from the heat wire and the pipe. That is, the heat generated by the heating wire is transferred to the catalyst having a low specific heat, the temperature of the catalyst rapidly rises, and the temperature rise continues until the temperature approaches the temperature of the heating wire. At this time, the catalyst absorbs the heat generated from the heating wire, but since the specific heat increases as the temperature of the catalyst rises, the amount of heat radiated to the surroundings decreases. That is, the catalyst has a heat storage effect. Therefore, unlike the case where the heat of the heating wire is unilaterally absorbed and radiated, the heat can be radiated while keeping the temperature as a heat source of the heating wire constant. Then, since the heat is radiated from the heating wire and also from the catalyst at the same time, radiant heat to the surrounding area can be sufficiently given, and the heat of the heating wire can be effectively used without lowering the temperature of the heat source. Therefore, the floor heating efficiency can be improved.

[0017]

Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a seamless pipe (seamless pipe) 1 is arranged in a wavy form under the floor of a room A, and both ends 2 and 3 of the seamless pipe 1 are connected to an expansion tank 4. The heat medium liquid is enclosed in the seamless pipe 1, and a small amount of the heat medium liquid is also filled in the expansion tank 4. Then, when the heat medium liquid in the seamless pipe 1 slightly expands as the temperature rises, the expansion tank 4 controls the liquid amount. The seamless pipe 1 is housed in a groove 6 (FIG. 3) provided in the heat insulating panel 5, and a heating wire 7 is housed in the same groove 6 so as to abut the seamless pipe 1. This heating wire 7 is a seamless pipe 1.
Similarly, it has a wavy shape, both ends of which are connected to a power source (not shown) and can be operated by an operation panel (not shown) provided near the expansion tank 4. Further, the aluminum tape 8 is adhered so as to contact the seamless pipe 1 and the heating wire 7, so that the heat emitted from the heating wire 7 and the seamless pipe 1 can be diffused and transferred to the floor. There is. In this way, by energizing the heating wire 7, a predetermined amount of heat is released from this heating wire, this heat is transferred to the floor through the aluminum tape 8, and the seamless pipe 1 and the inside thereof are filled. The heat medium liquid is also transmitted to the heat medium liquid and the temperature of the heat medium liquid can be increased.

Here, the seamless pipe 1 as described above
And the state under the floor when the heating wire 7 is provided will be described. In a general underfloor structure, as shown in FIG. 2, a floorboard 11 is stretched on a joist 10 and both of them support the entire floor. The heat insulating sheet 12 is laid on the upper surface of the floor plate 11, and the heat insulating panel 5 is placed on the heat insulating sheet 12. This heat insulation sheet 12
And the heat insulating panel 5 prevents the heat released for heating from escaping downward. And the seamless pipe 1 and the heating wire 7 are arrange | positioned in the predetermined position in the heat insulation panel 5, and the finishing floor 13 is provided on it. Although not shown in FIG. 2, on the upper surface of the heat insulation panel 5, there is an aluminum tape attached so as to abut on the seamless pipe 1 and the heating wire 7, and the heat transferred by this aluminum tape is finished. The floor 13 is warmed, and in addition, the upper surface of the finishing floor 13 is warmed. The finishing floor 13 may be a flooring floor, concrete, or a wooden board, but the same applies to any of them.

Next, the storage state of the seamless pipe 1 and the heating wire 7 in the heat insulating panel 5 will be described with reference to FIG. First, as shown in FIG. 3A, by providing the heat insulating panel 5 with the groove 6 having a laterally long cross-sectional shape, the heating wire 7 can be provided in contact with the horizontal side of the seamless pipe 1. In this case, the thickness of the heat insulation panel 5 is about twice that of the seamless pipe 1 and is relatively thin. The aluminum tape 8 is provided so as to be able to contact the seamless pipe 1 and the upper ends of the heating wires 7,
It can be transmitted to a finishing floor provided in close contact with the upper portion of the heat insulating panel 5. FIG. 3B is a modified example of FIG. 3A, and the heating wire 7 can be provided by abutting on both sides of the seamless pipe 1 laterally. Further, as shown in FIG. 3C, the heating wire 7 can be provided on the lower side of the seamless pipe 1 by providing the heat insulating panel 5 with the groove 6 having a vertically long sectional shape. In this case, the thickness of the heat insulation panel 5 is slightly thick. The aluminum tape 8 is attached so as to surround the seamless pipe 1 and the heating wire 7, and the heat released by the heat generation of the heating wire 7 can be transferred to the seamless pipe 1 or the finishing floor without waste. There is.

As described above, by heating the heating wire 7 with the heating wire 7 abutting on the seamless pipe 1, the heat emitted from the heating wire 7 is released from the seamless pipe 1. Since it is transmitted to the heat medium liquid inside this, the seamless pipe 1
The heat carrier liquid therein can be heated. Since the heating medium liquid is an ethylene glycol-based catalyst, the heating medium 7 starts to generate heat and at the same time the temperature of the heating medium liquid rises rapidly. The temperature will rise to a level close to the temperature. At this time, the heat generated by the heating wire 7 is
Initially, it is absorbed by the low-temperature heat medium liquid, and the surface temperature of the heating wire 7 also decreases. However, as the temperature of this heat medium liquid rises, the specific heat of the heat medium liquid also rises, so the heat medium The liquid has a heat storage effect, does not conduct much heat to the surroundings, and the temperature of the heating medium liquid rises together with the surface temperature of the heating wire 7. Then, when the heating medium liquid is sufficiently heated, heat is radiated to the surroundings by the heating wire 7 and the heating medium liquid, and the floor heating can be rapidly performed by warming the finishing floor 13. The amount of this heat radiation is large from the heating wire 7, and the amount of heat radiation from the heating medium liquid is small compared to the heating wire 7, but the surface temperature of the heating wire 7 is not lowered and the high temperature state is maintained. It is possible to radiate heat while doing. That is, the fact that the surface temperature of the heating wire 7 does not decrease means that a large amount of heat can always be radiated, and when the finishing floor 13 is extremely low, the heating wire 7 is heated by this low temperature.
It is possible to suppress the decrease in the surface temperature and the decrease in the calorific value.

Next, a second embodiment will be described. In this embodiment, as shown in FIG. 4, heating wires 7 and 7'are arranged beside the seamless pipe 1 arranged in a wavy shape.
In addition to the heating wire 7 which generates heat on the right side of the drawing, a heating wire 7'which generates heat on the left side of the drawing is provided so that the room can be partly divided and heated. Even in this case, heat is radiated from both the heating wires 7 and 7'and the seamless pipe 1 in the same manner as described above.

It is needless to say that various embodiments can be adopted without departing from the spirit of the present invention. For example, although the one shown in the embodiment has only one seamless pipe 1 that abuts on the heating wire 7, two seamless pipes 1 may abut on the heating wire 7 on both sides in the lateral direction, including the lower side. Three seamless pipes 1 or more, and more seamless pipes 1 may be brought into contact.

[0023]

As described above, the present invention provides a floor heating system characterized in that a pipe filled with a catalyst having a low specific heat is arranged under the floor and a heating wire is attached to the pipe. Therefore, it is much more efficient than the method of heating and circulating the heat medium liquid using a boiler or the like. That is, the heat generated by the heating wire is first absorbed by the low-temperature catalyst, and the surface temperature of the heating wire is also lowered, but the specific heat of the catalyst also rises as the temperature of this catalyst rises. Therefore, the catalyst has a heat storage effect, does not conduct much heat to the surroundings, the temperature of the catalyst rises with the surface temperature of the heating wire, and when the catalyst is sufficiently heated, The heat is dissipated by the heating wire and the catalyst, and the surrounding area can be heated.This heat dissipation is large from the heating wire, and the heat dissipation from the catalyst is smaller than that of the heating wire. However, since it is possible to radiate heat while maintaining the high temperature state without lowering the surface temperature of the heating wire, the heat can be effectively used and the running cost can be reduced. Therefore, the fact that the surface temperature of the heating wire does not decrease means that a large amount of heat can always be radiated, and when the temperature of the place to radiate heat is extremely low, this low temperature causes the surface temperature of the heating wire to rise. It is possible to suppress the decrease in the calorific value due to the decrease. The fact that the surface temperature of the heating wire does not decrease means that the surrounding temperature can be increased with less heat generation. Also, the amount of heat generated from the heating wire is very low,
By heating the catalyst to a high temperature, it is possible to perform sufficient floor heating with low power consumption. Furthermore, by using a heating wire as the heat source for heating the catalyst, the operation can be simplified and the temperature control of the chamber and the catalyst and the timer control can be facilitated.

The present invention is based on a floor heating system characterized in that an endless pipe filled with a catalyst having a low specific heat is arranged under the floor, and a heating wire is attached to this pipe. The catalyst does not circulate, and it is possible to prevent heat from radiating to other places through this catalyst, and the heat efficiency can be improved accordingly.

The present invention is characterized in that a seamless pipe filled with a heat transfer medium liquid having a low specific heat is provided, both ends of the pipe are connected to an expansion tank, and a heating wire is attached to the seamless pipe. Since the floor heating system is the main point, even when the heat medium liquid expands due to high temperature, these heat medium liquid can flow into the expansion tank, so the seamless pipe bursts. Such troubles can be prevented in advance.

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, a pipe filled with a catalyst having a low specific heat is arranged in the heat insulating panel, and a heating wire is attached to this pipe. Since the gist of the floor heating system is that the heat can be radiated immediately below the finishing floor, the loss of the radiated heat can be minimized.

According to the present invention, a heat insulating panel is embedded between a floor plate and a finishing floor, a pipe filled with a catalyst having a low specific heat is arranged in the heat insulating panel, and a heating wire is attached to the pipe.
Since the floor heating system is characterized in that an aluminum tape is adhered only to the above pipe or so as to be in contact with the pipe and the heating wire, the heat radiated from the pipe and the heating wire is aluminum tape. The heat radiated can be effectively used because it can be transmitted to the finishing floor via the.

By providing the heating wire below the pipe so as to continuously contact the heating wire in the axial direction, the area of contact of the heating wire with the pipe can be increased, and at any portion of the pipe. The same temperature can be maintained. By providing the heating wire so as to be continuously abutted on the side of the pipe in the axial direction thereof,
Since the floor heating can be performed by the heat emitted from the heating wire and the heat emitted from the pipe, the efficiency is improved. When the heating wire is formed by bundling a plurality of heating wires, heating can be continued even if one heating wire is broken. The heating wire,
By configuring with a plurality of closed circuits, divided floor heating is possible. By using an ethylene glycol-based heat medium liquid as the heat medium liquid, a reliable catalyst having a low specific heat can be used.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing a structure under a floor in floor heating.

FIG. 3 is a sectional view taken along line XX.

FIG. 4 is an explanatory diagram showing another embodiment.

[Explanation of symbols] 1 Seamless pipe 2,3 Both ends of seamless pipe 4 Expansion tank 5 Insulation panel 6 Groove 7,7 'Heating wire 8 Aluminum tape 10 joist 11 Floorboard 12 Insulation sheet A room

Claims (15)

[Claims] 1. A pipe filled with a catalyst having a low specific heat and a high boiling point and having a high specific heat or a low thermal conductivity as the temperature rises is disposed under the floor, and a heating wire is provided in this pipe. A floor heating system characterized by being attached. 2. An endless pipe filled with a catalyst having a low specific heat and a high boiling point and having a high specific heat or a low thermal conductivity as the temperature rises is disposed under the floor, and a heating wire is provided in the pipe. A floor heating system characterized by being attached to. 3. A seamless pipe filled with a low specific heat and high boiling point heat transfer medium liquid having a high specific heat or a low thermal conductivity as the temperature rises is provided under the floor, and A floor heating system characterized in that both ends of the pipe are connected to an expansion tank and heating wires are attached to this seamless pipe. 4. A heat insulating panel is buried between the floor plate and the finishing floor to fill a catalyst having a low specific heat and a high boiling point with a high specific heat or a low thermal conductivity as the temperature rises. A floor heating system in which a pipe is arranged in the heat insulation panel and a heating wire is attached to the pipe. 5. A heat insulating panel is buried between the floor plate and the finished floor to fill a catalyst having a low specific heat and a high boiling point with a high specific heat or a low thermal conductivity as the temperature rises. A floor heating system characterized in that an endless pipe is arranged in the heat insulation panel, and a heating wire is attached to this pipe. 6. A heat-insulating panel having a low specific heat and a high boiling point, which has a high specific heat or a low thermal conductivity as the temperature rises, by embedding a heat insulating panel between the floor plate and the finishing floor. A floor heating system characterized in that a filled seamless pipe is arranged in the heat insulation panel, both ends of the pipe are connected to an expansion tank, and heating wires are attached to the seamless pipe. 7. A heat insulating panel is buried between a floor plate and a finishing floor to fill a catalyst having a low specific heat and a high boiling point with a high specific heat or a low thermal conductivity as the temperature rises. A pipe is arranged in the heat insulation panel, a heating wire is attached to this pipe, and an aluminum tape is attached only to the above pipe or so as to come into contact with the pipe and the heating wire. Floor heating system. 8. A heat insulating panel is embedded between the floor plate and the finishing floor, and filled with a catalyst having a low specific heat and a high boiling point, which has a high specific heat or a low thermal conductivity as the temperature rises. An endless pipe is arranged in the heat insulating panel, a heating wire is attached to this pipe, and an aluminum tape is attached only to the above pipe or so as to come into contact with the pipe and the heating wire. Underfloor heating system. 9. A heat-insulating panel having a low specific heat and a high boiling point, wherein a heat-insulating panel is buried between a floor plate and a finishing floor, and which has a high specific heat or a low thermal conductivity as the temperature rises. A filled seamless pipe is placed in the heat insulation panel, both ends of this pipe are connected to an expansion tank, and heating wires are attached to this seamless pipe to the pipe alone, or to the pipe and heating wire. A floor heating system characterized by being attached with aluminum tape so as to be in contact with each other. 10. A floor heating system in which a floor board, a heat insulating sheet, and a heat insulating panel are sequentially provided on a joist, a continuous pipe is arranged in the heat insulating panel, and a finishing floor is stretched on the pipe. A pipe filled with a low specific heat and high boiling point catalyst having a high specific heat or a low thermal conductivity as the temperature rises is arranged in the heat insulation panel, and a heating wire is attached to the pipe. A floor heating system characterized by 11. The floor heating system according to claim 1, wherein the heating wire is provided below the pipe so as to continuously abut in the axial direction thereof. 12. The floor heating system according to claim 1, wherein the heating wire is provided beside the pipe so as to continuously abut in the axial direction thereof. 13. The floor heating system according to claim 1, wherein the heating wire is a bundle of a plurality of heating wires. 14. The floor heating system according to claim 1, wherein the heating wire is constituted by a plurality of closed circuits. 15. The floor heating system according to claim 3, 6, or 9, wherein the heating medium liquid is an ethylene glycol-based heating medium liquid.