JPH08139479A - Heat sink - Google Patents

Abstract

PURPOSE: To provide a high-durability heat sink, which can absorb efficiently heat from a radiator and can be easily manufactured. CONSTITUTION: A beam emitted from an LD bar 12 placed on a radiator 11 is emitted via a microlens 13. A water channel formed in the interior of the radiator 11 is constituted of a pressing water channel 14, a cooling part 15 and a discharge water channel 16. A puddle part 14a is formed in the end part of the water channel 14. A plurality of small holes 17 are formed in this puddle part 14a along the arrangement direction of the LD bar 12. A roughened surface 15a is formed in an on the cooling part 15 in the vicinity of the LD bar 12. The remaining cavity part of the radiator 11 constitutes the discharge water channel 15. Cooling water jetted through the small holes 17 is sprayed on the part 15 at a high pressure and heat transferred from the LD bar 12 to the cooling part 15 is effectively absorbed in this cooling water.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink having a water cooling structure.

[0002]

2. Description of the Related Art Conventionally, as this type of heat sink,
For example, the high power LD (laser diode) shown in FIG.
There is a heat sink for the array. Here, FIG. 10A shows a cross-sectional view of this heat sink, and FIG. This heat sink for LD array is required to not only suppress the dynamic fluctuation of the LD oscillation wavelength but also fulfill the function of suppressing the spatial variation of the emitted laser beam to the minimum. Therefore, this heat sink is provided with a water cooling structure in order to smoothly dissipate heat from the LD array. That is, the radiator 1 is provided with the water channel 2 having a two-layer structure of the upper water channel 2a and the lower water channel 2b. The cooling water taken from the inlet 3 of the water channel 2 is spread in the upper surface water channel 2a. The spread cooling water uniformly cools the LD array 4, and after cooling, is returned to the discharge port 5 through the lower surface water passage 2b. The radiator 1 is made of silicon crystal, and the upper surface water channel 2a and the lower surface water channel 2b are formed by finely processing the silicon (Si) crystal.

[0003]

However, in the above conventional heat sink, since the upper surface water passage 2a and the lower surface water passage 2b are formed by using the fine processing technique as described above, the manufacturing process of the heat sink becomes complicated. There was a problem. Further, since Si is mechanically brittle, there is a problem in durability of the heat sink.

[0004]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and includes a radiator for contacting a heating element and a water channel formed in the radiator.
In a heat sink that cools a heating element by flowing cooling water in the channel, the channel is formed in the vicinity of a pressure channel where a small hole is formed and pressurized water is supplied, and a heating element to which the cooling water sprayed from the hole is applied It is characterized by comprising a cooling unit provided and an exhaust water channel for discharging the cooling water used in this cooling unit.

Further, it is characterized in that the cooling portion is provided with irregularities.

A water reservoir is formed in the pressurized water channel,
A plurality of small holes are formed in the water reservoir.

[0007]

The cooling water sprayed from the small holes is sprayed at high pressure to the cooling section, and the heat transferred from the heat generating element to the cooling section is effectively taken away by this cooling water. On the other hand, this structure is formed without using a brittle silicon crystal.

If unevenness is formed in the cooling portion,
The surface area of the cooling part increases and the contact area with the cooling water increases.

If a water reservoir is formed in the pressurized water passage and a plurality of small holes are formed in this water reservoir, high-pressure cooling water injected from each small hole is simultaneously sprayed onto the cooling unit.

[0010]

1 is a side view showing a heat sink according to an embodiment of the present invention, and FIG. 2 is a top view of the heat sink.

At the end of the upper surface of the radiator 11, a heating element L
The D bar 12 is placed. This LD bar 12 is an LD
Is formed in a rod shape, and extends in the direction perpendicular to the paper surface of FIG. 1 at the end of the radiator 11. LD bar 1
The laser beam emitted from 2 is a microlens 13
It is focused and emitted by. A water channel for cooling the LD bar 12 is formed inside the radiator 11.
The water channel is composed of a pressurized water channel 14, a cooling unit 15, and a discharge water channel 16. The pressurized water passage 14 is made of a cylindrical copper pipe, and a thick copper pipe is welded to the end portion of the pressurized water passage 14 at a right angle to form a water reservoir 14a.
A plurality of small holes 17 are formed in the water reservoir 14a along the arrangement direction of the LD bar 12. These pressurized waterways 1
4 and the water reservoir 14a are inserted and fixed in a cavity formed inside the radiator 11. The hollow portion is formed by cutting the inside of the radiator 11 made of a copper plate having a thickness of 1 mm. The cavity below the LD bar 12 constitutes a cooling unit 15, and the cooling unit 15 near the LD bar 12 is provided with an uneven surface 15a. The uneven surface 15a is formed at a position where the cooling water sprayed from each small hole 17 is sprayed. The remaining cavity of the radiator 11 constitutes the discharge water channel 16.

In such a structure, the cooling water injected into the pressurized water passage 14 has a high pressure, and the pressurized cooling water is jetted from each small hole 17. The sprayed cooling water has uneven surface 15
It is sprayed on a, collected in the discharge water channel 16, and discharged.

In the heat sink according to this embodiment,
The cooling water sprayed from the small holes 17 is sprayed at a high pressure on the inner wall of the cooling part 15, and the heat transferred from the LD bar 12 to the cooling part 15 is effectively taken away by this cooling water. on the other hand,
The heat sink according to this embodiment is formed of a highly durable copper plate and a copper pipe, and can be configured without using a brittle silicon crystal as in the conventional case. For this reason, a fine and complicated conventional processing step is not required in the manufacturing process of the heat sink, and it becomes possible to manufacture the heat sink having high durability relatively easily.

Further, the cooling unit 15 to which cooling water is sprayed
Since the uneven surface 15a is formed on the inner wall of the cooling unit 1,
The surface area of 5 increases. Therefore, the contact area between the cooling unit 15 and the cooling water increases, so that the LD bar 12 moves to the cooling unit 1.
The heat transferred to 5 is more efficiently taken by the cooling water, and the heat exchange efficiency of the heat sink is improved.

Further, since the water reservoir 14a is formed in the pressurized water passage 14 and the plurality of small holes 17 are formed in the water reservoir 14a, the high-pressure cooling water injected from each small hole 17 is supplied to the cooling unit 15. It is sprayed at the same time. Therefore, even the LD bar 12 formed in a long rod shape can be efficiently cooled as a whole by a large amount of cooling water.

[0016]

As described above, according to the present invention, the cooling water sprayed from the small holes is sprayed at a high pressure on the cooling part, and the heat transmitted from the heating element to the cooling part is effectively supplied by this cooling water. Be robbed by. On the other hand, this structure can be constructed without using a brittle silicon crystal. Therefore, a fine and complicated processing step is not required in the heat sink manufacturing process, and it becomes possible to relatively easily manufacture the heat sink having high durability.

Further, if the cooling portion has irregularities,
The surface area of the cooling part increases and the contact area with the cooling water increases. Therefore, the heat transferred from the heating element to the cooling unit is more efficiently taken by the cooling water, and the heat exchange efficiency of the heat sink is improved.

When a water reservoir is formed in the pressurized water passage and a plurality of small holes are formed in the water reservoir, high-pressure cooling water sprayed from each small hole is simultaneously sprayed onto the cooling unit. Therefore, the heating element is cooled efficiently as a whole.

[Brief description of drawings]

FIG. 1 is a side view showing a heat sink according to an exemplary embodiment of the present invention.

FIG. 2 is a top view showing a heat sink according to this embodiment.

FIG. 3 is a diagram showing a conventional heat sink.

[Explanation of symbols]

11 ... Radiator, 12 ... LD bar, 13 ... Microlens, 14 ... Pressurized water channel, 14a ... Water reservoir, 15 ... Cooling section,
15a ... uneven surface, 16 ... discharge water channel, 17 ... small hole.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Hirofumi Miyajima 1126, Nomachi, Hamamatsu City, Shizuoka Prefecture 1126 Hamamatsu Photonics Co., Ltd. (72) Inventor Takeshi Kanzaki 1126, 1126 Ichinomachi, Hamamatsu City, Shizuoka Prefecture Hamamatsu Photonics Co., Ltd. (72) Inventor Hirofumi Suga 1126-1 Nomachi, Hamamatsu-shi, Shizuoka Prefecture 1 Hamamatsu Photonics Co., Ltd.

Claims (3)

[Claims] 1. A heat sink, comprising: a heat radiator which is brought into contact with a heat generating body; and a water channel formed in the heat radiator, wherein cooling water is flowed through the water channel to cool the heat generating element, wherein the water channel has a small hole. And a cooling section provided in the vicinity of the heating element to which the cooling water sprayed from the small holes is applied, and a discharge for discharging the cooling water used in the cooling section. A heat sink characterized by being composed of a water channel. 2. The heat sink according to claim 1, wherein the cooling portion has irregularities. 3. The heat sink according to claim 1, wherein a water reservoir is formed in the pressurized water passage, and a plurality of the small holes are formed in the water reservoir.