JPH08139214A - Marking method and apparatus - Google Patents

Abstract

PURPOSE: To provide a marking method and an apparatus for simplifying preparation for marking work and shortening the time required for marking. CONSTITUTION: A marking apparatus comprises a tape fixing means 3 for fixing a plurality of glass diodes with a tape member 2 having the bonding or adhesive property to at least one surface, a marking means 6 which is provided with a nozzle 5 for injecting ink 4 to mark the glass diodes 1, a drying means 7 for drying the ink 4 used for marking the surface of the glass diode 1 and a take-up roller 8 for accommodating glass diode 1 having completed the fixing of tape and marking work. After fixing a plurality of glass diodes 1 with the tape member 2, the ink 4 is injected from the nozzle 5 for marking the surface of glass diode 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a marking technique for marking electronic parts with ink, and more particularly to a so-called ink jet type marking technique for ejecting ink from a nozzle to apply a mark.

[0002]

2. Description of the Related Art The techniques described below are for studying the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

Techniques for marking a mark on an electronic component such as a diode, a resistor, or a capacitor using ink include an offset method and a direct method. In these, after marking the electronic component, each electronic component is marked. It is fixed by a tape member.

Here, the offset method is one in which the ink of the plate is once transferred onto a transfer rubber and a mark is attached by utilizing the elasticity of the rubber.

Further, in the direct method, a relief plate made of rubber or resin is used as a plate, and a mark is directly attached without using a transfer rubber.

Regarding the offset method and the direct method of the marking technique, for example, "Semiconductor Manufacturing Equipment Dictionary, Second Edition", published by Nikkan Kogyo Shimbun, September 28, 1991, Japan Semiconductor Manufacturing Equipment Association (ed.) , Page 232.

[0007]

However, in the above-mentioned technique, when the kind of the electronic component is exchanged, the marking conditions such as the change of the ink or the mark display are changed, so that the marking device is changed. There is a problem that it takes a lot of time to prepare for cleaning and setup, and the work efficiency is reduced.

In addition, fine adjustment of ink performed at the time of preparation,
For example, there is a problem that it is very difficult and time-consuming to make fine adjustments regarding the quality of mark display such as the amount of ink to be transferred, ink bleeding, or ink blurring.

Further, since the viscosity of the ink also affects the quality of the mark display, there is also a problem that it is necessary to manage the working conditions in the marking work such as the management of the viscosity of the ink.

Further, the amount of ink attached to the marking device or discarded at the time of ink replacement is larger than the amount of ink used for marking, and waste of ink is also a problem.

When the electronic parts are of a small quantity and a large variety, such as glass diodes, the time required for the preparation is longer than the time required for the marking work, and the efficiency of the work is reduced as described above. There is a problem.

SUMMARY OF THE INVENTION An object of the present invention is to provide a marking method and apparatus which simplifies the preparation for the marking operation and shortens the time required for the preparation.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0014]

Of the inventions disclosed in the present application, a representative one will be briefly described below.
It is as follows.

That is, in the marking method according to the present invention, after fixing a plurality of electronic components with a tape member having adhesiveness or adhesiveness on at least one surface,
A mark is provided on the surface of the electronic component by ejecting the ink from the nozzle.

Further, marks are provided on the surface of the electronic component from a plurality of directions.

Further, the marking device according to the present invention is provided with a tape fixing portion for fixing a plurality of electronic components by a tape member having adhesiveness or adhesiveness on at least one surface, and a nozzle for ejecting the ink. And a marking portion for marking the electronic component, and a housing portion for housing the electronic component that has been tape-fixed and marked, and after fixing a plurality of electronic components by the tape member, the ink is A mark is attached to the surface of the electronic component by jetting from a nozzle.

Further, the marking portion is provided with a control means for setting a marking condition and an ink amount adjusting means for adjusting the amount of ink ejected from the nozzle.

A plurality of nozzles are installed in the marking portion.

The electronic component is a glass diode.

[0021]

According to the above-mentioned means, by using the ink jet system in which ink is ejected from the nozzle to mark the surface of the electronic component, the plural electronic components are fixed by the tape member and then the marking is performed. It is possible to simplify the work content of the preparation at the time of exchanging the types of electronic components, and further to shorten the time required for the preparation.

Further, by fixing a plurality of electronic components with a tape member and then marking the electronic components,
Marking can be provided within the taping process, and thus the taping process and the marking process can be merged.

Further, by drying the ink after the marking, the three steps of the taping step, the marking step and the drying step can be combined into one step.

Further, since the marking section is provided with a control means for setting the marking conditions, a plurality of marking conditions can be set in advance so that the marking can be carried out a plurality of times under the same conditions. In this case, the marking can be repeated as it is.

Further, even if the kind of electronic parts is changed, only one of the preset marking conditions is selected, and it is not necessary to set the marking condition again. It is possible to simplify the work content and shorten the time in preparation for time, and
Anyone can work easily.

Further, since the ink amount adjusting means for adjusting the amount of ink is installed, the adjustment can be facilitated, so that the time required for the adjustment can be shortened.

By the ink jet system, the ink is exchanged in units, so that the ink does not adhere to the marking device and the ink is not discarded when exchanging the ink.

Further, since the ink to be used is limited to the one determined by the specifications, it is not necessary to manage the ink and the quality of marking can be stabilized.

Since the plurality of nozzles are installed in the marking portion of the marking device, the surface of the electronic component can be marked in a plurality of directions.

As a result, it is possible to perform marking on the entire circumference of the electronic component having a cylinder, or at a predetermined position on the cylindrical surface, or even on an electronic component having a spherical surface or the like. become.

Further, even in the case of a glass diode or the like, which has a large amount of various electronic components, it takes a short time to prepare for marking, so that marking can be performed without lowering work efficiency.

[0032]

Embodiments of the present invention will now be described in detail with reference to the drawings.

FIG. 1 is a structural conceptual view showing an embodiment of the structure of a marking device according to the present invention, and FIG. 2 is an embodiment of the structure of a glass diode which is an example of an electronic component marked by the marking device according to the present invention. 3 is a perspective view showing FIG.
FIG. 4 is a cross-sectional view showing an embodiment of the structure of a glass diode which is an example of an electronic component marked by the marking device of the present invention, and FIG. 4 is an embodiment of the structure of an electronic component tape-fixed by the marking device of the present invention. FIG. 5 is a partial plan view showing an example, and FIG. 5 is a partial side view showing an embodiment of a state of marking an electronic component to be marked by the marking device of the present invention.

First, the structure of the marking apparatus of this embodiment will be described. A tape for fixing a plurality of electronic parts, for example, a glass diode 1 with a tape member 2 having adhesiveness or adhesiveness on at least one surface. A marking part 6 provided with a fixed part 3 and a nozzle 5 for ejecting ink 4 and for marking the glass diode 1.
And a take-up roller 8 which is a housing portion for housing the glass diode 1 which has been fixed and marked with a tape, and a tape member. After fixing a plurality of glass diodes 1 with 2, ink 4
Is ejected from the nozzle 5 to mark the surface of the glass diode 1.

Here, the tape fixing portion 3 is the tape member 2
And a tape member supplying roller 3a for supplying a plurality of glass diodes 1 and a taping roller 3b for fixing a plurality of glass diodes 1 on a tape.
And an electronic component supply roller 3c for supplying an electronic component such as the glass diode 1.

Further, the marking unit 6 is provided with a control means 6a for setting a marking condition according to the type of the glass diode 1 and an ink amount adjusting means 6b for adjusting the amount of the ink 4 ejected from the nozzle 5. ing.

The ink amount adjusting means 6b is, for example,
For example, a knob (not shown) provided near the base of the nozzle 5.

The drying means 7 is a heat source for drying the ink 4 marked on the surface of the glass diode 1 by heat.

Further, in the marking device of this embodiment, as shown in FIGS. 1 and 5, the nozzle 5 has two nozzles on one side and the opposite side of the surface of the glass diode 1.
This is a case where individual pieces are installed, and marking is performed from two directions.

The tape member 2 has adhesiveness or tackiness on at least one surface thereof.

The structure of the glass diode 1, which is an example of an electronic component marked by the marking device of the present embodiment, will be described with reference to FIGS. 2 and 3. Iron and nickel wires are coated with copper. A pellet 1c is connected between the two dumet wires 1a via a bump 1b, and the two dumet wires 1a and the pellet 1c are welded and sealed by a glass sleeve 1d. Furthermore, 2
A lead wire 1e obtained by solder-plating an annealed copper wire is connected to each end of the dumet wire 1a.

The surface of the glass sleeve 1d is marked with a product type character 1f, which is an example of a mark, and a cathode band 1g for displaying the cathode side of the glass diode 1.

Next, the marking method of this embodiment will be described.

First, the glass diode 1 on which the lead wire 1e is solder-plated is conveyed to the taping section 3, where the tape fixing of the glass diode 1 is performed (taping) by the tape member 2.

The tape is fixed through the taping roller 3b while the glass diode 1 is being supplied by the electronic component supply roller 3c. At this time, both ends of the lead wire 1e of the glass diode 1 are fixed from the front and back sides by two tape members 2 (see FIG. 4).

Here, the glass diode 1 is fixed at a pitch of several millimeters, and the tape member 2 is supplied from the tape member supply roller 3a.

Then, in the marking portion 6, the surfaces of the plurality of glass diodes 1 whose tapes have been fixed are marked.

Further, a plurality of types of marking conditions are set in advance in the control means 6a installed in the marking section 6.

The above conditions are, for example, the number of cathode bands 1g (only one in the glass diode 1), the color of the ink 4 used, or the type display character 1f.
And so on.

As a result, when performing marking,
Select the predetermined conditions required for the marking.

Further, at the time of marking, the amount of ink 4 ejected from the nozzle 5 is adjusted to an appropriate amount by the ink amount adjusting means 6b. This is because the ink amount adjusting means 6b
For example, in the case of a knob (not shown) or the like, adjustment is made by turning the knob.

After making these preparations, ink 4 is ejected from the nozzles 5 to perform marking.

After that, the ink 4 attached to the glass diode 1 for which the marking has been completed is thermally dried by the drying means 7 and wound up by the winding roller 8 which is a housing portion of the glass diode 1 to be contained therein.

Next, according to the marking method and apparatus of this embodiment, the following effects can be obtained.

That is, by using the ink jet system in which the ink 4 is ejected from the nozzle 5 to make a mark on the surface of the glass diode 1, the plurality of glass diodes 1 are fixed by the tape member 2 and then the mark is made. It is possible to simplify the work content of the preparation when the type of the glass diode 1 is exchanged, and it is possible to shorten the time required for the preparation.

Further, after fixing a plurality of glass diodes 1 with the tape member 2, by marking the glass diode 1 with the cathode band 1g, the type designation character 1f, etc., the above-mentioned marks can be provided in the taping process. it can.

As a result, the taping process and the marking process can be combined, so that the process can be shortened.

Further, by drying the ink 4 by the drying means 7 immediately after the marking, the three steps of the taping step, the marking step, and the drying step are performed.
Can be merged into one process, so that as before,
It is possible to shorten the process.

Further, since the marking means 6 is provided with the control means 6a for setting the marking conditions, a plurality of marking conditions can be set in advance so that plural markings can be made under the same conditions. When it is performed once, the marking can be repeated as it is.

Further, even if the type of the glass diode 1 is changed, only one of the preset marking conditions is selected, and it is not necessary to set the marking condition again. It is possible to simplify the work content and shorten the time required for the preparation when the product type is changed, and anyone can easily proceed with the work.

Since the ink amount adjusting means 6b for adjusting the amount of the ink 4 is installed, the adjustment is
For example, since the knob (not shown) or the like is simply rotated, the adjustment can be easily performed.

As a result, the time required for the adjustment can be shortened and the waste of the ink 4 can be reduced.

Since the ink-jet method allows the ink 4 to be exchanged in units, the ink 4 does not adhere to the marking device and the ink 4 is not discarded when the ink 4 is exchanged.

As a result, similarly to the above, it is possible to reduce the waste of the ink 4, and further it is possible to shorten the work time when the ink 4 is replaced.

Here, since the ink 4 to be used is limited to that determined by the specifications, it is not necessary to manage the ink 4, and as a result, the quality of marking can be stabilized.

Further, even in the case of the glass diode 1 in which a small number and a large variety of electronic parts are used, since the preparation time for marking is short, it is possible to carry out marking without lowering work efficiency.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the marking device of the above-mentioned embodiment, the case where two nozzles are installed has been described. However, as in the marking device of another embodiment of the present invention shown in FIG. 6, three nozzles are provided. 5 may be installed, and four or more nozzles 5 may be installed.

With this, the surface of the glass diode 1 can be marked from a plurality of directions. As a result, marking is performed on the entire circumference of the glass diode 1 having a cylinder, or at a predetermined position on the cylinder surface of another electronic component, or even on an electronic component having a spherical surface. It will be possible to do.

In the above embodiment, the case where the electronic component is the glass diode has been described, but the electronic component is not limited to the glass diode, and may be a resistor, a capacitor, a transistor or the like.

[0071]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). Using an ink jet method that ejects ink from nozzles to mark the surface of electronic components, multiple electronic components are fixed by tape members and then marked, so that preparations can be made when changing the types of electronic components. The work content can be simplified, and the time required for the preparation can be shortened.

(2). After fixing a plurality of electronic components with a tape member, by attaching a mark such as a cathode band or a type designation character to the electronic component, the mark can be attached in the taping process.

As a result, the taping process and the marking process can be combined, so that the process can be shortened.

(3). By performing the drying of the ink by the drying means immediately after the marking, the taping process,
The three steps of the marking step and the drying step can be combined into one step, and as a result, the steps can be shortened.

(4). Since the marking unit has a control means for setting the marking conditions, by setting multiple types of marking conditions in advance, if the marking is performed multiple times under the same conditions, repeat it as it is. Can be marked. In addition, even if a product type exchange of electronic parts occurs, it is only necessary to select one of the preset marking conditions, and it is not necessary to set the marking condition again. The work content in preparation can be simplified and the time can be shortened, and anyone can easily proceed with the work.

(5). Since the ink amount adjusting means for adjusting the amount of ink is installed, the adjustment can be easily performed because, for example, the adjustment is performed only by rotating the knob or the like.

As a result, the time required for the adjustment can be shortened, and the waste of ink can be reduced.

(6). Since the marking device of the present invention is an ink jet system, the ink can be exchanged in units, so that the ink does not adhere to the marking device and the ink is not discarded when exchanging the ink.

As a result, similarly to the above, it is possible to reduce the waste of ink, and further it is possible to shorten the time required for the work of exchanging ink.

(7). Since the ink used is limited to the one determined by the specifications, it is not necessary to manage the ink, and as a result, the quality of marking can be stabilized.

(8). Since the plurality of nozzles are installed in the marking unit of the marking device, the surface of the electronic component can be marked in a plurality of directions.

As a result, the mark is applied to the entire circumference of the electronic component having a cylinder, to a predetermined position on the cylindrical surface of another electronic component, or to an electronic component having a spherical surface. It becomes possible to attach.

(9). Even in the case of a glass diode or the like, which has a large number of small electronic components, it is possible to perform the marking without lowering the working efficiency because the preparation time for the marking is short.

[Brief description of drawings]

FIG. 1 is a structural conceptual diagram showing an embodiment of the structure of a marking device according to the present invention.

FIG. 2 is a perspective view showing an example of the structure of a glass diode which is an example of an electronic component marked by the marking device of the present invention.

FIG. 3 is a cross-sectional view showing an embodiment of the structure of a glass diode which is an example of an electronic component marked by the marking device of the present invention.

FIG. 4 is a partial plan view showing an embodiment of the structure of an electronic component tape-fixed by the marking device according to the present invention.

FIG. 5 is a partial side view showing an embodiment of a state of marking an electronic component to be marked by the marking device of the present invention.

FIG. 6 is a partial side view showing an embodiment of a state of marking an electronic component to be marked by a marking device which is another embodiment of the present invention.

[Explanation of symbols]

 1 Glass diode (electronic component) 1a Dumet wire 1b Bump 1c Pellet 1d Glass sleeve 1e Lead wire 1f Product type character (mark) 1g Cathode band (mark) 2 Tape member 3 Tape fixing part 3a Tape member supply roller 3b Taping roller 3c Electronic Component supply roller 4 Ink 5 Nozzle 6 Marking portion 6a Control means 6b Ink amount adjusting means 7 Drying means 8 Winding roller (accommodating portion)

Claims (6)

[Claims] 1. A marking method using ink, comprising: fixing a plurality of electronic components with a tape member having adhesiveness or tackiness on at least one surface,
A marking method, wherein a mark is formed on the surface of the electronic component by ejecting the ink from a nozzle. 2. The marking method according to claim 1, wherein marks are attached to the surface of the electronic component from a plurality of directions. 3. A marking device for marking electronic parts with ink, the tape fixing part fixing a plurality of electronic parts with a tape member having adhesiveness or adhesiveness on at least one surface thereof. A plurality of electronic parts are provided by the tape member, which includes a marking part in which a nozzle for ejecting the ink is installed and which marks the electronic part After fixing the ink, the ink is ejected from the nozzle to mark the surface of the electronic component. 4. The marking device according to claim 3, wherein the marking unit is provided with a control unit that sets a marking condition and an ink amount adjustment unit that adjusts the amount of ink ejected from the nozzle. Marking device characterized by being provided. 5. The marking device according to claim 3 or 4, wherein a plurality of the nozzles are installed in the marking portion. 6. The marking device according to claim 3, 4 or 5, wherein the electronic component is a glass diode.