JPH08138585A - Manufacture of flat panel display and electrode structure - Google Patents

Abstract

PURPOSE: To improve image quality and yield rate by forming a electron beam control electrode by press processing thereby reducing the cost and reducing the dispersion of diameters of electrode holes, and also, removing distortion by heat treatment for the junction with an etching processing electrode, and stacking and fixing it to this. CONSTITUTION: Passage holes are made in an electron beam lead electrode 3, convergence electrodes 5 and 6, and a shield electrode 8 by press processing. On the other hand, since a signal electrode 4, a horizontal deflection electrode 7, and a vertical deflection electrode 9 are divided in a stripe shape, passage holes are made by etching processing. The distortion caused at processing of each material is removed by heat treatment under the same specified condition, and then they are fused and joined together by glass material. By using the electrode made by press processing, a highly accurate electrode structure can be obtained by reducing the dispersion of diameters of electrode holes, and also, the yield rate of manufacture can be improved, whereby the productivity can be raised.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CRT type flat panel display device and a manufacturing method thereof.

[0002]

2. Description of the Related Art A general electrode structure of a CRT type flat panel image display device is shown in FIG. The electron beam control electrode is made of a thin metal plate, and an electrode having an electron beam passage hole is formed by etching, and the electrodes are bonded and fixed to each other using low melting glass to form a laminated electrode. The electron beam emitted from the cathode passes through the control electrode, collides with the phosphor of the anode, and emits light.

[0003]

When the electron beam control electrode is formed by the etching process, the electron beam passage holes vary in diameter, resulting in low yield and high cost. Further, if the variation in the hole diameter is large, the variation in the focus diameter or the deflection distortion occurs, which deteriorates the image quality.

As a solution to this problem, it is conceivable to reduce the cost of the electrode and reduce the variation in the hole diameter of the electrode by using the electrode forming method by press punching for the electrode which has a large influence of the hole diameter variation on the electron beam characteristics. To be

However, when the electrodes formed by the press work and the electrodes formed by the etching work are joined and fixed, the warpage at the joining becomes large, and the required electrode flatness cannot be secured.
Image defects such as uneven brightness were generated.

The present invention solves the above problem.

[0007]

At least an electron beam control electrode having a hole diameter variation reduced by punching an electron beam control electrode having a hole diameter variation having a large influence on an electron beam characteristic by punching with a press. And a control electrode formed by an etching process are stacked to form an electron beam control electrode structure.

Electrodes formed by punching by a press are subjected to heat treatment for removing strain of the electrodes before and after the processing, and electrodes formed by etching process are subjected to heat treatment for removing strain of the electrodes after etching processing. , Which are fixed in layers.

[0009]

The function of forming the electron beam passage hole of the control electrode by punching with a press reduces the variation of the passage hole diameter. When the electrode formed by press working and the electrode formed by etching are joined and fixed, heat treatment is performed in advance to reduce warpage at the time of joining due to processing strain, and an accurate electrode structure can be realized.

The press working has high productivity and can realize cost reduction.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of the principle of the flat panel display device of this embodiment. 1 is a back electrode and 2 is a linear cathode, and a plurality of cathodes are arranged. 3 is an electron beam extraction electrode, 4 is a signal electrode, 5,
6 is a focusing electrode, 7 is a horizontal deflection electrode 8, 8 is a shield electrode, and 9
Is a vertical deflection electrode, 10 is an electron beam emitted from the cathode 2, 11 is a front container, 12 is a phosphor layer formed on the inner surface of the front container, and an aluminum film (not shown) is formed on the phosphor surface to serve as an anode. There is. A back container 13 forms a vacuum container together with the front container 11.

FIG. 2 is a vertical sectional view of the flat panel display device of this embodiment. The control electrodes 3, 4, 5, 6, 7, 8, and 9 are all made of Invar material having a thickness of t0.18. Reference numeral 14 is a low melting glass material for joining electrodes.

Electron beam extraction electrode 3, focusing electrodes 5, 6,
The shield electrode 8 is formed by punching with a press to form an electron beam passage hole. The signal electrode 4, the horizontal deflection electrode 7, and the vertical deflection electrode 9 are formed by an etching process.

The signal electrode 4, the horizontal deflection electrode 7 and the vertical deflection electrode 9 are all divided into small strips, and when strips are formed by press punching, prevention of electrode deformation during handling is a major problem. , This time, we chose etching instead of pressing.

The electron beam control electrode is bonded and fixed by a glass material 14 to form an electrode assembly in which seven sheets are laminated. The electron beam 10 emitted from the cathode 2 passes through the electrode hole of the control electrode, collides with the phosphor 12, and emits light.

Next, a method of manufacturing the electron beam control electrode will be described. The process diagram is shown in FIG. The electrodes are formed by press punching in the following steps.

The rolled material is divided into a predetermined size. The outer shape of the divided plate material is punched by a press.

Next, in order to remove the rolling strain of the material, pre-annealing is performed under the temperature condition of holding at 585 ° C. for 1 hour. The heat treatment temperature of 585 ° C. is a temperature at which the mechanical properties of the Invar material are not deteriorated and shrinkage strain of the electrode does not occur when reheated at the heat treatment temperature of 460 ° C. at the time of electrode bonding. This temperature varies slightly depending on the material characteristics of the electrode and the heat treatment conditions when manufacturing the material.

After the pre-annealing, the electron beam passage hole is formed by press punching. When press-punching, burrs and warpage of punching occur. If the flash of about 10 μm or more remains, it affects the landing characteristics and the focus characteristics of the electron beam, so the flash needs to be removed.

Since the electrode 30 immediately after pressing has a warp, a method for removing the burrs of the warped electrode is shown in FIG.
As shown in FIG. 5, if the burrs are removed by the cylindrical buffing device 32 containing an abrasive in a state where the burrs are sandwiched between the two rollers 31 and the warp is corrected, the burrs can be uniformly removed. The cylindrical buff polishing device 32 is for polishing the flash by contacting the flash with a cylindrical buff that is rotating at high speed. When removing the flash, wash it with water at the same time to flush the flash.

After removing the flash in this way, a heat treatment is performed to remove the residual stress of the press punching. Post-annealing is performed at a temperature of 585 ° C. for a holding time of 1 hour while the electrodes are pressed and sandwiched by a stamper.

The reason for removing burrs immediately after press punching is that when post-annealing first, burrs remain, so when the pressure is corrected by pressing to correct the warpage, the burrs remaining cause the flatness of the electrode. This is because the problem that does not improve occurs. Further, a step of removing the oil used during pressing is required, which is disadvantageous in terms of cost. This completes the process of forming electrodes by press punching.

When the electrode hole is formed by press punching, the electrode hole can be surely formed, and the hole diameter is determined by the dimensional relationship between the punch and the die, and the accuracy of about ± 5 μm can be realized.

The electrode manufactured by the etching process is an electron beam passage hole of the electrode by etching from a roll material.
The outer shape is formed. As the Invar material used in the etching process, a material manufactured in the same process as the material used in the press working is used. When an Invar material having a thickness t of about 0.18 mm is used and formed by an etching process, the hole diameter accuracy is about ± 10 to 15 μm.

After etching, the annealing treatment is 585.
The heat treatment is performed under the temperature condition of holding at 1 ° C. for 1 hour. In this case, since the electrode has almost no warp, it is not necessary to perform heat treatment by applying pressure. Note that it is necessary to make the etching pattern large in advance in consideration of the amount of electrode shrinkage during heat treatment.

Next, the electrodes formed by press punching and the electrodes formed by etching are joined. FIG. 5 is a cross-sectional view showing an apparatus used for carrying out the case where two electrodes are joined with a glass material 14.

The vertical deflection electrode 9 is placed on the baked substrate 20,
Further, the glass material 14 which is a crystallizing material having a low melting point and the shield electrode 8 are placed, and the temperature is raised in the electric furnace 22 while being pressed by the stamper 21. The temperature condition is to hold at 460 ° C. for 1 hour. The size of the electrode is 330m in length
m, width 230 mm.

FIG. 6 shows the measurement results of the warp after the two electrodes are joined.
As shown in, the warpage is about 70 μm. FIG. 7 is a cross-sectional view of an apparatus for forming an electrode assembly by laminating seven bonded electrodes and melting and bonding with a glass material 14. The temperature conditions are the same as when joining two sheets. As shown in FIG. 6, the measurement result of the warp of the electrode structure after laminating and fixing seven sheets was within ± 50 μm.

Next, FIG. 6 also shows the experimental results when the heat treatment conditions of the electrodes are different. The electrode materials to be joined were the same lot materials, and the same coefficient of thermal expansion was used at the material stage.

When joining two sheets, one electrode is 585 ° C.
The heat treatment condition was held for 1 hour, and the other shows the measurement result of the amount of warpage after joining when the heat treatment condition was changed. A
Indicates the case without heat treatment. The warp is about 1.5 mm. B is the case where the heat treatment is carried out at 520 ° C. for 1 hour, the warpage is about 300 μm, and C is the case where the heat treatment is carried out at 550 ° C. for 1 hour. The warp was about 200 μm.

As described above, when electrodes made of the same material and having different heat treatment conditions are joined together, the warpage after joining becomes large, and unevenness in the screen brightness and the like occurs due to the warpage, and the electrode structure of the flat panel display device. Can not be used as.

[0032]

As described above, according to the present invention, as compared with the case where all electrodes are manufactured by etching, the electrodes manufactured by press punching can be used, so that the electrode yield is improved and the production is improved. Because it also improves the
The cost can be significantly reduced.

Further, the problem of warpage at the time of joining the electrode manufactured by press working and the electrode manufactured by etching work is solved, a highly accurate electrode structure is realized, and a flat panel display device having good image characteristics is obtained. It becomes possible to provide.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electrode configuration of an embodiment of a flat panel display device of the present invention.

FIG. 2 is an overall sectional view of the apparatus of the same embodiment.

FIG. 3 is a manufacturing process diagram of electrodes of the apparatus of the embodiment.

FIG. 4 is a cross-sectional view of a deburring device used for deburring an electrode of the device of the same embodiment.

FIG. 5 is a sectional view of an electrode joining device for manufacturing the device of the same embodiment.

FIG. 6 is a measurement result diagram of a warp after electrode bonding in the apparatus of the embodiment.

FIG. 7 is a cross-sectional view of an electrode multi-layer joining device for manufacturing the device of the same embodiment.

[Explanation of symbols]

 1 Back Electrode 2 Cathode 3 Electron Beam Extraction Electrode 4 Signal Electrode 5 Focusing Electrode 6 Focusing Electrode 7 Horizontal Deflection Electrode 8 Shielding Electrode 9 Vertical Deflection Electrode 14 Glass Bonding Member

Front page continuation (72) Inventor Yoshinobu Maeda 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Hiroshi Noguchi 1006, Kadoma, Kadoma City, Osaka Prefecture (72) Person Yukio Murashishi 1006 Kadoma, Kadoma-shi, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. A display device comprising an electron beam generation source, a phosphor which emits light when an electron beam collides, and an electron beam control electrode in which a plurality of electron beam passage holes are formed in a metal plate in a vacuum container. A flat panel display device comprising: an electrode structure in which a plurality of control electrodes formed by pressing an electron beam passage hole of the electron beam control electrode and electrodes formed by etching are stacked. 2. A method of manufacturing an electrode assembly in which a plurality of electron beam control electrodes are laminated, comprising a step of heat-treating a flat plate electrode material, a step of pressing an electron beam passage hole, and a distortion of a pressed electrode. A heat-treated step for producing a press-processed electrode, a step of forming an electron beam passage hole by etching, a heat-treatment step for removing strain of the etched electrode, and an etched electrode produced through the heat-treatment step. A method of manufacturing an electrode assembly, comprising the step of heat-bonding a joining member to form a plurality of laminated electrodes. 3. The electrode according to claim 2, wherein the heat treatment step for removing the strain of the pressed electrode and the heat treatment step for removing the strain of the etched electrode are the same. Structure manufacturing method. 4. When the press working electrode and the etching working electrode are reheated at the temperature at which the joining member is heat-sealed, the residual stress is removed at a high temperature which does not cause thermal contraction due to the residual stress of the material. The method for manufacturing an electrode assembly according to claim 2 or 3, wherein the method is a heat treatment step. 5. A method of manufacturing an electrode assembly in which a plurality of electron beam control electrodes are laminated, comprising a step of heat-treating a flat plate electrode material, a step of pressing an electron beam passage hole, and a burr of the pressed electrode. For removing the strain of the press-processed electrode manufactured through the removing process, the heat treatment process for removing the strain of the burrs-removed electrode, the process of forming the electron beam passage hole by the etching process, and the etched electrode. And a step of forming a plurality of laminated electrodes by heat-bonding a joining member to an etching-processed electrode manufactured through the heat treatment step of. 6. The method for manufacturing an electrode assembly according to claim 5, wherein the burr of the electrode is removed by a buff containing an abrasive.