JPH0813467B2 - Mold of high frequency molding machine - Google Patents
Mold of high frequency molding machineInfo
- Publication number
- JPH0813467B2 JPH0813467B2 JP62102515A JP10251587A JPH0813467B2 JP H0813467 B2 JPH0813467 B2 JP H0813467B2 JP 62102515 A JP62102515 A JP 62102515A JP 10251587 A JP10251587 A JP 10251587A JP H0813467 B2 JPH0813467 B2 JP H0813467B2
- Authority
- JP
- Japan
- Prior art keywords
- molding
- mold
- frequency
- molding machine
- auxiliary electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Blow-Moulding Or Thermoforming Of Plastics Or The Like (AREA)
- Molding Of Porous Articles (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 この発明は、例えば自動車用装飾モールなどを高周波
成形するための高周波成形機の成形型の改良に関する。Description: TECHNICAL FIELD The present invention relates to improvement of a molding die of a high-frequency molding machine for high-frequency molding of, for example, a decorative molding for automobiles.
従来の技術 塩化ビニル等の高周波損失の多い合成樹脂では、高周
波電圧を印加することによって自己発熱し、溶融軟化す
るので、自動車用装飾モールなどを成形するに際して、
従来から高周波成形機を用いた成形が行われている（特
開昭58−3840号公報，特開昭58−3826号公報等）。2. Description of the Related Art Synthetic resins with high high-frequency loss such as vinyl chloride generate heat by applying a high-frequency voltage and melt and soften.
Conventionally, molding has been performed using a high-frequency molding machine (Japanese Patent Laid-Open Nos. 58-3840 and 58-3826, etc.).
第４図は、例えば自動車用装飾モールを高周波成形す
るために用いられる従来の成形型の一例を示している。FIG. 4 shows an example of a conventional molding die used for high-frequency molding of a decorative molding for automobiles, for example.
この成形型は、導電体例えばアルミニュウムなどから
なる上型１と、非導電体例えばシリコン樹脂などからな
る下型２とに大別され、両者間に所望のモール形状に沿
ったキャビティが画成されるようになっている。そし
て、上記上型１は高周波成形機の上部電極板３に、下型
２は下部電極板４にそれぞれ固定される。This mold is roughly divided into an upper mold 1 made of a conductive material such as aluminum and a lower mold 2 made of a non-conductive material such as silicon resin, and a cavity along a desired molding shape is defined between them. It has become so. Then, the upper mold 1 is fixed to the upper electrode plate 3 of the high-frequency molding machine, and the lower mold 2 is fixed to the lower electrode plate 4.
このような成形型を用いてモールを成形するには、ま
ず、軟質塩化ビニル等の高周波損失の多い樹脂材料ある
いはこれに発泡剤を混ぜ、これを押し出し成形すること
によって、シート状の成形材料５を形成し、かつこの成
形材料５を所定の長さ寸法にカットして、上型1,下型２
間に挿填する。そして、上型1,下型２を型締めし、上部
電極板3,下部電極板４間に高周波電圧を加える。これに
より、成形材料５は発熱して軟化し、流動もしくは発泡
して流動する。従って、冷却後取り出せば、第５図に示
すように、キャビティ形状に沿ったモール６が得られる
のである。In order to mold a molding using such a molding die, first, a resin material having a high frequency loss such as soft vinyl chloride, or a foaming agent is mixed with the resin material and extruded to form a sheet-shaped molding material 5. And the molding material 5 is cut into a predetermined length dimension to form an upper mold 1 and a lower mold 2.
Insert in between. Then, the upper mold 1 and the lower mold 2 are clamped, and a high frequency voltage is applied between the upper electrode plate 3 and the lower electrode plate 4. As a result, the molding material 5 is heated to soften, flow or foam, and flow. Therefore, if taken out after cooling, a molding 6 having a cavity shape can be obtained as shown in FIG.
なお、樹脂材料をシート状に予備成形せずに、ペレッ
ト状の樹脂材料をそのままキャビティ内に投入して成形
を行う場合もある。In some cases, the resin material in pellet form may be put into the cavity as it is without performing the pre-molding of the resin material into a sheet shape.
発明が解決しようとする問題点 しかし、上記のような高周波成形においては、第５図
に示すような平坦な形状の成形品しか成形することがで
きず、例えば第６図に示すような立ち上がり部6aを有す
るモール６の成形は不可能である。すなわち、第７図に
示すように、高周波電流は導電体からなる上型１と下部
電極板４との間を図中矢印のように略垂直方向に流れて
しまい、モール６の立ち上がり部6a部分を水平方向に流
れることはないので、該立ち上がり部6a部分が十分に発
熱せず、良好な成形が行われない。Problems to be Solved by the Invention However, in the above high-frequency molding, only a flat-shaped molded product as shown in FIG. 5 can be molded. For example, the rising portion as shown in FIG. Molding of the molding 6 with 6a is not possible. That is, as shown in FIG. 7, the high frequency current flows between the upper die 1 made of a conductor and the lower electrode plate 4 in a substantially vertical direction as indicated by an arrow in the figure, and the rising portion 6a of the molding 6 is Since it does not flow in the horizontal direction, the rising portion 6a does not sufficiently generate heat, and good molding cannot be performed.
問題点を解決するための手段 この発明は、上記の問題点を解決するために、導電体
からなる上型と非導電体からなる下型とを有し、両者間
のキャビティ内に挿填された発泡性樹脂材料を高周波成
形する高周波成形機の成形型において、上記キャビティ
の立ち上がり部に略平行な補助電極を下型内に埋設し、
かつこの補助電極を下部電極板に導通させたことを特徴
としている。Means for Solving the Problems In order to solve the above problems, the present invention has an upper mold made of a conductor and a lower mold made of a non-conductor, and is inserted into a cavity between them. In a molding die of a high-frequency molding machine for high-frequency molding a foamable resin material, an auxiliary electrode substantially parallel to the rising portion of the cavity is embedded in the lower mold,
The auxiliary electrode is electrically connected to the lower electrode plate.
作用 上記のように、補助電極を設けることにより、キャビ
ティの立ち上がり部の内側に位置する上型側面から該立
ち上がり部を通して補助電極に高周波電流が流れるの
で、立ち上がり部部分も良好に成形することができる。Action As described above, by providing the auxiliary electrode, a high-frequency current flows from the side surface of the upper mold located inside the rising portion of the cavity to the auxiliary electrode through the rising portion, so that the rising portion can also be molded well. .
実施例 第１図は、この発明に係る高周波成形機の成形型の一
実施例を示している。Embodiment FIG. 1 shows an embodiment of a molding die for a high-frequency molding machine according to the present invention.
この実施例は、第3,6図に示したような断面略Ｌ字形
のモール６を高周波成形するための成形型であり、アル
ミニュウム等の導電体からなる上型１には、モール６の
水平部6bに対応した水平面7bと、モール６の立ち上がり
部6aに対応した垂直面7aとからなる型面７が形成されて
いる。なお、上記水平面7bと垂直面7aとは適宜なＲ面で
連続している。また、シリコン樹脂等の非導電体からな
る下型２には、同様にモール６の水平部6bに対応した水
平面8bと、モール６の立ち上がり部6aに対応した垂直面
8aとからなる型面８が形成されており、上記型面７との
間に、モール６形状に沿ったキャビティ９（第２図参
照）を画成するようになっている。なお、上記水平面8b
と垂直面8aとは、やはり適宜なＲ面で連続している。This embodiment is a molding die for high-frequency molding of a molding 6 having a substantially L-shaped cross section as shown in FIGS. 3 and 6, and a horizontal molding 6 is formed on an upper mold 1 made of a conductor such as aluminum. A mold surface 7 is formed which includes a horizontal surface 7b corresponding to the portion 6b and a vertical surface 7a corresponding to the rising portion 6a of the molding 6. The horizontal surface 7b and the vertical surface 7a are continuous with each other by an appropriate R surface. Further, the lower mold 2 made of a non-conductive material such as silicone resin has a horizontal surface 8b corresponding to the horizontal portion 6b of the molding 6 and a vertical surface corresponding to the rising portion 6a of the molding 6 in the same manner.
8a and a mold surface 8 are formed, and between the mold surface 7 and the mold surface 7, a cavity 9 (see FIG. 2) is formed along the shape of the molding 6. The horizontal surface 8b
The vertical surface 8a and the vertical surface 8a are continuous with each other by an appropriate R surface.
そして、上記下型２の垂直面8aの背部には、該垂直面
8aと略平行に補助電極10が埋設されている。この補助電
極10は、下端面10aが下型２下面に露出しており、下型
２を下部電極板４に固定することによって、下部電極板
４に電気的に導通する構成となっている。なお、この補
助電極10と上型１の垂直面7aとの距離が、上型１の水平
面7bと下部電極板４との距離と略等しくなるような位置
に、補助電極10を配置することが望ましい。ここで、下
型２を例えば室温加硫タイプのシリコンゴムの注型成形
によって形成する場合には、その注型成形時に上記補助
電極10をインサートすることによって極めて簡単に補助
電極10を設けることができる。The vertical surface 8a of the lower mold 2 has a vertical surface
An auxiliary electrode 10 is embedded substantially parallel to 8a. The lower end surface 10a of the auxiliary electrode 10 is exposed on the lower surface of the lower mold 2, and by fixing the lower mold 2 to the lower electrode plate 4, the auxiliary electrode 10 is electrically connected to the lower electrode plate 4. The auxiliary electrode 10 may be arranged in such a position that the distance between the auxiliary electrode 10 and the vertical surface 7a of the upper mold 1 is substantially equal to the distance between the horizontal surface 7b of the upper mold 1 and the lower electrode plate 4. desirable. Here, when the lower mold 2 is formed by, for example, cast molding of room temperature vulcanizing type silicone rubber, the auxiliary electrode 10 can be provided very easily by inserting the auxiliary electrode 10 during the cast molding. it can.
上記のように構成された成形型によれば、第２図に示
すように型締めして、上部電極板3,下部電極板４間に高
周波電圧を印加した際に、導電体からなる上型１の水平
面7bから下部電極板４へ略垂直方向に高周波電流が流れ
ると同時に、上型１の垂直面7aから補助電極10へ略水平
方向に高周波電流が流れる。従って、キャビティ９の立
ち上がり部9aにも、略均一に高周波電流が流れ、この立
ち上がり部9a部分の成形材料５が十分に発熱，流動もし
くは発泡流動する。この結果、第３図に示すように、立
ち上がり部6aを備えた自動車用装飾用モール６を確実に
成形することができる。According to the molding die configured as described above, when the mold is clamped as shown in FIG. 2 and a high frequency voltage is applied between the upper electrode plate 3 and the lower electrode plate 4, the upper mold made of a conductor is used. A high frequency current flows from the horizontal surface 7b of the first mold 1 to the lower electrode plate 4 in a substantially vertical direction, and at the same time, a high frequency current flows from the vertical surface 7a of the upper mold 1 to the auxiliary electrode 10 in a substantially horizontal direction. Therefore, the high-frequency current flows substantially evenly in the rising portions 9a of the cavities 9, and the molding material 5 in the rising portions 9a heats sufficiently, flows or foams. As a result, as shown in FIG. 3, the automobile decoration molding 6 having the rising portion 6a can be reliably molded.
発明の効果 以上の説明で明らかなように、この発明に係る高周波
成形機の成形型によれば、キャビティの立ち上がり部を
通過するように高周波電流を導くことができ、従来高周
波成形が困難であった立ち上がり部を有する自動車用装
飾モール等を容易に、かつ確実に成形することができ
る。EFFECTS OF THE INVENTION As is apparent from the above description, according to the molding die of the high-frequency molding machine according to the present invention, the high-frequency current can be guided so as to pass through the rising portion of the cavity, and conventional high-frequency molding is difficult. An automobile decorative molding or the like having a raised portion can be easily and surely molded.
第１図はこの発明に係る成形型の一実施例を示す断面
図、第２図はこの成形型を型締め状態において示す断面
図、第３図はこの成形型によって成形されたモールの断
面図、第４図は従来の成形型の一例を示す断面図、第５
図及び第６図はそれぞれ従来の成形型によって成形され
たモールを示す断面図、第７図は従来の成形型における
高周波電流の流れを示す説明図である。 １……上型、２……下型、３……上部電極板、４……下
部電極板、９……キャビティ、9a……立ち上がり部、10
……補助電極。FIG. 1 is a sectional view showing an embodiment of a molding die according to the present invention, FIG. 2 is a sectional view showing the molding die in a clamped state, and FIG. 3 is a sectional view of a molding molded by the molding die. FIG. 4 is a sectional view showing an example of a conventional molding die, FIG.
FIG. 6 and FIG. 6 are cross-sectional views showing a molding molded by a conventional molding die, and FIG. 7 is an explanatory view showing the flow of high-frequency current in the conventional molding die. 1 ... upper mold, 2 ... lower mold, 3 ... upper electrode plate, 4 ... lower electrode plate, 9 ... cavity, 9a ... rising part, 10
…… Auxiliary electrode.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｂ２９Ｃ 51/42 7619−4Ｆ Ｂ２９Ｌ 31:30 ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location B29C 51/42 7619-4F B29L 31:30
Claims (1)
型とを有し、両者間のキャビティ内に挿填された樹脂材
料を高周波成形する高周波成形機の成形型において、上
記キャビティの立ち上がり部に略平行な補助電極を下型
内に埋設し、かつこの補助電極を下部電極板に導通させ
たことを特徴とする高周波成形機の成形型。1. A molding die of a high-frequency molding machine, comprising: an upper die made of a conductor and a lower die made of a non-conductor, and high-frequency molding a resin material inserted in a cavity between them. A molding die for a high-frequency molding machine, characterized in that an auxiliary electrode substantially parallel to the rising part of the is embedded in the lower mold, and the auxiliary electrode is electrically connected to the lower electrode plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62102515A JPH0813467B2 (en) | 1987-04-25 | 1987-04-25 | Mold of high frequency molding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP62102515A JPH0813467B2 (en) | 1987-04-25 | 1987-04-25 | Mold of high frequency molding machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63267515A JPS63267515A (en) | 1988-11-04 |
| JPH0813467B2 true JPH0813467B2 (en) | 1996-02-14 |
Family
ID=14329496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP62102515A Expired - Lifetime JPH0813467B2 (en) | 1987-04-25 | 1987-04-25 | Mold of high frequency molding machine |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0813467B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04272809A (en) * | 1991-02-28 | 1992-09-29 | Kinugawa Rubber Ind Co Ltd | Molding tool for high frequency molding |
| JP4654717B2 (en) * | 2005-03-15 | 2011-03-23 | 東洋製罐株式会社 | Container and manufacturing method thereof |
| WO2013067678A1 (en) | 2011-11-07 | 2013-05-16 | Lanxess Deutschland Gmbh | Uv curable flame retardant compounds, a uv curing method thereof, and the use thereof |
| CN103317622B (en) * | 2013-07-02 | 2015-10-14 | 无锡吉兴汽车声学部件科技有限公司 | Acoustic part of automobile ceiling mould A/C post heating arrangements |
-
1987
- 1987-04-25 JP JP62102515A patent/JPH0813467B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63267515A (en) | 1988-11-04 |
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