JPH08129716A - Method for polishing magnetic head structural body and device therefor and magnetic disk device - Google Patents

Abstract

PURPOSE: To facilitate polishing of the floating surfaces and rear surface of many thin-film magnetic heads with high accuracy in a block state connecting these elements by pressing the surfaces facing a polishing surface by an air pressure or air fluid pressure and polishing the surfaces. CONSTITUTION: A template 6 floated by static pressure air bearings is installed on a polishing surface plate 5 and a block 3 is inserted into a square hole 25 of the plate 6. A pressurizing section 8 having discharge holes 7 for discharging compressed air is placed on the plate 6. There are two rows of the holes 7 facing the longitudinal direction of the block 3 and return holes 9 of the discharge air are bored in the middles of two rows of the holes 7. Particularly, the pressurizing section is bored with the holes 7 with the plural holes on both sides across the holes 9 as one group and is further provided with discharge holes 27 on the outer side thereof. The pressurizing section 8 is lowered by a Z table 19 and the block 3 is pressed to a surface plate 5 by the air pressure or air fluid pressure flow out of the air discharge surface. The surface plate 5 is rotated in this state and the pressurizing part 8 is circularly moved by an X-Y table 8, by which the polishing surface of the block 3 and the surface plate 5 are slid.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for polishing a magnetic head structure such as a thin film magnetic head for a magnetic disk, a method for manufacturing a magnetic head such as a thin film magnetic head, and a magnetic disk device.

[0002]

2. Description of the Related Art Polishing of a conventional thin film magnetic head is performed by using FIG.
As shown in FIG. 3, a large number of thin film magnetic heads 102 adhere a block 103 in a straight line to a rotating jig 104, and a polishing agent 106 is supplied onto a rotary polishing plate 105 for polishing, and the jig 104 is moved to the jig 104. The air bearing surface of the block 103 was polished by applying a pressing force by a weight. Block 10
The bending of No. 3 is caused not only by the imbalance of the internal stress of the machined surface but also by the shrinkage of the adhesive when the block 103 is bonded to the jig 104 and the temperature change. Since it is extremely difficult to correct such a bend of the block 103 at the time of bonding, the conventional polishing method is disclosed in JP-A-5-123.
As shown in Japanese Patent Publication No. 960, the jig 4 was mechanically deformed so as to correct the bending of the block 3.

[0003]

In the conventional polishing method described above, the positional accuracy of the thin film magnetic head element patterns arranged in the longitudinal direction of the block 103 is high, and the gap length of the thin film magnetic head or the height of the magnetoresistive element is high. The accuracy is high. However, since the jig 104 is forcibly deformed, a local distortion is included. Also, block 10
Deformation due to adhesive strain and processing strain in the lateral direction of 3 also remains. Therefore, when the block 103 is peeled from the jig 104, the strain is released, and there is a problem in that the flatness of the air bearing surface, which is the polishing surface, deteriorates.

In order to solve the above-mentioned problems of the prior art, an object of the present invention is to polish a magnetic head such that the air bearing surface and the back surface can be highly accurately polished in a block state in which a large number of thin film magnetic head elements are connected. A method and an apparatus therefor are provided.

Another object of the present invention is to provide a method of manufacturing a thin film magnetic head with high accuracy and in a short time with a high throughput.

Another object of the present invention is to provide a magnetic disk device in which the flatness of the air bearing surface of a thin film magnetic head is improved to realize high density recording with a small thin film magnetic head.

[0007]

In order to achieve the above-mentioned object, the present invention is directed to the magnetic field by pressing a surface (opposing surface) of a magnetic head structure with respect to a polishing surface against a polishing tool by air pressure or air fluid pressure. A polishing method for a magnetic head structure, wherein the polishing surface of the magnetic head structure is polished by the polishing tool by a relative polishing motion between the head structure and the polishing tool.

Further, according to the present invention, a surface of the magnetic head structure (a surface facing the polishing surface) of a magnetic head structure in which a plurality of magnetic head element portions are connected to a polishing tool is pressed by air pressure or air fluid pressure to form the magnetic head structure. A polishing method for a magnetic head structure, comprising: polishing a polishing surface of a magnetic head structure in which a plurality of magnetic head element portions are connected by a relative polishing motion with the polishing tool, using the polishing tool. The present invention also provides the method of polishing a magnetic head structure as described above,
The magnetic head element portion constituting the magnetic head structure is
It is characterized in that it is formed of a thin film magnetic head element portion. Further, according to the present invention, in the method of polishing a magnetic head structure, the polishing surface is at least an air bearing surface in a form in which the plurality of magnetic head elements are connected. The present invention also provides the method of polishing a magnetic head structure, wherein the air pressure or the air fluid pressure is 10 to 200.
It is characterized by being kPa. Further, according to the present invention, in the method of polishing a magnetic head structure, a distribution of air pressure or air fluid pressure in a direction in which a plurality of magnetic head elements pushing a surface of the magnetic head structure against a polishing surface by air pressure or air fluid pressure are connected. Is controlled to control the polishing amount distribution in the plurality of magnetic head elements. Further, the present invention is, in the method for polishing a magnetic head structure, by independently adjusting individual discharge air pressures or discharge air fluid pressures from a plurality of air discharge holes provided, air pressures for pushing the polishing surface back surface or It is characterized in that the distribution of the air-fluid pressure is controlled to control the polishing amount distribution of the plurality of magnetic heads. Further, the present invention provides the method of polishing a magnetic head structure, wherein a gap between an ejection surface of air for pushing the back surface of each magnetic head polishing surface in one magnetic head structure (block) and a back surface of each magnetic head polishing surface is set. Measure based on the discharge amount of air, and use the measured value to determine the distribution of discharge air pressure or discharge air fluid pressure in order to control the polishing amount distribution so that the thickness of the magnetic head or the dimensions of the magnetic head element are uniform. It is characterized by adjusting and polishing. In the polishing method of the magnetic head structure according to the present invention, the polishing amount is detected by a polishing amount detection pattern formed on the magnetic head together with the discharge amount of air, and the size of the magnetic head element is also the discharge air pressure or the discharge air fluid pressure. Is controlled by the distribution of. Further, the present invention is characterized in that, in the method of polishing a magnetic head structure, the air bearing surface side and the back surface side of the magnetic head structure are continuously polished using an inversion mechanism of the magnetic head. In the method of polishing a magnetic head structure according to the present invention, after polishing a back surface and an air bearing surface of the magnetic head structure, the magnetic head is chucked to about 0.7.
It is characterized in that the inclined surface portion of about 0.7 degrees is also continuously polished at the inflow end of the magnetic head. Further, according to the present invention, in the method for polishing a magnetic head structure, air is ejected by drawing a vacuum from an air ejection hole or an ejection air return hole in order to simultaneously polish a large number of magnetic head structures (blocks). The magnetic head structure (block) whose surface has been polished is vacuum-chucked and lifted up, and polishing is sequentially stopped.

The present invention also measures the polishing amount of the magnetic head structure or the gap between the surface of the magnetic head structure with respect to the polishing surface and the air ejection surface for ejecting air, and the measured polishing amount or gap. The air flow or the air pressure or the air fluid pressure of the air discharged from the air discharge surface is controlled based on the above to push the back surface with the air pressure or the air fluid pressure with respect to the polishing tool, and the relative between the magnetic head structure and the polishing tool. The method for polishing a magnetic head structure is characterized in that the polishing surface of the magnetic head structure is polished by the polishing tool by a mechanical polishing motion.

The present invention also measures the polishing amount of a magnetic head structure in which a plurality of magnetic head elements are connected, or the gap between the surface of the magnetic head structure with respect to the polishing surface and the air ejection surface for ejecting air. Controlling the flow rate or the air pressure or the air fluid pressure of the air discharged from the air discharge surface based on the measured polishing amount or the gap, to the polishing tool to the air pressure or the surface of the magnetic head structure to the polishing surface. A method of polishing a magnetic head structure, comprising pressing the surface of the magnetic head structure with an air-fluid pressure and polishing the surface with the polishing tool.

Further, according to the present invention, a thin film element in which a large number of thin film elements each including an inductive element for writing and a magnetoresistive element for reading which are composed of at least a magnetic core, a magnetic gap limiting film and a coil are formed on a ceramic substrate. A thin film element substrate manufacturing step of manufacturing a substrate, a cutting step of cutting the thin film element substrate manufactured in the thin film element substrate manufacturing step into a thin film magnetic head structure in which a plurality of thin film magnetic head element parts are connected, and the cutting step With respect to the air bearing surface and the back surface of the thin film magnetic head structure in which a plurality of thin film magnetic head elements that have been cut with each other are pressed by air pressure or air fluid pressure, the thin film magnetic head structure and the polishing surface are pressed. The air bearing surface and the back surface of the thin film magnetic head structure in which the plurality of thin film magnetic head elements are connected by the relative polishing motion with the tool are moved forward. A polishing step of polishing with a polishing tool and further forming an inclined surface for entry at the entry end on the air bearing surface, and a hard protective film on the air bearing surface of the thin film magnetic head structure polished in the polishing step. And a chip cutting process for obtaining each thin film magnetic head by cutting the thin film magnetic head structure having a hard protective film formed in the protective film forming process into chips. It is a method of manufacturing a magnetic head. Further, in the magnetic head manufacturing method of the present invention, an air bearing surface of a thin film magnetic head structure having a hard protective film formed in the protective film forming step between the protective film forming step and the chip cutting process. It is characterized in that it has a shape rail processing step of performing shape rail processing. Further, in the magnetic head manufacturing method of the present invention, in the polishing step, a step of roughly polishing an air bearing surface and a back surface of the block using an abrasive containing diamond abrasive grains in water, and an interface with water are used. And a step of performing final polishing using a liquid in which an activator is dissolved.

The present invention also provides a polishing tool, pneumatic pressing means for pressing the surface of the magnetic head structure against the polishing surface with air pressure or air fluid pressure, and a magnetic head pressed by the pneumatic pressing means. Relative polishing motion imparting means for performing relative polishing motion between the structure and the polishing tool, and the relative polishing motion imparted by the relative polishing motion imparting means causes the polishing surface of the magnetic head structure to move. A polishing apparatus for a magnetic head structure, which is configured to be polished by a polishing tool. The present invention also provides
In the magnetic head structure polishing apparatus, the air pressure pressing means is provided with a control means for controlling an air pressure or an air fluid pressure for pressing a surface against the polishing surface.

Further, according to the present invention, a thin film magnetic head having a head length of 1.5 mm or less and an air bearing surface flatness of 6 nm or less is provided at the tip of a leaf spring attached to a slide mechanism. A magnetic disk device characterized by being configured so as to be levitated with respect to a magnetic disk at 0.03 μm or less.

Further, according to the present invention, a head length of 1.5 mm or less, a head width of 1.3 mm or less, and a head thickness of 0.35 mm or less are provided at the tip of a leaf spring attached to a slide mechanism. The gap length is 0.25 μm or less, the track width is 2 μm or less, and the air bearing surface has a flatness of 6 n.
A magnetic disk device comprising a thin-film magnetic head of m or less, and the thin-film magnetic head being configured to float above a magnetic disk at 0.03 μm or less.
According to the present invention, in the magnetic disk device, the height accuracy of the magnetoresistive element in the thin film magnetic head is ± 0.
It is characterized by being 2 μm or less.

[0015]

The thin film magnetic head is processed by the process shown in FIG. That is, hundreds or thousands of layers 2 of thin film elements are formed on the ceramic substrate 1 by using the same lithography as that of LSI. This substrate is cut into a thin film magnetic head structure (block) 3 in which dozens or dozens of thin film elements of the magnetic head are linearly connected. Since the positional accuracy of the element 2 before cutting the substrate is determined by the accuracy of the thin film lithography, the deviation of the element position from the straight line is within 0.1 μm. However, if a difference occurs in the work strain layers of the cut surfaces on both sides of the block, a bending moment is generated due to the difference in the internal stress, and the thin film magnetic head structure (block 3) bends. When bent, the positions of the magnetic head element patterns arranged in a straight line in the longitudinal direction of the block 3 change. If the block 3 is polished while it is bent, the gap depth of the magnetic head element or the height of the magnetoresistive element will not be uniform, and many magnetic heads that do not satisfy the characteristics will be produced. So block 3
Both sides are polished to reduce processing strain.

However, the recording density is improved (the surface density is 1 Gb
/ In ² or more) to the miniaturization of the thin film magnetic head with (is 1.5mm or less head length, head width of 1.3mm or less, for the head thickness of 0.35mm or less), block 3 is 0.35mm The thickness becomes thinner (0.3 mm) (dimension after polishing) and the bending rigidity is reduced. Therefore, even if both surfaces of the block 3 are polished, the block 3 is bent due to a slight imbalance in the internal stress. Further, as the recording density is improved, the required accuracy of the gap depth of the magnetic head element or the height of the magnetoresistive element is also increased.
Even a slight bend in Block 3 cannot be ignored.

However, according to the present invention, the thin-film magnetic head structure (block) 3 due to the contraction of the adhesive and the temperature change is not adhered to the jig as in the prior art due to the above-mentioned structure.
Even if the internal stress on both sides of the block 3 changes due to polishing, the block 3 bends in response to the change and is polished in this bent state, so polishing is completed. The block 3 will not be bent later, the flatness of the air bearing surface will not deteriorate to 7 nm or more, and the flatness of the air bearing surface will be 6 nm or less (especially 5 nm).
It was confirmed by experiments that the value of (within) was ensured. In this way, in the thin-film magnetic head, in particular, the flatness of the air bearing surface can be secured at 6 nm or less. By using this thin film magnetic head, the flying height can be secured at 0.03 μm or less and the areal density is 2 Gb / in. It became possible to record on a magnetic disk with a recording density of ² or more.

Further, according to the present invention, the flatness of the air bearing surface and the back surface is ensured to be 6 nm or less (particularly within 5 nm), and the polishing amount is controlled so that the gap depth accuracy of the inductive element varies. Is within ± 0.2 μm, the accuracy of height variation of the magnetoresistive element can be secured within ± 0.1 μm, the yield is good, and it is used for the magnetic disk device with high recording density of ² Gb / in ² or more. Became possible.

Further, according to the present invention, since the thin film magnetic head structure (block) 3 can be inverted and both surfaces of the block (the air bearing surface and the back surface) can be continuously polished, the polishing processing time including the handling can be shortened. The manufacturing throughput can be improved and the cost can be significantly reduced.

Further, in the present invention, in order to realize a recording density of ² Gb / in ² or more, it is necessary to set the gap length of the inductive element to 0.25 μm or less and the track width to 2 μm or less.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described with reference to the contents shown in FIGS.

As shown in FIG. 6, the block 3 provided in the polishing apparatus has a thin film element forming step 3 as described below.
0 and a substrate cutting (block forming) step 31. That is, in the thin film element forming step 30, the diameter of the mixture of alumina titanium carbide 1
On the ceramic substrate 1 having a thickness of 52.4 mm and a thickness of 1.2 mm, the same lithographic method as that for the LSI is used to form
(A) (b) magnetic core (magnetic film) (track width is 2 μm or less) 81, magnetic gap regulating film (gap length 1 is 0.25 μm or less), winding (coil) ) 82, etc., a layer 2 of a large number of thin film elements consisting of an inductive element for writing and a magnetoresistive element 80 for reading is formed. The thickness of the layer 2 of this thin-film element is 0.05 mm, and when this thickness is added to the thickness of the substrate, it becomes 1.25 mm. A thickness of 1.25 mm obtained by adding the thickness of the thin film element layer to the substrate thickness corresponds to the length of the thin film magnetic head. Next, in a substrate cutting (block forming) step 31, the substrate on which the layer 2 of the thin film element is formed is set to a length of 5
0.2 mm (42 thin film magnetic head elements connected in series), thickness 0.35 mm (thin film magnetic head thickness 0.3)
The block (thin film magnetic head structure) 3 is obtained by cutting at a value obtained by adding a polishing allowance of 0.05 mm to the value of mm. FIG. 6 shows the dimensions of the block (thin film magnetic head structure) 3 cut in the substrate cutting step 31. That is, 50.2 mm (length) x 1.25 mm (width) x 0.
It is 35 mm (thickness).

The polishing apparatus includes a polishing platen 5 which is rotationally driven.
It is installed on the polishing surface plate 5 so as to float by a static pressure air bearing. Each of the eight blocks 3 can be radially inserted at an interval of 45 °, and has an expanded inclined surface on the upper side. A template 6 in which eight rectangular square holes (slits) 25 are formed at intervals of 45 ° and a discharge hole 7 that is fastened to the template 6 by vacuum suction and discharges compressed air are provided in each square hole 2.
5 (corresponding to each block 3), a pressurizing unit 8 formed in 5 positions in two rows in the radial direction corresponding to 5 (each block 3), a regulator 10 provided in the pressurizing unit 8 for adjusting the air pressure supplied to the discharge hole 7,
A flow meter 11 provided in the pressurizing unit 8 for measuring the flow rate of air, an XY table 18 and a Z table 19 supporting the template 6 and the pressurizing unit 8, and a template 6 fastened by vacuum suction. An air cylinder or a dead weight (not shown) that presses a fastening body composed of the pressurizing unit 8 and the polishing platen 5 is provided. As shown in FIG. 6, the block 3 is provided with a polishing amount detection pattern (resistance, disconnection pattern) 12 shown in FIG. 5 at a position corresponding to the ejection hole 7 in the thin film element forming step 30.

A template 6 which is floated by a static pressure air bearing is set on the polishing platen 5, and the block 3 is inserted into the square hole 25 of the template 6. The length of this block 3 is 5
0.2 mm (42 thin film magnetic head elements with a width of 1 mm are connected in series, a chip cutting allowance of 0.2 mm is provided between the individual thin film magnetic head elements, and the total length is 50.2 mm), The width is 1.25 mm (corresponding to the length of the thin film magnetic head) and the thickness is 0.35 mm (0.3 m after polishing).
m). On the template 6, a pressure part 8 having a discharge hole 7 for discharging compressed air is placed. Pressure part 8
There are two rows of compressed air discharge holes 7 formed corresponding to the longitudinal direction of the block 3, and 45 rows each have a diameter of 0.
A 1 mm discharge hole 7 is formed. In addition, a return hole 9 having a diameter of discharge air of 0.8 mm is formed in the middle of the two rows of discharge holes 7. The discharge holes 7 are divided into 5 groups per row, with 9 holes that are continuously arranged on one row as one group, and are divided into a total of 10 groups in 2 rows. In particular, since the discharge holes 7 having 9 holes as one group on both sides of the return hole 9 are formed, both ends of the width of the block 3 are pressed by air pressure or air fluid pressure. Since small exhaust grooves (exhaust ports) 26 and 27 are provided on the outer side of the exhaust holes 7,
As a result, compressed air flows smoothly without stagnation, and the block 3 can be pressed uniformly against the polishing surface plate 5. Particularly, the center of the polishing surface becomes finely convex 6
A flatness of less than or equal to nm (within 5 nm) is obtained.

In one group, the supply air pressure can be independently adjusted by the regulator 10. The adjustment of the air pressure supplied to the discharge hole 7 for each group, that is, the control, is No. 1 to No.
No. 10 based on the air pressure command signal 23 of No. 1 to No.
This is performed by each of the ten regulators 10. Compressed air (compressed air) supplied from a compressed air source (not shown) through the pipe 20 is a flow meter 11 provided for each group.
Is supplied to the regulator 10 via. The compressed air whose pressure is adjusted by each regulator 10 is discharged from the nine discharge holes 7 of one group. And No.
1 to No. The flow rate of the compressed air supplied to the discharge holes 7 of each group is measured from each of the flow meters 11 of 10 and N
o. 1 to No. The respective flow rate signals 24 of 10 are transmitted to the control personal computer 21.

When polishing, the Z stage 19 lowers and stops the pressing unit 8 by a desired amount, and the pressing unit 8 and the template 6 are inclined with respect to each other (the template 6 is expanded upward). The inclined surface and the pressurizing portion 8 which are narrowed downward are engaged with each other, and the pressurizing portion 8 and the template 6 are fastened by vacuum suction. Then, when the pressurizing unit 8 is engaged with the template 6 and fastened by vacuum suction, small exhaust grooves (exhaust ports) 26, 27 are formed on the boundary surface (inclined surface) between the pressurizing unit 8 and the template 6. Are formed. The fastening body is configured to be pressed against the polishing platen 5 by an air cylinder or dead weight (not shown). Most of the pressing load is the template 6 and the polishing platen 5.
The fastening body is set to a constant height with respect to the polishing platen 5 by being received by an aerostatic bearing between As a result, from the polishing surface 17 of the polishing platen 5 to the air discharge surface 1 of the pressurizing unit 8.
Heights up to 4 can be made constant with high precision. Further, the pressurizing unit 8 provided with the air discharge surface 14 is configured so that it can be finely moved up and down by a large number of piezo elements with respect to the Z table 19, and each of the piezo elements is driven according to the thickness of the block 3 to make a template. It is also possible to finely move the pressurizing unit 8 to which 6 is fastened up and down so that the gap between the air discharge surface 14 and the block 3 becomes constant.

Further, since the pressurizing unit 8 is supported by the XY table 18 and the Z table 19, the template 6 and the pressurizing unit 8 are disengaged from each other by vacuum suction, and only the pressurizing unit 8 is operated by the Z table 19. The square hole 25 of the template 6 can be opened by raising it, and
It is possible to set each of the eight blocks (thin film magnetic head structure) 3 manufactured by cutting in each of the square holes 25.

During polishing, the pressurizing unit 8 descends by the Z table 19 and presses the block 3 against the polishing platen 5 by the air pressure or air fluid pressure blown from the air discharge surface 14. . In this state, polishing surface plate 5
The polishing surface of the block 3 and the surface plate 5 are slid by rotating the pressurizing section 8 (the template 6 is fastened) and making a circular motion by the XY table 18.

The polishing amount of the block 3 can be monitored by the polishing amount detecting pattern 12 including the disconnection pattern 40 and the resistance pattern 41 shown in FIG. As shown in FIG. 6, the polishing amount detection pattern 12 is formed at the same time as the thin film element layer 2 in the thin film element forming step 30, and is manufactured by the thin film manufacturing process within a relative positional accuracy of 0.1 μm or less. The resistance value of the polishing amount detection pattern 12 has a characteristic that it decreases stepwise as the polishing amount increases.
The resistance value of the polishing amount detection pattern 12 changes by 1Ω with respect to the change in the polishing amount. This is because a series of 1Ω resistance patterns are formed in series, and a switch formed of the same thin film as the resistance pattern is connected in parallel to each resistance pattern, and each time the polishing amount increases by 0.1 μm. The switches are formed so that they can be turned off one by one. Therefore, the detection resolution of the polishing amount is 0.1 μm. Each probe 13 is brought into contact with each of the terminals 42 of these at least five polishing amount detection patterns 12, and the resistance value between the terminals is detected by the probe 13 to determine No. 1 to N
o. The resistance value signal 5 of 5 is input to the control personal computer 21. Therefore, the control personal computer 21 can calculate the polishing amount at least at five points in the block 3 from the resistance value of the polishing amount detection pattern 12.

The polishing amount can also be detected based on the flow rate of the compressed air supplied to the discharge holes 7 of each group measured by the flow meter 11. The relationship between the polishing amount and the flow rate is obtained as follows. Surface 1 on which air discharge hole 7 is formed
The change in the gap h between 4 and the block 3 is the polishing amount. This gap h and the discharge amount (flow rate) Q of compressed air
The relationship of is expressed by the following expression (Equation 1).

Q = k · h ³ (1) where k is a proportional constant.

The relationship between the change δh in the gap h and the change δQ in the discharge amount (flow rate) of compressed air is given by the following (Equation 2).
It is expressed by the relationship of expressions.

ΔQ = 3k · h ² · δh = 3Q · δh / h (δQ) / Q = (3 · δh) / h (Equation 2) Therefore, the sensitivity of the flow meter 11 is 1 / full scale. 100
Then, the detection sensitivity of the polishing amount is 1 / g of the gap h.
It becomes 300. Since the gap is about 5 to 20 μm,
The detection sensitivity of the polishing amount by the flow meter 11 is about 0.02 to 0.
It becomes 07 μm. The air discharge holes 7 are arranged in two rows in the longitudinal direction of the block 3, and the discharge amount (flow rate) of the compressed air can be independently measured by each flow meter 11, so that not only the distribution of the polishing amount in the longitudinal direction but also the lateral direction can be measured. The tilt of the block 3 can also be measured.

Further, the return hole 9 for the discharged air also has a vacuum suction function, and the block 3 after polishing is vacuum-sucked to the air discharge surface 14 and lifted up to separate the polishing surface plate 5 and the block 3. To stop polishing.

Next, the reversing mechanism 15 for polishing both surfaces (the air bearing surface and the back surface) of the block 3 will be described with reference to FIG. That is, the square hole 25 is formed on the template 6.
Eight reversing mechanisms 15 for reversing the blocks 3 that have been inserted into, and polished and vacuum sucked in the return holes 9 for the discharge air are installed at 45-degree intervals corresponding to the square holes 25. The reversing mechanism 15 has an arc-shaped convex portion formed at its tip, a convex member 28 that is pressed by the spring 14 and guided so as to be slidable in the horizontal direction, and an arc-shaped member that is opposed to the convex member 28. The concave member 29 is formed at the tip and is pressed by the spring 14 and guided so as to be slidable in the horizontal direction. Then, when the pressing portion 8 is moved upward by the upward drive of the Z table 19, the block 3 is guided between the arcuate convex portion at the tip of the convex member 28 and the arcuate concave portion at the tip of the concave member 29. A space for reversing is formed by lowering the space. Therefore, when the block 3 is attracted to the tip of the pressing portion 8 as shown in FIG. 3A and the pressing portion 8 is moved up by the Z table 19 ascending drive as shown in FIG. The convex member 2 due to the pressing force
8 and the concave member 29 advance together to form a gap between the convex member 28 and the concave member 29 for reversing the block 3, and as shown in FIG. 3 (c), the vacuum suction of the return hole 9 of the discharge air is prevented. When the block is released, the block 3 falls and is guided by the gap and inverted. As a result, both the air bearing surface and the back surface of the block 3 can be polished.

Next, a tilting mechanism 16 for imparting a 0.7-degree tilted surface 40 to the entry end of the air bearing surface 41 of the block 3
Will be described with reference to FIG. That is, block 3
The tilting mechanism 16 for imparting the inclined surface 40 of 0.7 degree to the entry end of the air bearing surface 41 of the block 3 moves the block 3 into the air discharge surface 1
After being vacuum-adsorbed on 4, the piezoelectric element 42, which is installed between the pressurizing portion 8 and the base portion, which is pulled by the spring 43, is applied with a voltage, for example, to be extended to slightly rotate the pressurizing portion 8 by 0.7 degrees ( This is a mechanism for slightly tilting the block 3, lowering the block 3 with another piezo element (not shown), and pressing and sliding the block 3 against the polishing platen 5 to polish a 0.7-degree inclined surface.

As is clear from the description of FIGS. 1 and 2, the eight blocks 3 can be simultaneously polished.

Next, using the apparatus having the above-mentioned structure, the air bearing surface 41 and the back surface of the block 3 (thin film magnetic head structure) 3 (air bearing surface 41 and back surface) are ground by air pressure polishing 32 (FIG. 6). Will be specifically described. The polishing step 32 is specifically composed of the steps shown in FIG. 7. That is, an air bearing surface rough polishing step 70 of rough polishing (using an abrasive) the air bearing surface 41 of the block 3,
Inversion step 71 of inverting the block 3 and back surface rough polishing step 72 of rough polishing (using an abrasive) the back surface of the block 3.
And a back surface finish polishing step 73 of finishing polishing the back surface of the block 3 (by a liquid), an inversion step 74 of inverting the block 3, and an air bearing surface finish polishing step 75 of finishing polishing the air bearing surface of the block 3 (by a liquid). And a 0.7-degree inclined surface polishing step 76 for imparting a 0.7-degree inclined surface 40 to the entry end of the air bearing surface of the block 3.

First, in response to a command from the control personal computer 21, Z
The table 19 is driven to raise the pressurizing unit 8 to move the air bearing surface 4
The block 3 is mounted in the square hole 25 of the template 6 with 1 facing down, and set on the polishing platen 5. Next, in response to a command from the control personal computer 21, the Z table 19 is driven to lower the pressure unit 8 and the template 6 is fastened by vacuum suction. Next, in the pressurizing unit 8, the regulator 10 controls (adjusts) the air pressure based on the air pressure command 23 applied from the control personal computer 21 to the regulator 10 so that the air pressure from the air discharge hole 7 is 10 to 200 Pa. (Especially, since the discharge holes 7 having 9 holes as one group are formed on both sides of the return hole 9 as a center, press both ends of the width of the block 3 with air pressure or air fluid pressure. And a small exhaust groove (exhaust port) on the outside
Since 26 and 27 are provided, the compressed air flows smoothly from the discharge hole 7 without stagnation, and the block 3 can be pressed uniformly against the polishing platen 5. Further, since the five groups are installed also in the longitudinal direction of the block 3, the block 3 can be pressed uniformly in the longitudinal direction of the block 3. ), The block 3 is uniformly pressed against the polishing platen 5 (both ends in the width direction of the block 3 are pressed by air pressure or air fluid pressure). At the same time, the polishing surface plate (made of tin, diameter 300
mm) 5 rotational movement (300 r / min) and circular movement of the pressurizing section 8 driven by the XY table 18 (diameter 100 m
m, motion cycle 0.2 Hz), and while sliding both, an abrasive (average particle size 0.25 μ in 100 cm ³ of water)
An abrasive with 0.7 carats of m diamond abrasive dispersed and suspended with 0.2 cm ² of anionic and nonionic surfactants is 2.7 cm ² / min on the polishing platen 5.
Then, the head air bearing surface 41 side of the block 3 is polished. At this time, the control personal computer 21 calculates the polishing amount based on the resistance value change based on the resistance value signal 22 detected from the polishing amount detection pattern 12 and the flow rate change based on the flow rate signal 24 of the compressed air measured by the flowmeter 11. And monitor.
That is, the control personal computer 21 calculates the deviation of the height t of the read magnetoresistive element 80 or the gap depth g of the write inductive element from the target dimension shown in FIGS. Monitor it. To the target dimension,
The size including the final polishing allowance is used as the target size for rough polishing.
The control personal computer 21 compares the rough polishing target dimension at at least 10 locations (individual thin-film magnetic head elements) with the calculated monitor value in block 3 and ejects from the air ejection hole 7 above the location where the difference is large. The regulator 10 is controlled based on the air pressure command 23 so as to increase the air pressure or the air fluid pressure to be applied, and the thin film magnetic head element is controlled to be polished more. In this way, the control personal computer 21 controls the distribution of the polishing amount of the block 3, whereby the thin film magnetic head elements of the block 3 are simultaneously polished so as to reach the rough polishing target dimension.

Next, the block 3 which has reached the rough polishing target dimension
In response to a command from the control personal computer 21, the return hole 9 is vacuum-sucked and vacuum-sucked to the air discharge surface 14.
Then, by driving the Z stage 19, the block 3 is lifted and the polishing by the polishing platen 5 is stopped. 8
Although the individual blocks 3 are polished at the same time, the polishing is stopped by sequentially vacuum-sucking the blocks 3 that have reached the rough polishing target dimension using the return holes 9, and all blocks 3 (8
The rough polishing of individual pieces is completed. (Air bearing surface rough polishing step 70) When the rough polishing of the air bearing surfaces of all the blocks 3 (8 pieces) is completed in this way, a command from the control personal computer 21 causes the air bearing surface of FIG.
As shown in FIG. 3, the reversing mechanism 15 (the Z stage 19 is driven to raise the pressurizing portion 8 to release the vacuum suction by the return hole 9 to pass through the gap between the member 28 and the member 29 to block 3). Is reversed.) And the block 3 is reversed and set in the square hole 25 of the template 6. (Inversion Step 71) After inverting all blocks, rough polishing of the back surface of the block 3 (the back surface of the air bearing surface) is started in the same manner as the air bearing surface of the block 3. The rough polishing target size of the back surface of the block 3 is determined by the thickness of the block 3. That is, the target dimension of the back surface rough polishing is set to the target dimension of the block 3 plus the finish polishing margin on the air bearing surface side and the finish polishing margin on the back surface side. Since the polishing amount detection pattern 12 cannot be used when polishing the back side of the block, the control personal computer 21 uses the flow rate signal 24 of the compressed air measured by the flow meter 11 as described above. Calculate the dimensions from 14 to block 3.
In addition to the uniformity of the thickness of the block 3 in the longitudinal direction, the parallelism in the lateral direction of the block is controlled by utilizing the fact that the air ejection holes are arranged in two rows. As in the case of polishing on the air bearing surface side, the control method is to increase the ejection air pressure of the thicker magnetic head portion with respect to the target dimension by using the regulator 10 so that the block 3 has a uniform thickness. Vacuum suction is sequentially performed on the air ejection surface 14 from the block 3 that has reached the target back surface dimension, and polishing is stopped. (Backside rough polishing step 72) Based on a command from the control personal computer 21, when the rough polishing of the backsides of all blocks is completed, the finish polishing of the backsides is started. The target finish thickness of the back surface is a value obtained by adding the finish polishing allowance of the air bearing surface to the target thickness of the block 3. The finish polishing conditions are as follows: the number of rotations of the polishing platen 5 is 50 r / min, and the diameter of the circular motion of the pressurizing unit 8 driven by the XY stage 18 is 100.
mm, the motion cycle is 0.03 Hz, the abrasive used in the rough polishing is not supplied, and a solution of 0.2 cm ² of an anionic surfactant in 100 cm ³ of water is placed on the polishing platen 5
Supply in cm ² / min. The back surface finish polishing is performed in the same manner as the back surface rough polishing, and the blocks having reached the back surface finish polishing dimension are sequentially vacuum-adsorbed to the air ejection surface 14 to stop the polishing. (Back surface finish polishing step 73) When the back surface finish polishing of all blocks is completed, the block 3 is inverted using the inversion mechanism 15 shown in FIG. (Inversion Step 74) Next, based on a command from the control personal computer 21, the finish polishing of the air bearing surface side is started. The air bearing surface finish polishing conditions are
It is the same as the back surface finish polishing conditions. The distribution control of the polishing amount is performed in the same manner as the air bearing surface rough polishing. The control personal computer 21 adjusts the air discharge pressure distribution by the regulator 10 so that the resistance values of the polishing amount detection patterns of the respective magnetic heads become equal, and the flow meter 11 monitors the parallelism in the lateral direction of the block. The regulator 10 controls the difference in air pressure discharged from the air discharge holes 7 arranged in two rows in the lateral direction of the block so that the parallelism is within 0.1 μm. The blocks having reached the final polishing size are sequentially vacuum-adsorbed on the air ejection surface 14 to stop the polishing. (Finished surface finish polishing 7
5) After finishing the air bearing surface finish polishing, the tilting mechanism 1 shown in FIG.
6, the block 3 is tilted by 0.7 degrees, the pressurizing portion 8 is cut by a piezo element, and the 0.7-degree tilted surface 40 is polished at the entrance end of the air bearing surface. The width of the inclined surface of 0.7 degrees is controlled by the cut amount of the piezo element. (Step of polishing 0.7 degree inclined surface to the entry end of the air bearing surface 76) As described above, the air pressure pressing and polishing step 3 of the air bearing surface and the back surface
2 ends.

After that, the block 3 which has been polished is 218.
A jig having a diameter of 153 mm is positioned and fixed in two rows, and a protective film made of hard carbon is collectively formed on the air bearing surface 41. (Hard protective film forming step 33 shown in FIG. 6) After that, a resist is applied, exposed and developed to form a shape rail-shaped resist pattern on the air bearing surface. Ion milling is performed using this resist pattern as a mask, thereby forming a shape rail on the air bearing surface.
(Shape rail processing step 34 shown in FIG. 6) After this, chips are cut into individual magnetic heads on a jig.
Further, each thin film magnetic head obtained by peeling and cutting the resist is removed from the jig. (Chip cutting step 35 shown in FIG. 6) Through the steps described above, it is possible to manufacture a highly precise ultra-small thin film magnetic head. In this embodiment, since the polishing is carried out under the same constant plate and under the same polishing conditions, the internal stresses on the polished surface of the air bearing surface and the back surface of the magnetic head are substantially equal, so that there is no deformation due to processing strain. Further, since it is not bonded to the jig, there is no deterioration in flatness due to bonding distortion. Therefore, the flatness of the air bearing surface of the thin film magnetic head is 6
It has been confirmed by experiments that a wavelength of 5 nm or less (especially within 5 nm) can be realized (20 nm in the method of bonding to a conventional jig).
Is). The flatness was measured by a minute gap measuring method using optical interference.

Further, since the polishing amount is controlled while detecting the magnetic head element size and the magnetic head thickness, 81, 8
The accuracy of variation of the gap depth g of the inductive element formed in 2 is within ± 0.2 μm (conventional ± 0.5 μ).
m), the variation accuracy of the height t of the magnetoresistive element 80 is ±
It was possible to polish to within 0.1 μm (conventional ± 0.5 μm). Moreover, in the final polishing, the abrasive grains are not newly supplied, and only the abrasive grains embedded and remaining on the polishing surface plate 5 are used for the polishing, so that the processing step (the magnetic element from the air bearing surface of the magnetic head is removed). The amount of depression increases the effective flying height of the magnetic head with respect to the magnetic disk, so it is desirable to minimize it) s (shown in FIG. 6) is 5 nm.
Within the range (conventional 20 nm). Especially, the air bearing surface 4
8 is exaggeratedly enlarged in FIG. 8 (c). As described above, both ends of the block 3 are pneumatically or pneumatically fluidized by the air discharge holes 7 provided at a little distance on both sides of the return hole 9. Since the center of the air bearing surface becomes finely convex, since 6 nm or less (particularly within 5 nm) can be secured, the flying height with respect to the magnetic disk 90 is 0.03 μm or less. 0.025 μm
(Conventional 0.07 μm) has been realized, enabling a high recording density of ² Gb / in ² or more for a magnetic disk.

In order to realize a high recording density of ² Gb / in ² or more in this way, it is necessary to make the thin film magnetic head small. For that purpose, the head length is 1.
It is necessary that the head width is 5 mm or less, the head width is 1.3 mm or less, the head thickness is 0.35 mm or less, the gap length (width) 1 of the inductive element is 0.25 μm or less, and the track width is 2 μm or less.

Next, in FIG. 9, the flatness of the air bearing surface is 6
FIG. 1 is a perspective view showing a schematic configuration of a magnetic disk device equipped with a thin film magnetic head capable of ensuring a thickness of 5 nm or less (particularly within 5 nm). Reference numeral 90 is a magnetic disk in which a large number of them are arranged and which are rotated at high speed. Reference numeral 91 denotes the thin film magnetic head manufactured as described above. Reference numeral 92 is a support spring that supports the thin film magnetic head 91. 93 is the magnetic disk 9
The head carriage mounts a support spring 92 that supports a thin film magnetic head 91 corresponding to 0. Reference numeral 94 is a guide rail for guiding the head carriage 93.
Reference numeral 95 denotes a driving unit that reciprocates the head carriage 93 to reciprocate the thin film magnetic head 91. Thus, the magnetic disk device has a magnetic recording density of 2 Gb / in.
It is configured to achieve a high recording density of ² or more.

By the process shown in FIG. 6, about 30 mi
It is possible to process 8 blocks and 336 thin film magnetic heads in a cycle of n, that is, after cutting the substrate, the blocks are polished to 0.
It can be manufactured in a mere 30 minutes as compared with the conventional 5 to 10 days until the inclined surface 7 is provided.

[0046]

According to the present invention, in a thin film magnetic head, it is possible to obtain a high accuracy of the air bearing surface flatness of 6 nm or less (particularly within 5 nm) by polishing, and as a result, the thin film magnetic head can be used for a magnetic disk. And a surface density of 2 Gb / in ² or more can be recorded on a magnetic disk, and a magnetic disk device having a recording density of ² Gb / in ² or more can be provided. There is an effect that can be obtained.

According to the present invention, the gap depth precision of the inductive element in the thin film magnetic head is ± 0.2 μm or less, and the height variation precision of the magnetoresistive element is ±.
It is possible to realize a processing step of 0.1 μm or less and a processing step of 5 nm or less, and it is possible to manufacture a magnetic disk device having a recording density of ² Gb / in ² or more with a high yield.

Further, according to the present invention, the polishing efficiency of the thin film magnetic head can be improved, and as a result, the throughput of the thin film magnetic head can be remarkably improved.

[Brief description of drawings]

FIG. 1 is a schematic perspective view having a partially enlarged cross section showing an embodiment of a magnetic head polishing apparatus according to the present invention.

FIG. 2 is an external perspective view of the device shown in FIG.

3 is a diagram showing a schematic configuration and an operation of a block reversing mechanism provided in the apparatus shown in FIG.

FIG. 4 is a diagram showing a schematic configuration and an operation of a 0.7-degree tilting mechanism provided in the device shown in FIG.

5 is a diagram showing a polishing amount detection pattern provided in the apparatus shown in FIG. 1 and changes in its resistance value.

FIG. 6 is a diagram showing a manufacturing process of the magnetic head according to the present invention.

FIG. 7 is a process diagram specifically showing a polishing process of the magnetic head according to the present invention.

8 is a perspective view showing an embodiment of the magnetic head manufactured by the manufacturing process shown in FIG.

9 is a diagram showing an embodiment of a magnetic disk device to which the magnetic head manufactured in the manufacturing process shown in FIG. 6 is attached.

FIG. 10 is a diagram for explaining a conventional method of polishing a magnetic head.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Ceramic substrate, 2 ... Layer of thin film element 3 ... Block (thin film magnetic head structure), 5 ... Polishing surface plate 6 ... Template, 7 ... Air ejection hole, 8 ... Pressurization part,
9 ... Return hole 10 ... Regulator, 11 ... Flow meter, 12 ... Polishing amount detection pattern 14 ... Air ejection surface, 15 ... Inversion mechanism, 16 ... Inclination mechanism 17 ... Polishing action surface, 18 ... XY table, 19 ... Z
Table 40 ... Entry surface (inclined surface), 41 ... Air bearing surface, 81 ... Magnetic core (magnetic film) 82 ... Winding (coil), 90 ... Magnetic disk, 91
... Thin film magnetic head 92 ... Support spring, 93 ... Head carriage, 94 ...
Guide rail

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shigeo Aikawa 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Stock Manufacturing Research Institute, Hitachi, Ltd. (72) Inventor Yoshiharu Waki 2880, Kozu, Odawara-shi, Kanagawa Hitachi, Ltd. Storage System Division (72) Inventor Chihiro Isono 2880 Kokufu, Odawara, Kanagawa Hitachi Storage Systems Division (72) Inventor Katsuya Fukasawa 2880, Kozu, Odawara, Kanagawa Hitachi Storage Systems Division

Claims (16)

[Claims] 1. Polishing of the magnetic head structure by a relative polishing motion between the magnetic head structure and the polishing tool by pressing a surface of the magnetic head structure against a polishing surface with air pressure or air fluid pressure against the polishing tool. A method of polishing a magnetic head structure, comprising polishing a surface with the polishing tool. 2. A relative polishing between the magnetic head structure and the polishing tool by pressing the surface of the magnetic head structure, which is a plurality of magnetic head element parts connected to the polishing tool, against the polishing surface with air pressure or air fluid pressure. A method of polishing a magnetic head structure, comprising polishing the polishing surface of a magnetic head structure in which a plurality of magnetic head element portions are connected by movement with the polishing tool. 3. The method of polishing a magnetic head structure according to claim 2, wherein the magnetic head element part constituting the magnetic head structure is formed of a thin film magnetic head element part. 4. The method of polishing a magnetic head structure according to claim 2, wherein the polishing surface is at least an air bearing surface in a form in which the plurality of magnetic head elements are connected. 5. The air pressure or the air fluid pressure is 10 to 20.
The method of polishing a magnetic head structure according to claim 2 or 3, wherein the polishing method is 0 kPa. 6. A plurality of magnetic head elements in which a distribution of air pressure or air fluid pressure is controlled in a direction in which a plurality of magnetic head elements for pushing a surface of the magnetic head structure with respect to a polishing surface by air pressure or air fluid pressure are controlled. 4. The method of polishing a magnetic head structure according to claim 2, wherein the polishing amount distribution is controlled. 7. A polishing amount of a magnetic head structure or a gap between a surface with respect to a polishing surface of a magnetic head structure and an air ejection surface for ejecting air is measured, and based on the measured polishing amount or gap. Relative polishing motion between the magnetic head structure and the polishing tool by controlling the flow rate of air discharged from the air discharge surface or the air pressure or air fluid pressure to press the back surface against the polishing tool with air pressure or air fluid pressure. A method of polishing a magnetic head structure, wherein the polishing surface of the magnetic head structure is polished by the polishing tool. 8. A measurement of a polishing amount of a magnetic head structure in which a plurality of magnetic head elements are connected or a gap between a surface of the magnetic head structure with respect to a polishing surface and an air ejection surface for ejecting air, and the measurement. The air flow rate or the air fluid pressure of the air discharged from the air discharge surface is controlled based on the polished amount or the gap, and the air pressure or the air fluid pressure is applied to the polishing tool of the magnetic head structure with respect to the polishing tool. A method for polishing a magnetic head structure, comprising: pressing the surface of the magnetic head structure to polish the polishing surface of the magnetic head structure with the polishing tool. 9. A thin film element substrate having a large number of thin film elements each composed of at least a magnetic inductive element composed of a magnetic core, a magnetic gap limiting film and a coil and a magnetoresistive element for reading formed on a ceramic substrate. And a cutting step of cutting the thin film element substrate manufactured in the thin film element substrate manufacturing step into a thin film magnetic head structure in which a plurality of thin film magnetic head element portions are connected, and a cutting step The air bearing surface and the back surface of the thin film magnetic head structure in which a plurality of thin film magnetic head elements are connected, the surfaces of the air bearing surface and the back surface are pressed by air pressure or air fluid pressure to form the thin film magnetic head structure and the polishing tool. The air bearing surface and the back surface of the thin film magnetic head structure in which the plurality of thin film magnetic head elements are connected to each other by the relative polishing movement are used as the polishing tool. Polishing step, and further, polishing and forming an inclined surface for entry at the entry end on the air bearing surface, and forming a hard protective film on the air bearing surface of the thin film magnetic head structure polished in the polishing step. A magnetic head comprising: a protective film forming step; and a chip cutting process for cutting a thin film magnetic head structure having a hard protective film formed in the protective film forming step into chips to obtain each thin film magnetic head. Manufacturing method. 10. A thin film element substrate having a ceramic substrate and a large number of thin film elements each composed of an inductive element for writing and a magnetoresistive element for reading which are composed of at least a magnetic core, a magnetic gap limiting film and a coil are manufactured. And a cutting step of cutting the thin film element substrate manufactured in the thin film element substrate manufacturing step into a thin film magnetic head structure in which a plurality of thin film magnetic head element portions are connected, and a cutting step The air bearing surface and the back surface of the thin film magnetic head structure in which a plurality of thin film magnetic head elements are connected, the surfaces of the air bearing surface and the back surface are pressed by air pressure or air fluid pressure to form the thin film magnetic head structure and the polishing tool. The polishing tool is applied to the air bearing surface and the back surface of the thin film magnetic head structure in which the plurality of thin film magnetic head elements are connected by relative polishing movement. A polishing step of further polishing, and further forming an inclined surface for entry at the entry end on the air bearing surface, and forming a hard protective film on the air bearing surface of the thin film magnetic head structure polished in the polishing step. A protective film forming step; a shape rail processing step of forming a shape rail on the air bearing surface of the thin film magnetic head structure having a hard protective film formed in the protective film forming step; and a shape rail forming on the air bearing surface in the shape rail processing step. A method of manufacturing a magnetic head, comprising: cutting the processed thin film magnetic head structure into chips to obtain each thin film magnetic head. 11. In the polishing step, the air bearing surface and the back surface of the block are roughly polished using an abrasive containing water-containing diamond abrasive grains, and a solution of a surfactant in water is used. 11. The method of manufacturing a magnetic head according to claim 10, further comprising a step of finish polishing. 12. A polishing tool, pneumatic pressing means for pressing the surface of the magnetic head structure against the polishing surface with air pressure or air fluid pressure against the polishing tool, and a magnetic head structure pressed by the pneumatic pressing means. Relative polishing motion imparting means for performing relative polishing motion between the polishing tool and the polishing tool, and the relative polishing motion imparted by the relative polishing motion imparting means causes the polishing surface of the magnetic head structure to move by the polishing tool. A polishing device for a magnetic head structure, which is configured to polish. 13. A magnetic head structure polishing apparatus according to claim 12, wherein said air pressure pressing means includes control means for controlling air pressure or air fluid pressure for pressing a surface against said polishing surface. . 14. A thin film magnetic head having a head length of 1.5 mm or less and a flatness of an air bearing surface of 6 nm or less, and configured to fly the thin film magnetic head above a magnetic disk at 0.03 μm or less. A magnetic disk device characterized by the above. 15. A head length of 1.5 mm or less, a head width of 1.3 mm or less, and a head thickness of 0.35 mm or less,
The gap length of the inductive element is 0.25 μm or less,
A magnetic disk comprising a thin film magnetic head having a track width of 2 μm or less and a flatness of an air bearing surface of 6 nm or less, and the thin film magnetic head is configured to be floated at 0.03 μm or less with respect to a magnetic disk. apparatus. 16. The magnetic disk drive according to claim 15, wherein in the thin film magnetic head, the height accuracy of the magnetoresistive element is ± 0.2 μm or less.