JPH08126017A - Solid-state image pickup device - Google Patents

Abstract

PURPOSE: To provide a solid-state image pickup device in which the generation of a registration error due to thermal distortion is prevented and excellent repair performance to remove a solid-state image pickup element from a color separation prism in the case of defects is obtained. CONSTITUTION: First mount members 4a, 4b are mounted in the vicinity of an emission face of a color separation prism 2 by means of an adhesives and 2nd L-shaped mount members 5a, 5b are bonded to the first mount members 4a, 4b by means of a melting metal 8, a light curing resin adhesives 9 is coated to two faces at a right angle of connection members 7a, 7b, and while the connection members 7a, 7b are pressed into contact with the 2nd mount members 5a, 5b and the solid-state image pickup element 3r, an ultraviolet ray is emitted to the assembly, then the solid-state image pickup element 3r is fixed while being opposite to the emission face of the color separation prism 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solid-state image pickup device for a television or a video recorder using a solid-state image pickup device such as a CCD and a color separation prism.

[0002]

2. Description of the Related Art Generally, in a three-chip camera solid-state image pickup device,
The image separation light is separated into three color components of R, G, and B by a color separation prism, and a subject color image of each color component is formed into a standard color television signal such as an NTSC system from each image output obtained by each solid-state image sensor. And output it.

In a solid-state image pickup apparatus using three solid-state image pickup elements, it is possible to reliably maintain a state in which the subject images of the respective color components picked up by the respective solid-state image pickup elements are superposed, that is, registration adjustment of the μm order is accurately performed. There is a need to.

An outline of some conventionally proposed solid-state image pickup devices will be described below.

(1) [See Japanese Patent Application Laid-Open No. 61-3572] As shown in FIG.
1 is attached to the end face plate 22, and the solid-state imaging device 23 is attached to the end face plate 22 through the screw 24 while facing the opening of the end face plate 22.
Fixed to. 22a is a screw hole, 23a is a notch, and 25 is a washer.

(2) [JP-A-61-135279] As shown in FIG. 6 (schematic diagram), the color separation prism 3
1. The metal fitting 32 is attached to the emission surface of No. 1 and the metal fitting 34 is attached to the imaging surface side of the solid-state image sensor 33 via the screw 35. Solder joint at.

(3) [Japanese Utility Model Publication No. 4-45343]
As shown in FIG. 7, columns 42 are provided upright on both sides of the emission surface of the color separation prism 41, and holes 44 are provided in the solid-state image sensor 43.
Is fitted to the column 42, and is joined with the solder 45 in the gap between the column 42 and the hole 44.

(4) [JP-A-5-37943]
As shown in FIG. 8, an ultraviolet curable adhesive 53 is applied between the color separation prism 51 and the connection fixing member 52, and an ultraviolet curable adhesive 55 is applied between the solid-state imaging device 54 and the connection fixing member 52. After coating and positioning of the solid-state image pickup element 54, ultraviolet rays are irradiated to cure the adhesives 53 and 55 and fix the solid-state image pickup element 54.

(5) [JP-A-4-290090]
As shown in FIG. 9, the solid-state imaging device 63 is directly attached to the emission surface of the color separation prism 61 via an ultraviolet curable adhesive 62.
To fix.

(6) [Japanese Patent Publication No. 1-25277]
As shown in FIG. 10, the solid-state image sensor 72 is directly bonded to the emission surface of the color separation prism 71. Solid-state image sensor 72
Is composed of a semiconductor substrate 72a, an insulating film 72b, and an electrode 72c. A transparent substrate 74 is attached to the electrode surface with an adhesive 73, and the transparent substrate 74 is directly fixed to the emission surface of the color separation prism 71 with an adhesive 75.

[0011]

In the solid-state image pickup device of the above (1), the color separation prism, the end face plate, and the solid-state image pickup device expand or contract due to heat, causing a slip between the solid-state image pickup device and the end face plate. , Poor position stability.

In the solid-state image pickup device of the above (2) and (3),
Since this is a method of fixing the solid-state image pickup device itself in a mode involving heat generation called soldering, thermal strain occurs and it is difficult to fix with high positional accuracy. Further, the solid-state image sensor may be deteriorated or damaged by heat.

In the solid-state image pickup devices (4), (5), and (6), when dust or air bubbles are mixed between the prism exit surface and the solid-state image pickup device, or when the solid-state image pickup device is defective. Although it is necessary to repair the solid-state image pickup device by removing it, the repair is almost impossible because the solid-state image pickup device is fixed with an adhesive. In particular,
In the case of 3-plate type, the probability of failure increases in the form of product,
It is more likely to cause defects than the single plate type. Further, even if the color separation prism is defective and cannot be repaired, the color separation prism is also disposed. However, since the color separation prism is expensive as compared with the solid-state image sensor, the manufacturing cost is greatly affected.

The present invention was devised in view of such circumstances, and can prevent the occurrence of a registration error due to thermal strain, and at the time of a defect, the solid-state image pickup element is detached from the color separation prism. It is an object of the present invention to provide a solid-state imaging device having good repair workability.

[0015]

A solid-state image pickup device according to a first aspect of the present invention is a solid-state image pickup device according to the first aspect of the present invention. Solid-state imaging fixed to the second mounting member through a connecting member coated with a photo-curing resin adhesive in a state of facing the emission surface of the color separation prism. And an element.

A solid-state image pickup device according to a second aspect of the present invention is
In the above claim 1, the exit surface of the color separation prism and the second
A dustproof rubber is interposed between the mounting member and the mounting member.

According to a third aspect of the present invention, in the solid-state imaging device according to the first or second aspect, the thermal expansion coefficients of the first mounting member and the second mounting member are substantially the same as the thermal expansion coefficient of the color separation prism. It is characterized by being.

[0018]

In the solid-state image pickup device according to the first aspect, the solid-state image pickup device is fixed to the light-curable resin adhesive by light irradiation instead of fixing the solid-state image pickup device in a manner involving heat generation such as soldering as in the conventional example. Since the fixing is performed by the method, there is almost no heat generation, and the occurrence of registration error due to thermal strain is prevented. Further, when the solid-state imaging device is removed from the color separation prism due to a defect or the like, it is sufficient to heat the molten metal joint to separate the second mounting member and the first mounting member, which facilitates repair work. You can do it.

In the solid-state image pickup device of the second aspect, when fixing the solid-state image pickup device, dust in the air and flux at the time of joining molten metal are prevented from entering between the color separation prism and the solid-state image pickup device. In addition, the reflected light and the leaked light that disturb the captured image are prevented.

In the solid-state image pickup device of the third aspect, since the color separation prism, the first mounting member and the second mounting member have substantially the same thermal expansion coefficient, the registration is performed regardless of the temperature fluctuation during use. Suppress the occurrence of error.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a solid-state image pickup device according to the present invention will be described in detail below with reference to the drawings. Here, a three-plate CCD color video camera is taken as an example.

FIG. 1 is a block diagram of an image pickup block of a three-plate camera,
2 is a side view showing a mounting structure of one of the solid-state image pickup elements in FIG. 1, FIG. 3 is a plan view thereof, and FIG. 4 is a front view thereof. In the figure, reference numeral 1 denotes an image pickup lens, 2 denotes three prism members, and a color separation prism for separating image pickup light incident through the image pickup lens 1 into three primary colors R, G, and B, 3
Reference numerals r, 3g, and 3b denote solid-state image pickup devices (CCD) for picking up a subject image of each color component dispersed by the color separation prism 2.
The NTSC standard color television signal is formed and output from the image pickup outputs obtained by the solid-state image pickup devices 3r, 3g, and 3b.

As shown in FIGS. 2 to 4, the side surface near the emission surface of the color separation prism 2 is made of a Fe--Ni--Co alloy having a coefficient of thermal expansion substantially the same as that of the color separation prism 2. The first mounting members 4a and 4b are fixed via a polyimide adhesive. Further, the second mounting members 5a and 5b having an L-shaped cross section having a thermal expansion coefficient substantially the same as the thermal expansion coefficient of the color separation prism 2 are the first mounting members via the molten metal 8 of the Sn-Pb binary solder. 4a,
It is fixed to a predetermined position of 4b. In this case, the solder joint between the first mounting member 4a, 4b and the second mounting member 5a, 5b is metallized with Ag-Pd or Mn-Mo so that the solder wettability is improved even at a relatively low temperature. Has been done. The bent portions of the second mounting members 5a and 5b face the emission surface of the color separation prism 2, and a rectangular loop-shaped dustproof rubber 6 is interposed therebetween in a close contact state. The dust-proof rubber 6 prevents dust in the air and flux at the time of solder joining from entering the space between the emission surface of the color separation prism 2 and the solid-state image sensor 3r, and reflects light that disturbs the captured image. It is for preventing light leakage and is made of silicone rubber. The first mounting members 4a and 4b, the second mounting members 5a and 5b, and the dustproof rubber 6 are subjected to black light reflection preventing treatment so as not to reflect emitted light.

The first mounting members 4a and 4b are fixed to each of the three prism members, and the second mounting members 4a and 4b are attached to the first mounting members 4a and 4b while the dust-proof rubber 6 is interposed between the first mounting members 4a and 4b. After the mounting members 5a and 5b of 1 are joined via the molten metal 8, the solid-state image sensor 3r is aligned with the emitted light, and R, G, and B registration adjustments are performed.

Subsequently, while maintaining this state, the connecting members 7a and 7b made of transparent rectangular parallelepiped glass coated with the photo-curable resin adhesive 9 on the two surfaces at right angles are respectively attached to the second mounting members 5a and 5a. 5b and the solid-state image pickup device 3r are brought into surface contact with each other, and while maintaining the state, the photocurable resin adhesive 9 is cured, and the solid-state image pickup device 3r is moved through the connecting members 7a and 7b. It is fixed to the second mounting members 5a and 5b. The connecting members 7a and 7b are made transparent so that ultraviolet rays or the like emitted from the outside can reach the photo-curing resin adhesive 9 through the connecting members 7a and 7b.

Since ultraviolet rays or the like are radiated when fixing the solid-state image pickup device 3r, heat is not generated unlike soldering, so that a registration error due to thermal strain can be prevented. Further, by bringing the photo-curable resin adhesive 9 applied to the two surfaces of the connecting members 7a and 7b into surface contact with the second mounting members 5a and 5b and the solid-state imaging device 3r, the volume of the adhesive that contributes to the adhesion is reduced. It becomes possible to reduce the relative displacement of the color separation prism 2 and the solid-state image pickup device 3r due to the curing shrinkage of the adhesive to the utmost limit.

When it is necessary to remove the solid-state image pickup device 3r from the color separation prism 2 due to a defect of the solid-state image pickup device 3r, the first mounting members 4a and 4b and the second mounting member 5a are formed by the molten metal 8. , 5b can be easily removed from the color separation prism 2 by heating and melting the portions where they are fixed to each other. In other words, the workability of repair is good.

Further, since the dustproof rubber 6 is interposed between the emission surface of the color separation prism 2 and the second mounting members 5a and 5b, when the solid-state image pickup device 3r is fixed, It is possible to prevent dust in the air and flux at the time of joining molten metal from entering the solid-state image sensor 3r, and also to prevent reflected light and leaked light that disturb the captured image.

The first mounting members 4a and 4b are also second
Since the mounting members 5a and 5b have the same thermal expansion coefficient as that of the color separation prism 2, it is possible to suppress the occurrence of a registration error regardless of the temperature fluctuation during use.

Although the above-mentioned embodiment is of a three-plate type, the present invention can be applied to a two-plate type.

[0031]

According to the solid-state image pickup device of the first aspect, unlike the conventional example, a mode involving heat such as soldering,
Since the solid-state imaging device is fixed by irradiating the photo-curable resin adhesive with light, there is almost no heat generation, and it is possible to prevent the occurrence of a registration error due to thermal strain. Further, when the solid-state image pickup device has to be detached from the color separation prism due to a defect or the like, it is sufficient to heat and melt the molten metal joint to separate the second mounting member and the first mounting member. Work can be performed easily.

According to the solid-state image pickup device of the second aspect, the dustproof rubber can prevent dust in the air and flux at the time of joining the molten metal from entering between the color separation prism and the solid-state image pickup device, and at the same time, the image pickup can be performed. It is possible to prevent reflected light and leaked light that disturb the image.

According to the solid-state image pickup device of the third aspect, since the color separation prism, the first mounting member and the second mounting member have substantially the same thermal expansion coefficient, regardless of the temperature variation during use, the resist can be used. It is possible to suppress the occurrence of a translation error.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a 3-plate camera imaging block according to an embodiment of the present invention.

FIG. 2 is a side view showing a mounting structure for one of the solid-state imaging devices in FIG.

FIG. 3 is a plan view showing a mounting structure of a solid-state imaging device corresponding to FIG.

FIG. 4 is a front view showing a mounting structure of the solid-state imaging device corresponding to FIG.

FIG. 5 is an exploded perspective view showing a first conventional example.

FIG. 6 is an exploded perspective view showing a second conventional example.

FIG. 7 is a perspective view showing a third conventional example.

FIG. 8 is a side view showing a fourth conventional example.

FIG. 9 is a side view showing a fifth conventional example.

FIG. 10 is a side view showing a sixth conventional example.

[Explanation of symbols]

 1 ... Imaging lens 2 ... Color separation prism 3r ... Solid-state imaging device 4a, 4b ... First mounting member 5a, 5b ... Second mounting member 6 ... Dustproof rubber 7a, 7b ... Connecting member 8 ... Molten metal (Solder) 9 ... Photocurable resin adhesive

Claims (3)

[Claims] 1. A first mounting member fixed to a side surface of the color separation prism near the emission surface, a second mounting member joined to the first mounting member via a molten metal, and the color separation prism. A solid-state image pickup device, comprising: a solid-state image pickup device fixed to the second mounting member via a connecting member coated with a photocurable resin adhesive in a state of being opposed to the emission surface. 2. The solid-state imaging device according to claim 1, further comprising a dustproof rubber interposed between the emission surface of the color separation prism and the second mounting member. 3. The solid-state imaging device according to claim 1, wherein the thermal expansion coefficients of the first mounting member and the second mounting member are substantially the same as the thermal expansion coefficient of the color separation prism. apparatus.