JPH08119671A - Treatment of powdery glass - Google Patents

Treatment of powdery glass

Info

Publication number
JPH08119671A
JPH08119671A JP28591894A JP28591894A JPH08119671A JP H08119671 A JPH08119671 A JP H08119671A JP 28591894 A JP28591894 A JP 28591894A JP 28591894 A JP28591894 A JP 28591894A JP H08119671 A JPH08119671 A JP H08119671A
Authority
JP
Japan
Prior art keywords
glass
powder
slurry
weight
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28591894A
Other languages
Japanese (ja)
Inventor
Yoshikatsu Nishikawa
欣克 西川
Hiroyuki Oshita
浩之 大下
Kazuo Hatano
和夫 波多野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Electric Glass Co Ltd
Original Assignee
Nippon Electric Glass Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Glass Co Ltd filed Critical Nippon Electric Glass Co Ltd
Priority to JP28591894A priority Critical patent/JPH08119671A/en
Publication of JPH08119671A publication Critical patent/JPH08119671A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C8/00Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
    • C03C8/14Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions
    • C03C8/16Glass frit mixtures having non-frit additions, e.g. opacifiers, colorants, mill-additions with vehicle or suspending agents, e.g. slip

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Geochemistry & Mineralogy (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Surface Treatment Of Glass (AREA)
  • Glass Compositions (AREA)

Abstract

PURPOSE: To provide a method for treating powdery glass by which a hardly separable slurry having high viscosity can be prepd. while using lead-contg. powdery glass. CONSTITUTION: The surface of lead-contg. powdery glass is treated with an aq. HNO3 soln. This soln. is preferably added by 0.03-1 pt.wt. per 100 pts.wt. of the powdery glass and the pref. concn. of the soln. is 0.1-15wt.%.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、粉末ガラスの処理方法
に関し、より詳しくは半導体のPN接合部を保護する目
的で使用される半導体被覆用粉末ガラスの処理方法に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for treating powder glass, and more particularly to a method for treating powder glass for coating a semiconductor used for the purpose of protecting a PN junction of a semiconductor.

【0002】[0002]

【従来の技術】従来、PN接合部を有するシリコンダイ
オード等の半導体素子全体をガラスで被覆した、いわゆ
るガラスモールド型半導体は、亜鉛系又は鉛系の粉末ガ
ラスに純水を適当量添加してスラリーとし、これを半導
体素子に塗布して焼成することにより作製される。
2. Description of the Related Art Conventionally, a so-called glass mold type semiconductor in which the entire semiconductor element such as a silicon diode having a PN junction is covered with glass is a slurry prepared by adding an appropriate amount of pure water to zinc-based or lead-based powder glass. And is applied to a semiconductor element and fired.

【0003】ところでこのような用途に使用される粉末
ガラスは、スラリーにしたときにスラリー粘度が低かっ
たり、水とガラスが分離した場合、塗布工程での作業性
に問題が生じ、半導体の電気特性の劣化や形状不良等の
歩留りの低下を引き起こす原因となる。このため粘度が
高く、且つ、分離し難いスラリーを作製することができ
る粉末ガラスが要求されている。
By the way, the powdered glass used for such purposes has a low slurry viscosity when made into a slurry, or has a problem in workability in a coating process when water and glass are separated from each other, resulting in electrical characteristics of a semiconductor. Cause deterioration of the yield and a decrease in yield such as defective shape. Therefore, there is a demand for powdered glass that has a high viscosity and is capable of producing a slurry that is difficult to separate.

【0004】[0004]

【発明が解決しようとする課題】一般に粉末ガラスは、
塊状や板状のガラス成型物を、例えばボールミル等の砕
砕装置内で純水を粉砕助剤に用いて粉砕し、分級するこ
とにより作製される。
Generally, powdered glass is
It is produced by crushing a lump-shaped or plate-shaped glass molded product in a crushing device such as a ball mill using pure water as a crushing aid and classifying.

【0005】しかしながらこのような方法で作製される
粉末ガラスの内、特に鉛系の粉末ガラスではスラリーに
すると十分に高い粘度が得られず、また分離が起こり易
いという問題を有しており、前記した要求を満たすこと
が困難である。
However, among the powdered glass produced by such a method, particularly lead-based powdered glass has a problem that a sufficiently high viscosity cannot be obtained when it is made into a slurry, and separation easily occurs. It is difficult to meet the demands made.

【0006】本発明の目的は、鉛系の粉末ガラスであっ
ても粘度が高く、しかも分離し難いスラリーを作製でき
る粉末ガラスの処理方法を提供することである。
It is an object of the present invention to provide a method for treating powdered glass which is a lead-based powdered glass and which has a high viscosity and is difficult to separate.

【0007】[0007]

【課題を解決するための手段】本発明者等は詳細な検討
を行った結果、粉末ガラスの表面をHNO3 水溶液で処
理することにより、上記目的が達成できることを見いだ
し、本発明として提案するものである。
As a result of a detailed study, the present inventors have found that the above object can be achieved by treating the surface of powder glass with an HNO 3 aqueous solution, and propose the present invention. Is.

【0008】即ち、本発明の粉末ガラスの処理方法は、
粉末ガラスの表面をHNO3 水溶液で処理することを特
徴とする。
That is, the method for treating powder glass of the present invention is as follows:
It is characterized in that the surface of powdered glass is treated with an HNO 3 aqueous solution.

【0009】なお処理の方法としては、粉末ガラスの作
製時、即ち、粉砕時に粉砕助剤としてHNO3 水溶液を
添加して処理する方法が効率的であるため好ましいが、
これ以外にも粉末ガラスとした後にHNO3 水溶液を添
加してボールミル等を用いて均一に攪拌混合する方法を
使用しても良い。
As a treatment method, a method of adding an HNO 3 aqueous solution as a grinding aid at the time of producing powder glass, that is, at the time of grinding is preferable because it is efficient.
In addition to this, a method may be used in which HNO 3 aqueous solution is added after being made into powder glass and uniformly stirred and mixed by using a ball mill or the like.

【0010】本発明において、被処理物である粉末ガラ
スは、亜鉛系、鉛系の何れでも差し支えないが、特に鉛
系ガラスの場合に効果的であり、例えば重量百分率でP
bO30〜70%、SiO2 25〜60%、B23
〜20%、Al23 0〜10%の組成を有するガラス
を使用することができる。
In the present invention, the powder glass to be treated may be either zinc-based or lead-based glass, but it is particularly effective in the case of lead-based glass. For example, P in terms of weight percentage.
bO 30 to 70%, SiO 2 25 to 60%, B 2 O 3 0
20%, the glass having a Al 2 O 3 0% of the composition can be used.

【0011】また処理液として添加するHNO3 水溶液
の添加量は、粉末ガラス100重量部に対して0.03
〜1重量部であることが好ましく、またその濃度は0.
1〜15重量%であることが望ましい。なお添加量や濃
度をこのように限定した理由は次の通りである。添加量
が0.03重量部未満ではその効果が小さい。1重量部
を越えると、粉砕と同時に処理する場合は粉砕性や分級
性の低下が起こり、また粉砕後に処理する場合は局所的
にガラスが劣化して粉末自体の流動性が低下する等粉末
特性が劣化し易くなる。またHNO3 水溶液の濃度が
0.1重量%未満ではその効果が小さく、逆に15重量
%を越えると安全性や作業性の点で問題が生じ易い。
The amount of HNO 3 aqueous solution added as a treatment liquid is 0.03 with respect to 100 parts by weight of powdered glass.
It is preferably from 1 to 1 part by weight, and the concentration is 0.1.
It is desirable to be 1 to 15% by weight. The reason for limiting the addition amount and concentration in this way is as follows. If the addition amount is less than 0.03 part by weight, the effect is small. If it exceeds 1 part by weight, the pulverizability and the classifying property are deteriorated when it is treated at the same time as the pulverization, and the glass properties are locally deteriorated and the fluidity of the powder itself is lowered when it is treated after the pulverization. Are likely to deteriorate. If the concentration of the HNO 3 aqueous solution is less than 0.1% by weight, its effect is small, while if it exceeds 15% by weight, problems tend to occur in terms of safety and workability.

【0012】[0012]

【作用】粉末ガラスの表面をHNO3 水溶液で処理する
と、粉末表面がエッチングされて表面積が大きくなる。
また粉末粒子同士が互いに緩く絡み合った状態となり、
分散し易くなる。このためスラリーにすると、未処理品
に比べてスラリーの粘度が高くなり、また分離し難くな
る。
When the surface of the powder glass is treated with the HNO 3 aqueous solution, the surface of the powder is etched to increase the surface area.
Also, the powder particles become loosely entangled with each other,
It becomes easy to disperse. Therefore, when the slurry is used, the viscosity of the slurry is higher than that of the untreated product, and it becomes difficult to separate the slurry.

【0013】[0013]

【実施例】以下、本発明の粉末ガラスの処理方法を実施
例に基づいて説明する。
EXAMPLES The method for treating powdered glass of the present invention will be described below based on examples.

【0014】[0014]

【表1】 [Table 1]

【0015】表1は、本発明の方法で処理した実施例
(試料No.1〜5)及び比較例(試料No.6)を示
すものである。
Table 1 shows Examples (Sample Nos. 1 to 5) and Comparative Examples (Sample No. 6) treated by the method of the present invention.

【0016】各試料は次のようにして処理した。Each sample was processed as follows.

【0017】まず表の組成となるように調製したガラス
原料を溶融した後、フィルム状に成形した。次いでこの
成形体を、表に示す粉砕助剤を添加してボールミル中で
粉砕し、平均粒径が4μm程度の粉末ガラスを得た。
First, glass raw materials prepared so as to have the compositions shown in the table were melted and then formed into a film. Next, this molded product was crushed in a ball mill with the addition of the grinding aid shown in the table to obtain powder glass having an average particle size of about 4 μm.

【0018】次に得られた各試料100重量部に対して
純水30重量部を添加し、混練することによってスラリ
ーを作製し、粘度、分離の有無及び半導体素子への塗布
性について評価した。結果を表中に示す。
Next, 30 parts by weight of pure water was added to 100 parts by weight of each sample obtained and kneaded to prepare a slurry, and the viscosity, the presence or absence of separation, and the applicability to a semiconductor element were evaluated. The results are shown in the table.

【0019】表から明らかなように、本発明の方法で処
理したNo.1〜6の各試料は、スラリー粘度が150
0〜2000cpであり、粉末ガラスの分離は認められ
なかった。またこれらの試料は塗布性に優れていた。
As can be seen from the table, No. 1 treated by the method of the present invention. Each of the samples 1 to 6 has a slurry viscosity of 150.
It was 0 to 2000 cp, and separation of powder glass was not observed. Moreover, these samples were excellent in coating property.

【0020】これに対して比較例である試料No.6
は、スラリー粘度が500cpと低く、また分離が認め
られた。しかも塗布性が悪かった。
On the other hand, sample No. which is a comparative example. 6
Had a low slurry viscosity of 500 cp and separation was observed. Moreover, the coatability was poor.

【0021】なおスラリー粘度は、回転粘度計を用い、
25℃、10rpmの条件で測定した。また分離の有無
については、作製したスラリーを1時間放置した後、粉
末ガラスが分離していないものを無、分離が認められた
ものを有とした。塗布性の評価は次のようにして行っ
た。まず半導体素子を軸方向に回転させ、これにスラリ
ーを滴下させて巻き付けるようにして塗布を行った。そ
してこのとき塗布可能であり、且つ、モールドしたガラ
スの形状が図1のように均一であるものを良、塗布がで
きなかったり、或いは塗布はできても形状が図2のよう
に不均一であるものを不可とした。なお図1及び図2に
おいて、10はCuリード11、Mo電極12及びシリ
コン半導体チップ13からなる半導体素子、20はモー
ルドしたガラスをそれぞれ示している。
The slurry viscosity is measured by using a rotary viscometer.
The measurement was carried out under the conditions of 25 ° C. and 10 rpm. Regarding the presence / absence of separation, after leaving the prepared slurry for 1 hour, the powder glass was not separated, and the powder glass was confirmed to be separated. The applicability was evaluated as follows. First, the semiconductor element was rotated in the axial direction, and the slurry was dropped onto the semiconductor element and applied by winding the slurry. Then, at this time, it is possible to apply and the molded glass has a uniform shape as shown in FIG. 1, it is not possible to apply, or even if application is possible, the shape is not uniform as shown in FIG. I made something impossible. 1 and 2, reference numeral 10 denotes a semiconductor element composed of the Cu lead 11, Mo electrode 12 and silicon semiconductor chip 13, and 20 denotes molded glass.

【0022】[0022]

【発明の効果】本発明の方法を用いて処理した粉末ガラ
スは、粘度が高く、また分離し難いスラリーを作製する
ことが可能である。それゆえ特にガラスモールド型半導
体の被覆用として使用される鉛系の粉末ガラスの処理方
法として好適である。
The powder glass treated by the method of the present invention has a high viscosity and is capable of producing a slurry which is difficult to separate. Therefore, it is particularly suitable as a method for treating lead-based powder glass used for coating glass mold type semiconductors.

【図面の簡単な説明】[Brief description of drawings]

【図1】半導体素子がガラスで均一にモールドされた状
態を示す説明図である。
FIG. 1 is an explanatory view showing a state in which a semiconductor element is uniformly molded with glass.

【図2】半導体素子がガラスで不均一にモールドされた
状態を示す説明図である。
FIG. 2 is an explanatory diagram showing a state in which a semiconductor element is non-uniformly molded with glass.

【符号の説明】[Explanation of symbols]

10 半導体素子 20 ガラス 10 semiconductor element 20 glass

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 粉末ガラスの表面をHNO3 水溶液で処
理することを特徴とする粉末ガラスの処理方法。
1. A method for treating powder glass, which comprises treating the surface of the powder glass with an HNO 3 aqueous solution.
【請求項2】 HNO3 水溶液の添加量が粉末ガラス1
00重量部に対して0.03〜1重量部であることを特
徴とする請求項1の粉末ガラスの処理方法。
2. A powder glass 1 containing an HNO 3 aqueous solution in an added amount.
The method for treating powder glass according to claim 1, wherein the amount is 0.03 to 1 part by weight with respect to 00 parts by weight.
【請求項3】 HNO3 水溶液の濃度が0.1〜15重
量%であることを特徴とする請求項1の粉末ガラスの処
理方法。
3. The method for treating powder glass according to claim 1, wherein the concentration of the HNO 3 aqueous solution is 0.1 to 15% by weight.
【請求項4】 粉末ガラスが鉛系ガラスであることを特
徴とする請求項1の粉末ガラスの製造方法。
4. The method for producing powdered glass according to claim 1, wherein the powdered glass is lead-based glass.
【請求項5】 粉末ガラスが重量百分率でPbO 30
〜70%、SiO225〜60%、B23 0〜20
%、Al23 0〜10%の組成を有することを特徴と
する請求項4の粉末ガラスの処理方法。
5. Powder glass containing PbO 30 in weight percentage.
~70%, SiO 2 25~60%, B 2 O 3 0~20
%, Al 2 O 3 0-10% composition.
JP28591894A 1994-10-25 1994-10-25 Treatment of powdery glass Pending JPH08119671A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28591894A JPH08119671A (en) 1994-10-25 1994-10-25 Treatment of powdery glass

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28591894A JPH08119671A (en) 1994-10-25 1994-10-25 Treatment of powdery glass

Publications (1)

Publication Number Publication Date
JPH08119671A true JPH08119671A (en) 1996-05-14

Family

ID=17697706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28591894A Pending JPH08119671A (en) 1994-10-25 1994-10-25 Treatment of powdery glass

Country Status (1)

Country Link
JP (1) JPH08119671A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019503A (en) * 2005-07-05 2007-01-25 Schott Ag Method for manufacturing passivation electronic element passivation by nonlead glass

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007019503A (en) * 2005-07-05 2007-01-25 Schott Ag Method for manufacturing passivation electronic element passivation by nonlead glass

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