JPH08111375A - Scanning aligner - Google Patents

Abstract

PURPOSE: To obtain a scanning aligner in which the accuracy of a pattern, being exposed through a plurality of projection optical systems, can be enhanced significantly as compared with a conventional one. CONSTITUTION: Prior to exposure, the positional relationship between a mask 11 being illuminated through a plurality of projection optical systems 12A-12C and a photosensitive substrate 3 is determined in the direction of the optical axis of the projection optical system at an arbitrary position by position detecting means 12A-12C disposed, respectively, in the scanning direction of the plurality of projection optical systems 12A-12C. The positional relationship thus determined is stored in a memory 32. At the time of scanning exposure, the mask surface 11A and the photosensitive substrate surface 3A are controlled to satisfy a predetermined positional relationship based on the relative relationship. Consequently, the scanning exposure can be carried out while sustaining an optimal positional relationship between the mask surface 11A and the photosensitive substrate surface 3A in a plurality of exposure regions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention can be applied to a scanning type exposure apparatus, for example, an exposure apparatus for manufacturing a liquid crystal display device.

[0002]

2. Description of the Related Art Today, the control of an exposure apparatus is becoming complicated with the development of fine processing technology. As one of the control techniques, there is known a leveling technique that corrects an error such as a focus position of a projection optical system or unevenness generated on the photosensitive substrate by disposing the photosensitive substrate at an appropriate position.

As an exposure apparatus of this type, there is one having an automatic focus adjusting mechanism (hereinafter referred to as an autofocus mechanism) as shown in FIG. In this exposure apparatus 1, the LED
The light emitted from the light source 2 such as the above is reflected on the photosensitive substrate 3, and the reflected light is received by the light receiving device 4. Here, when the position of the photosensitive substrate 3 changes in the Z direction, the position of the reflected light received by the light receiving device 4 also changes accordingly, so that the position of the photosensitive substrate 3 in the Z direction changes from the position where the reflected light is received. You can read the changes. In the exposure apparatus 1, the position of the photosensitive substrate 3 in the Z direction is corrected based on the measured change in the position of the photosensitive substrate 3 (the photosensitive substrate 3 is projected onto the optical system 5).
(Positioning on the image forming surface of) is performed and the drawing pattern on the mask is accurately transferred onto the photosensitive substrate.

[0004]

By the way, the flatness and the parallelism are not necessarily good in the mask and the photosensitive substrate, and in the mask holder and the photosensitive substrate holder of the exposure apparatus for positioning and holding them. For this reason, in an exposure apparatus that has a plurality of projection optical systems and the exposure area is divided into a plurality of areas, even if the image planes of the projection optical systems are uniformly aligned, the effect of the flatness of the mask or the like causes , Each exposure area does not coincide with the image plane. For this reason, it is difficult to control the positional relationship between the mask and the photosensitive substrate in the optical axis direction of the projection optical system, which occurs in each exposure area of the projection optical system, by one autofocus mechanism. .

The present invention has been made in consideration of the above points, and in a scanning type exposure apparatus using a plurality of projection optical systems, the mask and the photosensitive area in the exposure area are not affected by the flatness of the mask. An object of the present invention is to propose a scanning type exposure apparatus capable of performing scanning exposure while controlling so that the positional relationship between the substrate and the projection optical system in the optical axis direction is always appropriate.

[0006]

A plurality of areas on a mask (11) are illuminated respectively, and respective images of the plurality of areas are exposed through a plurality of projection optical systems (12A to 12C) to a photosensitive substrate (3). By projecting on the mask (11) and the photosensitive substrate (3), the plurality of projection optical systems (12A to 12C) are scanned in the x-axis direction in the figure, so that the mask (1
The exposed regions (AR1 to AR3) of 1) are exposed to the photosensitive substrate (3
In the scanning type exposure apparatus (10) for exposing the projection areas (AR1 ′ to AR3 ′) of A), a plurality of projection optical systems (12) are provided.
A to C) corresponding to each of the plurality of exposed areas (AR1 to AR3) on the mask surface (11A) and the projection area (AR1 ′) on the photosensitive substrate surface (3A).
-AR3 ') and position detection means (14A-14C) for measuring the relative positional relationship of the projection optical system (12A-12C) in the optical axis direction at any position in the scanning direction, and position detection means (14A). 14C), the mask (11) is used so that the relative positional relationship maintains a predetermined relationship.
And position correction means (34, 35, 36) for correcting the position of at least one of the photosensitive substrates (3) in the optical axis direction.

In the present invention, the position detecting means (1
4A to 14C) measure a relative positional relationship in a plurality of exposed regions and arbitrary positions in a plurality of projection regions. Further, in the present invention, the position detecting means (14A to 14A
C), the relative positional relationship in the scanning direction is measured at the front or rear positions of the plurality of exposed areas and the plurality of projected areas.

[0008]

The mask surface (11A) and the photosensitive surface are exposed by the plurality of position detecting means (12A to 12C) provided for each of the plurality of areas exposed by each of the plurality of projection optical systems (12A to 12C). The positional relationship in the optical axis direction of the projection optical system with the substrate surface (3A) is obtained at an arbitrary position in the scanning direction, and the positional relationship between the mask surface (11A) and the photosensitive substrate surface (3A) in the optical axis direction is predetermined. By controlling so as to have a relation, a clear image can be obtained without being affected by the difference in the image plane of each of the plurality of projection optical systems (12A to 12C) and the flatness and parallelism between the mask and the photosensitive substrate. To the photosensitive substrate surface (3
A) can be transferred onto.

Further, the relative position relationship is measured by the position detecting means (14A to 14C) in the plurality of exposed regions and in the arbitrary positions of the plurality of projected regions, so that the plurality of exposed regions and the plurality of projected regions are measured. The measurement accuracy of the positional relationship in the area can be improved. Further position detecting means (14A to 14C)
By measuring the relative positional relationship at the front or rear position in the scanning direction of the multiple exposed areas and the multiple projected areas, the response delay of the control is achieved even when the control is performed while sequentially detecting the positional relationship during scanning. Can be measured without causing.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described in detail below with reference to the drawings.

In order to control the positional relationship between the mask surface and the photosensitive substrate surface, a method of fixing the mask and driving the photosensitive substrate side, a method of fixing the photosensitive substrate and driving the mask side, and a mask And a method of driving both the photosensitive substrate. Here, a scanning type exposure apparatus using a plurality of projection optical systems will be described taking the case where the mask side is fixed and the photosensitive substrate side is driven as an example.

In FIG. 1, reference numeral 10 denotes a scanning type exposure apparatus, in which a mask 11 and a photosensitive substrate 3 have three projection optical systems 12.
They are arranged face to face with A, 12B and 12C interposed therebetween. The mask 11 and the photosensitive substrate 3 are held by the scanning stage 13 and integrally scanned in the direction perpendicular to the paper surface (X direction), so that the pattern drawn on the mask surface 11A is projected onto the photosensitive substrate surface 3A. Expose. Three projection optical system 1
2A, 12B and 12C are in the non-scanning direction (Y shown in the figure).
Direction), and the adjacent areas of the respective projection areas partially overlap in the Y direction, which results in a large area once compared to the projection area of one projection optical system. It becomes possible to expose by scanning.

Each of the three projection optical systems 12A, 12B and 12C has a mask surface 11 as shown in FIG.
A and the photosensitive substrate surface 3A, the optical axis AX direction (Z
Sensor 14 for measuring the relative distance between
The positions of A, 14B and 14C are respectively illumination areas AR1 to AR3 of the mask and projection areas AR1 'to AR1' of the photosensitive substrate.
They are arranged so as to coincide with the scanning locus of AR3 '. Further, an alignment sensor (not shown) for measuring the relative position of the mask 11 and the photosensitive substrate 3 in the XY plane is arranged in the scanning type exposure apparatus 10, and the mask is used by using the focus sensor and the alignment sensor. Surface 11A
The accurate positional relationship between the photosensitive substrate surface 3A and the photosensitive substrate surface 3A is detected.
Incidentally, the relative positional relationship between the mask 11 and the photosensitive substrate 3 is in the focal direction of the projection optical systems 12A, 12B and 12C, and this will be referred to as the focus direction (Z direction in the drawing) hereinafter.
Say.

The mask 11 and the photosensitive substrate 3 are provided with holders 15 and 16 respectively, and a scanning stage 13 having a U-shaped cross section.
Attached to. By the way, in an actual apparatus, the scanning stage 13 is used in a state in which the opening portion faces upward. The scanning stage 13 is attached to the main body 17 so as to be movable in the X direction along the rail 17A. By the movement of the scanning stage 13, the integrated scanning of the mask 11 and the photosensitive substrate 3 is realized. Due to this, an illumination optical system 1 for illuminating the mask 11 and the photosensitive substrate 3 which are integrally scanned.
7B is held by the main body 17.

Focus sensors 14A, 14B and 14
Each C is composed of two optical elements, a light emitting element and a light receiving element. The pair of the light emitting element and the light receiving element are arranged at off-axis positions in the members of the projection optical system. Mask surface 1 from the light emitting element during measurement
Illumination light is emitted toward both 1A and the photosensitive substrate surface 3A, and the relative distance between the mask surface 11A and the photosensitive substrate surface 3A is measured by measuring the relative distance of the image obtained from the reflected light reflected by each surface. It is designed to measure specific intervals.
In this embodiment, relative distances between a plurality of points on the mask surface 11A and the photosensitive substrate surface 3A are measured. At this time, the more the number of measurement points is, the higher the accuracy of the flatness map described later can be increased. However, if the number of measurement points is excessively large, it takes extra time for signal processing.

As shown in FIG. 3, the optical system 20 for measuring the distance between the mask surface 11A and the photosensitive substrate surface 3A in the autofocus mechanism has an optical system 2 for the mask surface 11A.
0A LED (light emissioned diode)
e) The emitted light L1 from 21A is reflected by the mirror 22A, and the slit 23A, the lens 24A and the mirror 25
It is reflected at a predetermined position P in the projection direction on the mask surface 11A via A, and the mirror 26A, the lens 27A, and the slit 2 are reflected.
After passing through 8A, the light is reflected by the prism 29 and detected at the position P'of the light receiving surface 30A on the detector 30, which is a light receiving element.

Similarly, for the photosensitive substrate surface 3A, the optical system 2 is used.
The light L2 emitted from the LED 21B, which is a light emitting element of 0B, is reflected by the mirror 22B, and passes through the slit 23B, the lens 24B, and the mirror 25B, and corresponds to the projection position in the focus direction of the predetermined position P of the mask surface 11A. After being reflected at the position Q on the surface 3A, it is detected by the prism 29 via the mirror 26B, the lens 27B and the slit 28B at the position Q'of the light receiving surface 30A on the detector 30. Light-receiving surface 30A thus obtained
The change in the interval of P'Q 'on the upper side indicates the position P on the mask surface 11A.
To the projection position Q in the focus direction on the photosensitive substrate surface 3A in direct proportion. Using this, the mask surface 3A
The change in the distance between the photosensitive substrate surface 11A and the photosensitive substrate surface 11A in the focus direction can be detected.

As described above, the focus sensors 14A to 14
The detection result S1 of each measurement point measured by C is given to the storage device 32 via the detection system 31 and stored as position information in a storage medium such as a fixed disk. By the way, since the measurement value given from the detection system 31 is only the relative distance between the mask surface 11A and the photosensitive substrate surface 3A, FIG.
As shown in FIG. 5, it is impossible to distinguish whether the mask 11 has irregularities or the photosensitive substrate 3 has irregularities.

Therefore, in the embodiment, as shown in FIG. 4B, it is assumed that the mask 11 is an ideal plane, and all the irregularities are on the photosensitive substrate 3 side. That is, the height and the inclination of the side of the photosensitive substrate 3 are controlled based on the measured values with the mask surface 11A as a reference. For this reason, the storage device 32 uses the detection system 3
On the basis of the detection result S1 given from 1, a curved surface (hereinafter referred to as a flatness map) in which irregularities on the photosensitive substrate surface 3A are connected by contour lines is generated and stored.

The control system 33 controls the drive systems 34, 35 and 36, respectively, based on this flatness map, and holds the holder 15,
The positions of 16 and the scanning stage 13 are corrected. If the photosensitive substrate 3 in the exposure area can be controlled along the flatness map in this way, the positional relationship between the mask surface 11A and the photosensitive substrate surface 3A can be always optimized. However, the photosensitive substrate 3 cannot be moved for each exposure area corresponding to the projection optical systems 12A to 12C.

Therefore, the scanning type exposure apparatus 10 optimizes the positional relationship between the mask surface 11A and the photosensitive substrate surface 3A in the exposure area, and also Z, Zθ ₁ , Zθ, which will be described later.
Create an approximate surface as a surface that can be controlled by movement or rotation in _two directions. Then, as shown in FIG. 5, the photosensitive substrate 3 is orthogonal to the rotation direction Zθ ₁ with the scanning direction (X direction) as the central axis L1, the scanning direction (X direction), and the focus direction (Z direction). Rotate in the rotation direction Zθ ₂ with (Y direction) as the central axis L ₂ (however, Zθ 2
_{When 2} is driven, it is controlled so that it coincides with the approximate surface when the two-row projection optical system is aligned in the scanning direction.

Various methods are conceivable for creating this approximate surface. First, as a simple method, a method using the least squares method can be considered. When this method is used, the flatness is obtained for a plurality of points arranged in the direction (Y direction) orthogonal to the scanning direction (X direction) on the photosensitive substrate surface 3A, and the least squares method is applied to the plurality of flatness. Approximate line LV
Create This approximate line LV is shown in FIG. Then, during exposure, the holder 16 is rotated (Zθ ₁ ) or moved (Z direction) so that the photosensitive substrate surface 3A coincides with the approximate line LV obtained for each position in the scanning direction.

The scanning exposure apparatus 10 has three projection optical systems 12A, 12B and 12C. Therefore, if the mask surface 11A and the photosensitive substrate surface 3A are simply aligned with each other, the optimum positions may not be obtained due to the difference in the focal lengths of the projection optical systems 12A, 12B, and 12C. Therefore, the difference in focal length between the projection optical systems 12A, 12B, and 12C is also considered in the flatness map.

For example, when a plurality of projection optical systems 12A, 12B, 12C arranged in a zigzag pattern in the Y direction have different focal lengths, scanning exposure is performed as it is, and as shown in FIG. The same can be said as if there is a warp in the direction. That is, the same judgment as the unevenness of the photosensitive substrate 3 can be made. In this case, the scanning direction (X
Direction), the photosensitive substrate 3 may be rotated (Zθ ₁ ) about a central axis L1 parallel to the (direction).

As described above, the scanning type exposure apparatus 10 uses the mask surface 11A based on the information of the approximate surface and the focal length obtained for the positional relationship between the mask surface 11A and the photosensitive substrate surface 3A.
By correcting the positional relationship between the photosensitive substrate surface 3A and the photosensitive substrate surface 3A, the pattern of the mask 11 can be accurately transferred to the photosensitive substrate 3 for each of the exposure regions illuminated through the projection optical systems 12A, 12B, and 12C. Has been done.

In the above structure, the scanning type exposure apparatus 10
The scanning exposure operation by will be described. First, prior to exposure,
The scanning exposure apparatus 10 has a mask surface 11A and a photosensitive substrate surface 3A.
Is measured by the focus sensors 14A to 14C at arbitrary positions on the mask surface 11A and the photosensitive substrate surface 3A along the respective scanning directions of the projection optical systems 12A to 12C, and on the scanning direction. The distance to the position is stored in the storage medium of the storage device 32. In addition, the above-mentioned flatness map is created based on these pieces of information to create an approximate surface. In addition, each projection optical system 12A, 12B, 12C
A correction amount based on the difference in the focal lengths of is also obtained.

When the necessary information is obtained by these processes, the control system 33 gives the control data to the drive system 36,
The scanning of the scanning stage 13 is started. The control system 33
By giving control data to the drive system 35 to move the holder 16 on which the photosensitive substrate 3 is placed in the Z direction or by rotating (Zθ ₁ , Zθ ₂ ) about the two central axes L1 and L2 (however, When Zθ ₂ is driven, the projection optical system is arranged in two rows in the scanning direction. The same applies hereinafter) The positional relationship between the photosensitive substrate surface 3A and the mask surface 11A during scanning exposure is controlled to an optimum state.

In this way, the control data for the photosensitive substrate 3 is sent from the control system 33 to the drive system 35, and the photosensitive substrate 3 is driven based on the data value. The area to be exposed at the time of sending the control data. If the control data for the portion is sent from the control system 33 to the drive system 35, the processing will be delayed. That is, when the photosensitive substrate 3 travels and the control for position correction is actually executed before the drive system 35 starts the operation based on the control data, the control system 33
Regarding the position delayed from the position specified by
Will be driven.

Therefore, the control system 33 considers the traveling speed of the photosensitive substrate 3 (that is, the scanning speed of the scanning stage 13),
The control data is sent at a position slightly before the control position so that the driving of the holder 16 is completed at the designated position.

For example, the time until position information is sent from the control system 33 to the drive system 35 as control data is t1,
Assuming that the time required for the drive system 35 to judge the position information and complete the drive is t2, and the moving speed of the photosensitive substrate 3 at this time is v, the exposure is performed when an exposure region reaches the position x. If you want to correct the position of the board 3,

[Equation 1] The position information is sent when the exposure area comes to the position X represented by.

As described above, the scanning type exposure apparatus 10 scans the photosensitive substrate 3 while rotating the photosensitive substrate 3 about the Z direction or the two central axes L1 and L2 (Zθ ₁ and Zθ ₂ ) as needed, based on the control data. Exposure (however, when Zθ ₂ is driven, the projection optical system is arranged in two rows in the scanning direction). According to the above configuration, the positional relationship between the mask surface 11A and the photosensitive substrate surface 3A, which has been measured in advance by the focus sensors 14A to 14C along the respective scanning directions of the projection optical systems 12A to 12C, and the scanning in the scanning direction. Mask surface 11A and photosensitive substrate surface 3A during scanning exposure based on stage position information.
By always controlling the positional relationship between the photosensitive substrate surface 3A and the photosensitive substrate surface 3A in an accurate state, the pattern on the mask surface 11A can be accurately controlled.
Can be transferred onto A.

Further, the position of the photosensitive substrate 3 is corrected in the optical axis direction (Z
Not only the direction) but also the center axis L1 parallel to the scanning direction (X direction) and the center axis L2 orthogonal to the scanning direction so that the inclination of the photosensitive substrate 3 can be corrected, and thus the mask It is possible to realize fine control according to the shapes of the surface 11A and the photosensitive substrate surface 3A.

In the above embodiment, the mask 11 is used.
In the case of correcting the relative positional relationship between the photosensitive substrate 3 and the photosensitive substrate 3, the case where the mask 11 side is fixed and only the photosensitive substrate 3 side is sequentially driven during scanning exposure has been described, but the present invention is not limited to this. The photosensitive substrate 3 side may be fixed and only the mask 11 side may be sequentially driven during scanning exposure, or both the mask 11 and the photosensitive substrate 3 may be sequentially driven during scanning exposure.

Further, in the above-mentioned embodiment, the case where three projection optical systems are used has been described, but the present invention is not limited to this and can be widely applied when two projection optical systems are used or four or more projection optical systems are used. Here, for example, when a plurality of projection optical systems are provided in two rows along the scanning direction as shown in FIG. 8, the projection optical systems 12A to 12C in the first row and the projection optical system 12 in the second row are provided.
If there is a difference in focal length between D and 12E, if scanning exposure is performed as it is, a difference occurs between the exposure pattern in the first row and the exposure pattern in the second row due to the difference in focal length.
Therefore, in this case, the mask 11 and the photosensitive substrate 3 may be rotated (Zθ ₂ ) about the central axis L2 orthogonal to the scanning direction (X direction). That is, the mask 11 and the photosensitive substrate 3 are arranged in the Z direction and the two axes L so as to coincide with the approximate surface.
It is sufficient to rotate (Zθ ₁ , Zθ ₂ ) about 1 and L2. Thereby, the pattern difference due to the focal length can be reduced.

Further, in the above-mentioned embodiment, the case of using the least square method when creating the approximate surface has been described, but the present invention is not limited to this, and the approximate surface can be created by using another method. good. For example, a method of considering the maximum value of flatness can be considered. In the method using the least squares method, when there is a fine maximum value or minimum value in order to obtain an average plane for the whole, the difference from the approximate plane becomes large only for that portion. However, in exposure, even if it is minute, the presence of partial peaks leads to uneven exposure. Therefore, a plane that smoothly connects the highest value and the lowest value is better than an average plane over the entire exposure area.

A method considering the depth of focus is also conceivable. The optical system has a depth of focus, and is in focus within this range. That is, even if the mask 11 and / or the photosensitive substrate 3 has irregularities, or if there are differences in the focal lengths of the plurality of projection optical systems 12A to 12C, as long as they are within this range, the mask 11
The drive of the photosensitive substrate 3 is unnecessary. Therefore, it is possible to measure the depth of focus in advance and drive the photosensitive substrate within that range.

Further, when a plurality of flatnesses are obtained in the direction (Y direction) orthogonal to the scanning direction (X direction) and the focus direction (Z direction), extremely different flatness values are shown. It is also possible that Possible reasons for this include partial deformation of the photosensitive substrate, adhesion of dust, and abnormality of the detector. In this case, if these pieces of information are used as they are, there is a possibility that an accurate approximate plane cannot be obtained because the use of an abnormal value affects other flatness. It is possible that a certain tolerance is set to prevent such a situation and flatness that does not fall within the tolerance is not used.

In the above embodiment, the mask surface 1
Although the flatness map of the photosensitive substrate surface 3A based on the mask surface 11A is created by the relative distance between 1A and the photosensitive substrate surface 3A, the present invention is not limited to this. Also when the flatness map of the reference mask surface 11A is created, the mask surface 11A and the photosensitive substrate surface 3A are also used.
The flatness map may be obtained for each of the above. If flatness maps are obtained for the mask surface 11A and the photosensitive substrate surface 3A, respectively, the mask surface 11A and the photosensitive substrate surface 3A are obtained.
Since the relative distance between them is known, the same control as above can be applied.

Further, in the above embodiment, the mask 1
1 and the photosensitive substrate 3 are described so as to be rotatable with respect to the central axes L1 and L2 respectively, the present invention is not limited to this, and the mask 11 and the photosensitive substrate 3 may be moved in the XY plane. (That is, the central axes L1 and L2 move in the XY plane). In the above-described embodiment, the projection optical system has the same magnification, and therefore the mask 11 and the photosensitive substrate 3 are integrally scanned by the scanning stage, but the projection optical system has the same magnification. If not, the mask 11 and the photosensitive substrate 3 may be independently measured and may be synchronously scanned.

[0040]

As described above, according to the present invention, the max plane and the photosensitive substrate are provided by the plurality of position detecting means provided for each of the plurality of areas exposed by each of the plurality of projection optical systems. By determining the positional relationship in the optical axis direction of the projection optical system with the surface for any position in the scanning direction, by controlling the positional relationship in the optical axis direction between the mask surface and the photosensitive substrate surface to be a predetermined relationship, A clear image can be transferred onto the photosensitive substrate without being affected by the difference in the image plane of each of the plurality of projection optical systems and the flatness and parallelism of the mask and the photosensitive substrate.

[Brief description of drawings]

FIG. 1 is a schematic diagram showing an embodiment of a scanning exposure apparatus according to the present invention.

FIG. 2 is a schematic perspective view showing a projection optical system and a focus sensor arranged in a scanning direction.

FIG. 3 is a schematic diagram showing an optical system of an autofocus mechanism.

FIG. 4 is a schematic diagram for explaining how to see the unevenness generated on both the mask surface and the photosensitive substrate as the unevenness only on the photosensitive substrate.

FIG. 5 is a schematic diagram for explaining a drive shaft used for correcting a positional relationship.

FIG. 6 is a schematic diagram for explaining an approximate surface.

FIG. 7 is a schematic perspective view showing a locus of focal positions obtained by scanning exposure using projection optical systems having different focal lengths.

FIG. 8 is a schematic perspective view for explaining a projection optical system arranged in a plurality of rows in the scanning direction.

FIG. 9 is a schematic diagram showing measurement of a distance between a conventional mask surface and a photosensitive substrate.

[Explanation of symbols]

1 ... Exposure device, 3 ... Photosensitive substrate, 3A ... Photosensitive substrate surface, 4 ... Light receiving device, 10 ... Scanning exposure device, 11 ...
... mask, 11A ... mask surface, 13 ... scanning stage, 14 ... focus sensor, 21A, 21B ... L
ED, 30 ... Detector, 31 ... Detection system, 32 ...
Storage device, 33 ... Control system, 34, 35, 36 ... Drive system.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication location G03F 9/00 A (72) Inventor Seiji Miyazaki 3 2-3 Marunouchi, Chiyoda-ku, Tokyo Stock company In Nikon

Claims (3)

[Claims] 1. Illuminating a plurality of areas on a mask,
By projecting the respective images of the plurality of regions onto a photosensitive substrate via a plurality of projection optical systems and scanning the mask and the photosensitive substrate with respect to the plurality of projection optical systems, In a scanning type exposure apparatus that exposes a region to be exposed to a projection region on the photosensitive substrate, each of the plurality of regions to be exposed on the mask surface and the photosensitive region is installed corresponding to each of the plurality of projection optical systems. Based on a measurement result of the position detection unit, a position detection unit that measures a relative positional relationship in the optical axis direction of the projection optical system with the projection region on the substrate surface at an arbitrary position in the scanning direction, And a position correction means for correcting the position of at least one of the mask and the photosensitive substrate in the optical axis direction so that the relative positional relationship maintains a predetermined relationship. Exposure apparatus. 2. The scanning type according to claim 1, wherein the position detecting means measures the relative positional relationship at arbitrary positions of the plurality of exposed regions and the plurality of projected regions. Exposure equipment. 3. The position detecting means measures the relative positional relationship at positions in front of or behind the plurality of exposed regions and the plurality of projected regions in the scanning direction. The scanning type exposure apparatus according to.