JPH08111340A - Spraying method of magnetic material - Google Patents

Abstract

PURPOSE: To provide a practical adhesion between a base material and a film to be sprayed thereon by spraying a magnetic material to the surface of the base material after forming an underlying layer composed at least of colloidal silica and ceramic powder or an underlying layer containing a low melting point glass or a magnetic powder. CONSTITUTION: An underlying layer 2 is formed at a part on a base material 1 for forming a magnetic layer and then a magnetic material is sprayed to form a magnetic layer 3 on the underlying layer 2. The base material 1 includes various inorganic or organic materials. The underlying layer 2 comprises a first layer composed of colloidal silica and ceramic powder, a second layer of low melting point glass, and a third layer of low melting point glass containing a magnetic powder. The magnetic powder is composed of same soft magnetic material as that being sprayed to form the magnetic layer 3. The magnetic layer 3 is obtained by spraying the magnetic material.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic material thermal spraying method, and more particularly to a magnetic material thermal spraying method for electronic parts.

[0002]

2. Description of the Related Art The thermal spraying method is capable of easily forming a layer made of various materials, such as a metal layer, an alloy layer or a ceramic layer, on any base material at a relatively low temperature. It has been studied in various fields such as thick film (thin film) formation, and various methods have been proposed.

Several proposals have already been made for the thermal spraying method of magnetic materials. First, regarding ferrite, Japanese Patent Publication No. 25953/1982 or Japanese Patent Publication No. 58/1983
Regarding the characteristics of the ferrite sprayed film obtained as described in JP-A-26820, and regarding the magnetic material and the insulating material, as disclosed in JP-A-60-135993 or JP-A-3-203740. Japanese Patent Application Laid-Open No. 2-21 / 1990 discloses a method of spraying a magnetic material and an insulating material alternately or simultaneously, or an undercoat of a base material before spraying.
7200 and the like.

Regarding the above-mentioned ferrite, the one in which the oxygen concentration at the time of thermal spraying is set to a specific condition in order to make the obtained ferrite thermal sprayed film into a single phase of spinel type, or a predetermined value after thermal spraying of the obtained thermal sprayed film The heat treatment is performed.

The above-mentioned magnetic material and insulating material are for obtaining a structure suitable for a magnetic core, and the magnetic layer is divided by an insulating layer to reduce eddy current loss.

Further, Japanese Patent Laid-Open No. 217200/1990, which relates to the undercoating of the base material before the thermal spraying described above, imparts adhesiveness to a general structure when the magnetic material is thermally sprayed. Magnetic materials include ferrite, sendust, permalloy, and stainless steel. The undercoat paint is specifically a mixture of an inorganic curing accelerator consisting of cements, silica sand, fly ash and slag and a synthetic resin. After applying this undercoat paint to the base material, by spraying the magnetic material described above, the adhesive force with the base material is increased, the wear resistance of the sprayed film is improved, and people and vehicles such as floors and wall surfaces It is used for the contact surface of.

On the other hand, as a means for improving the adhesion to the base material in a general thermal spraying method, there are known a method of roughening the surface of the base material, a blast treatment or a method of slightly heating the base material during the thermal spraying. In the blast treatment, abrasive grains are struck on the base material to roughen the surface of the base material, and it cannot be applied to those that cannot withstand such a treatment. Also, heating the substrate is not very effective and rather rather prevents quenching of the sprayed coating.

[0008]

As described above, according to various conventional thermal spraying methods, various thermal sprayed magnetic films can be formed on various thermal sprayed substrates and have sufficient adhesive force. However, there is a problem that the desired condition cannot be satisfied.

The present invention solves the above-mentioned problems of the prior art by spraying a magnetic material onto various spray-coated substrates without physically damaging the spray-coated substrate, and An object of the present invention is to provide a thermal spraying method in which a thermal sprayed film has a practical adhesive force.

[0010]

In order to achieve the above object, the thermal spraying method of the present invention comprises a base layer to be sprayed containing at least an underlayer consisting of colloidal silica and ceramic powder, a low melting point glass or a magnetic powder. Is a thermal spraying method in which a magnetic material is thermally sprayed after the underlayer is formed.

[0011]

According to the thermal spraying method of the present invention, an underlayer made of at least colloidal silica and ceramic powder is formed on the surface of a thermal sprayed substrate, and then a magnetic material is sprayed or a thermal sprayed substrate is formed. After forming an underlayer of low melting point glass or low melting point glass containing magnetic powder on the surface of the material, the surface of the substrate to be sprayed is modified with any of the above underlayers in order to spray the magnetic material. Be quality. Therefore, it is possible to spray the magnetic material onto any sprayed substrate and form the sprayed magnetic layer on the sprayed substrate.

[0012]

EXAMPLES A method of thermal spraying a magnetic material according to an example of the present invention will be described below.

The thermal spraying method of the present invention is a method of spraying a magnetic material after forming an underlayer made of at least colloidal silica and ceramic powder on the surface of a substrate to be sprayed, or the underlayer is mainly made of low melting glass. There are three methods, one consisting of a low melting glass containing magnetic powder. In any method, after first forming any one of the specific underlayers on the surface of the substrate to be sprayed,
This is a method of spraying a magnetic material.

The material to be sprayed is not particularly limited. INDUSTRIAL APPLICABILITY Since the present invention is intended for electronic parts, a base material for electronic parts, a glass epoxy resin for circuit boards, an alumina substrate, a glass substrate, an insulating material for various ceramics, a dielectric material, a glass material, a magnetic material. It has excellent adhesion to various materials and members such as iron-based metals, coated wires, and organic films.

As described above, according to the present invention, excellent adhesion is observed in any of the three underlayers.
These will be described in detail first.

The first underlayer is made of colloidal silica and ceramic powder. The second underlayer is mainly made of low melting glass. The third underlayer is made of low melting point glass containing magnetic powder. As will be described later, the proper use of these may be selected from the viewpoint of the heat resistance of the base material to be sprayed or the magnetic circuit.

First, the underlayer made of the first colloidal silica and ceramic powder will be described. Colloidal silica refers to colloidal silica, and is generally the main component of sol when silica glass is produced by the sol-gel method. First, a solution obtained by mixing the colloidal silica with an appropriate thinner and further containing ceramic powder is prepared. After applying this solution to the substrate to be sprayed, it is dried and the thinner is removed, whereby a solid film (underlayer) having an appropriate hardness can be obtained. The obtained underlayer can be viewed as if the ceramic powder was solidified by using colloidal silica as a binder. Layers formed from solutions containing no ceramic powder do not reach the object of the invention. That is, even if the magnetic material is sprayed, it does not exhibit sufficient adhesiveness.
Ceramic powder remedies this deficiency and provides excellent adhesion. Any ceramic powder will provide sufficient adhesion. Examples of the ceramic powder include alumina, zirconia, zircon, mullite, beryllia, steatite, forsterite, magnesia, titania, ferrite, barium titanate and the like. From the viewpoint of a magnetic circuit, there are cases where magnetic materials such as ferrite, sendust, permalloy, iron and Fe-Si are desirable. This will be described later.

By drying a sol containing colloidal silica under appropriate conditions, a sol mainly composed of silica can be obtained. However, even if a magnetic material is sprayed, sufficient adhesion cannot be recognized. . In some cases, the sprayed magnetic layer cannot be formed at all. By incorporating a ceramic powder into this, this defect can be eliminated, and the above various powders show an improvement in adhesion.

Next, a method of forming the second underlayer made of the low melting point glass will be described. The low melting point glass of the present invention means a glass having a softening point of 1200 ° C. or lower. That is, the softening point is higher than that of ordinary low melting glass. In order for the thermal sprayed base material and the thermal sprayed magnetic layer to have practical adhesiveness, an effect is recognized at a temperature below this temperature. Thermal spraying is a method of melting a thermal spray material and adhering it to a substrate to be sprayed to form a thermal spray layer. Since the thermal spray material is heated to very high temperatures, any glass that softens at temperatures lower than this temperature will exhibit sufficient adhesion. Therefore, there is no limitation on the low melting point glass for the underlayer from the viewpoint of the adhesive force with the thermal spraying material, but there is some limitation on the configuration of the thermal sprayed substrate or the magnetic circuit as described later. For example, glass having a low softening point is desirable when the heat resistance of the substrate to be sprayed is not so excellent. These include lead borosilicate glass and lead oxide-based glass.

The low-melting glass is formed by dispersing a low-melting glass powder in a thinner, applying the solution onto a substrate to be sprayed, drying and then heating the softening temperature or higher to form an underlayer. Method of spraying melting point glass on the material to be sprayed, method of melting low melting point glass and dipping the material to be sprayed there, or attaching low melting point glass powder to the material to be sprayed and heating it above the softening temperature to form the underlying layer There are various methods such as a method of doing so, and an appropriate method may be selected according to the material to be sprayed.

The method of forming the underlayer made of the low melting point glass containing the third magnetic material powder is a method of improving the magnetic circuit problem of the second underlayer, and the forming method is almost the same. is there. That is, it is only the difference between the presence or absence of the magnetic powder in the low melting point glass. The magnetic powder contained in the low melting point glass is the same as the magnetic material used for thermal spraying described later, and is not particularly limited as long as it is a high magnetic permeability material. However, the reaction between the low-melting glass and the magnetic powder may become a problem depending on which underlying layer forming method is selected. For example, when ferrite is selected as the magnetic powder in the method of dipping the thermal spraying base material in the molten low melting point glass, the ferrite powder and the glass react with each other, and it becomes difficult to obtain a stable quality product.

As described above, the thermal spraying method of the present invention is one in which the magnetic material is sprayed after the underlayer is formed on the substrate to be sprayed by several methods. As a result, a sprayed magnetic layer can be formed on various base materials to be sprayed when the magnetic material is sprayed, and a practical adhesive force can be obtained.

The magnetic material refers to a material having a high magnetic permeability or a soft magnetic material, and is roughly classified into a metal or alloy-based high magnetic permeability material and an oxide-based high magnetic permeability material. Iron in the former,
There are Fe-Si type, Fe-Al type, Co-Fe type, sendust, permalloy, Fe type or Co type amorphous alloy, and the like. The latter has spinel type ferrite,
There are various systems represented by MeOFe ₂ O ₃ . Where Me
Are Mn, Fe, Ni, Co, Cu, Mg, Li,
MnZn, MnMgZn, MgCuZn, NiZn, N
There are iCuZn, NiCuCo, MnZnCu, and the like. All of these high permeability materials are sprayable,
Due to the above-mentioned base layer, it has sufficient adhesiveness or adhesiveness to various thermal sprayed substrates.

As the thermal spraying method, there are an arc thermal spraying method, a gas thermal spraying method and a plasma thermal spraying method, but the plasma thermal spraying method is selected from the viewpoint of the selection range of the thermal spraying material (the range of materials which can be sprayed) and the ease of adjusting the atmosphere. Is the best. The arc spraying method is suitable for spraying a conductive material, and the gas spraying method may be either conductive or insulating,
Atmosphere control is difficult in terms of burning gas. In the plasma spraying method, an inert gas such as argon or helium, nitrogen, hydrogen, oxygen or the like can be used as a working gas of plasma. The form of the material to be sprayed is generally powdery, and the atmosphere for spraying can be controlled by using the above-mentioned various gases as a gas for supplying the powder and a carrier gas. Comparing the above-mentioned three spraying methods from the sprayable material, the range of materials that can be sprayed in the order of plasma spraying method, gas spraying method and arc spraying method becomes smaller. That is, the plasma spraying method can spray a very large amount of materials from low melting point materials to high melting point materials.

The thermal spraying method of the present invention can form a magnetic layer by thermal spraying on various substrates to be sprayed when spraying a magnetic material, and can obtain practical adhesiveness or adhesive force. It is the formation of the magnetic layer for electronic parts that is more limited and that the characteristics of the thermal spraying method of the present invention are further exerted. That is, one of the purposes of forming the magnetic layer in electronic parts is to form a predetermined magnetic circuit. In particular, when forming a series of magnetic circuits with a constituent material composed of a sprayed substrate and a sprayed magnetic layer formed by spraying, the magnetic characteristics of the underlayer are important. For example, if the underlayer is a non-magnetic material, a gap will be formed between the sprayed base material and the sprayed magnetic layer, and if the underlayer is a magnetic material, the sprayed base material and the sprayed magnetic layer will be the underlayer. Becomes a magnetically continuous body via. Generally, the gap is formed in order to improve leakage current, such as a magnetic head, or to avoid saturation of a magnetic material forming a magnetic circuit to improve, for example, DC superposition characteristics. On the other hand, a continuous structure is required to reduce the leakage flux or obtain an excellent inductance. The underlayer of the thermal spraying method of the present invention can satisfy any of the above objects. For example, in forming the gap, a ceramic powder of a non-magnetic material may be used in the method of forming an underlayer composed of at least colloidal silica and ceramic powder. Conversely, in the case of forming a continuous body, magnetic powder may be used as the ceramic powder.

Further, application of the specific spraying method of the present invention to electronic parts will be described. For example, when an electronic component is a component for obtaining inductance or impedance, a magnetic material core or a conductive wire is an example of the material to be sprayed in that case. An electronic component is obtained by forming the above-mentioned various underlayers on the spray-coated substrate and then spraying the magnetic material. In this case, a magnetic circuit is formed by the magnetic core, the underlayer, and the sprayed magnetic layer formed by spraying. As described above, whether to form a gap or to form a continuous closed magnetic circuit structure is selected depending on whether or not the magnetic powder is contained in the underlayer. As a result, excellent inductance characteristics or excellent DC superposition characteristics are exhibited.

Next, this embodiment will be described in more detail with reference to the drawings. FIG. 1 shows the thermal spraying method of the present invention described above. FIG. 1A shows the state after the underlayer is formed, and FIG. 1B shows the state after the magnetic material is sprayed. In FIG. 1, 1 is a base material to be sprayed and 2 is a base layer. Reference numeral 3 is a sprayed magnetic layer obtained by spraying a magnetic material. Thus, first, the underlayer 2 is formed on the portion of the substrate 1 to be sprayed where the sprayed magnetic layer is to be formed. Next, as shown in FIG. 1B, a sprayed magnetic layer 3 is formed on the underlayer 2 by spraying a magnetic material. As described above, the underlayer 2 has three forming methods.

Next, an example in which the thermal spraying method of the present invention is applied to the production of electronic parts will be shown. FIG. 2 shows a perspective perspective view of an inductance component manufactured by the above-described thermal spraying method of the present invention.
In FIG. 2, reference numeral 2 is an underlayer, but a conductor wire exists in the core. That is, the conductor wire is covered with the underlayer, and the surface is formed of the underlayer 2. First, as shown in FIG. 2A, the wound conductor wire is covered with the underlayer 2. Next, (b)
As shown in (1), the magnetic material is sprayed to form the sprayed magnetic layer 3. In the case of FIG. 2, the conductive wire covered with the underlayer 2 by the sprayed magnetic layer 3 is molded.

In the case of FIG. 2, the base material to be sprayed was only the conductive wire, but FIG. 3 shows an example in which the conductive wire is wound around the conductive wire support. In FIG. 3, reference numeral 4 is a conductive wire, and 5 is a conductive wire supporter that supports the conductive wire 4. Also in this case, first, as in FIG.
As shown in (a), a thermal spraying base material in which the conductive wire 4 is wound around the conductive wire support 5 is prepared. Next, as shown in (b),
The underlayer 2 is formed on the conductor 4 and the conductor support 5. Further, as shown in FIG. 3C, a magnetic material is sprayed to form a sprayed magnetic layer 3.

As described above, the base material 1 to be sprayed is not particularly limited, and various inorganic or organic materials can be used.

As described above, the underlayer 2 is a layer made of colloidal silica and ceramic powder, a second layer is made of low melting point glass, and a third layer is made of low melting point containing magnetic powder. It is a layer made of glass. This magnetic powder is a powder made of a soft magnetic material similar to the magnetic material used for thermal spraying to form the thermal spray magnetic layer 3.

The sprayed magnetic layer 3 is a layer obtained by spraying a magnetic material. The magnetic material means a material having a high magnetic permeability as described above, that is, a soft magnetic material. When using a spinel type ferrite, it is desirable that the thermal sprayed magnetic layer 3 obtained by thermal spraying be sufficiently ferritic so as to have excellent characteristics. A general method for producing ferrite is to mix various raw material oxides in predetermined amounts, and after mixing,
The calcined powder is molded and then fired to produce a ferrite magnetic body. Therefore, general ferrite powder is calcined considering the main firing after molding. That is, for example, the calcination temperature is a low temperature of about 800 ° C., and the main calcination is a high temperature of about 1200 ° C. However, it is desirable that the ferrite powder used for thermal spraying be a powder that is calcined at about the main firing temperature.

The above is the basic constituents of the thermal spraying method of the present invention. In one example in which the thermal spraying method of the present invention is applied to the formation of electronic parts, the sprayed substrate 1 is the conductor wire 4 or the conductor wire 4 and the conductor wire support. The case of 5 will be described.

The conductive wire 4 may be a coated copper wire which is generally and often used, and may be any other conductive material such as nickel, silver, gold or platinum. Examples of the coating material include polyurethane, polyester, ester imide, amide imide, and the like, and may be a material in which ceramic powder is mixed as a filler in these organic substances.

The conductor support 5 can be divided into the above-mentioned magnetic material and non-magnetic material other than the magnetic material. Typical non-magnetic materials include various ceramics such as alumina, mullite, beryllia, steatite, forsterite, magnesia, titania, and various glass ceramics, as well as nitrides, carbides, zinc ferrite, barium titanate, and niobium. Potassium acid, thermoplastic resin, thermosetting resin, and the like.

As described above, by properly selecting the underlayer 2, it is possible to control the inductance, the impedance, the DC superposition characteristic or the frequency characteristic, and to provide an electronic component having excellent electrical characteristics capable of responding to any characteristics. Obtainable. In such a case, the underlayer 2 has both an adhesive property or an adhesive force and excellent electrical characteristics.

Example 1 A solution containing colloidal silica and alumina powder having an average particle size of 1 μm was applied to a stainless plate, a copper plate, a quartz glass plate, an alumina substrate and a polyimide film, and dried at a temperature of 150 ° C. for 30 minutes. The underlayer was formed. Next, the NiZn-based ferrite powder was sprayed onto each sprayed base material having these underlayers to form a sprayed magnetic layer. The formed sprayed magnetic layer had a thickness of 0.2 mm. Plasma spraying was used as the spraying method, and argon and helium were used as working gases. The flow rate was 10 l / min for each. The arc current was 440A and the voltage was 34V.

The thermally sprayed magnetic layer was firmly adhered to any of the thermally sprayed base materials, and there were obtained practically no problems.

For comparison, an attempt was made to form a thermally sprayed magnetic layer in the same manner as above without forming an underlayer on the thermally sprayed base material, but a slight amount of ferrite powder adhering to each of the thermally sprayed base materials was recognized. However, it was not possible to form a sprayed magnetic layer.

As described above, it is possible to form a sprayed magnetic layer on a substrate to be sprayed on which a sprayed magnetic layer cannot be formed by the spraying method of the present invention, and to form a sprayed magnetic layer having practical adhesive force. it can.

The magnetic material to be sprayed was replaced with MnZn type ferrite powder, NiZnCu type ferrite powder, sendust, permalloy and iron, and an underlayer was first formed and sprayed on the substrate to be sprayed in the same manner as above. No matter which magnetic material was used, a sprayed magnetic layer having sufficient adhesion to each sprayed substrate could be formed.

Further, a solution for forming an underlayer containing colloidal silica and alumina powder is colloidal silica and M.
An underlayer was formed in the same manner as a solution containing nZn ferrite powder, and various magnetic materials were sprayed as described above.
No significant difference was observed in the adhesive force of the sprayed magnetic layer.

Example 2 A solution of lead borosilicate low melting point glass powder dissolved in a thinner was applied to a stainless steel plate, a copper plate, a quartz glass plate and an alumina substrate, dried at 100 ° C., and then a temperature of 400 ° C. Was fired to form a base layer. Next, MnZ is applied to each of the thermal sprayed base materials provided with these underlayers.
The n-type ferrite powder was sprayed. The thickness of the obtained sprayed magnetic layer was 0.2 mm. The thermal spraying conditions are the same as in Example 1.

As in Example 1, the sprayed magnetic layer was firmly adhered to any of the sprayed substrates, and a practically problem-free one was obtained.

When the thermal spraying material was changed to NiZn ferrite powder, sendust, permalloy and iron, an underlayer was first formed on the substrate to be sprayed and sprayed in the same manner as described above. There was no significant difference in the force of attachment.

Example 3 A lead borosilicate low melting point glass paste was printed on a stainless plate, a copper plate, a quartz glass plate and an alumina substrate. 400 after drying at 150 ° C
The base layer was formed by firing at a temperature of ° C. Next, MnZn-based ferrite powder was sprayed onto each of the sprayed base materials provided with these underlayers. The thermal spraying conditions are the same as in Example 1.

The thickness of the obtained sprayed magnetic layer was 0.2 mm, and the sprayed magnetic layer was not formed on the surface on which the underlayer was not formed. The thermally sprayed magnetic layer adhered firmly, and a practically problem-free one was obtained.

The thermal spraying material was replaced with NiZn ferrite powder, sendust, permalloy and iron to form a thermal spray magnetic layer in the same manner as described above, but no significant difference was observed in the adhesive force.

Example 4 Polyurethane-coated copper wires having a diameter of 35 μm were arranged linearly, wound 5 times, and NiZn-based ferrite sintered bodies having a diameter of 0.5 mm were wound 5 times, respectively. . Next, an underlayer was formed on these copper wires in the same manner as in Example 1. NiZn-based ferrite powder was sprayed onto the copper wire provided with these underlayers. The thickness of the sprayed magnetic layer was 0.2 mm. The thermal spraying conditions are those of Example 1.
Is the same as

The sprayed magnetic layer was firmly adhered to any of the copper wires, and there was no problem in practical use.

When the thermal spraying material was changed to MnZn ferrite, sendust, permalloy and iron powder and thermal spraying was carried out in the same manner as above, no significant difference was observed in the adhesive force.

Further, the polyurethane coated copper wire was replaced with a polyester, ester imide and amide imide coated copper wire to form an underlayer in the same manner as described above and then sprayed.
The adhesion to each copper wire was similar.

Example 5 A polyimide coated copper wire having a diameter of 50 μm was wound 10 times around a NiZn type ferrite rod having a diameter of 1 mm to form an underlayer in the same manner as in Example 1. Next, two kinds of NiZn-based ferrite powders having calcination temperatures of 800 ° C. and 1200 ° C. were used, and the above-mentioned base layer was subjected to the same plasma spraying method as in Example 1, and each of the above two types was applied to the sprayed base material. Was sprayed to form a sprayed magnetic layer having a thickness of 0.1 mm. The thermal spraying conditions were the same as in Example 1.

The thermal sprayed magnetic layer thus obtained was 1200
The one using the powder calcined at ℃ was 1.5 times better in adhesion and film strength than the one using the powder calcined at 800 ° C. The ferrite powder having a calcination temperature of 800 ° C. was not sufficiently spinelized, and the 1200 ° C. calcinated one was sufficiently ferritic. Although this does not show a large difference crystallographically, there is a difference between the two in terms of magnetic properties.

[0055]

As described above, according to the thermal spraying method of the present invention, an underlayer containing at least colloidal silica and ceramic powder or an underlayer containing low melting point glass or a magnetic powder is formed on the surface of the substrate to be sprayed. By spraying a magnetic material after forming an underlayer made of glass with a melting point, it is possible to form a sprayed magnetic layer on various sprayed substrates without physically damaging the sprayed substrate. It is possible to obtain a sprayed magnetic layer having sufficient adhesiveness or adhesive force. Further, when used for forming a magnetic circuit of an electronic component or the like, various electromagnetic characteristics can be obtained by including magnetic powder in the underlayer.

[Brief description of drawings]

FIG. 1A is a sectional view showing an example of a thermal spraying method of the present invention, and FIG. 1B is a sectional view of the same.

FIG. 2 (a) is a perspective view of a lead wire for producing an electronic component by using the thermal spraying method of the present invention, and FIG. 2 (b) is the same perspective view.

3A is a perspective view showing an example of manufacturing an electronic component by using the thermal spraying method of the present invention, FIG. 3B is the same perspective view, and FIG. 3C is the same perspective view.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Base material for thermal spraying 2 Underlayer 3 Thermal spraying magnetic layer 4 Conductive wire 5 Conductive wire support

Claims (8)

[Claims] 1. A method of thermal spraying a magnetic material, which comprises a step of thermally spraying a magnetic material after forming an underlayer made of at least colloidal silica and ceramic powder on the surface of a substrate to be sprayed. 2. The method of thermal spraying a magnetic material according to claim 1, wherein the ceramic powder is mainly composed of magnetic powder. 3. The thermal spraying method for a magnetic material according to claim 2, wherein the magnetic powder comprises a ferrite powder sufficiently spinelized. 4. A method of thermal spraying a magnetic material, which comprises a step of thermally spraying a magnetic material after forming an underlayer mainly composed of low melting point glass on the surface of a substrate to be sprayed. 5. A method of thermal spraying a magnetic material, which comprises a step of thermally spraying a magnetic material after forming an underlayer made of low melting point glass containing magnetic powder on the surface of a substrate to be sprayed. 6. The method of thermal spraying a magnetic material according to claim 4, wherein the low-melting glass comprises lead borosilicate glass. 7. The magnetic material comprises ferrite.
Alternatively, the thermal spraying method of the magnetic material according to claim 4 or 5. 8. The thermal spraying method for a magnetic material according to claim 1, 4 or 5, wherein the base material to be sprayed comprises at least a conductive wire or a conductive wire and a conductive wire support.