JPH0811048A - Grooved roller for wire saw - Google Patents
Grooved roller for wire sawInfo
- Publication number
- JPH0811048A JPH0811048A JP6168794A JP16879494A JPH0811048A JP H0811048 A JPH0811048 A JP H0811048A JP 6168794 A JP6168794 A JP 6168794A JP 16879494 A JP16879494 A JP 16879494A JP H0811048 A JPH0811048 A JP H0811048A
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- groove roller
- groove
- base metal
- cooling medium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002826 coolant Substances 0.000 claims abstract description 53
- 239000010953 base metal Substances 0.000 claims abstract description 27
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000470 constituent Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 abstract description 7
- 239000003921 oil Substances 0.000 description 10
- 235000012431 wafers Nutrition 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
- B23D57/00—Sawing machines or sawing devices not covered by one of the preceding groups B23D45/00 - B23D55/00
- B23D57/003—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts
- B23D57/0053—Sawing machines or sawing devices working with saw wires, characterised only by constructional features of particular parts of drives for saw wires; of wheel mountings; of wheels
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/283—With means to control or modify temperature of apparatus or work
- Y10T83/293—Of tool
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T83/00—Cutting
- Y10T83/929—Tool or tool with support
- Y10T83/9292—Wire tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体単結晶や磁性材
料あるいは石英、セラミック等の被加工物（以下「ワー
ク」という）を切断してウェーハ等を作製するためのワ
イヤソーに関するもので、さらに詳しくは、切断用ワイ
ヤが巻き掛けられる溝ローラの構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw for producing a wafer or the like by cutting a semiconductor single crystal, a magnetic material, or a workpiece (hereinafter referred to as "work") such as quartz or ceramic. Specifically, it relates to a structure of a groove roller around which a cutting wire is wound.
【０００２】[0002]
【従来の技術】従来、前記ワークを切断してウェーハを
作製するのにワイヤソーが用いられている。このワイヤ
ソーは、互いに平行な一定ピッチのワイヤ列にワークを
押し当て、切断用ワイヤにその線方向の往復動作と送り
動作の複合動作をさせながら、ワークとワイヤの間に砥
粒を含む加工液を供給することにより、ラッピング作用
でワークを切断してウェーハを作製するものである。2. Description of the Related Art Conventionally, a wire saw has been used to cut a workpiece to produce a wafer. This wire saw presses a work against a row of wires having a constant pitch parallel to each other, and causes a cutting wire to perform a combined operation of reciprocating motion and feeding motion in the linear direction, and a machining liquid containing abrasive grains between the work and the wire. Is supplied, the work is cut by the lapping action to produce a wafer.
【０００３】このワイヤソーによれば、ワークを切断す
る切込み速度は内周刃による切断に比べると遅いけれど
も、多数枚のウェーハを同時に切断できるという特長が
ある。ちなみに、ワイヤソーによれば、１回の切断に要
する時間は、例えば直径が１２５ｍｍのシリコン単結晶
で６時間位を要するが、１回で２００枚程度のウェーハ
を切断することができる。According to this wire saw, the cutting speed for cutting the work is slower than that for cutting by the inner peripheral blade, but it has a feature that a large number of wafers can be cut at the same time. By the way, according to the wire saw, the time required for one cutting is about 6 hours for a silicon single crystal having a diameter of 125 mm, for example, but about 200 wafers can be cut at one time.
【０００４】ところで、このワイヤソーにおいては、切
断時にワイヤとワークとの間の摩擦熱や、前記切断用ワ
イヤが巻き掛けられる溝ローラの軸受け部での摩擦熱が
生じる。これらの熱は、切断中に溝ローラの温度を変動
させ、その溝ローラの表面に刻設されたワイヤ溝のピッ
チを変化させる。そして、このワイヤ溝のピッチが変化
すると、切断中に、ワイヤ列のピッチが変化してしま
い、切断したウェーハの表面にうねりが生じてしまう。In the wire saw, frictional heat is generated between the wire and the work during cutting, and frictional heat is generated in the bearing portion of the groove roller around which the cutting wire is wound. These heats change the temperature of the groove roller during cutting and change the pitch of the wire grooves engraved on the surface of the groove roller. When the pitch of the wire grooves changes, the pitch of the wire rows changes during cutting, causing undulations on the surface of the cut wafer.
【０００５】そこで、このような問題を解決するため
に、従来、特開昭６２−２５１０６３号公報に示される
ようなローリング装置が考えられている。このローリン
グ装置に使用されている溝ローラは、その台金に設けた
中空部（油路を構成している）に、その一端側から冷却
オイルを導入し、他端側から当該冷却オイルを排出させ
るように構成されている。In order to solve such a problem, a rolling device as disclosed in Japanese Patent Laid-Open No. 62-251063 has been conventionally considered. The groove roller used in this rolling device introduces cooling oil from one end side to the hollow part (which constitutes an oil passage) provided in the base metal and discharges the cooling oil from the other end side. Is configured to let.
【０００６】[0006]
【発明が解決しようとする課題】しかしながら、一端側
から供給した冷却オイルを他端側で排出させる溝ローラ
にあっては、下記のような問題がある。However, the groove roller which discharges the cooling oil supplied from one end side at the other end side has the following problems.
【０００７】すなわち、オイル供給口から中空部に供給
された冷却オイルは吸熱しつつオイル排出口へ向かうの
で、オイル供給口からオイル排出口に向かうにつれて昇
温して冷却オイルの吸熱率（吸熱量）が低減してしま
う。そして、この吸熱量の差により、溝ローラの長手方
向に沿って温度勾配が生じてしまい、溝ローラのスリー
ブの表面に形成したワイヤ溝のピッチが変化してしまう
ことになる。このような傾向はワーク、例えばシリコン
単結晶棒の場合のように大径化、長尺化が進むと益々顕
著になる。ちなみに、従来のワイヤソーでは、直径が１
５０ｍｍ、長さが３００ｍｍ程度のワークの切断で済ん
だが、最近では、直径が２００ｍｍ、長さが８００ｍｍ
〜１０００ｍｍという長大なワークを切断する必要にせ
まられている。That is, since the cooling oil supplied from the oil supply port to the hollow portion absorbs heat and goes to the oil discharge port, the temperature rises as it goes from the oil supply port to the oil discharge port, and the heat absorption rate of the cooling oil (heat absorption amount). ) Will be reduced. The difference in the amount of heat absorption causes a temperature gradient along the longitudinal direction of the groove roller, which changes the pitch of the wire grooves formed on the surface of the sleeve of the groove roller. Such a tendency becomes more remarkable as the diameter and length of the work become larger, as in the case of a silicon single crystal ingot. By the way, in the conventional wire saw, the diameter is 1
It was only necessary to cut a work piece of 50 mm and a length of 300 mm, but recently, a diameter of 200 mm and a length of 800 mm
It is necessary to cut a large work of ~ 1000 mm.
【０００８】本発明は、このような問題点を考慮してな
されたもので、特に長尺の溝ローラの長手方向に沿う温
度勾配を低減せしめることが可能な構造を持つ溝ローラ
を提供することを目的としている。The present invention has been made in view of the above problems, and particularly provides a groove roller having a structure capable of reducing the temperature gradient along the longitudinal direction of a long groove roller. It is an object.
【０００９】[0009]
【課題を解決するための手段】請求項１記載のワイヤソ
ー用溝ローラは、切断用ワイヤが巻き掛けられる溝ロー
ラにおいて、前記溝ローラの台金の内部には、その台金
の長手方向中央で区分けされた２つの領域に、冷却媒体
流通用の流路がそれぞれ設けられ、前記各流路の始端と
終端とは、前記台金の当該流路に対応する端部に位置し
ていることを特徴とするものである。A groove roller for a wire saw according to a first aspect of the present invention is a groove roller around which a cutting wire is wound. Inside the metal of the groove roller, at the center in the longitudinal direction of the metal. A flow path for circulating a cooling medium is provided in each of the two divided areas, and the start end and the end of each flow path are located at the ends of the base metal corresponding to the flow path. It is a feature.
【００１０】請求項２記載のワイヤソー用溝ローラは、
請求項１記載のワイヤソー用溝ローラにおいて、前記台
金は、前記溝ローラの外側に固定支持されるスリーブと
同心的に配される円柱形状あるいは円筒形状の流路構成
部材を有し、この流路構成部材の外周部には前記流路が
設けられ、この流路の少なくとも一部分は前記流路構成
部材の外周部に蛇行して延在していることを特徴とする
ものである。A groove roller for a wire saw according to claim 2 is
2. The wire saw groove roller according to claim 1, wherein the base has a columnar or cylindrical flow path component that is concentrically arranged with a sleeve that is fixedly supported outside the groove roller. The flow path is provided in an outer peripheral portion of the passage forming member, and at least a part of the flow passage is meanderingly extended to the outer peripheral portion of the flow passage forming member.
【００１１】請求項３記載のワイヤソー用溝ローラは、
請求項１記載のワイヤソー用溝ローラにおいて、前記台
金は、前記溝ローラの外側に固定支持されるスリーブと
同心的に配される円柱形状の流路構成部材を有し、この
流路構成部材の内部には、当該流路構成部材の外側端か
ら内側端（中央壁側の端）近くまで延びる冷却媒体流通
用の孔が設けられ、前記流路構成部材の外周部には、前
記孔に前記内側端近くで連結され、かつ前記孔とともに
前記流路を構成する冷却媒体案内部が設けられているこ
とを特徴とするものである。The groove roller for a wire saw according to claim 3 is
The groove roller for a wire saw according to claim 1, wherein the base metal has a cylindrical flow path forming member that is arranged concentrically with a sleeve that is fixedly supported outside the groove roller. Is provided with a hole for cooling medium flow extending from the outer end to the inner end (end on the central wall side) of the flow path forming member, and the hole is provided on the outer peripheral portion of the flow path forming member. It is characterized in that a cooling medium guide portion which is connected near the inner end and constitutes the flow path together with the hole is provided.
【００１２】請求項４記載のワイヤソー用溝ローラは、
請求項１記載のワイヤソー用溝ローラにおいて、前記流
路は、前記溝ローラの内部に形成された空洞部と、前記
溝ローラの回転軸の内部に形成された孔とによって構成
されていることを特徴とするものである。A groove roller for a wire saw according to claim 4,
The groove roller for a wire saw according to claim 1, wherein the flow path is constituted by a hollow portion formed inside the groove roller and a hole formed inside a rotation shaft of the groove roller. It is a feature.
【００１３】[0013]
【作用】上記した手段によれば、冷却媒体は、溝ローラ
の台金の各端部から供給され、それぞれの流れは中央付
近で折り返して、当該各端部から排出される。したがっ
て、台金の各端部から供給される冷却媒体は溝ローラの
半部だけを冷却することになり、冷却媒体を一端部から
供給し他端部から排出する従来の構造に比べて、溝ロー
ラの各端部と中央付近とで冷却媒体の温度差が小さくな
る。その結果、溝ローラの各端部と中央付近での冷却媒
体の吸熱率がほぼ均一となり、溝ローラが長手方向で均
一に冷却されることになる。According to the above-mentioned means, the cooling medium is supplied from each end of the base of the groove roller, each flow is turned back near the center, and is discharged from each end. Therefore, the cooling medium supplied from each end of the base metal cools only the half of the groove roller, which is different from the conventional structure in which the cooling medium is supplied from one end and discharged from the other end. The temperature difference of the cooling medium between each end of the roller and the vicinity of the center becomes small. As a result, the heat absorption coefficient of the cooling medium at each end of the groove roller and in the vicinity of the center of the groove roller becomes substantially uniform, and the groove roller is cooled uniformly in the longitudinal direction.
【００１４】[0014]
【第１実施例】図１にはワイヤソーの要部が示されてい
る。このワイヤソー１はワークホルダ２を有し、このワ
ークホルダ２には、切断すべきワーク３が接着されてい
る。そして、このワークホルダ２下方には、３本の溝ロ
ーラ４０で構成されるローリング装置４が設けられてい
る。これら溝ローラ４０には切断用ワイヤＷが同一ピッ
チで多数回巻き掛けられ、この切断用ワイヤＷに、前記
ワークホルダ２に接着されたワーク３を押し付けつつ、
切断用ワイヤＷに、その線方向の往復動作と送り動作の
複合動作をさせることによって、ワーク３が切断されて
ウェーハが作製される。First Embodiment FIG. 1 shows the main part of a wire saw. The wire saw 1 has a work holder 2, and a work 3 to be cut is bonded to the work holder 2. A rolling device 4 including three groove rollers 40 is provided below the work holder 2. The cutting wires W are wound around the groove rollers 40 a number of times at the same pitch, and the work 3 adhered to the work holder 2 is pressed against the cutting wires W,
By causing the cutting wire W to perform a combined operation of reciprocating movement and feeding movement in the linear direction, the work 3 is cut and a wafer is manufactured.
【００１５】各溝ローラ４０は、図２に示すように、こ
の溝ローラ４０の両端を軸支するローラ軸支装置４１，
４１を有している。As shown in FIG. 2, each groove roller 40 has a roller shaft support device 41 for supporting both ends of the groove roller 40.
Has 41.
【００１６】溝ローラ４０は、大別すると、金属製の台
金４２と、この外側に固定支持されるプラスチック製の
スリーブ４３とから構成されている。The groove roller 40 is roughly composed of a metal base metal 42 and a plastic sleeve 43 fixedly supported on the outside thereof.
【００１７】台金４２は、図３に示すように、大径の芯
金部４４と、この芯金部４４の両端に付設された軸部４
５とによって構成されている。この台金４２の内部には
左右一対の筒体５０，５０が嵌合して設けられている。
また、台金４２の内部には、その長手方向中央に、前記
左右一対の筒体５０，５０に挟持されるようにして中央
壁４０ａが設けられている。さらに、この台金４２にお
いては、筒体５０，５０および中央壁４０ａによって区
分けされる左右一対の領域に、それぞれ、円柱形状の流
路構成部材５１が嵌合している。各流路構成部材５１の
外周には溝６０が形成されている。この溝６０は、図４
（平面図）に示すように、流路構成部材５１の長手方向
に直線的に延びる溝６０ａと、この溝６０ａの中央壁４
０ａ側端部で連結され展開形状が矩形波形状（図５参
照）の溝６０ｂとから構成されている。溝６０ｂは溝６
０ａと中央壁４０ａ側端部でのみ連絡され、他の端部に
まで亘るように蛇行して延びている。なお、溝６０ｂの
展開形状を矩形波形状としたのは、溝６０ａと途中で干
渉しないようにするためである。これら溝６０ａおよび
６０ｂにより、各流路構成部材５１の外周部には１本の
流路が構成される。なお、この第１実施例の溝ローラに
おいては、前記中央壁４０ａおよび前記各流路構成部材
５１を貫通して回転軸４９が設けられている。As shown in FIG. 3, the base metal 42 has a large-diameter core metal portion 44 and a shaft portion 4 attached to both ends of the core metal portion 44.
5 and. Inside the base metal 42, a pair of left and right cylindrical bodies 50, 50 are fitted and provided.
Further, inside the base metal 42, a center wall 40a is provided at the center in the longitudinal direction so as to be sandwiched between the pair of left and right cylindrical bodies 50, 50. Further, in the base metal 42, a columnar flow path forming member 51 is fitted in each of a pair of left and right regions divided by the cylindrical bodies 50, 50 and the central wall 40a. Grooves 60 are formed on the outer periphery of each flow path forming member 51. This groove 60 is shown in FIG.
As shown in (plan view), a groove 60a linearly extending in the longitudinal direction of the flow path forming member 51, and a central wall 4 of the groove 60a.
The groove 60b is connected at the end on the 0a side and has a rectangular wave shape (see FIG. 5) in a developed shape. Groove 60b is groove 6
0a is connected only to the end portion on the side of the central wall 40a, and extends meandering so as to extend to the other end portion. The developed shape of the groove 60b is a rectangular wave so that the groove 60b does not interfere with the groove 60a on the way. These grooves 60a and 60b form one flow path in the outer peripheral portion of each flow path forming member 51. In the groove roller of the first embodiment, a rotary shaft 49 is provided so as to penetrate the central wall 40a and the flow path forming members 51.
【００１８】一方、台金４２両端の軸部４５には、それ
ぞれ、前記溝６０の各々の端に連絡する冷却媒体供給口
４５ａおよび冷却媒体排出口４５ｂが付設されている。
また、軸部４５には、冷却媒体供給口４５ａの付設箇所
にスリップリング４６ａが嵌合され、冷却媒体排出口４
５ｂの付設箇所にはスリップリング４６ｂが嵌合されて
いる。On the other hand, the shaft portions 45 at both ends of the base metal 42 are provided with a cooling medium supply port 45a and a cooling medium discharge port 45b which communicate with respective ends of the groove 60.
In addition, a slip ring 46a is fitted to the shaft portion 45 at the location where the cooling medium supply port 45a is attached, and the cooling medium discharge port 4 is provided.
A slip ring 46b is fitted to the location of attachment of 5b.
【００１９】スリーブ４３は、図２に示すように、前記
台金４２の芯金部４４（図３参照）に外嵌されている。
このスリーブ４３の外周には、Ｖ字状のワイヤ案内溝４
３ａが長手方向に沿って所定ピッチで多数形成され、そ
のワイヤ案内溝４３ａには切断用ワイヤＷが巻き掛けら
れるようになっている。As shown in FIG. 2, the sleeve 43 is fitted onto the cored bar portion 44 (see FIG. 3) of the base metal 42.
A V-shaped wire guide groove 4 is formed on the outer circumference of the sleeve 43.
A large number of 3a are formed at a predetermined pitch along the longitudinal direction, and a cutting wire W is wound around the wire guide groove 43a.
【００２０】ローラ軸支装置４１は、図２に示すよう
に、前記台金４２を各軸部４５にて回転自在に支持する
ベアリング４１ａ，４１ａを含んで構成されている。As shown in FIG. 2, the roller shaft support device 41 includes bearings 41a, 41a for rotatably supporting the base metal 42 by respective shaft portions 45.
【００２１】次に、この溝ローラ４０の作用を説明す
る。Next, the operation of the groove roller 40 will be described.
【００２２】この溝ローラ４０によれば、冷却媒体は、
台金４２の各端にある冷却媒体供給口４５ａから溝６０
に供給される。すると、冷却媒体は、流路構成部材５１
外周の直線状の溝６０ａを通り一旦中央壁４０ａにまで
達し、次に、流路構成部材５１外周の蛇行した溝６０ｂ
を通り冷却媒体排出口４５ｂに達し、この冷却媒体排出
口４５ｂから排出される。この間に、冷却媒体によって
芯金部４４ひいてはスリーブ４３が冷却される。According to this groove roller 40, the cooling medium is
From the cooling medium supply port 45a at each end of the base metal 42 to the groove 60
Is supplied to. Then, the cooling medium is the flow path forming member 51.
It passes through the linear groove 60a on the outer periphery and once reaches the central wall 40a, and then the meandering groove 60b on the outer periphery of the flow path forming member 51.
It reaches the cooling medium discharge port 45b through and is discharged from this cooling medium discharge port 45b. During this time, the core metal portion 44 and thus the sleeve 43 are cooled by the cooling medium.
【００２３】このように構成された溝ローラ４０によれ
ば、台金４２の各端にある冷却媒体供給口４５ａから溝
６０に供給される冷却媒体によって溝ローラ４０の半部
ずつが別個に冷却されることになるので、その冷却媒体
の昇温の程度も従来と比べて小さくなり、溝ローラ４０
の各端部と中央付近とで冷却媒体の温度差が小さくな
る。その結果、溝ローラ４０の長手方向での冷却媒体の
吸熱率がほぼ均一となり、溝ローラ４０が長手方向で均
一に冷却されることになる。According to the groove roller 40 thus constructed, each half of the groove roller 40 is separately cooled by the cooling medium supplied to the groove 60 from the cooling medium supply port 45a at each end of the base metal 42. As a result, the degree of temperature rise of the cooling medium becomes smaller than in the conventional case, and the groove roller 40
The difference in temperature of the cooling medium between each end and the vicinity of the center is small. As a result, the heat absorption coefficient of the cooling medium in the longitudinal direction of the groove roller 40 becomes substantially uniform, and the groove roller 40 is cooled uniformly in the longitudinal direction.
【００２４】[0024]
【第２実施例】図６には第２実施例の溝ローラの要部、
すなわち台金４２が示されている。この台金４２は、第
１実施例の流路構成部材５１の代わりに、他の流路構成
部材７０を備えている。そして、この第２実施例では、
冷却媒体供給口４５ａから入った冷却媒体を、流路構成
部材７０の外周部に形成されている螺旋形状の流路を流
して中央壁４０ａ近くまで導いた後、さらに、流路構成
部材７０の内部を通して冷却媒体排出口４５ｂまで導く
ようにしている。それ以外の構成については、第１実施
例とほぼ同様なので、第１実施例の構成部材や構成部品
に対応するものについては、図６において同一符号を付
して、その詳しい説明は省略する。[Second Embodiment] FIG. 6 shows an essential part of a groove roller of a second embodiment.
That is, the base metal 42 is shown. This base metal 42 is provided with another flow path forming member 70 instead of the flow path forming member 51 of the first embodiment. And in this second embodiment,
After the cooling medium that has entered from the cooling medium supply port 45a flows through the spiral flow passage formed on the outer peripheral portion of the flow passage forming member 70 and is guided to the vicinity of the central wall 40a, the flow passage forming member 70 The cooling medium discharge port 45b is guided through the inside. Since the other configurations are almost the same as those of the first embodiment, the components corresponding to the components and the components of the first embodiment are designated by the same reference numerals in FIG. 6, and the detailed description thereof will be omitted.
【００２５】ここで、流路構成部材７０について詳細に
説明すれば、この流路構成部材７０は円柱形状に構成さ
れ、図６における左側の流路構成部材７０の斜視図であ
る図７に示すように、外周部に螺旋形状の冷却媒体案内
部７１を備えている。また、流路構成部材７０の内部に
は、前記冷却媒体案内部７１によって画成される流路に
中央壁４０ａ側の端部（流路構成部材７０の内側端部）
で連絡する冷却媒体流通用の孔７２が形成されている。
この孔７２は流路構成部材７０の外側端部にまで達し、
冷却媒体排出口４５ｂに連絡している。Now, the flow path forming member 70 will be described in detail. The flow path forming member 70 is formed in a cylindrical shape, and is shown in FIG. 7 which is a perspective view of the flow path forming member 70 on the left side in FIG. As described above, the spiral cooling medium guide portion 71 is provided on the outer peripheral portion. In addition, inside the flow path forming member 70, an end portion on the side of the central wall 40 a in the flow path defined by the cooling medium guide portion 71 (inner end portion of the flow path forming member 70).
A hole 72 for communicating the cooling medium is formed.
The hole 72 reaches the outer end of the flow path forming member 70,
It communicates with the cooling medium discharge port 45b.
【００２６】この実施例においても、第１実施例の溝ロ
ーラと同様の効果を有する。This embodiment also has the same effect as the groove roller of the first embodiment.
【００２７】[0027]
【第３実施例】図８には第３実施例の溝ローラの要部が
示されている。この溝ローラには、第１実施例や第２実
施例のような流路構成部材５１，７０は設けられてはい
ない。その代わりに、この第３実施例の溝ローラでは、
台金４２の内部には、回転軸４９の周りに、中央壁４０
ａによって左右に区分けされる空洞部８５ａ，８５ｂが
設けられている。そして、回転軸４９の左側の空洞部８
５ａには冷却媒体流通用の孔８１ａ，８１ｂが設けられ
るとともに、右側の空洞部８５ｂには冷却媒体流通用の
孔８１ｃ，８１ｄが設けられている。さらに、回転軸４
９の左右端部にはロータリジョイント８２，８２が設け
られ、このうち左側のロータリジョイント８２には、前
記冷却媒体流通用の孔８１ａ，８１ｂにそれぞれ連絡す
る冷却媒体供給口４５ａ、冷却媒体排出口４５ｂが設け
られ、一方、右側のロータリジョイント８２には、前記
冷却媒体流通用の孔８１ｃ，８１ｄにそれぞれ連絡する
冷却媒体供給口４５ａ、冷却媒体排出口４５ｂが設けら
れている。それ以外の構成については、第１実施例とほ
ぼ同様なので、第１実施例の構成部材や構成部品に対応
するものについては、図８において同一符号を付して、
その詳しい説明は省略する。[Third Embodiment] FIG. 8 shows an essential part of a groove roller of a third embodiment. This groove roller is not provided with the flow path constituting members 51 and 70 as in the first and second embodiments. Instead, in the groove roller of this third embodiment,
Inside the base metal 42, around the rotation axis 49, the central wall 40
Cavities 85a and 85b that are divided into left and right by a are provided. Then, the hollow portion 8 on the left side of the rotating shaft 49
5a is provided with holes 81a and 81b for circulating the cooling medium, and holes 81c and 81d for circulating the cooling medium are provided in the cavity 85b on the right side. Furthermore, the rotating shaft 4
Rotary joints 82, 82 are provided at the left and right end portions of 9, and the left side rotary joint 82 has a cooling medium supply port 45a and a cooling medium discharge port which communicate with the cooling medium circulation holes 81a, 81b, respectively. On the other hand, the rotary joint 82 on the right side is provided with a cooling medium supply port 45a and a cooling medium discharge port 45b which communicate with the cooling medium circulation holes 81c and 81d, respectively. Since the other configurations are almost the same as those in the first embodiment, the components corresponding to those of the first embodiment are designated by the same reference numerals in FIG.
Detailed description is omitted.
【００２８】この第３実施例の溝ローラによれば、各端
から孔８１ａ，８１ｃを通して供給された冷却媒体はそ
れぞれ空洞部８５ａ，８５ｂに入り、中央壁４０ａによ
って区分けされる各空洞部を冷却した後、孔８１ｂ，８
１ｄを通して排出される。According to the groove roller of the third embodiment, the cooling medium supplied from each end through the holes 81a and 81c enters the cavities 85a and 85b, respectively, and cools the cavities partitioned by the central wall 40a. After that, the holes 81b, 8
It is discharged through 1d.
【００２９】この実施例においても、第１実施例の溝ロ
ーラと同様の効果を有する。This embodiment also has the same effect as the groove roller of the first embodiment.
【００３０】以上、本発明がなした実施例について説明
したが、本発明は、かかる実施例に限定されず、その要
旨を逸脱しない範囲で、種々の変形が可能であることは
いうまでもない。Although the embodiments of the present invention have been described above, it is needless to say that the present invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. .
【００３１】[0031]
【発明の効果】本発明の代表的な効果を述べれば、切断
用ワイヤが巻き掛けられる溝ローラにおいて、前記溝ロ
ーラの台金の内部には、その台金の長手方向中央で区分
けされた２つの領域に、冷却媒体流通用の流路がそれぞ
れ設けられ、各領域に設けられる前記流路は、始端と終
端とが前記台金の当該流路に対応する端部に位置するよ
うに構成されているので、溝ローラの長手方向の吸熱率
がほぼ均一となり、溝ローラが長手方向で均一に冷却さ
れることになる。As a representative effect of the present invention, in a groove roller around which a cutting wire is wound, inside the base of the groove roller, the base is divided at the center in the longitudinal direction of the base. A flow path for cooling medium circulation is provided in each of the two areas, and the flow path provided in each area is configured such that the starting end and the terminating end are located at the ends of the base metal corresponding to the flow path. Therefore, the heat absorption coefficient in the longitudinal direction of the groove roller becomes substantially uniform, and the groove roller is cooled uniformly in the longitudinal direction.
【図１】本発明に係る溝ローラを適用したワイヤソーの
主要部の斜視図である。FIG. 1 is a perspective view of a main part of a wire saw to which a groove roller according to the present invention is applied.
【図２】第１および第２実施例に係る溝ローラの主要部
分の構成図である。FIG. 2 is a configuration diagram of a main part of a groove roller according to first and second embodiments.
【図３】第１実施例に係る溝ローラの台金の構成図であ
る。FIG. 3 is a configuration diagram of a base of a groove roller according to the first embodiment.
【図４】第１実施例に係る流路構成部材の平面図であ
る。FIG. 4 is a plan view of the flow path forming member according to the first embodiment.
【図５】第１実施例に係る流路構成部材の溝の展開図で
ある。FIG. 5 is a development view of grooves of the flow path forming member according to the first embodiment.
【図６】第２実施例に係る溝ローラの主要部分の構成図
である。FIG. 6 is a configuration diagram of a main part of a groove roller according to a second embodiment.
【図７】第２実施例に係る溝ローラの流路構成部材の斜
視図である。FIG. 7 is a perspective view of a flow path forming member of a groove roller according to a second embodiment.
【図８】第３実施例に係る溝ローラの主要部分の構成図
である。FIG. 8 is a configuration diagram of a main part of a groove roller according to a third embodiment.
１ ワイヤソー ４ ローリング装置 ４０ 溝ローラ ４０ａ 中央壁 ４２ 台金 ４５ａ 冷却媒体供給口 ４５ｂ 冷却媒体排出口 1 Wire Saw 4 Rolling Device 40 Groove Roller 40a Central Wall 42 Base Metal 45a Cooling Medium Supply Port 45b Cooling Medium Discharge Port
───────────────────────────────────────────────────── フロントページの続き (72)発明者 外山 公平 福島県西白河郡西郷村大字小田倉字大平 150番地 信越半導体株式会社半導体白河 研究所内 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Kohei Sotoyama 150 Odaira, Odakura, Saigo-mura, Nishishirakawa-gun, Fukushima Shin-Etsu Semiconductor Co., Ltd. Shirakawa Laboratory
Claims (4)
において、前記溝ローラの台金の内部には、その台金の
長手方向中央で区分けされた２つの領域に、冷却媒体流
通用の流路がそれぞれ設けられ、前記各流路の始端と終
端とは、前記台金の当該流路に対応する端部に位置して
いることを特徴とするワイヤソー用溝ローラ。1. A groove roller around which a cutting wire is wound, and inside a base metal of the groove roller, a channel for circulating a cooling medium is provided in two regions divided at the longitudinal center of the base metal. And a starting end and a terminating end of each flow path are located at end portions of the base metal corresponding to the flow path, respectively.
支持されるスリーブと同心的に配される円柱形状あるい
は円筒形状の流路構成部材を有し、この流路構成部材の
外周部には前記流路が設けられ、この流路の少なくとも
一部分は前記流路構成部材の外周部に蛇行して延在して
いることを特徴とする請求項１記載のワイヤソー用溝ロ
ーラ。2. The base metal has a columnar or cylindrical flow path constituent member that is arranged concentrically with a sleeve that is fixedly supported on the outside of the groove roller, and an outer peripheral portion of the flow path constituent member. The groove roller for a wire saw according to claim 1, wherein the flow path is provided in the flow path, and at least a part of the flow path extends in a meandering manner to an outer peripheral portion of the flow path forming member.
支持されるスリーブと同心的に配される円柱形状の流路
構成部材を有し、この流路構成部材の内部には、当該流
路構成部材の外側端から内側端（中央壁側の端）近くま
で延びる冷却媒体流通用の孔が設けられ、前記流路構成
部材の外周部には、前記孔に前記内側端近くで連結さ
れ、かつ前記孔とともに前記流路を構成する冷却媒体案
内部が設けられていることを特徴とする請求項１記載の
ワイヤソー用溝ローラ。3. The base metal has a cylindrical flow path forming member that is arranged concentrically with a sleeve that is fixedly supported on the outside of the groove roller, and inside the flow path forming member, A hole for cooling medium flow extending from the outer end of the flow path forming member to the vicinity of the inner end (end on the side of the central wall) is provided, and the outer peripheral portion of the flow path forming member is connected to the hole near the inner end. The groove roller for a wire saw according to claim 1, further comprising: a cooling medium guide portion that forms the flow path together with the hole.
された空洞部と、前記溝ローラの回転軸の内部に形成さ
れた孔とによって構成されていることを特徴とする請求
項１記載のワイヤソー用溝ローラ。4. The flow path is configured by a hollow portion formed inside the groove roller and a hole formed inside a rotation shaft of the groove roller. The groove roller for the wire saw described.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168794A JP2755907B2 (en) | 1994-06-28 | 1994-06-28 | Groove roller for wire saw |
| US08/452,835 US5575189A (en) | 1994-06-28 | 1995-05-30 | Roller having grooves for wire saw |
| MYPI95001452A MY113788A (en) | 1994-06-28 | 1995-06-02 | Roller having grooves for wire saw |
| EP95304272A EP0689891B1 (en) | 1994-06-28 | 1995-06-20 | A roller |
| DE69511635T DE69511635T2 (en) | 1994-06-28 | 1995-06-20 | A roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6168794A JP2755907B2 (en) | 1994-06-28 | 1994-06-28 | Groove roller for wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0811048A true JPH0811048A (en) | 1996-01-16 |
| JP2755907B2 JP2755907B2 (en) | 1998-05-25 |
Family
ID=15874602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6168794A Expired - Fee Related JP2755907B2 (en) | 1994-06-28 | 1994-06-28 | Groove roller for wire saw |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US5575189A (en) |
| EP (1) | EP0689891B1 (en) |
| JP (1) | JP2755907B2 (en) |
| DE (1) | DE69511635T2 (en) |
| MY (1) | MY113788A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690840A (en) * | 2013-12-06 | 2015-06-10 | 硅电子股份公司 | Method for slicing wafers from a workpiece by means of a wire saw |
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|---|---|---|---|---|
| EP0738572B1 (en) * | 1995-04-22 | 2004-01-21 | HCT Shaping Systems SA | Method for orienting monocrystals for cutting in a cutting machine and device for performing the method |
| JP2885270B2 (en) * | 1995-06-01 | 1999-04-19 | 信越半導体株式会社 | Wire saw device and work cutting method |
| CH691036A5 (en) * | 1996-02-06 | 2001-04-12 | Hct Shaping Systems Sa | Wire sawing device for cutting thin slices of including a mechanism for the in situ cutting the throats of guide rollers son. |
| CH691037A5 (en) * | 1996-02-06 | 2001-04-12 | Hct Shaping Systems Sa | Wire sawing device. |
| CZ283541B6 (en) * | 1996-03-06 | 1998-04-15 | Trimex Tesla, S.R.O. | Process of cutting ingots from hard materials to plates and a saw for making the same |
| JP3273163B2 (en) * | 1996-09-06 | 2002-04-08 | シャープ株式会社 | Multi wire saw |
| DE19717379A1 (en) * | 1997-04-24 | 1998-10-29 | Wacker Siltronic Halbleitermat | Wire saw and assembly station for a wire guide roller of a wire saw and method for replacing a wire guide roller |
| TW383249B (en) * | 1998-09-01 | 2000-03-01 | Sumitomo Spec Metals | Cutting method for rare earth alloy by annular saw and manufacturing for rare earth alloy board |
| EP1004383A1 (en) * | 1998-11-25 | 2000-05-31 | Meyer & Burger AG | Saw wire guiding roller with cooling system |
| MY126994A (en) | 1999-12-14 | 2006-11-30 | Hitachi Metals Ltd | Method and apparatus for cutting a rare earth alloy |
| US6357433B1 (en) * | 2000-06-01 | 2002-03-19 | Motorola, Inc. | Machine for cutting brittle materials |
| US6352071B1 (en) * | 2000-06-20 | 2002-03-05 | Seh America, Inc. | Apparatus and method for reducing bow and warp in silicon wafers sliced by a wire saw |
| US20030170948A1 (en) * | 2002-03-07 | 2003-09-11 | Memc Electronic Materials, Inc. | Method and apparatus for slicing semiconductor wafers |
| WO2009102630A1 (en) * | 2008-02-11 | 2009-08-20 | Memc Electronic Materials, Inc. | Carbon nanotube reinforced wiresaw beam used in wiresaw slicing of ingots into wafers |
| CN102744794A (en) * | 2011-04-01 | 2012-10-24 | 江苏省惠山中等专业学校 | Double-piece independent wire guide wheel |
| DE102011083175A1 (en) * | 2011-09-22 | 2013-03-28 | Voith Patent Gmbh | Wire guide roller for wire saws with data acquisition system |
| DE102018221922A1 (en) * | 2018-12-17 | 2020-06-18 | Siltronic Ag | Method for producing semiconductor wafers using a wire saw, wire saw and semiconductor wafer made of single-crystal silicon |
| CN113369582B (en) * | 2021-06-28 | 2022-12-02 | 中国有色桂林矿产地质研究院有限公司 | Manufacturing method of annular diamond wire saw |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2826880A (en) * | 1957-04-10 | 1958-03-18 | Lyon Inc | Buffing cooling mechanism |
| US4134384A (en) * | 1977-09-16 | 1979-01-16 | Motorola, Inc. | Wire saw with rotatable guide sleeve |
| JPH0616985B2 (en) * | 1986-04-24 | 1994-03-09 | 住友金属工業株式会社 | Cutting method in wire saw |
| JP2516717B2 (en) * | 1991-11-29 | 1996-07-24 | 信越半導体株式会社 | Wire saw and its cutting method |
| JP2731309B2 (en) * | 1991-12-10 | 1998-03-25 | 信越半導体株式会社 | Wire saw and temperature control method of roller support device |
| CH687301A5 (en) * | 1992-01-22 | 1996-11-15 | W S Technologies Ltd | Wire sawing device. |
-
1994
- 1994-06-28 JP JP6168794A patent/JP2755907B2/en not_active Expired - Fee Related
-
1995
- 1995-05-30 US US08/452,835 patent/US5575189A/en not_active Expired - Fee Related
- 1995-06-02 MY MYPI95001452A patent/MY113788A/en unknown
- 1995-06-20 EP EP95304272A patent/EP0689891B1/en not_active Expired - Lifetime
- 1995-06-20 DE DE69511635T patent/DE69511635T2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104690840A (en) * | 2013-12-06 | 2015-06-10 | 硅电子股份公司 | Method for slicing wafers from a workpiece by means of a wire saw |
| KR20150066450A (en) * | 2013-12-06 | 2015-06-16 | 실트로닉 아게 | Method for slicing wafers from a workpiece by means of a wire saw |
| JP2015112711A (en) * | 2013-12-06 | 2015-06-22 | ジルトロニック アクチエンゲゼルシャフトＳｉｌｔｒｏｎｉｃ ＡＧ | Method for slicing wafer from workpiece with wire saw |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69511635T2 (en) | 2000-03-16 |
| US5575189A (en) | 1996-11-19 |
| DE69511635D1 (en) | 1999-09-30 |
| JP2755907B2 (en) | 1998-05-25 |
| EP0689891B1 (en) | 1999-08-25 |
| MY113788A (en) | 2002-05-31 |
| EP0689891A1 (en) | 1996-01-03 |
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