JPH0811044A - Grinding and polishing device - Google Patents

Grinding and polishing device

Info

Publication number
JPH0811044A
JPH0811044A JP16881694A JP16881694A JPH0811044A JP H0811044 A JPH0811044 A JP H0811044A JP 16881694 A JP16881694 A JP 16881694A JP 16881694 A JP16881694 A JP 16881694A JP H0811044 A JPH0811044 A JP H0811044A
Authority
JP
Japan
Prior art keywords
grinding
workpiece
grindstone
wheel
curvature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP16881694A
Other languages
Japanese (ja)
Inventor
Yoshinori Muto
吉則 武藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Olympus Corp
Original Assignee
Olympus Optical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co Ltd filed Critical Olympus Optical Co Ltd
Priority to JP16881694A priority Critical patent/JPH0811044A/en
Publication of JPH0811044A publication Critical patent/JPH0811044A/en
Withdrawn legal-status Critical Current

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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Abstract

PURPOSE:To greatly reduce the cost for a grinding wheel and the set-up time, execute the grinding and polishing with one device, and reduce the machining cost. CONSTITUTION:A motor 3 to transmit the rotational force and a motor 4 to transmit the sliding force on the axis of rotation are provided on the rear end of a work holder 2 to hold a work 1. The position of the work holder 2 is precisely controlled by a laser beam length measuring machine 5 installed in the vicinity thereof. A tool holder 8 where the center 6 of curvature of the work 1 is the center axis 7 of sway is arranged on the position opposite to the work holder 2.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ホイール状砥石を用い
てレンズ等の光学素子球面を創成する研削・研磨装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a grinding / polishing device for creating a spherical surface of an optical element such as a lens by using a wheel-shaped grindstone.

【0002】[0002]

【従来の技術】従来、レンズ等の球面を創成する研磨装
置として、例えば特公平6−22799号公報に記載さ
れる発明がある。上記発明は、図5に示す様に、レンズ
71を軸回りに回転可能に保持する上軸72と、研磨皿
73を同軸上に保持するとともに駆動装置74を介して
回転駆動自在に構成された下軸75と、下軸75を角度
振幅揺動させる機構76と、該機構76および下軸75
を上軸72と直行する方向に直進移動させる機構(図示
省略)とを備え、上軸72および下軸75のそれぞれの
中心線が同じ曲率半径を有するレンズ71および研磨皿
73の球心で常に交わるように上軸72,下軸75相互
の角度揺動および直進移動を制御するように構成されて
いる。
2. Description of the Related Art Conventionally, as a polishing apparatus for creating a spherical surface such as a lens, there is an invention described in Japanese Patent Publication No. 6-22799. As shown in FIG. 5, the above-mentioned invention is configured such that an upper shaft 72 that holds a lens 71 rotatably around an axis and a polishing dish 73 are held coaxially, and that they can be rotationally driven via a drive device 74. Lower shaft 75, mechanism 76 for swinging lower shaft 75 with an angular amplitude, and mechanism 76 and lower shaft 75
Is provided with a mechanism (not shown) for linearly moving in a direction orthogonal to the upper shaft 72, and the center line of each of the upper shaft 72 and the lower shaft 75 has the same radius of curvature. The upper shaft 72 and the lower shaft 75 are configured to control the angular swing and the rectilinear movement so that they intersect.

【0003】上記構成の研磨装置は、レンズ71と研磨
皿73との相互回転による相対すべりを介して、レンズ
71の研磨加工が成されるものである。
In the polishing apparatus having the above structure, the lens 71 is polished by the relative sliding between the lens 71 and the polishing dish 73 due to the mutual rotation.

【0004】[0004]

【発明が解決しようとする課題】しかるに、前記従来技
術においては以下の様な問題点がある。すなわち、被加
工物の球面を創成するためには、求める被加工物の球面
の曲率の近似値まで精度良く砥石の曲率を加工しておく
必要があり、生産において被加工物の形状や曲率が変更
された場合、砥石をその都度その被加工物の曲率に合っ
た砥石に加工する必要があり、段取りに非常な時間がか
かるという問題があった。さらに、この装置では研磨加
工しか行うことが出来ず、一般的に研磨加工の前加工で
研削を行わなくてはならず、そのため研削用の設備が必
要となり、また加工工程が多い分加工コストが高くなっ
ている。
However, the above-mentioned prior art has the following problems. In other words, in order to create the spherical surface of the work piece, it is necessary to accurately process the curvature of the grindstone up to the approximate value of the curvature of the spherical surface of the work piece to be obtained. If changed, it is necessary to process the grindstone into a grindstone that matches the curvature of the workpiece each time, and there is a problem that the setup takes a very long time. In addition, this equipment can only perform polishing, and generally must perform grinding before polishing, which requires equipment for grinding, and there are many processing steps, resulting in processing cost. It's getting higher.

【0005】請求項1,2および3の目的は、被加工物
の球面をホイール状砥石で加工を行うことによりどのよ
うな曲率の被加工物でも研削・研磨加工が可能となり、
被加工物の形状によりその都度砥石を準備する必要が無
くて段取り時間が飛躍的に削減出来、さらには1台の設
備で研削・研磨砥石が行えるため加工コストが大幅に削
減できる装置の提供にある。
The object of claims 1, 2 and 3 is to grind and polish a workpiece having any curvature by processing the spherical surface of the workpiece with a wheel grindstone.
Depending on the shape of the work piece, it is not necessary to prepare a grindstone each time, and the setup time can be dramatically reduced. Furthermore, since the grinding / polishing grindstone can be done by one piece of equipment, the processing cost can be greatly reduced. is there.

【0006】[0006]

【課題を解決するための手段】本発明は、被加工物を保
持して回転するワークホルダーと、砥石を保持して回転
および移動するツールホルダーと、砥石を被加工物に接
触させる送り手段と、前記ツールホルダーの揺動中心軸
と被加工物の曲率中心を一致させる位置決め手段とを具
備したことを特徴とする研削・研磨装置である。
According to the present invention, there is provided a work holder for holding and rotating a workpiece, a tool holder for holding and rotating and moving a grindstone, and a feeding means for bringing the grindstone into contact with the workpiece. A grinding / polishing device, comprising: a positioning means for aligning a swing center axis of the tool holder with a curvature center of a workpiece.

【0007】[0007]

【作用】請求項1,2および3の作用は、被加工物をワ
ークホルダーに取り付け、その曲率中心とツールホルダ
ーの揺動中心とを一致させ、要求される曲率半径分だけ
揺動中心位置より離れた位置までホイール状砥石を回転
揺動させながら送り込むことにより被加工物の球面を創
成する。また、被加工物を研削砥石で研削した後、研削
用砥石と同一形状を成す研磨砥石に変更し、前記と同様
な作用を行うことで、研削・研磨加工を1台の装置で可
能とする。
According to the operations of claims 1, 2 and 3, the workpiece is attached to the work holder, the center of curvature of the workpiece is matched with the swing center of the tool holder, and the swing center position is adjusted by the required radius of curvature. The spherical surface of the work piece is created by sending the wheel-shaped grindstone to the distant position while rotating and rocking. Further, after grinding the work piece with the grinding wheel, the grinding wheel is changed to a grinding wheel having the same shape as the grinding wheel, and the same operation as described above is performed, so that the grinding / polishing processing can be performed by one apparatus. .

【0008】[0008]

【実施例1】図1〜図4は本実施例を示し、図1は正面
断面図、図2は側面断面図、図3は凸レンズの加工状態
を示す説明図、図4は凹レンズの加工状態を示す説明図
である。
1 to 4 show the present embodiment, FIG. 1 is a front sectional view, FIG. 2 is a side sectional view, FIG. 3 is an explanatory view showing a processing state of a convex lens, and FIG. 4 is a processing state of a concave lens. FIG.

【0009】先端に被加工物1を取着するワークホルダ
ー2の後端には、回転力を伝達するモータ3と回転軸線
上での摺動力を伝達するモータ4とが設けられている。
ワークホルダー2は近傍に設置されたレーザー測長機5
によりその位置を精密に制御される。ワークホルダー2
と相対する位置には、被加工物1の曲率中心6を揺動中
心軸7とするツールホルダー8が配置されている。被加
工物1はワークホルダー2に保持され、ツールホルダー
8の揺動中心軸7と被加工物1の曲率中心6とが合致す
る位置に位置出しされている。
At the rear end of the work holder 2 for attaching the work piece 1 to the front end, a motor 3 for transmitting a rotational force and a motor 4 for transmitting a sliding force on the rotation axis are provided.
The work holder 2 is a laser length measuring machine 5 installed in the vicinity.
The position is precisely controlled by. Work holder 2
A tool holder 8 having a center of curvature 6 of the workpiece 1 as a swing center axis 7 is arranged at a position opposite to. The work piece 1 is held by the work holder 2, and is positioned at a position where the swing center axis 7 of the tool holder 8 and the center of curvature 6 of the work piece 1 coincide with each other.

【0010】ツールホルダー8は以下のように構成され
ている。揺動中心軸7を中心に揺動自在な半円板状を成
すタライ部9と、それに任意角度で揺動力を伝達するモ
ータ10とが係合されている。タライ部9の中央部に
は、材質がメタルボンド製で、且つ被加工物1の直径1
/2〜1/5の直径を有するホイール状砥石11を先端
に具備し、モータ12より回転力が伝達され、且つ送り
モータ13により揺動中心軸7と交差する回転軸線上で
の摺動が制御されるホイールホルダー14が配設されて
いる。
The tool holder 8 is constructed as follows. A tarai portion 9 having a semicircular plate shape that is swingable around a swing center shaft 7 and a motor 10 that transmits a swing force at an arbitrary angle are engaged with the tarai portion 9. At the center of the tarai part 9, the material is made of metal bond and the diameter of the workpiece 1 is 1
A wheel-shaped grindstone 11 having a diameter of / 2 to 1/5 is provided at the tip, a rotational force is transmitted from a motor 12, and a feed motor 13 slides on a rotation axis intersecting with the swing center axis 7. A controlled wheel holder 14 is provided.

【0011】本実施例の作用を、図3および図4を用い
て以下に説明する。回転するホイール状砥石11は、被
加工物1の曲率半径:R分だけ曲率中心6より離れた位
置で位置決めされている。ここで、該ホイール状砥石1
1を含むツールホルダー8は所定の角度を保って揺動を
行っている。この状態において、被加工物1に所定の切
り込みを与えるべくホイール状砥石11を送る。この
時、研削用メッシュ#100〜#1200のホイール状
砥石11で研削加工を行い、次に同形状の研磨用メッシ
ュ#3000〜#10000のホイール状砥石11で研
磨加工を行うことにより、所望の球面形状を得る事が出
来る。
The operation of this embodiment will be described below with reference to FIGS. 3 and 4. The rotating wheel-shaped grindstone 11 is positioned at a position separated from the center of curvature 6 by the radius of curvature R of the workpiece 1. Here, the wheel-shaped grindstone 1
The tool holder 8 including 1 swings while maintaining a predetermined angle. In this state, the wheel-shaped grindstone 11 is fed to make a predetermined cut in the workpiece 1. At this time, grinding is performed with the wheel-shaped grindstones 11 of the grinding meshes # 100 to # 1200, and then with the wheel-shaped grindstone 11 of the polishing meshes # 3000 to # 10000 having the same shape. A spherical shape can be obtained.

【0012】本実施例によれば、ホイール状砥石11は
汎用的に使用出来るため被加工物1の形状毎に専用の砥
石を制作することが不要となる。さらに、逐次専用砥石
を搭載する必要が無いため、大幅に段取り時間が削減さ
れる。
According to this embodiment, since the wheel-shaped grindstone 11 can be used for general purposes, it is not necessary to produce a dedicated grindstone for each shape of the workpiece 1. Further, since it is not necessary to sequentially mount a dedicated grindstone, the setup time is greatly reduced.

【0013】[0013]

【実施例2】本実施例は、前記実施例1におけるメタル
ボンド製のホイール状砥石11を廃止し、代わりに材質
がレジン製のホイール状砥石にて構成した点が異なり、
他の構成は同一な構成部分から成るものであり、構成の
説明を省略する。
Example 2 This example is different in that the wheel-shaped grindstone 11 made of metal bond in the above-mentioned Example 1 is abolished, and a wheel-shaped grindstone made of resin is used instead.
Other configurations are composed of the same components, and the description of the configurations is omitted.

【0014】本実施例は、前記実施例1と同様な作用で
あり、作用の説明を省略する。
This embodiment has the same operation as that of the first embodiment, and the description of the operation will be omitted.

【0015】本実施例によれば、ホイール状砥石をレジ
ン製とすることで被加工物の加工面の表面粗さが向上す
る。
According to this embodiment, since the wheel-shaped grindstone is made of resin, the surface roughness of the machined surface of the workpiece is improved.

【0016】[0016]

【実施例3】本実施例は、前記実施例1におけるメタル
ボンド製のホイール状砥石11を廃止し、代わりにホイ
ール状砥石の材質が研磨材を圧縮形成したもので研磨加
工として使用できる点が異なり、他の構成は同一な構成
部分から成るものであり、構成の説明を省略する。
[Third Embodiment] In this embodiment, the wheel-shaped grindstone 11 made of metal bond in the first embodiment is eliminated, and instead, the material of the wheel-shaped grindstone is formed by compressing an abrasive, which can be used as a polishing process. Differently, the other configurations are composed of the same components, and the description of the configurations is omitted.

【0017】本実施例は、前記実施例1と同様な作用で
あり、作用の説明を省略する。
The operation of this embodiment is similar to that of the first embodiment, and the description of the operation is omitted.

【0018】本実施例によれば、研磨材を圧縮形成した
ホイール状砥石を用いたことにより、研磨加工が可能と
なる。
According to the present embodiment, it is possible to carry out the polishing process by using the wheel-shaped grindstone in which the abrasive material is compressed and formed.

【0019】[0019]

【実施例4】本実施例は、前記実施例1におけるメタル
ボンド製のホイール状砥石11を廃止し、代わりにホイ
ール状砥石の材質がウレタン製である点と、加工時に研
磨材を供給する供給機構(図示省略)とを設けて構成し
た点が異なり、他の構成は同一な構成部分から成るもの
であり、構成の説明を省略する。
[Fourth Embodiment] In this embodiment, the wheel-shaped grindstone 11 made of metal bond in the first embodiment is abolished, and instead, the material of the wheel-shaped grindstone is made of urethane, and an abrasive is supplied during processing. It is different in that it is configured by providing a mechanism (not shown), and other configurations are composed of the same components, and the description of the configuration will be omitted.

【0020】本実施例では、加工時に研磨材を供給しな
がら研磨加工を行うものである。他の作用は、前記実施
例1と同様な作用であり、その説明を省略する。
In this embodiment, polishing is performed while supplying an abrasive during processing. Other operations are the same as those in the first embodiment, and the description thereof will be omitted.

【0021】本実施例によれば、ホイール状砥石をウレ
タン製とし、研磨材を供給しつつ加工を行うことで研磨
加工が可能となる。
According to the present embodiment, the wheel-shaped grindstone is made of urethane, and the polishing can be performed by supplying the abrasive and performing the processing.

【0022】[0022]

【発明の効果】請求項1,2および3に係わる本発明の
効果は、被加工物の曲率に合わせた専用砥石の制作が不
要となり、砥石コストと段取り時間とを大幅に削減出来
る。また、研削と研磨加工とが1台で可能であり、加工
コストを安く出来る。
According to the effects of the present invention according to claims 1, 2 and 3, it is not necessary to produce a dedicated grindstone according to the curvature of the workpiece, and the grindstone cost and the setup time can be greatly reduced. Further, grinding and polishing can be performed by one unit, and the processing cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1を示す正面断面図である。FIG. 1 is a front cross-sectional view showing a first embodiment.

【図2】実施例1を示す側面断面図である。FIG. 2 is a side sectional view showing the first embodiment.

【図3】実施例1を説明図である。FIG. 3 is an explanatory diagram of the first embodiment.

【図4】実施例1を説明図である。FIG. 4 is an explanatory diagram of the first embodiment.

【図5】従来例を示す側面断面図である。FIG. 5 is a side sectional view showing a conventional example.

【符号の説明】[Explanation of symbols]

1 被加工物 2 ワークホルダー 3,4,10,12,13 モータ 5 レーザー測長機 8 ツールホルダー 9 タライ部 11 ホイール状砥石 14 ホイールホルダ 1 Workpiece 2 Work holder 3, 4, 10, 12, 13 Motor 5 Laser length measuring machine 8 Tool holder 9 Tarai part 11 Wheel-shaped grindstone 14 Wheel holder

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 被加工物を保持して回転するワークホル
ダーと、砥石を保持して回転および移動するツールホル
ダーと、砥石を被加工物に接触させる送り手段と、前記
ツールホルダーの揺動中心軸と被加工物の曲率中心を一
致させる位置決め手段とを具備したことを特徴とする研
削・研磨装置。
1. A work holder that holds and rotates a workpiece, a tool holder that holds and rotates a grindstone, a feeding means that brings the grindstone into contact with the workpiece, and a swing center of the tool holder. A grinding / polishing device comprising: a shaft and a positioning means for aligning a center of curvature of a workpiece.
【請求項2】 前記ツールホルダーの揺動中心軸と被加
工物の曲率中心を一致させる位置決め手段にレーザー測
長機を用いたことを特徴とする請求項1記載の研削・研
磨装置。
2. The grinding / polishing device according to claim 1, wherein a laser length measuring machine is used as a positioning means for aligning the swing center axis of the tool holder and the curvature center of the workpiece.
【請求項3】 前記ツールホルダーに保持される砥石
は、被加工物の直径の1/2〜1/5の直径のホイール
状砥石であることを特徴とする請求項1記載の研削・研
磨装置。
3. The grinding / polishing device according to claim 1, wherein the grindstone held by the tool holder is a wheel-shaped grindstone having a diameter of 1/2 to 1/5 of the diameter of the workpiece. .
JP16881694A 1994-06-28 1994-06-28 Grinding and polishing device Withdrawn JPH0811044A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16881694A JPH0811044A (en) 1994-06-28 1994-06-28 Grinding and polishing device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16881694A JPH0811044A (en) 1994-06-28 1994-06-28 Grinding and polishing device

Publications (1)

Publication Number Publication Date
JPH0811044A true JPH0811044A (en) 1996-01-16

Family

ID=15875039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16881694A Withdrawn JPH0811044A (en) 1994-06-28 1994-06-28 Grinding and polishing device

Country Status (1)

Country Link
JP (1) JPH0811044A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270392B1 (en) 1998-06-19 2001-08-07 Nec Corporation Polishing apparatus and method with constant polishing pressure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6270392B1 (en) 1998-06-19 2001-08-07 Nec Corporation Polishing apparatus and method with constant polishing pressure
US6652354B2 (en) 1998-06-19 2003-11-25 Nec Corporation Polishing apparatus and method with constant polishing pressure

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Effective date: 20010904