JPH0810483B2 - Method of manufacturing thin film magnetic head - Google Patents
Method of manufacturing thin film magnetic headInfo
- Publication number
- JPH0810483B2 JPH0810483B2 JP22237588A JP22237588A JPH0810483B2 JP H0810483 B2 JPH0810483 B2 JP H0810483B2 JP 22237588 A JP22237588 A JP 22237588A JP 22237588 A JP22237588 A JP 22237588A JP H0810483 B2 JPH0810483 B2 JP H0810483B2
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- film
- photosensitive resin
- pattern
- resin film
- ultraviolet rays
- Prior art date
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Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は薄膜磁気ヘツドの製造方法に係り、特に、高
精度に形成されたトラツク幅をもつ薄膜磁気ヘツドの製
造方法に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin film magnetic head, and more particularly to a method for manufacturing a thin film magnetic head having a highly accurately formed track width.
磁気デイスク装置の高記録密度化が進むにつれて、薄
膜磁気ヘツドのトラツク幅も微細化しつつある。第２図
は、薄膜磁気ヘツドの構造の一例を表わした側断面図で
ある。基板21の上には下部磁性膜22が形成されており、
後から形成される上部磁性膜23と共に磁気回路を構成し
ている。先端部24では、ギヤツプ材25を磁性膜22及び23
の間に介在して磁気ギヤツプを形成し、このギヤツプを
用いて記録媒体に対する読み出し及び書き込みを行な
う。一方、磁気コアの中央部では、導体コイル26が磁気
回路と交差するように設けてあり、この導体コイル26
は、磁性膜22、及び、23と樹脂絶縁膜27により絶縁され
ている。As the recording density of the magnetic disk device has been increased, the track width of the thin film magnetic head has been miniaturized. FIG. 2 is a side sectional view showing an example of the structure of the thin film magnetic head. A lower magnetic film 22 is formed on the substrate 21,
A magnetic circuit is configured with the upper magnetic film 23 formed later. At the tip portion 24, the gear stopper material 25 is attached to the magnetic films 22 and 23.
A magnetic gap is formed between the magnetic recording medium and the magnetic recording medium, and reading and writing are performed on the recording medium using the magnetic gear. On the other hand, in the central portion of the magnetic core, the conductor coil 26 is provided so as to intersect with the magnetic circuit.
Are insulated from the magnetic films 22 and 23 by the resin insulating film 27.
この薄膜磁気ヘツドの記録密度を決めるトラツク幅
は、通常、ヘツド先端部24における上部磁性膜23の幅に
よつて決められる。このため、高精度なトラツク幅寸法
を実現するには、約10μｍの高さの樹脂絶縁膜27の段差
下部で、±0.5μｍ以下の高精度で磁性膜23をパターニ
ングする必要がある。このため、エツチング量のコント
ロールが容易で、かつ、高い精度が期待できるドライエ
ツチング法が用いられることが多く、特に、加速したイ
オンを用いるイオンミリング法がよく用いられる。The track width that determines the recording density of this thin film magnetic head is usually determined by the width of the upper magnetic film 23 at the head tip portion 24. Therefore, in order to realize a highly accurate track width dimension, it is necessary to pattern the magnetic film 23 with a high accuracy of ± 0.5 μm or less under the step of the resin insulating film 27 having a height of about 10 μm. For this reason, the dry etching method is often used because it is easy to control the etching amount and high accuracy can be expected, and in particular, the ion milling method using accelerated ions is often used.
例えば、特開昭60−37130号公報には、感光性樹脂を
マスク材として、イオンミリング法を用いて段差部の薄
膜をパターニングする方法の例があげられており、これ
を第３図に示す。まず、（ａ）に示すように、基板31の
上部に段差32を形成し、その上部にパターニングされる
べき薄膜33を形成する。次いで第３図（ｂ）に示したよ
うに、感光性樹脂膜34を塗布し、パターン形成した後、
第３図（ｃ）に示すように、イオンミリング法を用いて
薄膜33をエツチングし、目的とするパターン形状を得て
いる。For example, Japanese Unexamined Patent Publication No. 60-37130 discloses an example of a method of patterning a thin film at a step portion using an ion milling method using a photosensitive resin as a mask material, which is shown in FIG. . First, as shown in (a), a step 32 is formed on an upper part of a substrate 31, and a thin film 33 to be patterned is formed on the step 32. Next, as shown in FIG. 3B, after coating the photosensitive resin film 34 and patterning it,
As shown in FIG. 3C, the thin film 33 is etched by using an ion milling method to obtain a target pattern shape.
また、特開昭60−37130号公報には、第３図に示すプ
ロセスよりも高精度なパターニングを実現する方法もあ
げられており、これを第４図に示す。まず、（ａ）に示
すように、第３図（ａ）と同様の構造を形成した後、そ
の上部にアルミナ膜45を形成する。次いで、（ｂ）に示
すように、感光性樹脂膜44を形成した後、（ｃ）に示す
ように、弗素系ガスを用いた反応性イオンミリング法で
アルミナ膜45をパターニングする。その後、（ｄ）に示
すように、感光性樹脂膜44を除去した後、アルミナ膜45
をマスク材にしてイオンミリング法で薄膜43をパターニ
ングして、目的とする形状を得ている。図中、41は基
板、42は段差。Further, Japanese Patent Application Laid-Open No. 60-37130 discloses a method for realizing more precise patterning than the process shown in FIG. 3, which is shown in FIG. First, as shown in (a), a structure similar to that shown in FIG. 3 (a) is formed, and then an alumina film 45 is formed thereon. Next, as shown in (b), after forming a photosensitive resin film 44, as shown in (c), the alumina film 45 is patterned by a reactive ion milling method using a fluorine-based gas. Then, as shown in (d), after removing the photosensitive resin film 44, the alumina film 45 is removed.
Is used as a mask material to pattern the thin film 43 by the ion milling method to obtain a target shape. In the figure, 41 is a substrate and 42 is a step.
上記従来技術のうち、第３図に示す方法では、マスク
材となる感光性樹脂膜の厚さが段差下部では約10〜15μ
ｍと厚くなつてしまうため、イオンミリング時に、第５
図に示すような再付着層35が発生してしまい。段差下部
における薄膜33の寸法精度が悪くなり、かつ、目的とす
るパターニング形状が得られないという問題があつた。
なお、第５図は、第３図（ｃ）で得られた段差下部の薄
膜パターンを正面から見た正断面図である。In the method shown in FIG. 3 among the above-mentioned conventional techniques, the thickness of the photosensitive resin film serving as the mask material is about 10 to 15 μm below the step.
Since it becomes thicker than m, the
The redeposition layer 35 shown in the figure is generated. There was a problem that the dimensional accuracy of the thin film 33 in the lower part of the step was deteriorated and the desired patterning shape could not be obtained.
Note that FIG. 5 is a front cross-sectional view of the thin film pattern under the step obtained in FIG. 3C as seen from the front.
また、第４図に示す方法では、マスク材となるアルミ
ナ膜の厚さが約２μｍと薄くできるためこのような再付
着層は発生しないものの、感光性樹脂膜の幅をアルミナ
膜に転写してから、さらに、これを目的とする薄膜に転
写してパターン形成するという二重の工程が必要であ
り、従つて、寸法精度が悪くなつてしまうという問題が
あつた。すなわち、第４図に示した方法ではパターン精
度は±0.8μｍが限界であり、±0.5μｍ以下の高精度な
パターンを得ることは困難であつた。Further, in the method shown in FIG. 4, since the thickness of the alumina film as the mask material can be reduced to about 2 μm, such a re-adhesion layer does not occur, but the width of the photosensitive resin film is transferred to the alumina film. Therefore, a double process of transferring this to a desired thin film and forming a pattern is required, and thus there is a problem that the dimensional accuracy deteriorates. That is, with the method shown in FIG. 4, the pattern accuracy is limited to ± 0.8 μm, and it is difficult to obtain a highly accurate pattern of ± 0.5 μm or less.
本発明の目的は、高精度なトラツク幅寸法をもつ薄膜
磁気ヘツドの製造方法を提供することにある。An object of the present invention is to provide a method of manufacturing a thin film magnetic head having a highly precise track width dimension.
上記目的は、絶縁膜段差のある基板上に上部磁性膜を
堆積した後、感光性樹脂膜を塗布・形成して露光する工
程において、高い寸法精度を必要とする段差下部と、そ
れ以外の段差上部とを別の工程でパターン作製し、段差
下部の感光性樹脂膜厚を薄くして、イオンミリング時の
再付着発生を防ぐこと、及び、この二つの工程で形成し
た感光性樹脂膜パターンに対して、紫外線、もしくは、
遠紫外光を照射して感光性樹脂を硬化させ、パターン形
成後の変形を防ぎ、高い寸法精度を保つことにより達成
される。The purpose of the above is to deposit a top magnetic film on a substrate having a step of an insulating film, and then apply / form a photosensitive resin film and expose it to expose the bottom part of the step and other steps that require high dimensional accuracy. The upper part and the upper part are patterned in different steps to reduce the thickness of the photosensitive resin film under the step to prevent re-adhesion from occurring during ion milling, and the photosensitive resin film pattern formed in these two steps On the other hand, ultraviolet rays, or
It is achieved by irradiating with far-ultraviolet light to cure the photosensitive resin, prevent deformation after pattern formation, and maintain high dimensional accuracy.
具体的な方法として、基板上に、下部磁性膜、ギャッ
プ膜、及び先端部に段差を持つ絶縁膜とをこの順に形成
し、その上部に上部磁性膜を形成した後に、該上部磁性
膜をパターニングする、薄膜磁気ヘッドの製造方法にお
いて、該上部磁性膜上に第１の感光性樹脂膜を塗布した
のち前記絶縁膜の前記段差の下方部分に位置する部分近
傍のみに第１の感光性樹脂膜パターンを形成する工程
と、前記第１の感光性樹脂膜パターンに紫外線もしくは
遠紫外線を照射して第１の感光性樹脂を硬化する工程
と、前記上部磁性膜上にさらに第２の感光性樹脂膜を塗
布したのち少なくとも前記第１の感光性樹脂膜パターン
の先端部が露出するように第２の感光性樹脂膜パターン
を形成する工程と、前記第２の感光性樹脂膜パターンに
紫外線もしくは遠紫外線を照射して第２の感光性樹脂を
硬化する工程と、前記第１及び第２の感光性樹脂膜パタ
ーンをマスク材として前記上部磁性膜をパターニングす
る工程とを含むよりにより達成され、それにより、イオ
ンミリング時に再付着が発生せず、かつ、段差下部でも
寸法精度の良いパターンの形成が可能となる。As a specific method, a lower magnetic film, a gap film, and an insulating film having a step at the tip are formed in this order on a substrate, an upper magnetic film is formed on the upper magnetic film, and then the upper magnetic film is patterned. In the method for manufacturing a thin film magnetic head, the first photosensitive resin film is applied to the upper magnetic film, and then the first photosensitive resin film is provided only in the vicinity of a portion of the insulating film located below the step. Forming a pattern, irradiating the first photosensitive resin film pattern with ultraviolet rays or deep ultraviolet rays to cure the first photosensitive resin, and further forming a second photosensitive resin on the upper magnetic film. Forming a second photosensitive resin film pattern so that at least a tip portion of the first photosensitive resin film pattern is exposed after applying the film; UV rays And a step of patterning the upper magnetic film by using the first and second photosensitive resin film patterns as a mask material to thereby cure the second photosensitive resin. Reattachment does not occur during ion milling, and a pattern with high dimensional accuracy can be formed even under the step.
これら、二つの感光性樹脂パターンの形成順序は段差
下部、段差上部のいずれを先に形成しても問題ないが、
段差下部の膜厚をできるだけ薄くするためには、まず、
段差下部のパターンを形成した後で段差上部のパターン
を形成するのが望ましい。また、二つの感光性樹脂パタ
ーンを形成するには、感光性樹脂を重ね塗りする必要が
あるが、この時、最初に形成したパターンが感光性樹脂
溶媒に溶解して変形してしまうことを防ぎ、さらに、イ
オンミリング時のエツチング速度を遅くしたり、感光性
樹脂パターン形状の経時変化を防ぐために、感光性樹脂
パターンに遠紫外光等のエネルギー線を照射して樹脂を
硬化させる手法が有効である。この遠紫外光の照射は、
樹脂の硬化を効率良く進めるために、50〜120℃に加熱
しながら実施するのが望ましく、また、1Torr以下の真
空中で照射するのが有効である。The order of forming these two photosensitive resin patterns does not matter whether the lower part of the step or the upper part of the step is formed first.
To make the film thickness under the step as thin as possible, first,
It is desirable to form the pattern above the step after forming the pattern below the step. In addition, in order to form two photosensitive resin patterns, it is necessary to coat the photosensitive resin again, but at this time, it is necessary to prevent the first formed pattern from being dissolved and deformed in the photosensitive resin solvent. Moreover, in order to slow down the etching speed during ion milling and prevent the photosensitive resin pattern shape from changing with time, it is effective to cure the resin by irradiating the photosensitive resin pattern with energy rays such as far-ultraviolet light. is there. The irradiation of this far-ultraviolet light is
In order to efficiently proceed the curing of the resin, it is desirable to carry out the heating while heating at 50 to 120 ° C., and it is effective to irradiate in a vacuum of 1 Torr or less.
一方、イオンミリング時の再付着を防ぐために、感光
性樹脂パターンに100〜150℃の熱処理を施して、パター
ン側面のテーパ角度を小さくしても良い。On the other hand, in order to prevent reattachment during ion milling, the photosensitive resin pattern may be heat-treated at 100 to 150 ° C. to reduce the taper angle of the pattern side surface.
この手段を適用することにより、段差下部でも薄い感
光性樹脂膜をマスク材として、上部磁性膜をイオンミリ
ングすることが可能となるため、再付着層の発生が無く
なる。By applying this means, it is possible to ion mill the upper magnetic film using the thin photosensitive resin film as a mask material even under the step, so that the redeposition layer does not occur.
また、薄い感光性樹脂膜パターンの幅をそのまま上部
磁性膜に転写できるため、絶縁膜段差下部でも高い寸法
精度が実現でき、トラツク幅の作成精度が向上する。Further, since the width of the thin photosensitive resin film pattern can be transferred as it is to the upper magnetic film, high dimensional accuracy can be realized even under the step of the insulating film, and the track width creation accuracy is improved.
一方、段差上部でも、イオンミリング時のマスク材と
して充分な厚さを持つ感光性樹脂パターンが得られるた
め、膜減りやパターン欠けの無い高精度な磁性膜パター
ンが得られる。On the other hand, since a photosensitive resin pattern having a sufficient thickness as a mask material at the time of ion milling can be obtained even at the upper part of the step, a highly accurate magnetic film pattern without film loss or pattern chipping can be obtained.
また、感光性樹脂膜パターンに対して遠紫外線等のエ
ネルギー線を照射することによつて、パターン形状が安
定化し、樹脂を重ね塗りしたり、イオンミリングを施し
たりしても高い寸法精度が保たれる。Further, by irradiating the photosensitive resin film pattern with energy rays such as deep ultraviolet rays, the pattern shape is stabilized, and high dimensional accuracy is maintained even if the resin is overcoated or ion milled. Be drunk
以下、本発明の一実施例を第１図を用いて説明する。
第１図は、本発明を適用した薄膜磁気ヘツドの製造方法
を表わす側断面図である。An embodiment of the present invention will be described below with reference to FIG.
FIG. 1 is a side sectional view showing a method of manufacturing a thin film magnetic head to which the present invention is applied.
まず、第１図（ａ）に示すように、セラミツク基板11
上に、下部磁性膜12,ギヤツプ膜13,絶縁膜14、及び、導
体コイル15を形成した後、上部磁性膜16をスパツタリン
グした。次いで、第１図（ｂ）に示すように、ポジ型ホ
トレジスト17を薄く塗布し、主として段差下部にのみホ
トレジストが残存するように、パターン形成した。この
時、段差下部のホトレジスト厚さは３μｍとなつた。こ
のホトレジストパターン17に対して、0.2Torrの真空中
でセラミツク基板11を90℃に加熱しながら、照度25mw/c
m2の遠紫外光を３分間照射し、樹脂を硬化させた。次い
で、第１図（ｃ）に示すように、ポジ型ホトレジスト18
を厚く塗布した。この時、先に形成したホトレジストパ
ターン17は遠紫外光処理によつて硬化しているため、重
ね塗りしたホトレジスト18の溶媒に溶けず、パターン形
状の変化は認められなかつた。次いで、第１図（ｄ）に
示すように、主として段差上部にのみホトレジスト18が
残存するように露光してパターンを形成した後、0.5Tor
rの真空中で基板11を90℃に加熱しながら、照度25mw/cm
2の遠紫外線で４分間照射し、樹脂を硬化させた。次い
で、第１図（ｅ）に示すようにホトレジスト17及び18を
マスク材として、イオンミリング法により上部磁性膜16
をパターニングして、目的とする形状を得た。この時、
マスク材として用いたホトレジスト17、及び、18の厚さ
が薄いため、再付着は発生しなかつた。First, as shown in FIG. 1 (a), the ceramic substrate 11
After forming the lower magnetic film 12, the gap film 13, the insulating film 14, and the conductor coil 15 on the upper part, the upper magnetic film 16 was sputtered. Then, as shown in FIG. 1 (b), a positive photoresist 17 was applied thinly, and a pattern was formed so that the photoresist remained mainly only under the step. At this time, the photoresist thickness under the step was 3 μm. With respect to this photoresist pattern 17, while heating the ceramic substrate 11 to 90 ° C. in a vacuum of 0.2 Torr, an illuminance of 25 mw / c
The resin was cured by irradiating m 2 far ultraviolet light for 3 minutes. Then, as shown in FIG. 1 (c), a positive photoresist 18
Was applied thickly. At this time, since the photoresist pattern 17 previously formed was hardened by the deep-ultraviolet light treatment, it did not dissolve in the solvent of the overcoated photoresist 18, and no change in the pattern shape was observed. Then, as shown in FIG. 1 (d), a pattern is formed by exposing the photoresist 18 so that the photoresist 18 remains only above the step, and then 0.5Tor
Illuminance 25mw / cm while heating the substrate 11 to 90 ℃ in a vacuum of r
The resin was cured by irradiation with 2 deep UV rays for 4 minutes. Then, as shown in FIG. 1E, the upper magnetic film 16 is formed by ion milling using the photoresists 17 and 18 as mask materials.
Was patterned to obtain a desired shape. This time,
Re-deposition did not occur because the photoresists 17 and 18 used as the mask material were thin.
また、ホトレジスト17及び18の両方とも遠紫外線光処
理によって硬化しているため、イオンミリング速度が遅
くなって、磁気コアパターンの高い寸法精度を保つこと
ができた。Further, since both the photoresists 17 and 18 are hardened by the deep UV light treatment, the ion milling speed is slowed down, and the high dimensional accuracy of the magnetic core pattern can be maintained.
本発明の別の実施例を、第７図を用いて説明する。第
７図は、本発明を適用した薄膜磁気ヘッドの製造方法を
表す側断面図である。Another embodiment of the present invention will be described with reference to FIG. FIG. 7 is a side sectional view showing a method of manufacturing a thin film magnetic head to which the present invention is applied.
まず、第７図（ａ）に示すように、セラミック基板11
上に、下部磁性膜12、ギャップ膜13、絶縁膜14、及び導
体コイル15を形成した後、上部磁性膜16をスパッタリン
グした。次いで、第７図（ｂ）に示すように、ポジ型ホ
トレジスト77を厚く塗布し、主として段差上部にのみホ
トレジストが残存するように、パターンを形成した。こ
の時、段差上部のホトレジスト厚さは４μｍとなった。
このホトレジストパターンに対して、0.5Torrの真空中
でセラセミック基板11を90℃に加熱しながら、照度25mw
/cm2の遠紫外線で４分間照射し、樹脂を硬化させた。次
いで、第７図（ｃ）に示すように、ポジ型ホトレジスト
78を薄く塗布した。この時、先に形成したホトレジスト
パターン77は遠紫外線光処理によって硬化しているた
め、重ね塗りしたホトレジスト78の溶媒に溶けず、パタ
ーン形状の変化は認められなかった。次いで、第７図
（ｄ）に示すように、主として段差下部にのみホトレジ
スト78が残存するように露光してパターンを形成した
後、0.2Torrの真空中でセラミック基板11を90℃に加熱
しながら、照度25mw/cm2の遠紫外線を３分間照射し、樹
脂を硬化させた。次いで、第７図（ｅ）に示すように、
ホトレジスト77と78をマスク材として、イオンミリング
法により上部磁性膜16をパターンニングして、目的とす
る形状を得た。この時、マスク材として用いたホトレジ
スト77及び78の厚さが薄いため、再付着は発生しなかっ
た。また、ホトレジスト77及び78の両方とも遠紫外線光
処理によって硬化しているため、イオンミリング速度が
遅くなって、磁気コアパターンの高い寸法精度を保つこ
とができた。First, as shown in FIG. 7 (a), the ceramic substrate 11
After forming the lower magnetic film 12, the gap film 13, the insulating film 14, and the conductor coil 15 on the upper surface, the upper magnetic film 16 was sputtered. Then, as shown in FIG. 7 (b), a positive photoresist 77 was applied thickly to form a pattern so that the photoresist remained mainly only on the steps. At this time, the photoresist thickness above the step was 4 μm.
With respect to this photoresist pattern, while the ceramic substrate 11 is heated to 90 ° C. in a vacuum of 0.5 Torr, the illuminance is 25 mw.
The resin was cured by irradiating with deep ultraviolet rays of / cm 2 for 4 minutes. Then, as shown in FIG. 7 (c), a positive photoresist
78 was applied thinly. At this time, since the photoresist pattern 77 previously formed was hardened by the deep ultraviolet ray treatment, it was not dissolved in the solvent of the overcoated photoresist 78, and no change in the pattern shape was observed. Then, as shown in FIG. 7 (d), a pattern is formed by exposing the photoresist 78 so that the photoresist 78 remains only under the step, and then the ceramic substrate 11 is heated to 90 ° C. in a vacuum of 0.2 Torr. The resin was cured by irradiating deep ultraviolet rays with an illuminance of 25 mw / cm 2 for 3 minutes. Then, as shown in FIG. 7 (e),
Using the photoresists 77 and 78 as mask materials, the upper magnetic film 16 was patterned by the ion milling method to obtain the target shape. At this time, re-deposition did not occur because the photoresists 77 and 78 used as the mask material were thin. Further, since both the photoresists 77 and 78 are hardened by the deep UV light treatment, the ion milling speed was slowed down, and the high dimensional accuracy of the magnetic core pattern could be maintained.
第６図に、本発明の方法を用いて、トラツク幅10μｍ
の薄膜磁気ヘツドを作製した時の、トラツク幅寸法のば
らつき（ｂ）を従来法（ａ）と比較して示す。本実施例
によれば従来は困難であつたトラツク幅寸法のばらつき
の±0.5μｍ以内の精度が実現できることがわかつた。FIG. 6 shows a track width of 10 μm using the method of the present invention.
The variation (b) in the track width dimension when the thin film magnetic head of (1) is manufactured is shown in comparison with the conventional method (a). It has been found that according to this embodiment, it is possible to realize the accuracy within ± 0.5 μm of the variation in the track width dimension, which has been difficult in the past.
また、あらかじめ形成した感光性樹脂パターンを遠紫
外光を照射して硬化させることにより、さらに、その上
部に感光性樹脂を重ね塗りしてもパターンの変形が無
く、高い寸法精度が保たれる。Further, by irradiating the photosensitive resin pattern formed in advance with far-ultraviolet light and curing it, the photosensitive resin pattern is not deformed even if the photosensitive resin is overcoated thereon, and high dimensional accuracy is maintained.
本発明によれば、トラツク幅寸法のばらつきが小さ
く、かつ、再付着の無いパターンが形成できる。According to the present invention, it is possible to form a pattern in which variations in the track width dimension are small and no reattachment occurs.
第１図（ａ）〜（ｅ）は、本発明の一実施例としての製
造方法を示す側断面図、第２図は、薄膜磁気ヘツドの製
造を示す側断面図、第３図（ａ）〜（ｃ）及び第４図
（ａ）〜（ｄ）は、従来の製造方法を示す側断面図、第
５図は、第３図（ｃ）で得られた薄膜パターンの正断面
図、第６図（ａ），（ｂ）は、トラツク幅寸法のばらつ
きを示したグラフ、第７図（ａ）〜（ｅ）は、本発明の
他の実施例としての製造方法を示す側断面図である。 11……セラミツク基板、12……下部磁性膜、13……ギヤ
ツプ膜、14……絶縁膜、15……導体コイル、16……上部
磁性膜、17,18……ホトレジスト。1 (a) to (e) are side sectional views showing a manufacturing method as one embodiment of the present invention, FIG. 2 is a side sectional view showing the manufacturing of a thin film magnetic head, and FIG. 3 (a). -(C) and FIGS. 4 (a)-(d) are side sectional views showing a conventional manufacturing method, and FIG. 5 is a front sectional view of the thin film pattern obtained in FIG. 3 (c). 6 (a) and 6 (b) are graphs showing variations in track width dimension, and FIGS. 7 (a) to 7 (e) are side sectional views showing a manufacturing method as another embodiment of the present invention. is there. 11 …… ceramic substrate, 12 …… lower magnetic film, 13 …… gear film, 14 …… insulating film, 15 …… conductor coil, 16 …… upper magnetic film, 17,18 …… photoresist.
フロントページの続き (72)発明者 芦田 栄次 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 森尻 誠 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 成重 真治 茨城県日立市久慈町4026番地 株式会社日 立製作所日立研究所内 (72)発明者 池田 宏 神奈川県小田原市国府津2880番地 株式会 社日立製作所小田原工場内Front Page Continuation (72) Inventor Eiji Ashida 4026 Kujimachi, Hitachi City, Hitachi, Ibaraki Prefecture, Hitachi Research Laboratory, Ltd. (72) Inventor Shinji Shigeshi 4026 Kujimachi, Hitachi City, Ibaraki Prefecture Hitachi Research Laboratory, Hitachi Ltd. (72) Inventor Hiroshi Ikeda 2880 Kozu, Odawara City, Kanagawa Prefecture
Claims (2)
先端部に段差を持つ絶縁膜とをこの順に形成し、その上
部に上部磁性膜を形成した後に、該上部磁性膜をパター
ニングする、薄膜磁気ヘッドの製造方法であって、 上部磁性膜上に第１の感光性樹脂膜を塗布したのち前記
絶縁膜の前記段差の下方部分に位置する部分近傍のみに
第１の感光性樹脂膜パターンを形成する工程、 前記第１の感光性樹脂膜パターンに紫外線もしくは遠紫
外線を照射して第１の感光性樹脂を硬化する工程、 前記上部磁性膜上にさらに第２の感光性樹脂膜を塗布し
たのち少なくとも前記第１の感光性樹脂膜パターンの先
端部が露出するように第２の感光性樹脂膜パターンを形
成する工程、 前記第２の感光性樹脂膜パターンに紫外線もしくは遠紫
外線を照射して第２の感光性樹脂を硬化する工程、及
び、 前記第１及び第２の感光性樹脂膜パターンをマスク材と
して前記上部磁性膜をパターニングする工程、 とをさらに有することを特徴とする、薄膜磁気ヘッドの
製造方法。1. A lower magnetic film, a gap film, and an insulating film having a step at the tip are formed in this order on a substrate, an upper magnetic film is formed on the upper part of the insulating film, and then the upper magnetic film is patterned. A method of manufacturing a thin film magnetic head, comprising: applying a first photosensitive resin film on an upper magnetic film, and then forming a first photosensitive resin film only near a portion of the insulating film located below the step. Forming a pattern, irradiating the first photosensitive resin film pattern with ultraviolet rays or deep ultraviolet rays to cure the first photosensitive resin, and further forming a second photosensitive resin film on the upper magnetic film. A step of forming a second photosensitive resin film pattern so that at least a tip portion of the first photosensitive resin film pattern is exposed after coating, and the second photosensitive resin film pattern is irradiated with ultraviolet rays or far ultraviolet rays. Then second A step of curing the photosensitive resin, and a step of patterning the upper magnetic film using the first and second photosensitive resin film patterns as a mask material. Production method.
に紫外線もしくは遠紫外線を照射して第１及び第２の感
光性樹脂を硬化する工程を、1Torr以下の真空中で施す
ことを特徴とする、特許請求の範囲第１項記載の薄膜磁
気ヘッドの製造方法。2. A step of irradiating the first and second photosensitive resin film patterns with ultraviolet rays or deep ultraviolet rays to cure the first and second photosensitive resins is performed in a vacuum of 1 Torr or less. A method of manufacturing a thin-film magnetic head according to claim 1, characterized in that:
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237588A JPH0810483B2 (en) | 1988-09-07 | 1988-09-07 | Method of manufacturing thin film magnetic head |
| US07/280,828 US4971896A (en) | 1987-12-08 | 1988-12-07 | Method for forming thin film pattern and method for fabricating thin film magnetic head using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22237588A JPH0810483B2 (en) | 1988-09-07 | 1988-09-07 | Method of manufacturing thin film magnetic head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0271412A JPH0271412A (en) | 1990-03-12 |
| JPH0810483B2 true JPH0810483B2 (en) | 1996-01-31 |
Family
ID=16781370
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22237588A Expired - Lifetime JPH0810483B2 (en) | 1987-12-08 | 1988-09-07 | Method of manufacturing thin film magnetic head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810483B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103485231A (en) * | 2013-10-10 | 2014-01-01 | 刘同烟 | Special papermaking device for producing mulberry paper according to traditional technology |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5254373A (en) * | 1993-04-19 | 1993-10-19 | Read-Rite Corp. | Process of making thin film magnetic head |
-
1988
- 1988-09-07 JP JP22237588A patent/JPH0810483B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103485231A (en) * | 2013-10-10 | 2014-01-01 | 刘同烟 | Special papermaking device for producing mulberry paper according to traditional technology |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0271412A (en) | 1990-03-12 |
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