JPH08100250A - Surface treatment of copper member - Google Patents

Surface treatment of copper member

Info

Publication number
JPH08100250A
JPH08100250A JP23703494A JP23703494A JPH08100250A JP H08100250 A JPH08100250 A JP H08100250A JP 23703494 A JP23703494 A JP 23703494A JP 23703494 A JP23703494 A JP 23703494A JP H08100250 A JPH08100250 A JP H08100250A
Authority
JP
Japan
Prior art keywords
copper
copper member
oxygen
surface treatment
pitting corrosion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP23703494A
Other languages
Japanese (ja)
Inventor
Shoei Hirano
昭英 平野
Shozo Nishikawa
正三 西川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to JP23703494A priority Critical patent/JPH08100250A/en
Publication of JPH08100250A publication Critical patent/JPH08100250A/en
Pending legal-status Critical Current

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  • Preventing Corrosion Or Incrustation Of Metals (AREA)

Abstract

PURPOSE: To suppress the rise of natural potential and to prevent pitting corrosion by forming an oxidized coating film on a copper member by oxidation under heating in an oxygen-contg. atmosphere. CONSTITUTION: A copper member such as a copper tube is heated in an oxygen- contg. atmosphere such as air to form a corrosion resistant oxidized coating film of about 10-500nm thickness on the surface of the copper member. Since this oxidized coating film formed by surface treatment acts as a barrier to electronic conduction, even when an active oxygen producing field is formed, a cathode reaction is not accelerated, the rise of natural potential does not occur and pitting corrosion is prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は銅製部材の表面処理方法
に係り、特に、銅管等の表面に良好な耐食性酸化皮膜を
形成してその孔食を防止する銅製部材の表面処理方法に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface treatment method for a copper member, and more particularly to a surface treatment method for a copper member which forms a good corrosion resistant oxide film on the surface of a copper pipe or the like to prevent pitting corrosion.

【0002】[0002]

【従来の技術】銅管は、給水・給湯管などの配管の他、
空調機器や熱交換器などの伝熱管などに広く使用されて
いる。このような用途に用いられる銅管は、一般に、製
造工程の最終段階において、還元雰囲気で光輝焼鈍が行
われた後、製品として出荷されている。この光輝焼鈍に
より、製品銅管は美麗な金属光沢を示すが、表面の酸化
皮膜は極めて薄い状態とされている。
2. Description of the Related Art Copper pipes are used in addition to water and hot water supply pipes,
Widely used for heat transfer tubes such as air conditioners and heat exchangers. Copper tubes used for such purposes are generally shipped as products after bright annealing is performed in a reducing atmosphere in the final stage of the manufacturing process. Due to this bright annealing, the product copper tube has a beautiful metallic luster, but the oxide film on the surface is in an extremely thin state.

【0003】[0003]

【発明が解決しようとする課題】このような銅管を給水
・給湯管などの配管や伝熱管などに使用した場合、孔食
による漏洩を起こすことがある。
When such a copper pipe is used for pipes such as water supply pipes and hot water supply pipes and heat transfer pipes, leakage due to pitting corrosion may occur.

【0004】従来、銅管の孔食については、銅管の自然
電位が臨界値(銀・塩化銀照合電極基準で190mV)
を超えると孔食に到ることが知られているが、本発明者
らが、従来の銅管について、孔食を起こす要因を、材料
面から研究した結果、従来提供されている銅管は容易に
自然電位が臨界値を超えて孔食を引き起こすことがある
ことを知見した。
Conventionally, regarding the pitting corrosion of the copper tube, the natural potential of the copper tube is a critical value (190 mV based on the silver / silver chloride reference electrode).
Although it is known that pitting corrosion occurs when the value exceeds the above, the inventors of the present invention have studied the factors that cause pitting corrosion in the conventional copper pipes from the viewpoint of materials, and as a result, the copper pipes conventionally provided are We found that the spontaneous potential could easily exceed the critical value and cause pitting corrosion.

【0005】本発明は上記従来の問題点を解決し、銅管
の耐孔食性を著しく改善することができる銅製部材の表
面処理方法を提供することを目的とする。
An object of the present invention is to solve the above-mentioned conventional problems and to provide a surface treatment method for a copper member which can remarkably improve the pitting corrosion resistance of a copper pipe.

【0006】[0006]

【課題を解決するための手段】請求項1の銅製部材の表
面処理方法は、銅製部材を酸素含有雰囲気中で加熱する
ことにより、該銅製部材表面に耐食性酸化皮膜を形成す
ることを特徴とする。
According to a first aspect of the present invention, there is provided a surface treatment method for a copper member, wherein a copper member is heated in an oxygen-containing atmosphere to form a corrosion resistant oxide film on the surface of the copper member. .

【0007】請求項2の銅製部材の表面処理方法は、請
求項1の方法において、形成される酸化皮膜の厚さが1
0〜500nmであることを特徴とする。
According to a second aspect of the present invention, there is provided a surface treatment method for a copper member, wherein the oxide film formed has a thickness of 1
It is characterized in that it is 0 to 500 nm.

【0008】以下に本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.

【0009】本発明においては、銅管等の銅製部材を空
気、酸素富化空気或いは酸素雰囲気等の酸素含有雰囲気
中、好適には空気中で加熱することにより表面を酸化し
て、表面に耐食性酸化皮膜を形成する。酸化皮膜の厚さ
は10〜500nm、好ましくは20〜100nm程度
とする。
In the present invention, a copper member such as a copper pipe is heated in an oxygen-containing atmosphere such as air, oxygen-enriched air, or oxygen atmosphere, preferably in air, to oxidize the surface and to corrode the surface. Form an oxide film. The thickness of the oxide film is 10 to 500 nm, preferably about 20 to 100 nm.

【0010】この皮膜を形成させるための加熱温度は、
低過ぎると、耐食性酸化皮膜が十分に形成されず、孔食
の防止効果が低いものとなる。加熱温度は過度に高くて
も耐食性酸化皮膜の形成効率に大差はなく、徒らに加熱
コストが高騰する上に、銅製部材に悪影響を及ぼす可能
性もある。このため、加熱温度は40〜400℃の範囲
とするのが好ましい。
The heating temperature for forming this film is
If it is too low, the corrosion resistant oxide film is not sufficiently formed and the effect of preventing pitting corrosion becomes low. Even if the heating temperature is excessively high, there is no great difference in the formation efficiency of the corrosion-resistant oxide film, and the heating cost is unnecessarily increased, and the copper member may be adversely affected. Therefore, the heating temperature is preferably in the range of 40 to 400 ° C.

【0011】より好適な加熱温度は加熱時間や雰囲気中
の酸素濃度、処理する銅製部材の大きさや形状、要求さ
れる耐孔食性の程度によっても異なるが、本発明によ
り、通常の給水・給湯管などの配管或いは空調機器や熱
交換器などの伝熱管に用いられる銅管の表面処理を行う
場合には、特に150〜350℃で0.2〜60分程度
空気中で加熱することにより、銅管表面に10〜500
nm、好ましくは20〜100nm程度の耐食性酸化皮
膜を形成するのが好ましい。
The more preferable heating temperature varies depending on the heating time, the oxygen concentration in the atmosphere, the size and shape of the copper member to be treated, and the required degree of pitting corrosion resistance. When performing the surface treatment of a copper pipe used for a pipe such as or a heat transfer pipe such as an air conditioner or a heat exchanger, by heating in air at 150 to 350 ° C for about 0.2 to 60 minutes, 10 to 500 on the tube surface
It is preferable to form a corrosion resistant oxide film having a thickness of about 20 nm, preferably about 20 to 100 nm.

【0012】このような本発明の銅製部材の表面処理方
法は、銅管に限らず、その他の銅製部材に有効に適用可
能である。
The surface treatment method for a copper member according to the present invention as described above can be effectively applied not only to copper pipes but also to other copper members.

【0013】[0013]

【作用】銅管等の銅製部材を酸素含有雰囲気中で加熱酸
化することにより、耐食性に優れた酸化皮膜を形成する
ことができ、この耐食性酸化皮膜により自然電位の上昇
を抑制して、孔食を防止することができる。
[Function] By heating and oxidizing a copper member such as a copper pipe in an oxygen-containing atmosphere, an oxide film having excellent corrosion resistance can be formed. This corrosion-resistant oxide film suppresses an increase in spontaneous potential, resulting in pitting corrosion. Can be prevented.

【0014】即ち、孔食の要因となる銅管等の銅製部材
の自然電位の上昇は、腐食反応の際、銅表面上で生じる
下記式で示されるカソード反応が促進される条件が成
立すると起こる。
That is, the increase in the natural potential of a copper member such as a copper pipe that causes pitting corrosion occurs when a condition for accelerating the cathodic reaction represented by the following formula that occurs on the copper surface during the corrosion reaction is established. .

【0015】 O2 +2H2 O+4e- → 4OH- … このカソード反応が促進される条件としては、微生物が
銅管表面に付着して活性酸素が生成する場が形成される
ことが挙げられる。
[0015] O 2 + 2H 2 O + 4e - → 4OH - ... As the conditions for the cathode reaction is accelerated, and that the place where microorganisms active oxygen generated by adhering to the copper tube surface.

【0016】しかし、厚い酸化皮膜は電子伝導のバリヤ
ーとなり、活性酸素生成の場が形成されても上記式の
カソード反応は促進されず、自然電位の上昇は起こらな
い。このため孔食が防止される。
However, the thick oxide film serves as a barrier for electron conduction, and even if a field for generating active oxygen is formed, the cathode reaction in the above formula is not promoted and the spontaneous potential does not rise. Therefore, pitting corrosion is prevented.

【0017】[0017]

【実施例】以下に実施例を挙げて本発明をより具体的に
説明する。
EXAMPLES The present invention will be described in more detail with reference to the following examples.

【0018】なお、実施例において用いた銅管テストピ
ースは次のNo. 1〜5であり、いずれも管内面を試験面
とし、その他の面はシリコン樹脂で被覆した。
The copper pipe test pieces used in the examples were Nos. 1 to 5 below, and the inner surface of the pipe was used as the test surface, and the other surfaces were coated with silicone resin.

【0019】No. 1:従来品(光輝焼鈍実施品) No. 2:空気雰囲気中、275℃で1分間加熱酸化した
もの No. 3:空気雰囲気中、275℃で2分間加熱酸化した
もの No. 4:空気雰囲気中、275℃で5分間加熱酸化した
もの No. 5:空気雰囲気中、275℃で60分間加熱酸化し
たもの なお、上記No. 2〜No. 5の銅管の加熱酸化で形成され
た酸化皮膜の厚さは、各々、No. 2:8nm,No. 3:
16nm,No. 4:40nm,No. 5:100nmであ
った。
No. 1: Conventional product (product subjected to bright annealing) No. 2: Heat-oxidized in air atmosphere at 275 ° C. for 1 minute No. 3: Heat-oxidized in air atmosphere at 275 ° C. for 2 minutes No .4: Heat-oxidized in air atmosphere at 275 ° C. for 5 minutes No. 5: Heat-oxidized in air atmosphere at 275 ° C. for 60 minutes In addition, in the above-mentioned heat oxidation of copper pipes No. 2 to No. The thickness of the oxide film formed is No. 2: 8 nm and No. 3:
It was 16 nm, No. 4:40 nm, and No. 5: 100 nm.

【0020】実施例1:活性酸素系での銅管の自然電位
上昇試験 酸化還元色素であるNBT(Nitro Blue Tetrazolium:
4030106 Cl2 =分子量817.65)を50
μM含むりん酸緩衝液(pH8.1)1リットルに、上
記No. 1〜4の銅管テストピースと照合電極(銀・塩化
銀電極)を各々浸漬して37℃に維持した。活性酸素は
キシロースを10g(1重量%)添加することにより発
生させて、自然電位の経時変化を測定し、結果を図1に
示した。
Example 1: Test for raising self-potential of copper tube in active oxygen system NBT (Nitro Blue Tetrazolium: redox dye:
C 40 H 30 N 10 O 6 Cl 2 = molecular weight 817.65) 50
The copper tube test pieces of Nos. 1 to 4 and the reference electrode (silver / silver chloride electrode) were immersed in 1 liter of a phosphate buffer (pH 8.1) containing μM and maintained at 37 ° C. Active oxygen was generated by adding 10 g (1% by weight) of xylose, and the change with time of the spontaneous potential was measured, and the results are shown in FIG.

【0021】図1より、No. 1の従来品は、自然電位が
速やかに上昇するが、加熱酸化を行うと自然電位の上昇
は抑制されることが明らかである。
From FIG. 1, it is clear that the conventional product of No. 1 has a rapid increase in the natural potential, but the increase in the natural potential is suppressed by the thermal oxidation.

【0022】実施例2:淡水系での銅管の自然電位上昇
試験 図2に示す通水試験装置のタンク1に試験水2として井
水を100リットル投入し、銅管テストピース3とし
て、前記No. 1,4,5を各々浸漬して試験水をポンプ
4で循環させた。照合電極5としては銀・塩化銀電極を
用い、電位差計6により自然電位の経時変化を測定し、
結果を図3に示した。なお、図2において、7は流量
計、8はバルブである。
Example 2: Self-potential rise test of copper pipe in fresh water system 100 liters of well water was added as test water 2 to tank 1 of the water flow test apparatus shown in FIG. The test water was circulated by the pump 4 by immersing each of Nos. 1, 4, and 5. A silver / silver chloride electrode is used as the reference electrode 5, and a change in spontaneous potential with time is measured by a potentiometer 6.
The results are shown in Fig. 3. In FIG. 2, 7 is a flow meter and 8 is a valve.

【0023】図3より、No. 1の従来品では自然電位が
臨界値(190mV)以上に上昇し孔食を生じるが、加
熱酸化を行うことにより自然電位の上昇は抑制され、孔
食は生じないことが明らかである。
As shown in FIG. 3, in the conventional product of No. 1, the spontaneous potential rises above the critical value (190 mV) to cause pitting corrosion. However, the thermal oxidation suppresses the increase in spontaneous potential and causes pitting corrosion. Clearly not.

【0024】[0024]

【発明の効果】以上詳述した通り、本発明の銅製部材の
表面処理方法によれば、酸素含有雰囲気で加熱するとい
う極めて簡便な処理により、銅管等の銅製部材の耐食性
を著しく高め、孔食を確実に防止することができる。
As described above in detail, according to the surface treatment method for a copper member of the present invention, the corrosion resistance of a copper member such as a copper pipe is remarkably enhanced by the extremely simple treatment of heating in an oxygen-containing atmosphere, Food can be surely prevented.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例1の結果を示すグラフである。FIG. 1 is a graph showing the results of Example 1.

【図2】実施例2で用いた試験装置を示す系統図であ
る。
FIG. 2 is a system diagram showing a test apparatus used in Example 2.

【図3】実施例2の結果を示すグラフである。FIG. 3 is a graph showing the results of Example 2.

【符号の説明】[Explanation of symbols]

1 タンク 3 銅管テストピース 5 照合電極 6 電位差計 1 Tank 3 Copper tube test piece 5 Reference electrode 6 Potentiometer

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 銅製部材を酸素含有雰囲気中で加熱する
ことにより、該銅製部材表面に耐食性酸化皮膜を形成す
ることを特徴とする銅製部材の表面処理方法。
1. A method for treating a surface of a copper member, which comprises forming a corrosion resistant oxide film on the surface of the copper member by heating the copper member in an oxygen-containing atmosphere.
【請求項2】 請求項1の方法において、形成される酸
化皮膜の厚さが10〜500nmであることを特徴とす
る銅製部材の表面処理方法。
2. The surface treatment method for a copper member according to claim 1, wherein the oxide film formed has a thickness of 10 to 500 nm.
JP23703494A 1994-09-30 1994-09-30 Surface treatment of copper member Pending JPH08100250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23703494A JPH08100250A (en) 1994-09-30 1994-09-30 Surface treatment of copper member

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23703494A JPH08100250A (en) 1994-09-30 1994-09-30 Surface treatment of copper member

Publications (1)

Publication Number Publication Date
JPH08100250A true JPH08100250A (en) 1996-04-16

Family

ID=17009423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23703494A Pending JPH08100250A (en) 1994-09-30 1994-09-30 Surface treatment of copper member

Country Status (1)

Country Link
JP (1) JPH08100250A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006194510A (en) * 2005-01-13 2006-07-27 Sumitomo Light Metal Ind Ltd Manufacturing method of copper heat transfer pipe for absorption refrigerating machine, and copper heat transfer pipe for absorption refrigerating machine provided by the manufacturing method
JP2007154221A (en) * 2005-11-30 2007-06-21 Kobelco & Materials Copper Tube Inc Pipe made from copper or copper alloy having pitting corrosion resistance

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006194510A (en) * 2005-01-13 2006-07-27 Sumitomo Light Metal Ind Ltd Manufacturing method of copper heat transfer pipe for absorption refrigerating machine, and copper heat transfer pipe for absorption refrigerating machine provided by the manufacturing method
JP2007154221A (en) * 2005-11-30 2007-06-21 Kobelco & Materials Copper Tube Inc Pipe made from copper or copper alloy having pitting corrosion resistance

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