JPH08100088A - Polypropylene resin composition - Google Patents

Abstract

PURPOSE: To obtain a propylene resin composition which stably exhibits a well- balanced combination of rigidity, high-temp. rigidity, and impact resistance by incorporating a specific amide compound into a polypropylene resin. CONSTITUTION: This resin composition comprises 100 pts.wt. polypropylene resin and preferably 0.001-10 pts.wt. amide compound represented by the formula R<2> -NHCO-R<1> -CONH-R<3> and having a maximum particle diameter of 50μm or smaller. In the formula, R<1> is a residue of a 3-28C aliphatic or a 6-28C aromatic dicarboxylic acid, and R<2> and R<3> may be the same or different and each is a 3-18C cycloalkyl or a group represented by formula I, II, III, or IV (wherein R<4> and R<5> each is a 1-12C linear or branched alkyl, a 6-12C cycloalkyl, or phenyl, and R<6> and R<7> each is a 1-4C linear or branched alkylene group).

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to a polypropylene resin composition having excellent rigidity, heat resistance and impact resistance.

[0002]

2. Description of the Related Art Polypropylene resins have excellent moldability, mechanical properties, electrical properties, etc., and are therefore used in various fields as raw materials for film molding, sheet molding, blow molding, injection molding and the like. ing.

However, in recent years, the demands for heat resistance and mechanical properties have become more and more strict with the widespread use thereof. In particular, under the present circumstances, there is an increasing demand for improvement in the balance of the contradictory properties of rigidity, heat resistance and impact resistance.

The present inventors have previously proposed that a product containing a large amount of β-crystalline polypropylene can be efficiently obtained by blending an amide compound having a specific structure, and at the same time, the polypropylene-based compound can be obtained. It was also shown that the resin composition greatly contributes to the improvement of impact resistance (JP-A-5-262936).

As a result of further studies on the effect of the polypropylene resin composition, the present inventors have found that the polypropylene resin composition has not only impact resistance but also rigidity,
It has been found that it has excellent heat resistance and rigidity and can solve the above problems. However, there is a large variation in the impact strength, which is a big obstacle to practical use.

An object of the present invention is to provide a polypropylene resin composition capable of exhibiting the properties of rigidity, heat resistance and impact resistance in a well-balanced and stable manner.

[0007]

Means for Solving the Problems As a result of intensive studies to solve the above problems, the present inventors have found the following facts, and have completed the present invention based on such findings.
That is,

(1) The above-mentioned variation in impact strength results from the undispersed amide compound remaining in the resin composition.

(2) The undispersed substance is reduced by blending the amide compound in which the particle size characteristics of the amide compound, particularly the maximum particle size, is controlled within a predetermined range, and the intended purpose is achieved. obtain.

That is, the polypropylene resin composition according to the present invention is a polypropylene resin composition containing an amide compound represented by the general formula (1), wherein the maximum particle size of the amide compound is 50 μm or less. It is characterized by being.

R ² —NHCO—R ¹ —CONH—R ³ (1) [wherein, R ¹ is an alicyclic group having 3 to 28 carbon atoms or 6 to 6 carbon atoms]
28 represents an aromatic dicarboxylic acid residue, R ² and R ³ are the same or different, and are a cycloalkyl group having 3 to 18 carbon atoms,
It represents a group represented by the general formula (2), the general formula (3), the general formula (4) or the general formula (5). ]

[0012] [In the formula, R ⁴ represents a linear or branched alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 6 to 12 carbon atoms, or phenyl. ]

[0013] [In formula, R < ⁵ > is synonymous with R < ⁴ > in General formula (2). ]

[0014] [In the formula, R ⁶ represents a linear or branched alkylene group having 1 to 4 carbon atoms. ]

[0015] [In the formula, R ⁷ has the same meaning as R ⁶ in formula (4). ]

The amide compound represented by the general formula (1) is easily prepared by amidating a predetermined alicyclic or aromatic dicarboxylic acid and a predetermined alicyclic or aromatic monoamine. be able to.

Specific examples of the alicyclic dicarboxylic acid include 1,2-cyclohexanedicarboxylic acid, 1,4-cyclohexanedicarboxylic acid and 1,4-cyclohexanediacetic acid.

Specific examples of the aromatic dicarboxylic acid include p-phenylenediacetic acid, p-phenylenediethanoic acid, phthalic acid, 4-tert-butylphthalic acid, isophthalic acid, 5-tert-butylisophthalic acid and terephthalic acid. acid,
1,8-naphthalic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, diphenic acid, 3,3′-biphenyldicarboxylic acid, 4,4′-biphenyldicarboxylic acid acid,
4,4′-binaphthyldicarboxylic acid, bis (3-carboxyphenyl) methane, bis (4-carboxyphenyl) methane, 2,2-bis (3-carboxyphenyl)
Propane, 2,2-bis (4-carboxyphenyl) propane, 3,3'-sulfonyldibenzoic acid, 4,4'-
Sulfonyldibenzoic acid, 3,3′-oxydibenzoic acid,
4,4'-oxydibenzoic acid, 3,3'-carbonyldibenzoic acid, 4,4'-carbonyldibenzoic acid, 3,3 '
-Thiodibenzoic acid, 4,4'-thiodibenzoic acid, 4,
4 '-(p-phenylenedioxy) dibenzoic acid, 4,
Examples thereof include aromatic dibasic acids such as 4'-isophthaloyldibenzoic acid, 4,4'-terephthaloyldibenzoic acid, and dithiosalicylic acid.

Specific examples of the alicyclic monoamine include cyclopropylamine, cyclobutylamine, cyclopentylamine, cyclohexylamine, 2-methylcyclohexylamine, 3-methylcyclohexylamine, 4-methylcyclohexylamine and 2-ethylcyclohexyl. Amine, 4-ethylcyclohexylamine,
2-propylcyclohexylamine, 2-isopropylcyclohexylamine, 4-propylcyclohexylamine, 4-isopropylcyclohexylamine, 2-te
rt-Butylcyclohexylamine, 4-n-butylcyclohexylamine, 4-isobutylcyclohexylamine, 4-sec-butylcyclohexylamine, 4-tert
-Butylcyclohexylamine, 4-n-amylcyclohexylamine, 4-isoamylcyclohexylamine, 4-sec-amylcyclohexylamine, 4-tert
-Amylcyclohexylamine, 4-hexylcyclohexylamine, 4-heptylcyclohexylamine, 4
-Octylcyclohexylamine, 4-nonylcyclohexylamine, 4-decylcyclohexylamine, 4-
Undecylcyclohexylamine, 4-dodecylcyclohexylamine, 4-cyclohexylcyclohexylamine, 4-phenylcyclohexylamine, cycloheptylamine, cyclododecylamine, cyclohexylmethylamine, α-cyclohexylethylamine, β-cyclohexylethylamine, α-cyclohexylpropylamine , Β-cyclohexylpropylamine and γ-cyclohexylpropylamine are exemplified.

As the aromatic monoamine, more specifically, aniline, o-toluidine, m-toluidine, p-
Toluidine, o-ethylaniline, p-ethylaniline, o-propylaniline, m-propylaniline, p
-Propylaniline, o-cumidine, m-cumidine, p
-Cumidine, o-tert-butylaniline, pn-butylaniline, p-isobutylaniline, p-sec-butylaniline, p-tert-butylaniline, pn-amylaniline, p-isoamylaniline, p- sec-amylaniline, p-tert-amylaniline, p-hexylaniline, p-heptylaniline, p-octylaniline, p-nonylaniline, p-decylaniline, p-undecylaniline, p-dodecylaniline, p- Cyclohexylaniline, o-aminodiphenyl, m-aminodiphenyl, p-aminodiphenyl, p-aminostyrene, benzylamine, α-phenylethylamine, β-
Phenylethylamine, α-phenylpropylamine,
Examples include β-phenylpropylamine and γ-phenylpropylamine.

The maximum particle size of the amide compound according to the present invention is 50 μm or less, more preferably 10 μm or less. When the maximum particle size exceeds 50 μm, undispersed substances are recognized in the molded product, and it is difficult to stably obtain the effects of the present invention. As the maximum particle size becomes smaller, impact resistance and rigidity of the obtained molded product tend to be improved, and the above tendency is remarkable especially when the maximum particle size is 5 μm or less. The maximum particle size is a value measured based on the diffraction method.

The particle size characteristics of the amide compound according to the present invention include the average particle size in addition to the maximum particle size. That is, the maximum particle size is controlled within the above range, and the average particle size is 0.5 to
By applying the amide compound adjusted to 10 μm, particularly 1 to 5 μm, more stable and excellent effects specific to the present invention can be obtained.

As a method of adjusting the particle size characteristics of the amide compound to the above range, a method of finely pulverizing using a predetermined device and classifying the fine particles is proposed. Specifically, a fluidized bed type counter jet mill 100AFG (trade name, manufactured by Hosokawa Micron Corporation) and a supersonic jet mill PJM-200.
A method of finely pulverizing and classifying using (trade name, manufactured by Nippon Pneumatic Co., Ltd.) is exemplified.

As a method of blending the amide compound with the polypropylene resin, a method of blending at the time of polymerization,
Any method of adding and mixing to a separately prepared polymer can be applied.

The amount of the amide compound to be applied is recommended to be 0.001 to 10 parts by weight, more preferably 0.01 to 1 part by weight, based on 100 parts by weight of polypropylene. If it is less than 0.001 part by weight, it is difficult to obtain a predetermined effect, and if it exceeds 10 parts by weight, no significant difference in effect is observed and it is economically disadvantageous, which is not preferable.

The polypropylene resin according to the present invention is
A polymer having propylene as a main constituent, specifically, polypropylene homopolymer, propylene-ethylene random copolymer mainly containing propylene, propylene-ethylene block copolymer, and the polypropylene resin and a small amount of thermoplastic resin. , For example, high density polyethylene, polybutene-1, poly-4-
Examples include blend polymers with methylpentene-1.

As the catalyst applied for producing such a polymer, not only the generally used Ziegler-Natta type catalyst but also transition metal compounds (for example, titanium halides such as titanium trichloride and titanium tetrachloride) are used. It is also possible to use a catalyst system in which a catalyst in which (1) is supported on a carrier containing magnesium halide such as magnesium chloride as a main component is combined with an alkylaluminum compound (triethylaluminum, diethylaluminum chloride, etc.).

Melt flow rate of crystalline polypropylene resin component (hereinafter abbreviated as "MFR". JIS K 6758
-1981) is appropriately selected depending on the molding method applied, and is usually about 0.1 to 100 g / 10 minutes, preferably about 0.5 to 50 g / 10 minutes.

Further, a conventionally known modifier for polyolefin can be added to the polypropylene resin composition according to the present invention as appropriate depending on the purpose of use and its application within a range that does not impair the effects of the present invention. .

As such a modifier for polyolefin,
For example, various additives described in "Polylist Additives Handbook" edited by the Hygiene Council of Polyolefins (October 1990) can be mentioned. More specifically, stabilizers (metal compounds, epoxy compounds, nitrogen Compounds, phosphorus compounds, sulfur compounds, etc.), ultraviolet absorbers (benzophenone compounds, benzotriazole compounds, etc.), antioxidants (phenol compounds, phosphite compounds, sulfur compounds, etc.), surfactants, Lubricants (aliphatic hydrocarbons such as paraffin and wax, higher fatty acids having 8 to 22 carbon atoms, higher fatty acid metals having 8 to 22 carbon atoms (Al, Ca, M
g, Zn) salt, fatty acid having 8 to 18 carbon atoms, 8 to 2 carbon atoms
2 aliphatic alcohols, polyglycols, 4 to 2 carbon atoms
Esters of 2 higher fatty acids and aliphatic monohydric alcohols having 4 to 18 carbon atoms, higher fatty acid amides having 8 to 22 carbon atoms, silicone oil, rosin derivatives, etc., fillers (talc, hydrotalcite, mica, zeolite) , Perlite, diatomaceous earth, calcium carbonate, glass fiber, etc.), foaming agents, foaming aids, polymer additives, plasticizers, crosslinking agents,
Crosslinking accelerator, antistatic agent, antifogging agent, polymer alloy component (rubber such as block SBR or random SBR and hydrides thereof, polystyrene, etc.), flame retardant, dispersant, organic / inorganic pigment, dye, processing Various additives such as auxiliary agents are exemplified.

The applicable molding methods are injection molding,
Examples include extrusion molding and compression molding.

When the resin composition according to the present application is formed into a molded article, a sheet or a film, almost no undispersed amide compound is visually observed. As a result, for example, in the case of an injection molded product, a polypropylene resin composition having a small variation in impact strength and an excellent balance of physical properties of impact resistance, rigidity and heat resistance rigidity can be obtained. In the field of sheets and films, the melting point is lower than that of α-crystal polypropylene, and the force required for deformation under heating is small, which is useful for improving secondary workability. Further, a good polypropylene resin composition free from fisheyes, pinholes, etc., whose main cause is the undispersed product, can be obtained.

[0033]

EXAMPLES The present invention will be described in detail below with reference to Examples and Comparative Examples. The amide compound pulverized product was prepared by the following method, and the particle size distribution of the obtained sample, the flexural modulus of the polypropylene resin composition, the impact strength, the heat distortion temperature and the dispersibility of the amide compound were as follows. It was measured by the method.

[Preparation of pulverized amide compound] An amide compound having an average particle diameter of 210 µm and a maximum particle diameter of 500 µm was pulverized using a fluidized bed type counter jet mill 100AFG manufactured by Hosokawa Micron Co., Ltd. to obtain a T-plex type ultrafine powder. An amide compound having a predetermined particle size characteristic was prepared by changing the classification rotation speed of the classifier. An amide compound having a particle size distribution larger than that was prepared by grinding with a rotary pin mill.

[Particle size distribution] The sample particles of the amide compound are sufficiently dispersed in methanol so as to be a single particle, and then a particle size distribution meter (trade name "Microtrac FRA") of a laser diffraction system is used. The average particle size and the maximum particle size were determined.

[Measurement of Flexural Modulus] JIS K 720
The measurement was performed according to 3. The test temperature was 25 ° C. and the test speed was 10 mm / min. The higher the value of flexural modulus,
It has excellent rigidity.

[Dupont Impact Strength] The 50% breaking energy of a sheet having a thickness of 2 mm at 23 ° C. was determined according to the falling weight impact test method (JIS K 7211).

[Heat deformation temperature] According to JIS K 7207, the heat deformation temperature was measured under a load of 4.6 kgf / cm ² .
The higher the heat distortion temperature value, the better the heat resistance rigidity.

[Dispersibility of amide compound] Thickness 0.5 mm
The injection-molded sheet of 1 was visually observed and judged.

Examples 1 to 8 Propylene homopolymer powder (MFR = 14 g / 10
Min) 0.2 parts by weight of N, N'-dicyclohexyl-2,6-naphthalene dicarboxamide having a predetermined particle size distribution is added to 100 parts by weight, and after mixing with a Henschel mixer,
Pelletized with a 20 mmφ uniaxial extruder. Next, the obtained pellets were injection-molded under the conditions of a resin temperature of 240 ° C. and a mold temperature of 50 ° C. to prepare various test pieces. Table 1 shows the DuPont impact strength, flexural modulus, heat distortion temperature, and presence / absence of non-dispersion of the obtained sample.

Comparative Examples 1 to 3 Samples were prepared in the same manner as in Example 1 except that N, N'-dicyclohexyl-2,6-naphthalenedicarboxamide having an average particle size of 10 μm or more and a maximum particle size of 50 μm or more was applied. It was prepared and its properties were evaluated. The results obtained are shown in Table 1.

Comparative Example 4 A sample was prepared in the same manner as in Example 1 except that N, N'-dicyclohexyl-2,6-naphthalenedicarboxamide was not added, and its characteristics were evaluated. The obtained results are first
Shown in the table.

By applying the polypropylene resin composition according to the present invention, an undispersed nucleating agent does not remain,
It is possible to stably obtain a molded product having an excellent balance of impact resistance, rigidity and heat resistance rigidity.

Claims (2)

[Claims] 1. A polypropylene resin composition comprising an amide compound represented by the general formula (1),
A polypropylene resin composition, wherein the maximum particle size of the amide compound is 50 μm or less. ^{R 2 -NHCO-R 1 -CONH-} R 3 (1) [ wherein, R ¹ is 6 alicyclic or carbon number of 3 to 28 carbon atoms
28 represents an aromatic dicarboxylic acid residue, R ² and R ³ are the same or different, and are a cycloalkyl group having 3 to 18 carbon atoms,
It represents a group represented by the general formula (2), the general formula (3), the general formula (4) or the general formula (5). ] [In the formula, R ⁴ represents a linear or branched alkyl group having 1 to 12 carbon atoms, a cycloalkyl group having 6 to 12 carbon atoms, or phenyl. ] [In formula, R < ⁵ > is synonymous with R < ⁴ > in General formula (2). ] [In the formula, R ⁶ represents a linear or branched alkylene group having 1 to 4 carbon atoms. ] [In the formula, R ⁷ has the same meaning as R ⁶ in formula (4). ] 2. The polypropylene resin composition according to claim 1, wherein the content of the amide compound represented by the general formula (1) is 0.001 to 10 parts by weight based on 100 parts by weight of the polypropylene resin.