JP5974655B2 - Method for producing polypropylene-based resin molded product including method for refining amide compound crystal, polypropylene-based resin molded product obtained by the production method, and secondary processed molded product thereof - Google Patents
Method for producing polypropylene-based resin molded product including method for refining amide compound crystal, polypropylene-based resin molded product obtained by the production method, and secondary processed molded product thereof Download PDFInfo
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- JP5974655B2 JP5974655B2 JP2012134297A JP2012134297A JP5974655B2 JP 5974655 B2 JP5974655 B2 JP 5974655B2 JP 2012134297 A JP2012134297 A JP 2012134297A JP 2012134297 A JP2012134297 A JP 2012134297A JP 5974655 B2 JP5974655 B2 JP 5974655B2
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- JP
- Japan
- Prior art keywords
- polypropylene resin
- carbon atoms
- general formula
- amide compound
- dicarboxylic acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- -1 amide compound Chemical class 0.000 title claims description 304
- 239000013078 crystal Substances 0.000 title claims description 64
- 238000004519 manufacturing process Methods 0.000 title claims description 62
- 238000000034 method Methods 0.000 title claims description 40
- 229920005673 polypropylene based resin Polymers 0.000 title claims description 17
- 238000007670 refining Methods 0.000 title claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 193
- 229920001155 polypropylene Polymers 0.000 claims description 193
- 229920005989 resin Polymers 0.000 claims description 121
- 239000011347 resin Substances 0.000 claims description 121
- 125000004432 carbon atom Chemical group C* 0.000 claims description 102
- 239000011342 resin composition Substances 0.000 claims description 88
- 239000008188 pellet Substances 0.000 claims description 53
- 238000000465 moulding Methods 0.000 claims description 41
- 229920006395 saturated elastomer Polymers 0.000 claims description 28
- 125000000217 alkyl group Chemical group 0.000 claims description 25
- 239000000203 mixture Substances 0.000 claims description 25
- 238000001816 cooling Methods 0.000 claims description 19
- 238000002425 crystallisation Methods 0.000 claims description 16
- 230000008025 crystallization Effects 0.000 claims description 16
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 15
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 14
- 150000001875 compounds Chemical class 0.000 claims description 14
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 claims description 13
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 12
- 229910052799 carbon Inorganic materials 0.000 claims description 12
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 11
- 239000002994 raw material Substances 0.000 claims description 11
- MBSRTKPGZKQXQR-UHFFFAOYSA-N 2-n,6-n-dicyclohexylnaphthalene-2,6-dicarboxamide Chemical compound C=1C=C2C=C(C(=O)NC3CCCCC3)C=CC2=CC=1C(=O)NC1CCCCC1 MBSRTKPGZKQXQR-UHFFFAOYSA-N 0.000 claims description 10
- 125000002947 alkylene group Chemical group 0.000 claims description 10
- 238000002844 melting Methods 0.000 claims description 10
- 230000008018 melting Effects 0.000 claims description 10
- 238000010438 heat treatment Methods 0.000 claims description 9
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 7
- 150000003839 salts Chemical class 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000004671 saturated fatty acids Chemical class 0.000 claims description 4
- 238000007711 solidification Methods 0.000 claims description 4
- 230000008023 solidification Effects 0.000 claims description 4
- 235000021122 unsaturated fatty acids Nutrition 0.000 claims description 4
- 150000004670 unsaturated fatty acids Chemical class 0.000 claims description 4
- 239000000155 melt Substances 0.000 claims description 3
- 239000000047 product Substances 0.000 description 36
- 230000000052 comparative effect Effects 0.000 description 12
- 239000000654 additive Substances 0.000 description 11
- 239000002253 acid Substances 0.000 description 10
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 10
- 235000014113 dietary fatty acids Nutrition 0.000 description 9
- 229930195729 fatty acid Natural products 0.000 description 9
- 239000000194 fatty acid Substances 0.000 description 9
- 238000004898 kneading Methods 0.000 description 9
- 229920001577 copolymer Polymers 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- 238000005259 measurement Methods 0.000 description 8
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 8
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 7
- 239000005977 Ethylene Substances 0.000 description 7
- 239000002667 nucleating agent Substances 0.000 description 7
- 150000004665 fatty acids Chemical class 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 229920000098 polyolefin Polymers 0.000 description 4
- 239000003507 refrigerant Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 3
- NRCMAYZCPIVABH-UHFFFAOYSA-N Quinacridone Chemical compound N1C2=CC=CC=C2C(=O)C2=C1C=C1C(=O)C3=CC=CC=C3NC1=C2 NRCMAYZCPIVABH-UHFFFAOYSA-N 0.000 description 3
- 125000001931 aliphatic group Chemical group 0.000 description 3
- SMBKCSPGKDEPFO-UHFFFAOYSA-L calcium;docosanoate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCCCCCC([O-])=O SMBKCSPGKDEPFO-UHFFFAOYSA-L 0.000 description 3
- 239000003484 crystal nucleating agent Substances 0.000 description 3
- PAFZNILMFXTMIY-UHFFFAOYSA-N cyclohexylamine Chemical compound NC1CCCCC1 PAFZNILMFXTMIY-UHFFFAOYSA-N 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 230000004927 fusion Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920005653 propylene-ethylene copolymer Polymers 0.000 description 3
- HQHCYKULIHKCEB-UHFFFAOYSA-N tetradecanedioic acid Natural products OC(=O)CCCCCCCCCCCCC(O)=O HQHCYKULIHKCEB-UHFFFAOYSA-N 0.000 description 3
- 238000003856 thermoforming Methods 0.000 description 3
- YWWVWXASSLXJHU-AATRIKPKSA-N (9E)-tetradecenoic acid Chemical compound CCCC\C=C\CCCCCCCC(O)=O YWWVWXASSLXJHU-AATRIKPKSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- SLWIPPZWFZGHEU-UHFFFAOYSA-N 2-[4-(carboxymethyl)phenyl]acetic acid Chemical compound OC(=O)CC1=CC=C(CC(O)=O)C=C1 SLWIPPZWFZGHEU-UHFFFAOYSA-N 0.000 description 2
- MLPVBIWIRCKMJV-UHFFFAOYSA-N 2-ethylaniline Chemical compound CCC1=CC=CC=C1N MLPVBIWIRCKMJV-UHFFFAOYSA-N 0.000 description 2
- JJYPMNFTHPTTDI-UHFFFAOYSA-N 3-methylaniline Chemical compound CC1=CC=CC(N)=C1 JJYPMNFTHPTTDI-UHFFFAOYSA-N 0.000 description 2
- HRXZRAXKKNUKRF-UHFFFAOYSA-N 4-ethylaniline Chemical compound CCC1=CC=C(N)C=C1 HRXZRAXKKNUKRF-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Chemical compound NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- BGYHLZZASRKEJE-UHFFFAOYSA-N [3-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]-2,2-bis[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxymethyl]propyl] 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCC(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)(COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)COC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 BGYHLZZASRKEJE-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- MBMBGCFOFBJSGT-KUBAVDMBSA-N all-cis-docosa-4,7,10,13,16,19-hexaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCC(O)=O MBMBGCFOFBJSGT-KUBAVDMBSA-N 0.000 description 2
- 238000007112 amidation reaction Methods 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 2
- 229940061587 calcium behenate Drugs 0.000 description 2
- 159000000007 calcium salts Chemical class 0.000 description 2
- CJZGTCYPCWQAJB-UHFFFAOYSA-L calcium stearate Chemical compound [Ca+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O CJZGTCYPCWQAJB-UHFFFAOYSA-L 0.000 description 2
- 239000008116 calcium stearate Substances 0.000 description 2
- 235000013539 calcium stearate Nutrition 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
- POULHZVOKOAJMA-UHFFFAOYSA-N dodecanoic acid Chemical compound CCCCCCCCCCCC(O)=O POULHZVOKOAJMA-UHFFFAOYSA-N 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 159000000003 magnesium salts Chemical class 0.000 description 2
- JOKYEDJSHIKSBI-UHFFFAOYSA-N n-cyclohexyl-4-[3-[4-(cyclohexylcarbamoyl)phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C=1C=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2CCCCC2)C=CC=1C(=O)NC1CCCCC1 JOKYEDJSHIKSBI-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 230000006911 nucleation Effects 0.000 description 2
- 238000010899 nucleation Methods 0.000 description 2
- RNVCVTLRINQCPJ-UHFFFAOYSA-N o-toluidine Chemical compound CC1=CC=CC=C1N RNVCVTLRINQCPJ-UHFFFAOYSA-N 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- BNJOQKFENDDGSC-UHFFFAOYSA-N octadecanedioic acid Chemical compound OC(=O)CCCCCCCCCCCCCCCCC(O)=O BNJOQKFENDDGSC-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- RZXMPPFPUUCRFN-UHFFFAOYSA-N p-toluidine Chemical compound CC1=CC=C(N)C=C1 RZXMPPFPUUCRFN-UHFFFAOYSA-N 0.000 description 2
- SECPZKHBENQXJG-FPLPWBNLSA-N palmitoleic acid Chemical compound CCCCCC\C=C/CCCCCCCC(O)=O SECPZKHBENQXJG-FPLPWBNLSA-N 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920002959 polymer blend Polymers 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- GWHCXVQVJPWHRF-KTKRTIGZSA-N (15Z)-tetracosenoic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCCCC(O)=O GWHCXVQVJPWHRF-KTKRTIGZSA-N 0.000 description 1
- OJOWICOBYCXEKR-APPZFPTMSA-N (1S,4R)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound CC=C1C[C@@H]2C[C@@H]1C=C2 OJOWICOBYCXEKR-APPZFPTMSA-N 0.000 description 1
- FGHOOJSIEHYJFQ-UHFFFAOYSA-N (2,4-ditert-butylphenyl) dihydrogen phosphite Chemical compound CC(C)(C)C1=CC=C(OP(O)O)C(C(C)(C)C)=C1 FGHOOJSIEHYJFQ-UHFFFAOYSA-N 0.000 description 1
- YUFFSWGQGVEMMI-JLNKQSITSA-N (7Z,10Z,13Z,16Z,19Z)-docosapentaenoic acid Chemical compound CC\C=C/C\C=C/C\C=C/C\C=C/C\C=C/CCCCCC(O)=O YUFFSWGQGVEMMI-JLNKQSITSA-N 0.000 description 1
- TWSWSIQAPQLDBP-CGRWFSSPSA-N (7e,10e,13e,16e)-docosa-7,10,13,16-tetraenoic acid Chemical compound CCCCC\C=C\C\C=C\C\C=C\C\C=C\CCCCCC(O)=O TWSWSIQAPQLDBP-CGRWFSSPSA-N 0.000 description 1
- OYHQOLUKZRVURQ-NTGFUMLPSA-N (9Z,12Z)-9,10,12,13-tetratritiooctadeca-9,12-dienoic acid Chemical compound C(CCCCCCC\C(=C(/C\C(=C(/CCCCC)\[3H])\[3H])\[3H])\[3H])(=O)O OYHQOLUKZRVURQ-NTGFUMLPSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- HVGRZDASOHMCSK-UHFFFAOYSA-N (Z,Z)-13,16-docosadienoic acid Natural products CCCCCC=CCC=CCCCCCCCCCCCC(O)=O HVGRZDASOHMCSK-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- XBWOPGDJMAJJDG-UHFFFAOYSA-N 1-cyclohexylethanamine Chemical compound CC(N)C1CCCCC1 XBWOPGDJMAJJDG-UHFFFAOYSA-N 0.000 description 1
- UJAHMMDIDKVNLK-UHFFFAOYSA-N 1-cyclohexylpropan-1-amine Chemical compound CCC(N)C1CCCCC1 UJAHMMDIDKVNLK-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- MVTUQUDYXZAYQX-UHFFFAOYSA-N 1-n,4-n-bis(2-methylcyclohexyl)benzene-1,4-dicarboxamide Chemical compound CC1CCCCC1NC(=O)C1=CC=C(C(=O)NC2C(CCCC2)C)C=C1 MVTUQUDYXZAYQX-UHFFFAOYSA-N 0.000 description 1
- RQEUFEKYXDPUSK-UHFFFAOYSA-N 1-phenylethylamine Chemical compound CC(N)C1=CC=CC=C1 RQEUFEKYXDPUSK-UHFFFAOYSA-N 0.000 description 1
- AQFLVLHRZFLDDV-UHFFFAOYSA-N 1-phenylpropan-1-amine Chemical compound CCC(N)C1=CC=CC=C1 AQFLVLHRZFLDDV-UHFFFAOYSA-N 0.000 description 1
- YJGUVTBNQCVSQB-UHFFFAOYSA-N 2,2-diphenylpropanedioic acid Chemical compound C=1C=CC=CC=1C(C(O)=O)(C(=O)O)C1=CC=CC=C1 YJGUVTBNQCVSQB-UHFFFAOYSA-N 0.000 description 1
- PVXCQHHWNDJIJP-UHFFFAOYSA-N 2,3-diphenylbutanedioic acid Chemical compound C=1C=CC=CC=1C(C(=O)O)C(C(O)=O)C1=CC=CC=C1 PVXCQHHWNDJIJP-UHFFFAOYSA-N 0.000 description 1
- YKOLZVXSPGIIBJ-UHFFFAOYSA-N 2-Isopropylaniline Chemical compound CC(C)C1=CC=CC=C1N YKOLZVXSPGIIBJ-UHFFFAOYSA-N 0.000 description 1
- WAXJSQREIWGYCB-UHFFFAOYSA-N 2-[4-(carboxymethyl)cyclohexyl]acetic acid Chemical compound OC(=O)CC1CCC(CC(O)=O)CC1 WAXJSQREIWGYCB-UHFFFAOYSA-N 0.000 description 1
- HFACYWDPMNWMIW-UHFFFAOYSA-N 2-cyclohexylethanamine Chemical compound NCCC1CCCCC1 HFACYWDPMNWMIW-UHFFFAOYSA-N 0.000 description 1
- QOPVVDFTPKWSFL-UHFFFAOYSA-N 2-ethylcyclohexan-1-amine Chemical compound CCC1CCCCC1N QOPVVDFTPKWSFL-UHFFFAOYSA-N 0.000 description 1
- FEUISMYEFPANSS-UHFFFAOYSA-N 2-methylcyclohexan-1-amine Chemical compound CC1CCCCC1N FEUISMYEFPANSS-UHFFFAOYSA-N 0.000 description 1
- IXHLYXZSIBLXFV-UHFFFAOYSA-N 2-n,6-n-bis(2-methylcyclohexyl)naphthalene-2,6-dicarboxamide Chemical compound CC1CCCCC1NC(=O)C1=CC=C(C=C(C=C2)C(=O)NC3C(CCCC3)C)C2=C1 IXHLYXZSIBLXFV-UHFFFAOYSA-N 0.000 description 1
- TWBPWBPGNQWFSJ-UHFFFAOYSA-N 2-phenylaniline Chemical group NC1=CC=CC=C1C1=CC=CC=C1 TWBPWBPGNQWFSJ-UHFFFAOYSA-N 0.000 description 1
- LVFFZQQWIZURIO-UHFFFAOYSA-N 2-phenylbutanedioic acid Chemical compound OC(=O)CC(C(O)=O)C1=CC=CC=C1 LVFFZQQWIZURIO-UHFFFAOYSA-N 0.000 description 1
- IUUHHWALHWRYPY-UHFFFAOYSA-N 2-propan-2-ylcyclohexan-1-amine Chemical compound CC(C)C1CCCCC1N IUUHHWALHWRYPY-UHFFFAOYSA-N 0.000 description 1
- WKURVXXDGMYSDP-UHFFFAOYSA-N 2-propyl-aniline Chemical compound CCCC1=CC=CC=C1N WKURVXXDGMYSDP-UHFFFAOYSA-N 0.000 description 1
- DWVNXHKKIRXAOL-UHFFFAOYSA-N 2-propylcyclohexan-1-amine Chemical compound CCCC1CCCCC1N DWVNXHKKIRXAOL-UHFFFAOYSA-N 0.000 description 1
- AEIOZWYBDBVCGW-UHFFFAOYSA-N 2-tert-butylaniline Chemical compound CC(C)(C)C1=CC=CC=C1N AEIOZWYBDBVCGW-UHFFFAOYSA-N 0.000 description 1
- GEYTUFUSXAMSQK-UHFFFAOYSA-N 2-tert-butylcyclohexan-1-amine Chemical compound CC(C)(C)C1CCCCC1N GEYTUFUSXAMSQK-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- DUHQIGLHYXLKAE-UHFFFAOYSA-N 3,3-dimethylglutaric acid Chemical compound OC(=O)CC(C)(C)CC(O)=O DUHQIGLHYXLKAE-UHFFFAOYSA-N 0.000 description 1
- HVEAQFIZKONJJG-UHFFFAOYSA-N 3-(3-carboxybenzoyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(C(=O)C=2C=C(C=CC=2)C(O)=O)=C1 HVEAQFIZKONJJG-UHFFFAOYSA-N 0.000 description 1
- ZFCNECLRCWFTLI-UHFFFAOYSA-N 3-(3-carboxyphenoxy)benzoic acid Chemical compound OC(=O)C1=CC=CC(OC=2C=C(C=CC=2)C(O)=O)=C1 ZFCNECLRCWFTLI-UHFFFAOYSA-N 0.000 description 1
- KHZYMPDILLAIQY-UHFFFAOYSA-N 3-(3-carboxyphenyl)benzoic acid Chemical compound OC(=O)C1=CC=CC(C=2C=C(C=CC=2)C(O)=O)=C1 KHZYMPDILLAIQY-UHFFFAOYSA-N 0.000 description 1
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- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 1
- 238000007561 laser diffraction method Methods 0.000 description 1
- 229960004488 linolenic acid Drugs 0.000 description 1
- KQQKGWQCNNTQJW-UHFFFAOYSA-N linolenic acid Natural products CC=CCCC=CCC=CCCCCCCCC(O)=O KQQKGWQCNNTQJW-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- PJJZFXPJNUVBMR-UHFFFAOYSA-L magnesium benzoate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 PJJZFXPJNUVBMR-UHFFFAOYSA-L 0.000 description 1
- APLYTANMTDCWTA-UHFFFAOYSA-L magnesium;phthalate Chemical compound [Mg+2].[O-]C(=O)C1=CC=CC=C1C([O-])=O APLYTANMTDCWTA-UHFFFAOYSA-L 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910000000 metal hydroxide Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- QZLPDBKEVWFQNF-UHFFFAOYSA-N n,n'-diphenylhexanediamide Chemical compound C=1C=CC=CC=1NC(=O)CCCCC(=O)NC1=CC=CC=C1 QZLPDBKEVWFQNF-UHFFFAOYSA-N 0.000 description 1
- GSUVDDINWMUONZ-UHFFFAOYSA-N n-(4-tert-butylcyclohexyl)-4-[3-[4-[(4-tert-butylcyclohexyl)carbamoyl]phenyl]-2,4,8,10-tetraoxaspiro[5.5]undecan-9-yl]benzamide Chemical compound C1CC(C(C)(C)C)CCC1NC(=O)C1=CC=C(C2OCC3(CO2)COC(OC3)C=2C=CC(=CC=2)C(=O)NC2CCC(CC2)C(C)(C)C)C=C1 GSUVDDINWMUONZ-UHFFFAOYSA-N 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N n-Dodecanedioic acid Natural products OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- HRRDCWDFRIJIQZ-UHFFFAOYSA-N naphthalene-1,8-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=C2C(C(=O)O)=CC=CC2=C1 HRRDCWDFRIJIQZ-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- ZQPPMHVWECSIRJ-KTKRTIGZSA-N oleic acid Chemical compound CCCCCCCC\C=C/CCCCCCCC(O)=O ZQPPMHVWECSIRJ-KTKRTIGZSA-N 0.000 description 1
- 235000021313 oleic acid Nutrition 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- LRTFPLFDLJYEKT-UHFFFAOYSA-N para-isopropylaniline Chemical compound CC(C)C1=CC=C(N)C=C1 LRTFPLFDLJYEKT-UHFFFAOYSA-N 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- YIYBQIKDCADOSF-UHFFFAOYSA-N pent-2-enoic acid Chemical compound CCC=CC(O)=O YIYBQIKDCADOSF-UHFFFAOYSA-N 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 150000003018 phosphorus compounds Chemical class 0.000 description 1
- IEQIEDJGQAUEQZ-UHFFFAOYSA-N phthalocyanine Chemical class N1C(N=C2C3=CC=CC=C3C(N=C3C4=CC=CC=C4C(=N4)N3)=N2)=C(C=CC=C2)C2=C1N=C1C2=CC=CC=C2C4=N1 IEQIEDJGQAUEQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
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- 229920000728 polyester Polymers 0.000 description 1
- 229920000151 polyglycol Polymers 0.000 description 1
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- 229920005629 polypropylene homopolymer Polymers 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- IFQCEOKSFPQHTD-UHFFFAOYSA-M potassium;12-hydroxyoctadecanoate Chemical compound [K+].CCCCCCC(O)CCCCCCCCCCC([O-])=O IFQCEOKSFPQHTD-UHFFFAOYSA-M 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
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- 229920005604 random copolymer Polymers 0.000 description 1
- 235000003441 saturated fatty acids Nutrition 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
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- 229940077386 sodium benzenesulfonate Drugs 0.000 description 1
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- HIEHAIZHJZLEPQ-UHFFFAOYSA-M sodium;naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 HIEHAIZHJZLEPQ-UHFFFAOYSA-M 0.000 description 1
- 150000003464 sulfur compounds Chemical class 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
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- OKUCEQDKBKYEJY-UHFFFAOYSA-N tert-butyl 3-(methylamino)pyrrolidine-1-carboxylate Chemical compound CNC1CCN(C(=O)OC(C)(C)C)C1 OKUCEQDKBKYEJY-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Chemical class OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000007666 vacuum forming Methods 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 150000003751 zinc Chemical class 0.000 description 1
- AXORVIZLPOGIRG-UHFFFAOYSA-N β-methylphenethylamine Chemical compound NCC(C)C1=CC=CC=C1 AXORVIZLPOGIRG-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Description
本発明は、ポリプロピレン系樹脂組成物を成形する際のアミド化合物の針状結晶を微細化する方法を含むポリプロピレン系樹脂成形体の製造方法、該製造方法により得られるポリプロピレン系樹脂成形体、及びその二次加工成形品に関する。 The present invention relates to a method for producing a polypropylene resin molded product including a method for refining needle-like crystals of an amide compound when molding a polypropylene resin composition, a polypropylene resin molded product obtained by the production method, and the method It relates to secondary processed molded products.
ポリプロピレン系樹脂には、α晶やβ晶等の結晶形態が存在するが、特定の結晶化条件やβ晶核剤を配合することにより、β晶を優先的に生成させることができる。β晶は、通常のα晶に比べて熱的性質、力学的性質が大きく異なり、β晶を優先的に発現させることにより耐熱性、耐衝撃性等の様々な物性を向上させることができることが知られている。β晶を形成させる方法としては、熱勾配下で成形する方法もあるが、ある種のアミド化合物を加えることにより効率的により多くのβ晶を形成することができることが知られている(特許文献1〜5)。 Polypropylene resins have crystal forms such as α crystals and β crystals, but β crystals can be preferentially produced by blending specific crystallization conditions and β crystal nucleating agents. β crystals have significantly different thermal and mechanical properties than normal α crystals, and by preferentially expressing β crystals, various physical properties such as heat resistance and impact resistance can be improved. Are known. As a method of forming β crystals, there is a method of molding under a thermal gradient, but it is known that more β crystals can be efficiently formed by adding a certain amide compound (Patent Document). 1-5).
本発明は、ポリプロピレン系樹脂中に存在するアミド化合物の針状結晶を含有する系において、ポリプロピレン系樹脂組成物を製造する工程におけるその結晶をより微細化する方法、その方法を含むポリプロピレン系樹脂成形体の製造方法、該製造方法により得られるポリプロピレン系樹脂成形体、及びその二次加工成形品を提供することを目的とする。 The present invention relates to a method of making a crystal further finer in a step of producing a polypropylene resin composition in a system containing acicular crystals of an amide compound present in a polypropylene resin, and a polypropylene resin molding including the method It aims at providing the manufacturing method of a body, the polypropylene-type resin molding obtained by this manufacturing method, and its secondary fabrication molded product.
本発明者らは、優れた特性を有するポリプロピレン系樹脂成形体を容易に得る方法を探索する過程で、溶融ポリプロピレン系樹脂中に溶解したアミド化合物の結晶析出に際し、その結晶の針状化、即ち縦方向への結晶成長を促進することにより、得られた成形体の機械的特性や熱的特性がより向上することを確認した。更に前記針状結晶が微細であるほどその効果が大きい傾向があることを確認した。即ち、ポリプロピレン系樹脂組成物を成形する際のアミド化合物の針状結晶をより微細化ことが、優れた特性を有するポリプロピレン系樹脂成形体及びその二次加工成形品を得るためには肝要であることが判った。 In the process of searching for a method for easily obtaining a polypropylene-based resin molded article having excellent characteristics, the inventors of the present invention have made the crystals acicular, that is, when the amide compound dissolved in the molten polypropylene-based resin is crystallized. It was confirmed that the mechanical properties and thermal properties of the obtained molded body were further improved by promoting the crystal growth in the longitudinal direction. Furthermore, it has been confirmed that the finer the acicular crystal, the greater the effect. That is, it is important to obtain a polypropylene resin molded article having excellent characteristics and a secondary processed molded article thereof by making the needle-like crystals of the amide compound finer when molding the polypropylene resin composition. I found out.
そこで、本発明者らは、アミド化合物を加えて優れた特性を有するポリプロピレン系成形体を製造するに際して、ポリプロピレン系樹脂組成物中に含有するアミド化合物の針状結晶をより微細化する方法に関して、鋭意検討した結果、ポリプロピレン系樹脂組成物を製造する工程で得られるポリプロピレン系樹脂組成物の形状を制御することにより、前記課題を満たすことができることを見出し、かかる知見に基づき本発明を完成するに至った。 Therefore, the present inventors have added a amide compound to produce a polypropylene-based molded article having excellent characteristics, and relates to a method for further miniaturizing the needle-like crystals of the amide compound contained in the polypropylene-based resin composition. As a result of intensive studies, it was found that the above problems can be satisfied by controlling the shape of the polypropylene resin composition obtained in the process of producing the polypropylene resin composition, and the present invention is completed based on such knowledge. It came.
即ち、本発明は、以下のアミド化合物の針状結晶を含有するポリプロピレン系樹脂組成物を成形する工程を含むポリプロピレン系樹脂成形体の製造方法において、該ポリプロピレン系樹脂組成物の形状を制御することにより含有する針状結晶をより微細化するする方法を含むポリプロピレン系樹脂成形体の製造方法、該製造方法により得られるポリプロピレン系樹脂成形体及びその二次加工成形品を提供するものである。 That is, the present invention controls the shape of a polypropylene resin composition in a method for producing a polypropylene resin composition comprising a step of molding a polypropylene resin composition containing needle crystals of the following amide compound. The present invention provides a method for producing a polypropylene-based resin molded product including a method for further miniaturizing the acicular crystals contained therein, a polypropylene-based resin molded product obtained by the production method, and a secondary processed molded product thereof.
(項1)
下記一般式(1)で表される少なくとも1種のアミド化合物の針状結晶を含有するポリプロピレン系樹脂組成物を成形する工程を含むポリプロピレン系樹脂成形体の製造方法であって、
該ポリプロピレン系樹脂組成物の形状が短径0.5mm以上、2.0mm以下であるペレット状であり、かつ成形時に該アミド化合物の針状結晶が溶融状態のポリプロピレン系樹脂中に存在していることを特徴とするポリプロピレン系樹脂成形体の製造方法。
一般式(1):
A method for producing a polypropylene resin molded body comprising a step of molding a polypropylene resin composition containing needle-like crystals of at least one amide compound represented by the following general formula (1),
The shape of the polypropylene resin composition is a pellet shape having a minor axis of 0.5 mm or more and 2.0 mm or less, and needle crystals of the amide compound are present in the molten polypropylene resin at the time of molding. A method for producing a polypropylene-based resin molded product.
General formula (1):
(項2)
アミド化合物の針状結晶を含有するポリプロピレン系樹脂組成物が、(i)ポリプロピレン系樹脂及びアミド化合物を含む未混練原料を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、及び(ii)前記工程(i)で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の針状結晶を析出させる工程を具備する製造方法で得られる組成物であり、
前記工程(i)におけるポリプロピレン系樹脂組成物の溶融温度が、Tdis以上、Tdis+50℃以下(Tdisはポリプロピレン系樹脂にアミド化合物が溶解する温度を表す)の範囲であり、かつ、
前記工程(ii)において、冷却固化時のストランドの直径を0.5mm以上、2.0mm以下の範囲に調整することを特徴とする(項1)に記載のポリプロピレン系樹脂成形体の製造方法。
(Section 2)
A polypropylene resin composition containing needle-like crystals of an amide compound, (i) heating an unkneaded raw material containing the polypropylene resin and the amide compound, and dissolving the amide compound in the molten polypropylene resin; ii) A composition obtained by a production method comprising a step of cooling the molten polypropylene resin composition obtained in the step (i) to precipitate acicular crystals of an amide compound,
The melting temperature of the polypropylene resin composition in the step (i) is in the range of T dis or more and T dis + 50 ° C. or less (T dis represents the temperature at which the amide compound is dissolved in the polypropylene resin), and
In the step (ii), the diameter of the strand at the time of cooling and solidification is adjusted to a range of 0.5 mm or more and 2.0 mm or less, and the method for producing a polypropylene resin molded article according to (Item 1).
(項3)
一般式(1)において、R1が炭素数1〜12の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜20の芳香族ジカルボン酸残基を表し、R2及びR3が、同一又は異なって、それぞれ炭素数3〜12のシクロアルキル基、又は一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す(項1)又は(項2)に記載のポリプロピレン系樹脂成形体の製造方法。
(Section 3)
In General Formula (1), R 1 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 1 to 12 carbon atoms, a saturated or unsaturated alicyclic dicarboxylic acid residue having 6 to 10 carbon atoms, or the number of carbon atoms Represents an aromatic dicarboxylic acid residue having 6 to 20 and R 2 and R 3 are the same or different and each represents a cycloalkyl group having 3 to 12 carbon atoms, or a general formula (a), a general formula (b), a general formula The method for producing a polypropylene resin molded article according to (Item 1) or (Item 2), which represents a group represented by the formula (c) or the general formula (d).
(項4)
一般式(1)において、R1が炭素数4〜8の飽和脂肪族ジカルボン酸残基、炭素数6〜8の飽和脂環族ジカルボン酸残基、又は炭素数6〜20の芳香族ジカルボン酸残基であり、R2及びR3が、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基又はフェニル基である(項1)〜(項3)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Section 4)
In the general formula (1), R 1 is a saturated aliphatic dicarboxylic acid residue having 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having 6 to 8 carbon atoms, or an aromatic dicarboxylic acid having 6 to 20 carbon atoms. R 2 and R 3 are the same or different and each is a cyclohexyl group or a phenyl group which may be substituted with one alkyl group having 1 to 4 carbon atoms (Claim 1) to (Claim). 3) The method for producing a polypropylene resin molded article according to any one of the above.
(項5)
一般式(1)において、R1が、一般式(e)、又は一般式(f)
In the general formula (1), R 1 represents the general formula (e) or the general formula (f).
(項6)
アミド化合物が、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドである(項1)〜(項5)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Claim 6)
The method for producing a polypropylene resin molded article according to any one of (Item 1) to (Item 5), wherein the amide compound is N, N′-dicyclohexyl-2,6-naphthalenedicarboxamide.
(項7)
アミド化合物を、ポリプロピレン系樹脂100重量部に対して、0.03〜0.5重量部含有する(項1)〜(項6)の何れかに記載のポリプロピレン系樹脂組成物成形体の製造方法。
(Claim 7)
The manufacturing method of the polypropylene resin composition molded article according to any one of (Item 1) to (Item 6), containing 0.03 to 0.5 parts by weight of the amide compound with respect to 100 parts by weight of the polypropylene resin. .
(項8)
ポリプロピレン系樹脂組成物中に、前記アミド化合物と、飽和又は不飽和の脂肪酸金属塩からなる群より選ばれる少なくとも1種の化合物が共存している(項1)〜(項7)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Section 8)
In the polypropylene-based resin composition, the amide compound and at least one compound selected from the group consisting of a saturated or unsaturated fatty acid metal salt coexist (Claim 1) to (Claim 7). The manufacturing method of the polypropylene resin molding of description.
(項9)
ポリプロピレン系樹脂組成物中でアミド化合物と共存する脂肪酸金属塩が、ステアリン酸カルシウム又はベヘン酸カルシウムである(項1)〜(項8)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Claim 9)
The method for producing a polypropylene resin molded article according to any one of (Item 1) to (Item 8), wherein the fatty acid metal salt coexisting with the amide compound in the polypropylene resin composition is calcium stearate or calcium behenate.
(項10)
ポリプロピレン系樹脂の230℃、荷重2160gにおけるメルトフローレートが0.5〜60.0g/10分である(項1)〜(項9)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Section 10)
The method for producing a polypropylene resin molded article according to any one of (Item 1) to (Item 9), wherein a melt flow rate of the polypropylene resin at 230 ° C. and a load of 2160 g is 0.5 to 60.0 g / 10 minutes.
(項11)
ポリプロピレン系樹脂組成物の示差走査熱量計(DSC)で測定した135℃での等温結晶化における結晶化完了時間(Tend)が1.2分以下である(項1)〜(項10)の何れかに記載のポリプロピレン系樹脂成形体の製造方法。
(Item 11)
The crystallization completion time (Tend) in isothermal crystallization at 135 ° C. measured with a differential scanning calorimeter (DSC) of the polypropylene resin composition is 1.2 minutes or less (Claim 1) to (Claim 10) A method for producing a polypropylene resin molded article according to claim 1.
(項12)
ポリプロピレン系樹脂組成物中に含有される下記一般式(1)で表される少なくとも1種のアミド化合物の針状結晶を微細化する方法であって、
(i)ポリプロピレン系樹脂及びアミド化合物を含む未混練原料を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、及び(ii)前記工程(i)で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の針状結晶を析出させる工程を具備する方法であり、かつ、
前記工程(ii)において、冷却固化時のストランドの直径を0.5mm以上、2.0mm以下の範囲に調整することを特徴とする方法。
一般式(1):
[式(1)中、R1は、炭素数1〜24の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数4〜28の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜28の芳香族ジカルボン酸残基を表し、R2及びR3は、同一又は異なって、それぞれ炭素数3〜18のシクロアルキル基、下記の一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す
A method of refining needle-like crystals of at least one amide compound represented by the following general formula (1) contained in a polypropylene resin composition,
(I) a step of heating an unkneaded raw material containing a polypropylene resin and an amide compound to dissolve the amide compound in the molten polypropylene resin, and (ii) a molten polypropylene system obtained in the step (i). A method comprising cooling the resin composition to precipitate amide compound needle crystals; and
In the step (ii), the diameter of the strand at the time of cooling and solidification is adjusted to a range of 0.5 mm or more and 2.0 mm or less.
General formula (1):
[In the formula (1), R 1 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 1 to 24 carbon atoms, a saturated or unsaturated alicyclic dicarboxylic acid residue having 4 to 28 carbon atoms, or carbon. Represents an aromatic dicarboxylic acid residue having a number of 6 to 28, and R 2 and R 3 are the same or different and are each a cycloalkyl group having 3 to 18 carbon atoms, the following general formulas (a) and (b): Represents a group represented by general formula (c) or general formula (d)
(項13)
一般式(1)において、R1が、炭素数1〜12の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10の飽和若しくは不飽和の脂環族ジカルボン酸残基、又は炭素数6〜20の芳香族ジカルボン酸残基を表し、R2及びR3が、同一又は異なって、それぞれ炭素数3〜12のシクロアルキル基、又は一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基を表す(項12)に記載の方法。
(Section 13)
In General Formula (1), R 1 is a saturated or unsaturated aliphatic dicarboxylic acid residue having 1 to 12 carbon atoms, a saturated or unsaturated alicyclic dicarboxylic acid residue having 6 to 10 carbon atoms, or carbon Represents an aromatic dicarboxylic acid residue having a number of 6 to 20, and R 2 and R 3 are the same or different and each represents a cycloalkyl group having 3 to 12 carbon atoms, or a general formula (a), a general formula (b), The method according to (Item 12), which represents a group represented by General Formula (c) or General Formula (d).
(項14)
一般式(1)において、R1が炭素数4〜8の飽和脂肪族ジカルボン酸残基、炭素数6〜8の飽和脂環族ジカルボン酸残基、又は炭素数6〜20の芳香族ジカルボン酸残基であり、R2及びR3が、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基又はフェニル基である(項12)又は(項13)に記載の方法。
(Item 14)
In the general formula (1), R 1 is a saturated aliphatic dicarboxylic acid residue having 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having 6 to 8 carbon atoms, or an aromatic dicarboxylic acid having 6 to 20 carbon atoms. A residue, R 2 and R 3 are the same or different and each is a cyclohexyl group or a phenyl group which may be substituted with one alkyl group having 1 to 4 carbon atoms (claim 12) or (claim) The method according to 13).
(項14)
一般式(1)において、R1が一般式(e)、又は一般式(f)
In General Formula (1), R 1 is General Formula (e) or General Formula (f)
(項16)
アミド化合物が、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドである(項12)〜(項15)の何れかに記載の方法。
(Section 16)
The method according to any one of (Item 12) to (Item 15), wherein the amide compound is N, N′-dicyclohexyl-2,6-naphthalenedicarboxamide.
(項17)
(i)ポリプロピレン系樹脂、下記一般式(1)で表される少なくとも1種のアミド化合物を含む未混練原料を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、
(ii)前記工程(i)で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の針状結晶を析出させる工程、及び
(iii)前記工程(ii)で得られたアミド化合物の針状結晶を析出させたポリプロピレン系樹脂組成物を、Tm+10℃〜Tdis−10℃の温度範囲で溶融させ、成形する工程
を含むポリプロピレン系樹脂成形体の製造方法により得られる、ポリプロピレン系樹脂成形体であって、
前記工程(ii)で得られたアミド系化合物の針状結晶を含有するポリプロピレン系樹脂組成物のペレット形状が短径0.5mm以上、2.0mm以下の範囲であることを特徴とするポリプロピレン系樹脂成形体。
一般式(1):
[式(1)中、R1は一般式(e)、又は一般式(f)
(I) a step of heating an unkneaded raw material containing at least one amide compound represented by the following general formula (1), and dissolving the amide compound in the molten polypropylene resin;
(Ii) a step of cooling the molten polypropylene resin composition obtained in the step (i) to precipitate needle crystals of the amide compound; and (iii) the amide obtained in the step (ii). Obtained by a method for producing a polypropylene resin molded article comprising a step of melting and molding a polypropylene resin composition in which needle crystals of a compound are precipitated in a temperature range of T m + 10 ° C. to T dis -10 ° C., A polypropylene resin molded body,
A polypropylene-based resin composition in which the pellet shape of the polypropylene-based resin composition containing acicular crystals of the amide compound obtained in the step (ii) is in the range of 0.5 mm to 2.0 mm in the minor axis. Resin molded body.
General formula (1):
[In Formula (1), R 1 is General Formula (e) or General Formula (f)
(項18)
アミド化合物が、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドである(項17)に記載のポリプロピレン系樹脂成形体。
(Item 18)
The polypropylene resin molded article according to (17), wherein the amide compound is N, N′-dicyclohexyl-2,6-naphthalenedicarboxamide.
(項19)
(項17)又は(項18)に記載のポリプロピレン系樹脂成形体を、更に成形することによって得られる二次加工成形品。
(Section 19)
A secondary processed molded article obtained by further molding the polypropylene resin molded article according to (Item 17) or (Item 18).
以下、本発明について詳細に説明する。 Hereinafter, the present invention will be described in detail.
<ポリプロピレン系樹脂>
本発明に用いられるポリプロピレン系樹脂としては、プロピレンを主要な構成成分とする重合体であって、具体的には、プロピレンホモポリマー、プロピレンを主体とするランダム又はブロックプロピレン共重合体を挙げることができる。
<Polypropylene resin>
The polypropylene resin used in the present invention is a polymer having propylene as a main component, and specifically includes a propylene homopolymer and a random or block propylene copolymer mainly composed of propylene. it can.
該プロピレン共重合体としては、例えば、プロピレンとコモノマーとのランダム共重合体又はブロック共重合体であって、プロピレンを主成分とするものが例示できる。該コモノマーとしては、プロピレン以外の1−アルケン(エチレン、1−ブテン、1−ペンテン、1−ヘキセン、4−メチルペンテン等)の他、他のコモノマー、例えば、スチレン、無水マレイン酸、(メタ)アクリル酸等を例示できる。また、該共重合体は、プロピレン−エチレン多元共重合体であってもよく、例えば、プロピレン、エチレンに加えて、5−エチリデン−2−ノルボルネン、5−メチレン−2−ノルボルネン、1,4−ヘキサジエン等を含む共重合体等が例示される。 Examples of the propylene copolymer include a random copolymer or a block copolymer of propylene and a comonomer, which is mainly composed of propylene. Examples of the comonomer include 1-alkenes other than propylene (ethylene, 1-butene, 1-pentene, 1-hexene, 4-methylpentene, etc.) and other comonomers such as styrene, maleic anhydride, (meth) Acrylic acid etc. can be illustrated. The copolymer may be a propylene-ethylene multi-component copolymer. For example, in addition to propylene and ethylene, 5-ethylidene-2-norbornene, 5-methylene-2-norbornene, 1,4- Examples include copolymers containing hexadiene and the like.
上記共重合体におけるプロピレンの含有量は、70〜99重量%程度、特に80〜98重量%程度であることが好ましい。また、プロピレンを主体とする共重合体のなかでも、プロピレン−エチレン共重合体が好ましい。プロピレン−エチレン共重合体としては、エチレンコンテントが1〜30重量%程度、特に2〜20重量%程度の共重合体が好ましい。 The propylene content in the copolymer is preferably about 70 to 99% by weight, particularly about 80 to 98% by weight. Of the copolymers mainly composed of propylene, propylene-ethylene copolymers are preferred. The propylene-ethylene copolymer is preferably a copolymer having an ethylene content of about 1 to 30% by weight, particularly about 2 to 20% by weight.
本明細書において、上記「エチレンコンテント」とは、プロピレン−エチレンコポリマーに含まれているエチレン含有量(エチレン由来の構造部分の含有量)を意味する。上記エチレンコンテントは、一般的に赤外線スペクトル法(J.Polym.Sci.,7,203(1964))により測定することができる。 In the present specification, the “ethylene content” means an ethylene content (content of a structural portion derived from ethylene) contained in a propylene-ethylene copolymer. The ethylene content can be generally measured by an infrared spectrum method (J. Polym. Sci., 7, 203 (1964)).
また、上記ポリプロピレン系樹脂は、他に少量の熱可塑性樹脂、例えば、高密度ポリエチレン、ポリブテン−1、ポリ−4−メチルペンテン−1等を含んでいるポリマーブレンドとして使用してもよい。これらポリマーブレンドにおけるポリプロピレン系樹脂の含有割合は、樹脂中、70〜99重量%程度、特に80〜98重量%程度であることが好ましい。 Moreover, you may use the said polypropylene resin as a polymer blend containing a small amount of thermoplastic resins, for example, high-density polyethylene, polybutene-1, poly-4-methylpentene-1, etc. The content of the polypropylene resin in these polymer blends is preferably about 70 to 99% by weight, particularly about 80 to 98% by weight in the resin.
これらのポリプロピレン系樹脂のメルトフローレート(「MFR」と略記する。JIS K−7210(1999))としては、0.5〜60g/10分程度、好ましくは2〜30g/10分程度が推奨される。射出成形品の場合は、5〜60g/10分程度、好ましくは10〜30g/10分程度が推奨される。また、押出成形品の場合は、0.5〜40g/10分程度、好ましくは2〜15g/10分程度が推奨される。なお、上記のMFRは、荷重2160g、230℃における数値である。 As the melt flow rate (abbreviated as “MFR”) of these polypropylene resins, JIS K-7210 (1999) is recommended to be about 0.5 to 60 g / 10 minutes, preferably about 2 to 30 g / 10 minutes. The In the case of an injection molded product, about 5 to 60 g / 10 min, preferably about 10 to 30 g / 10 min is recommended. In the case of an extrusion-molded product, about 0.5 to 40 g / 10 minutes, preferably about 2 to 15 g / 10 minutes is recommended. In addition, said MFR is a numerical value in load 2160g and 230 degreeC.
本発明において用いられるポリプロピレン系樹脂のMFRは、得られた成形体の剛性、耐衝撃性との機械的特性に影響することが確認されている。 It has been confirmed that the MFR of the polypropylene resin used in the present invention affects the mechanical properties such as rigidity and impact resistance of the obtained molded product.
<アミド化合物>
本発明に用いられるアミド化合物は、下記一般式(1)で示されるアミド化合物が例示される。前記アミド化合物は、β晶核剤として多用される。
一般式(1):
The amide compound used in the present invention is exemplified by an amide compound represented by the following general formula (1). The amide compound is frequently used as a β crystal nucleating agent.
General formula (1):
本明細書及び特許請求の範囲において、R1で表される飽和若しくは不飽和の脂肪族ジカルボン酸残基、飽和若しくは不飽和の脂環族ジカルボン酸残基又は芳香族ジカルボン酸残基とは、対応するジカルボン酸から2つのカルボキシル基を除いて得られる基を指す。 In the present specification and claims, the saturated or unsaturated aliphatic dicarboxylic acid residue, saturated or unsaturated alicyclic dicarboxylic acid residue or aromatic dicarboxylic acid residue represented by R 1 is: A group obtained by removing two carboxyl groups from the corresponding dicarboxylic acid.
また、本明細書及び特許請求の範囲において、R1で表される飽和若しくは不飽和の脂肪族ジカルボン酸残基、飽和若しくは不飽和の脂環族ジカルボン酸残基又は芳香族ジカルボン酸残基の炭素数とは、ジカルボン酸残基としての炭素数(即ち、ジカルボン酸の炭素数から2個の炭素数を引いたもの)を意味する。 In the present specification and claims, the saturated or unsaturated aliphatic dicarboxylic acid residue, saturated or unsaturated alicyclic dicarboxylic acid residue or aromatic dicarboxylic acid residue represented by R 1 The number of carbons means the number of carbons as a dicarboxylic acid residue (that is, the number of carbons of dicarboxylic acid minus two carbons).
一般式(1)で示されるアミド化合物は、一般式(1a)
で表される脂肪族、脂環族、又は芳香族のジカルボン酸と一般式(1b)
で表される1種若しくは2種の脂環族又は芳香族のモノアミンをアミド化することにより容易に調製することができる。
The amide compound represented by the general formula (1) is represented by the general formula (1a)
An aliphatic, alicyclic or aromatic dicarboxylic acid represented by the general formula (1b)
It can be easily prepared by amidating one or two alicyclic or aromatic monoamines represented by:
本発明に係るアミド化合物は、公知であるか又は公知の方法に従い製造できる。例えば、特開平5−310665号公報や特開平7−188246号公報の記載に従って、ジカルボン酸とモノアミンを原料にアミド化反応を行うことにより製造できる。また、これらのジカルボン酸の酸無水物、塩化物、該ジカルボン酸と炭素数1〜4程度の低級アルコールとのエステル化合物等の反応性誘導体をアミド化に供することによっても製造できる。公知の方法に従い製造されたアミド化合物は、若干不純物を含むものであってもよいものの、好ましくは90重量%以上、より好ましくは95重量%以上、特に好ましくは97重量%以上が推奨される。不純物としては、反応中間体又は未反応物由来の部分アミド化物、副反応物由来のイミド化合物等が例示される。 The amide compounds according to the present invention are known or can be prepared according to known methods. For example, it can be produced by carrying out an amidation reaction using a dicarboxylic acid and a monoamine as raw materials according to the descriptions in JP-A-5-310665 and JP-A-7-188246. It can also be produced by subjecting a reactive derivative such as an acid anhydride, chloride, or ester compound of the dicarboxylic acid and a lower alcohol having about 1 to 4 carbon atoms to amidation. The amide compound produced according to a known method may contain some impurities, but 90% by weight or more, more preferably 95% by weight or more, and particularly preferably 97% by weight or more is recommended. Examples of the impurities include partially amidated products derived from reaction intermediates or unreacted materials, imide compounds derived from side reaction products, and the like.
脂肪族ジカルボン酸としては、炭素数3〜26、好ましくは3〜14程度の飽和又は不飽和の脂肪族ジカルボン酸が例示され、より具体的には、マロン酸、ジフェニルマロン酸、コハク酸、フェニルコハク酸、ジフェニルコハク酸、グルタル酸、3,3−ジメチルグルタル酸、アジピン酸、ピメリン酸、スベリン酸、アゼライン酸、セバシン酸、1,12−ドデカン二酸、1,14−テトラデカン二酸、1,18−オクタデカン二酸が例示される。脂環族ジカルボン酸としては、炭素数6〜30、好ましくは8〜12程度の脂環族ジカルボン酸が例示され、より具体的には、1,2−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジカルボン酸、1,4−シクロヘキサンジ酢酸が例示される。 Examples of the aliphatic dicarboxylic acid include saturated or unsaturated aliphatic dicarboxylic acids having 3 to 26 carbon atoms, preferably about 3 to 14 carbon atoms. More specifically, malonic acid, diphenylmalonic acid, succinic acid, phenyl Succinic acid, diphenyl succinic acid, glutaric acid, 3,3-dimethyl glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, 1,12-dodecanedioic acid, 1,14-tetradecanedioic acid, 1 , 18-octadecanedioic acid. Examples of the alicyclic dicarboxylic acid include alicyclic dicarboxylic acids having 6 to 30 carbon atoms, preferably about 8 to 12 carbon atoms, and more specifically 1,2-cyclohexanedicarboxylic acid and 1,4-cyclohexanedicarboxylic acid. Examples include acid and 1,4-cyclohexanediacetic acid.
芳香族ジカルボン酸としては、炭素数8〜30、好ましくは8〜22程度の芳香族ジカルボン酸が例示され、より具体的には、p−フェニレンジ酢酸、p−フェニレンジエタン酸、フタル酸、4−tert−ブチルフタル酸、イソフタル酸、5−tert−ブチルイソフタル酸、テレフタル酸、1,8−ナフタル酸、1,4−ナフタレンジカルボン酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、ジフェン酸、3,3’−ビフェニルジカルボン酸、4,4’−ビフェニルジカルボン酸、4,4’−ビナフチルジカルボン酸、ビス(3−カルボキシフェニル)メタン、ビス(4−カルボキシフェニル)メタン、2,2−ビス(3−カルボキシフェニル)プロパン、2,2−ビス(4−カルボキシフェニル)プロパン、3,3’−スルホニルジ安息香酸、4,4’−スルホニルジ安息香酸、3,3’−オキシジ安息香酸、4,4’−オキシジ安息香酸、3,3’−カルボニルジ安息香酸、4,4’−カルボニルジ安息香酸、3,3’−チオジ安息香酸、4,4’−チオジ安息香酸、4,4’−(p−フェニレンジオキシ)ジ安息香酸、4,4’−イソフタロイルジ安息香酸、4,4’−テレフタロイルジ安息香酸、ジチオサリチル酸、3,9−ビス(p−カルボキシフェニル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス(m−カルボキシフェニル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス(o−カルボキシフェニル)−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン等の芳香族ジカルボン酸が例示される。 Examples of the aromatic dicarboxylic acid include aromatic dicarboxylic acids having 8 to 30 carbon atoms, preferably about 8 to 22 carbon atoms. More specifically, p-phenylene diacetic acid, p-phenylene diethanoic acid, phthalic acid, 4-tert-butylphthalic acid, isophthalic acid, 5-tert-butylisophthalic acid, terephthalic acid, 1,8-naphthalic acid, 1,4-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid Acid, diphenic acid, 3,3′-biphenyldicarboxylic acid, 4,4′-biphenyldicarboxylic acid, 4,4′-binaphthyldicarboxylic acid, bis (3-carboxyphenyl) methane, bis (4-carboxyphenyl) methane, 2,2-bis (3-carboxyphenyl) propane, 2,2-bis (4-carboxyphenyl) propane, 3,3′-sulfonyldibenzoic acid, 4,4′-sulfonyldibenzoic acid, 3,3′-oxydibenzoic acid, 4,4′-oxydibenzoic acid, 3,3′-carbonyldibenzoic acid, 4,4 '-Carbonyldibenzoic acid, 3,3'-thiodibenzoic acid, 4,4'-thiodibenzoic acid, 4,4'-(p-phenylenedioxy) dibenzoic acid, 4,4'-isophthaloyldibenzoic acid, 4,4'-terephthaloyldibenzoic acid, dithiosalicylic acid, 3,9-bis (p-carboxyphenyl) -2,4,8,10-tetraoxaspiro [5,5] undecane, 3,9-bis (m- Carboxyphenyl) -2,4,8,10-tetraoxaspiro [5,5] undecane, 3,9-bis (o-carboxyphenyl) -2,4,8,10-tetraoxaspiro [5,5] Undecane Aromatic dicarboxylic acids are exemplified.
脂環族モノアミンとしては、炭素数3〜18のシクロアルキルアミン、一般式(2)
で表される化合物、又は一般式(3)
で表される化合物が例示される。
Examples of the alicyclic monoamine include cycloalkylamine having 3 to 18 carbon atoms, and general formula (2).
Or a compound represented by the general formula (3)
The compound represented by these is illustrated.
より具体的には、シクロプロピルアミン、シクロブチルアミン、シクロペンチルアミン、シクロヘキシルアミン、2−メチルシクロヘキシルアミン、3−メチルシクロヘキシルアミン、4−メチルシクロヘキシルアミン、2−エチルシクロヘキシルアミン、4−エチルシクロヘキシルアミン、2−プロピルシクロヘキシルアミン、2−イソプロピルシクロヘキシルアミン、4−プロピルシクロヘキシルアミン、4−イソプロピルシクロヘキシルアミン、2−tert−ブチルシクロヘキシルアミン、4−n−ブチルシクロヘキシルアミン、4−イソブチルシクロヘキシルアミン、4−sec−ブチルシクロヘキシルアミン、4−tert−ブチルシクロヘキシルアミン、4−n−アミルシクロヘキシルアミン、4−イソアミルシクロヘキシルアミン、4−sec−アミルシクロヘキシルアミン、4−tert−アミルシクロヘキシルアミン、4−ヘキシルシクロヘキシルアミン、4−ヘプチルシクロヘキシルアミン、4−オクチルシクロヘキシルアミン、4−ノニルシクロヘキシルアミン、4−デシルシクロヘキシルアミン、4−ウンデシルシクロヘキシルアミン、4−ドデシルシクロヘキシルアミン、4−シクロヘキシルシクロヘキシルアミン、4−フェニルシクロヘキシルアミン、シクロヘプチルアミン、シクロドデシルアミン、シクロヘキシルメチルアミン、α−シクロヘキシルエチルアミン、β−シクロヘキシルエチルアミン、α−シクロヘキシルプロピルアミン、β−シクロヘキシルプロピルアミン、γ−シクロヘキシルプロピルアミンが例示される。 More specifically, cyclopropylamine, cyclobutylamine, cyclopentylamine, cyclohexylamine, 2-methylcyclohexylamine, 3-methylcyclohexylamine, 4-methylcyclohexylamine, 2-ethylcyclohexylamine, 4-ethylcyclohexylamine, 2 -Propylcyclohexylamine, 2-isopropylcyclohexylamine, 4-propylcyclohexylamine, 4-isopropylcyclohexylamine, 2-tert-butylcyclohexylamine, 4-n-butylcyclohexylamine, 4-isobutylcyclohexylamine, 4-sec-butyl Cyclohexylamine, 4-tert-butylcyclohexylamine, 4-n-amylcyclohexylamine, 4-isoamylcyclohexyl Min, 4-sec-amylcyclohexylamine, 4-tert-amylcyclohexylamine, 4-hexylcyclohexylamine, 4-heptylcyclohexylamine, 4-octylcyclohexylamine, 4-nonylcyclohexylamine, 4-decylcyclohexylamine, 4-decylcyclohexylamine Undecylcyclohexylamine, 4-dodecylcyclohexylamine, 4-cyclohexylcyclohexylamine, 4-phenylcyclohexylamine, cycloheptylamine, cyclododecylamine, cyclohexylmethylamine, α-cyclohexylethylamine, β-cyclohexylethylamine, α-cyclohexylpropylamine , Β-cyclohexylpropylamine, and γ-cyclohexylpropylamine.
芳香族モノアミンとしては、一般式(4)
で表される化合物、又は一般式(5)
で表される化合物が例示される。
As an aromatic monoamine, general formula (4)
Or a compound represented by the general formula (5)
The compound represented by these is illustrated.
より具体的には、アニリン、o−トルイジン、m−トルイジン、p−トルイジン、o−エチルアニリン、p−エチルアニリン、o−プロピルアニリン、m−プロピルアニリン、p−プロピルアニリン、o−クミジン、m−クミジン、p−クミジン、o−tert−ブチルアニリン、p−n−ブチルアニリン、p−イソブチルアニリン、p−sec−ブチルアニリン、p−tert−ブチルアニリン、p−n−アミルアニリン、p−イソアミルアニリン、p−sec−アミルアニリン、p−tert−アミルアニリン、p−ヘキシルアニリン、p−ヘプチルアニリン、p−オクチルアニリン、p−ノニルアニリン、p−デシルアニリン、p−ウンデシルアニリン、p−ドデシルアニリン、p−シクロヘキシルアニリン、o−アミノジフェニル、m−アミノジフェニル、p−アミノジフェニル、ベンジルアミン、α−フェニルエチルアミン、β−フェニルエチルアミン、α−フェニルプロピルアミン、β−フェニルプロピルアミン、γ−フェニルプロピルアミンが例示される。 More specifically, aniline, o-toluidine, m-toluidine, p-toluidine, o-ethylaniline, p-ethylaniline, o-propylaniline, m-propylaniline, p-propylaniline, o-cumidine, m -Cumidine, p-cumidine, o-tert-butylaniline, pn-butylaniline, p-isobutylaniline, p-sec-butylaniline, p-tert-butylaniline, pn-amylaniline, p-isoamyl Aniline, p-sec-amylaniline, p-tert-amylaniline, p-hexylaniline, p-heptylaniline, p-octylaniline, p-nonylaniline, p-decylaniline, p-undecylaniline, p-dodecyl Aniline, p-cyclohexylaniline, o-aminodiphenyl, - diaminodiphenyl, p- amino diphenyl, benzylamine, alpha-phenylethylamine, beta-phenylethylamine, alpha-phenylpropylamine, beta-phenylpropylamine, .gamma. phenylpropylamine are exemplified.
上記一般式(1)の化合物の中でも、好ましくは、R1が炭素数1〜12程度の飽和若しくは不飽和の脂肪族ジカルボン酸残基、炭素数6〜10程度の飽和若しくは不飽和の脂環族ジカルボン酸残基又は炭素数6〜20程度の芳香族ジカルボン酸残基を表し、R2及びR3が、同一又は異なって、炭素数3〜12程度のシクロアルキル基、又は、一般式(a)、一般式(b)、一般式(c)又は一般式(d)で示される基である。 Among the compounds of the general formula (1), R 1 is preferably a saturated or unsaturated aliphatic dicarboxylic acid residue having about 1 to 12 carbon atoms, a saturated or unsaturated alicyclic ring having about 6 to 10 carbon atoms. Represents an aromatic dicarboxylic acid residue or an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms, and R 2 and R 3 are the same or different, and a cycloalkyl group having about 3 to 12 carbon atoms, or a general formula ( It is a group represented by a), general formula (b), general formula (c) or general formula (d).
より好ましくは、R1が炭素数4〜8程度の飽和脂肪族ジカルボン酸残基、炭素数6〜8程度の飽和脂環族ジカルボン酸残基又は炭素数6〜20程度の芳香族ジカルボン酸残基であり、R2及びR3が、1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基又はフェニル基である。 More preferably, R 1 is a saturated aliphatic dicarboxylic acid residue having about 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having about 6 to 8 carbon atoms, or an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms. R 2 and R 3 are a cyclohexyl group or a phenyl group which may be substituted with one alkyl group having about 1 to 4 carbon atoms.
更に好ましくは、R1が炭素数6〜20程度の芳香族ジカルボン酸残基であり、R2及びR3が、1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基である。 More preferably, R 1 is an aromatic dicarboxylic acid residue having about 6 to 20 carbon atoms, and R 2 and R 3 may be substituted with one alkyl group having about 1 to 4 carbon atoms. It is a group.
特に、R1が、下記一般式(e)又は一般式(f)で表される芳香族ジカルボン酸残基であり、R2及びR3が1個の炭素数1〜4程度のアルキル基で置換されていてもよいシクロヘキシル基であることが推奨される。
一般式(1)で表されるアミド化合物の中でも、好ましい化合物としては、アジピン酸ジアニリド、テレフタル酸ジ(シクロヘキシルアミド)、テレフタル酸ジ(2−メチルシクロヘキシルアミド)、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミド、N,N’−ジ(2−メチルシクロヘキシル)−2,6−ナフタレンジカルボキサミド、3,9−ビス[4-(N−シクロヘキシルカルバモイル)フェニル]−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス[4-(N−4−tert−ブチルシクロヘキシルカルバモイル)フェニル]−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン、3,9−ビス{4-[N−(2,4−ジ−tert−ブチルシクロヘキシル)カルバモイル]フェニル}−2,4,8,10−テトラオキサスピロ[5,5]ウンデカン等が例示でき、特に好ましい化合物としてはN,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドが推奨される。 Among the amide compounds represented by the general formula (1), preferred compounds include adipic acid dianilide, terephthalic acid di (cyclohexylamide), terephthalic acid di (2-methylcyclohexylamide), and N, N′-dicyclohexyl-2. , 6-Naphthalenedicarboxamide, N, N′-di (2-methylcyclohexyl) -2,6-naphthalenedicarboxamide, 3,9-bis [4- (N-cyclohexylcarbamoyl) phenyl] -2,4,8 , 10-tetraoxaspiro [5,5] undecane, 3,9-bis [4- (N-4-tert-butylcyclohexylcarbamoyl) phenyl] -2,4,8,10-tetraoxaspiro [5,5 ] Undecane, 3,9-bis {4- [N- (2,4-di-tert-butylcyclohexyl) carbamoyl] fur Sulfonyl} -2,4,8,10-spiro [5,5] undecane can be exemplified, and as the particularly preferred compound N, N'-dicyclohexyl-2,6-naphthalene dicarboxamide is recommended.
工程(i)のポリプロピレン系樹脂に溶解前のアミド化合物の最大粒径としては、20μm以下、好ましくは10μm以下、より好ましくは5μm以下であることが推奨される。最大粒径が20μmを越えると前記工程(i)でアミド化合物が完全に溶解せず、溶け残りが生ずる可能性がある。溶け残った未溶解アミド化合物は、次の成形過程で結晶の巨大化(肥大化)の原因となり、得られた成形品の衝撃強度の低下、更には二次加工時の破断等の原因となり、好ましくない。ここで、最大粒径は、レーザー回折方式に基づく方法により測定した場合の粒径を指す。 The maximum particle size of the amide compound before being dissolved in the polypropylene resin in step (i) is recommended to be 20 μm or less, preferably 10 μm or less, more preferably 5 μm or less. When the maximum particle size exceeds 20 μm, the amide compound is not completely dissolved in the step (i), and there is a possibility that undissolved residue may be generated. The undissolved undissolved amide compound causes the enlargement of the crystal (enlargement) in the next molding process, the impact strength of the obtained molded product decreases, and further causes the fracture during the secondary processing, It is not preferable. Here, the maximum particle size refers to the particle size when measured by a method based on the laser diffraction method.
<脂肪酸金属塩>
本発明に用いられる脂肪酸金属塩としては、炭素数12〜32、好ましくは16〜28の飽和又は不飽和脂肪酸のカルシウム塩、マグネシウム塩、又は亜鉛塩等が挙げられる。炭素数12〜32の飽和脂肪酸としては、ラウリン酸、パルミチン酸、ステアリン酸、ベヘン酸、リグノセリン酸、セロチン酸、カルボセリック酸、モンタン酸、メリシン酸、ラセロイン酸等が挙げられる。
<Fatty acid metal salt>
Examples of the fatty acid metal salt used in the present invention include calcium salts, magnesium salts, zinc salts and the like of saturated or unsaturated fatty acids having 12 to 32 carbon atoms, preferably 16 to 28 carbon atoms. Examples of the saturated fatty acid having 12 to 32 carbon atoms include lauric acid, palmitic acid, stearic acid, behenic acid, lignoceric acid, serotic acid, carbocelic acid, montanic acid, mellicic acid, and racemic acid.
また、炭素数12〜32の不飽和脂肪酸としては、ミリストレイン酸、パルミトレイン酸、オレイン酸、リノール酸、リノレン酸、エルカ酸、ドコサジエン酸、アドレン酸、オズボンド酸、イワシ酸、ネルボン酸、テトラコサペンタエン酸、ドコサペンタエン酸、ドコサヘキサエン酸、ニシン酸等が挙げられる。 Examples of unsaturated fatty acids having 12 to 32 carbon atoms include myristoleic acid, palmitoleic acid, oleic acid, linoleic acid, linolenic acid, erucic acid, docosadienoic acid, adrenic acid, ozbondic acid, succinic acid, nervonic acid, tetracosa. Examples include pentaenoic acid, docosapentaenoic acid, docosahexaenoic acid, and nisic acid.
これらは、それぞれ単独で又は2種以上適宜組み合わせて使用することもできる。 These may be used alone or in appropriate combination of two or more.
これらの内でも、炭素数16〜28程度の飽和の脂肪酸カルシウム塩が好ましく、更にステアリン酸、ベヘン酸のカルシウム塩が特に好ましい。 Of these, saturated fatty acid calcium salts having about 16 to 28 carbon atoms are preferred, and stearic acid and behenic acid calcium salts are particularly preferred.
<他の添加剤>
本発明に係るポリプロピレン系樹脂組成物には、使用目的やその用途に応じて、適宜、従来公知のポリオレフィン用改質剤を本発明の効果を損なわない程度の範囲で配合してもよい。特に、アミド化合物によるβ晶核剤の核剤効果を阻害する添加剤については、その核剤効果を損なわない範囲で配合することが好ましい。
<Other additives>
In the polypropylene resin composition according to the present invention, a conventionally known modifier for polyolefin may be appropriately blended within a range that does not impair the effects of the present invention, depending on the purpose of use and its use. In particular, an additive that inhibits the nucleating agent effect of the β crystal nucleating agent by the amide compound is preferably blended within a range that does not impair the nucleating agent effect.
かかるポリオレフィン用改質剤としては、例えば、ポリオレフィン等衛生協議会編「ポジティブリストの添加剤要覧」(2001年5月)に記載されている各種添加剤が挙げられ、より具体的には、安定剤(金属化合物、エポキシ化合物、窒素化合物、燐化合物、硫黄化合物、フェノール系化合物、UV吸収剤等)、界面活性剤(非イオン性、陰イオン性、両イオン性、陽イオン性等)、滑剤(パラフィン、ワックス等の脂肪族炭化水素、炭素数8〜22程度の高級脂肪酸、炭素数8〜18程度の脂肪族アルコール、ポリグリコール、炭素数4〜22程度の高級脂肪酸と炭素数4〜18程度の脂肪族1価アルコールとのエステル、炭素数8〜22程度の高級脂肪酸アマイド、シリコーン油、ロジン誘導体等)、充填剤(酸化物、水酸化物、炭酸塩、硫酸塩、ケイ酸塩等)、発泡剤、発泡助剤、ポリマー添加材、本発明に係るアミド化合物以外の有機造核剤等の各種添加剤が例示される。 Examples of such polyolefin modifiers include various additives described in “Polyester Additives Manual” (May 2001) edited by the Sanitation Council for Polyolefins, and more specifically, Agents (metal compounds, epoxy compounds, nitrogen compounds, phosphorus compounds, sulfur compounds, phenolic compounds, UV absorbers, etc.), surfactants (nonionic, anionic, amphoteric, cationic, etc.), lubricants (Aliphatic hydrocarbons such as paraffin and wax, higher fatty acids having about 8 to 22 carbon atoms, aliphatic alcohols having about 8 to 18 carbon atoms, polyglycol, higher fatty acids having about 4 to 22 carbon atoms and 4 to 18 carbon atoms. Ester with aliphatic monohydric alcohol of about grade, higher fatty acid amide having about 8 to 22 carbon atoms, silicone oil, rosin derivative, etc.), filler (oxide, hydroxide, charcoal) , Sulfates, silicates, etc.), foaming agent, foaming aid, polymer additives, various additives organic nucleating agent other than the amide compound according to the present invention is illustrated.
前記有機造核剤として、例えば、従来公知のβ晶ポリプロピレン用核剤が例示される。 Examples of the organic nucleating agent include conventionally known nucleating agents for β-crystal polypropylene.
具体的には、下記一般式(6)
で表される化合物、有機二塩基酸のカルシウム塩、マグネシウム塩、バリウム塩(例えばピメリン酸カルシウム、テレフタル酸カルシウム等)、12−ヒドロキシステアリン酸カリウム、安息香酸マグネシウム、コハク酸マグネシウム、フタル酸マグネシウム等、ベンゼンスルホン酸ナトリウム、ナフタリンスルホン酸ナトリウム等の芳香族スルホン酸化合物、ジカルボン酸ジエステル類又はトリカルボン酸トリエステル類、テトラオキサスピロ化合物類、イミドカルボン酸誘導体、フタロシアニンブルー等のフタロシアニン系、キナクリドン、キナクリドンキノン等のキナクリドン系等の顔料、前記有機二塩基酸と周期律表第IIA族金属の酸化物、水酸化物又は塩とからなる二成分系等が例示される。
Specifically, the following general formula (6)
A compound represented by the formula: calcium salt of organic dibasic acid, magnesium salt, barium salt (eg, calcium pimelate, calcium terephthalate, etc.), potassium 12-hydroxystearate, magnesium benzoate, magnesium succinate, magnesium phthalate, etc. Aromatic sulfonic acid compounds such as sodium benzene sulfonate and sodium naphthalene sulfonate, dicarboxylic acid diesters or tricarboxylic acid triesters, tetraoxaspiro compounds, imide carboxylic acid derivatives, phthalocyanine series such as phthalocyanine blue, quinacridone, quinacridone Examples thereof include quinacridone-based pigments such as quinones, and two-component systems composed of the organic dibasic acids and Group IIA metal oxides, hydroxides or salts of the periodic table.
<ポリプロピレン系樹脂成形体及びその二次加工成形品の製造方法>
本発明のポリプロピレン系樹脂成形体の製造方法は、アミド化合物の針状結晶が溶融状態のポリプロピレン系樹脂中に存在する溶融ポリプロピレン系樹脂組成物を成形する工程を具備し、その溶融ポリプロピレン系樹脂中に本発明に係る方法により得られた微細な針状結晶状のアミド化合物を含有した状態で成形することを特徴とする。更に、得られたポリプロピレン系樹脂成形体を当該技術分野で採用されている方法にて成形加工することにより、二次加工成形品が得られる。例えば、当該成形体を原反シートとして用いた場合、その原反シートを熱成形に供することにより、二次加工成形品が得られる。
<Method for Producing Polypropylene Resin Molded Body and Secondary Processed Molded Product>
The method for producing a polypropylene resin molded body of the present invention comprises a step of molding a molten polypropylene resin composition in which needle-like crystals of an amide compound are present in a molten polypropylene resin, and the molten polypropylene resin Is molded in a state containing a fine acicular crystalline amide compound obtained by the method according to the present invention. Furthermore, a secondary processed molded product is obtained by molding the obtained polypropylene-based resin molded body by a method adopted in the technical field. For example, when the molded body is used as a raw fabric sheet, a secondary processed molded product is obtained by subjecting the raw fabric sheet to thermoforming.
以下、推奨されるポリプロピレン系樹脂成形体及びその二次加工成形品の製造条件について、製造工程に沿って詳しく説明する。 Hereinafter, the recommended manufacturing conditions of the polypropylene resin molded body and the secondary processed molded product will be described in detail along the manufacturing process.
まずポリプロピレン系樹脂成形体の製法方法としては、通常次の手順(工程)が採用される。 First, as a method for producing a polypropylene resin molded article, the following procedure (step) is usually employed.
ポリプロピレン系樹脂(粉末又はフレーク)、アミド化合物及び必要に応じて他の添加剤を混合して、ドライブレンド物(未混練原料)を得る。混合方法には特に制限はなく、ヘンシェルミキサー、Vブレンダー、スーパーミキサー、タンブラー型等の公知の混合機を用いて混合する。混合温度は、通常室温〜100℃程度であり、混合時間は、装置の回転速度等にもよるが、一般に1〜60分間程度である。 A polypropylene resin (powder or flake), an amide compound, and other additives as required are mixed to obtain a dry blend (unkneaded raw material). There is no restriction | limiting in particular in a mixing method, It mixes using well-known mixers, such as a Henschel mixer, a V blender, a super mixer, and a tumbler type. The mixing temperature is usually about room temperature to 100 ° C., and the mixing time is generally about 1 to 60 minutes, although it depends on the rotational speed of the apparatus.
また、本発明に係るポリプロピレン系樹脂組成物は、例えば、ポリプロピレン系樹脂(粉末又はフレーク)とアミド化合物及び脂肪酸カルシウム塩や必要に応じて他の添加剤を高濃度に配合した高濃度添加剤配合物(例えば、上記添加剤を高濃度にポリプロピレン系樹脂に配合したマスターバッチ等)をポリプロピレン系樹脂(粉末又はフレーク)や必要に応じて他の添加剤を配合した未混練原料を、押出機に投入して溶融混練し、押し出すことにより製造することもできる。 The polypropylene resin composition according to the present invention is, for example, a high concentration additive blended with a polypropylene resin (powder or flakes), an amide compound, a fatty acid calcium salt, and other additives as necessary. An unmixed raw material in which a product (for example, a masterbatch in which the above additives are blended with a polypropylene resin at a high concentration) is blended with a polypropylene resin (powder or flakes) or other additives as necessary is fed into an extruder It can also be produced by charging, melt-kneading, and extruding.
続いて、当該技術分野で採用されている一軸あるいは二軸スクリュー押出機、タンデム型混練押出機等によって、そのドライブレンド物を混練温度がTdis以上、Tdis+50℃以下の範囲で混練し、ダイスより吐出された溶融ポリプロピレン系樹脂組成物を素早く水等の冷媒槽に導き、冷却固化させる。次に、冷却固化したストランド状のポリプロピレン系樹脂組成物をペレタイザー等の破断機で適当な長さにカッティングし、ペレット状のポリプロピレン系樹脂組成物に得る。 Subsequently, the dry blend product is kneaded in a range where the kneading temperature is T dis or higher and T dis + 50 ° C. or lower by a uniaxial or twin screw extruder, a tandem kneading extruder, etc. employed in the technical field, The molten polypropylene resin composition discharged from the die is quickly guided to a coolant tank such as water and solidified by cooling. Next, the cooled and solidified strand-shaped polypropylene resin composition is cut into an appropriate length by a breaker such as a pelletizer to obtain a pellet-shaped polypropylene resin composition.
ここで、Tdisは、ポリプロピレン系樹脂にアミド化合物が溶解する温度を表し、ホットステージ上で前記ポリプロピレン系樹脂組成物を加熱し、完全に透明になった温度をTdisとした。 Here, Tdis represents the temperature at which the amide compound is dissolved in the polypropylene resin, and the temperature at which the polypropylene resin composition was completely transparent by heating on the hot stage was defined as Tdis .
前記混練温度は、混練時の溶融樹脂温度を指し、実際の成形機の設定温度は剪断等の掛かり具合により必ずしも、上記範囲である必要はない。 The kneading temperature refers to the temperature of the molten resin at the time of kneading, and the actual set temperature of the molding machine does not necessarily need to be in the above range depending on the degree of application such as shearing.
ここで、ポリプロピレン系樹脂成形体の剛性、耐熱性等の観点から、重要なことは前記ポリプロピレン系樹脂組成物中のアミド化合物が針状結晶であることであり、更にその針状結晶がより微細であることである。針状結晶のアミド化合物を含むポリプロピレン系樹脂組成物を得る方法としては、予め針状結晶のアミド化合物を添加し、該アミド化合物が溶解しない条件で混練する方法もあるが、より微細な針状結晶を得るためには、添加したアミド化合物をいったん溶融ポリプロピレン系樹脂中に溶解し、その後冷却してペレット化する際に針状結晶としてポリプロピレン系樹脂中に析出させる方法、即ち、ポリプロピレン系樹脂及びアミド化合物を含むポリプロピレン系樹脂組成物を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、及び前記工程で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の結晶を析出させる工程による方法が効果的である。 Here, from the viewpoint of the rigidity and heat resistance of the polypropylene resin molded product, it is important that the amide compound in the polypropylene resin composition is a needle crystal, and the needle crystal is finer. It is to be. As a method for obtaining a polypropylene-based resin composition containing an acicular amide compound, there is a method in which an acicular amide compound is added in advance and kneaded under a condition in which the amide compound does not dissolve. In order to obtain crystals, a method in which the added amide compound is once dissolved in a molten polypropylene resin and then precipitated into a polypropylene resin as needle crystals when cooled and pelletized, that is, the polypropylene resin and The step of heating the polypropylene resin composition containing the amide compound to dissolve the amide compound in the molten polypropylene resin, and cooling the molten polypropylene resin composition obtained in the step, A method using a step of precipitating crystals is effective.
一般に溶解状態から結晶を析出させる際の冷却速度が速いほど結晶は微細化しやすく、本発明でも工程(ii)における冷却速度が速いほどより微細な針状結晶が得られる。冷却速度を速くするためには、溶融したポリプロピレン樹脂組成物と冷媒との温度差を大きくすることも好ましいが、ストランド状のポリプロピレン系樹脂組成物の中心部分も含む全体的な冷却速度の観点からすると冷媒と接触している表面からの距離の影響の方がより大きく影響する。これは、ストランド状のポリプロピレン系樹脂組成物の中心部分の冷却速度が、樹脂温度と冷媒の温度差の1乗に比例するのに対して、ストランド状のポリプロピレン系樹脂組成物の中心と表面の距離の2乗に反比例するためと考えられる。 In general, the faster the cooling rate at which crystals are precipitated from the dissolved state, the easier the crystal becomes, and in the present invention, the faster the cooling rate in step (ii), the finer needle-like crystals are obtained. In order to increase the cooling rate, it is also preferable to increase the temperature difference between the molten polypropylene resin composition and the refrigerant, but from the viewpoint of the overall cooling rate including the central portion of the strand-shaped polypropylene resin composition. Then, the influence of the distance from the surface in contact with the refrigerant has a greater influence. This is because the cooling rate of the central portion of the strand-shaped polypropylene resin composition is proportional to the first power of the temperature difference between the resin temperature and the refrigerant, whereas the center and surface of the strand-shaped polypropylene resin composition are This is considered to be inversely proportional to the square of the distance.
従って、本発明では、針状結晶をより微細化するためには、冷媒中で冷却固化する際のダイスから出てきた溶融ポリプロピレン系樹脂組成物のストランドの径をある特定の範囲に制御することが重要である。 Therefore, in the present invention, in order to further refine the needle-like crystals, the diameter of the strands of the molten polypropylene resin composition that has come out of the die when cooled and solidified in the refrigerant is controlled within a certain range. is important.
前記ストランド径の範囲は、0.5mm以上、2.0mm以下が好ましく、更には0.7mm以上、1.5mm以下がより好ましい。 The range of the strand diameter is preferably 0.5 mm or more and 2.0 mm or less, and more preferably 0.7 mm or more and 1.5 mm or less.
ストランドの径が、0.5mm未満では得られたペレットのホッパーへの付着性が著しく及び成形機へのスクリュー噛み込みが困難であり、次の成形工程での使用に耐え得なくなり、2.0mmを超えては、本発明の効果である、剛性、耐熱性の向上が不十分である。 If the strand diameter is less than 0.5 mm, the resulting pellet has extremely high adhesion to the hopper, and it is difficult to bite the screw into the molding machine. Exceeding is insufficient for improvement of rigidity and heat resistance, which are the effects of the present invention.
上記で得られた細いストランド状のポリプロピレン系樹脂組成物は、次に破断機で適当な長さにカッティングされてペレット状の成形原料となる。本発明におけるカッティングする長さが成形時の作業性より上記ストランドの径より大きくする方が好ましく、流れ方向の径が得られたペレットの長径となり、流れ方向と垂直方向の径が短径となる。従って、前記ポリプロピレン系樹脂組成物の短径と上記ストランド径は同義である。尚、ペレット形状は、円柱状、楕円状、立方状いずれの形状でもよい。なお、ペレットが円柱状以外の形状となっている場合については、ペレット中心部分を通るペレット表面間が最短な箇所の長さをもってペレット径とすることができる。 The thin strand polypropylene resin composition obtained above is then cut to an appropriate length by a breaker to form a pellet-shaped forming raw material. The cutting length in the present invention is preferably larger than the diameter of the strand than the workability at the time of forming, the diameter in the flow direction becomes the long diameter of the obtained pellet, and the diameter in the direction perpendicular to the flow direction becomes the short diameter. . Therefore, the short diameter of the polypropylene resin composition and the strand diameter are synonymous. The pellet shape may be any of a cylindrical shape, an elliptical shape, and a cubic shape. In the case where the pellet has a shape other than the columnar shape, the pellet diameter can be determined by the length of the shortest portion between the pellet surfaces passing through the center portion of the pellet.
ポリプロピレン系樹脂組成物中のアミド化合物の針状結晶が微細化することで、ポリプロピレン系樹脂組成物中のアミド化合物の核形成能力を向上することができ、各形成能力はポリプロピレン系樹脂組成物の熱分析にて確認することができる。具体的には、示差走査熱量計(DSC)を用いて、プロピレン系樹脂組成物ペレットを溶融させ、次に結晶化温度まで急冷し、ポリプロピレン系樹脂を等温結晶化させ、その結晶化終了時間(Tend)を測定することで判定できる。得られたポリプロピレン樹脂組成物のTendを目安として、針状結晶形状の変化を確認することができる。即ち、結晶が微細であるほど核剤としての本質的な核剤効果が増大し、その結果Tendが短くなる傾向を示す。 By making the needle-like crystals of the amide compound in the polypropylene resin composition finer, the nucleation ability of the amide compound in the polypropylene resin composition can be improved. It can be confirmed by thermal analysis. Specifically, using a differential scanning calorimeter (DSC), the propylene resin composition pellets are melted, then rapidly cooled to the crystallization temperature, the polypropylene resin is isothermally crystallized, and the crystallization end time ( It can be determined by measuring Tend). Using the Tend of the obtained polypropylene resin composition as a guide, a change in the needle crystal shape can be confirmed. That is, the finer the crystal, the more the essential nucleating agent effect as a nucleating agent, and as a result, Tend tends to be shortened.
本発明におけるポリプロピレン系樹脂組成物のTendは、1.2分以下、より好ましくは1.15分以下、より好ましく1.10分以下であることが推奨される。Tendが1.2分を超えると、本発明の効果である、剛性、耐熱性の向上が不十分である。 It is recommended that the Tend of the polypropylene resin composition in the present invention is 1.2 minutes or less, more preferably 1.15 minutes or less, more preferably 1.10 minutes or less. When Tend exceeds 1.2 minutes, the improvement of rigidity and heat resistance, which are the effects of the present invention, is insufficient.
<ポリプロピレン系樹脂成形体>
本発明に係るポリプロピレン系樹脂成形体は、上記ポリプロピレン系樹脂組成物から、当該技術分野で採用されている射出成形機、Tダイ等が装着された押出成形機、円形ダイが装着されたインフレーション成形機等の公知の成形機を用いて成形する工程を経て製造される。
<Polypropylene-based resin molding>
The polypropylene resin molded body according to the present invention is an injection molding machine employed in the technical field, an extrusion molding machine equipped with a T die, and an inflation molding equipped with a circular die. It is manufactured through a molding process using a known molding machine such as a machine.
この場合も、ポリプロピレン系樹脂成形体を成形する時点におけるアミド化合物が針状結晶であることが重要である。 In this case as well, it is important that the amide compound at the time of molding the polypropylene resin molded body is a needle crystal.
本発明に係るアミド化合物の針状結晶が溶融状態のポリプロピレン系樹脂中に存在する溶融ポリプロピレン系樹脂組成物を成形する工程において、当該溶融ポリプロピレン系樹脂組成物とする為の溶融温度の範囲は、好ましくはTm+10℃以上、Tdis−10℃未満(Tmは、ポリプロピレン系樹脂の融点を表す)、より好ましくはTm+15℃以上、Tdis−15℃未満、特にTm+20℃以上、Tdis−15℃未満が推奨される。なお、当該温度範囲の関係には、(Tm+10℃)<(Tdis−10℃)、(Tm+15℃)<(Tdis−15℃)、或いは(Tm+20℃)<(Tdis−15℃)が成立する。 In the step of molding a molten polypropylene resin composition in which the needle-like crystals of the amide compound according to the present invention are present in a molten polypropylene resin, the range of the melting temperature for the molten polypropylene resin composition is as follows: Preferably, T m + 10 ° C. or more and less than T dis −10 ° C. (T m represents the melting point of the polypropylene resin), more preferably T m + 15 ° C. or more, less than T dis −15 ° C., particularly T m + 20 ° C. Tdis <-15 ° C. is recommended. The relationship between the temperature ranges is (T m + 10 ° C.) <(T dis −10 ° C.), (T m + 15 ° C.) <(T dis −15 ° C.), or (T m + 20 ° C.) <(T dis- 15 ° C) holds.
より具体的には、上記成形工程における溶融温度(樹脂温度)としては、アミド化合物の種類及び配合量にもよるが、190〜260℃程度、好ましくは200〜240℃程度、更に好ましくは200〜230℃程度の範囲である。溶融温度(樹脂温度)を190℃以上に設定することによって、未溶融樹脂の発生が抑制され、260℃以下に設定することによって、ポリプロピレン系樹脂成形体の剛性、耐熱性等の物性を優位に向上させる傾向が認められる。 More specifically, the melting temperature (resin temperature) in the molding step is about 190 to 260 ° C., preferably about 200 to 240 ° C., more preferably 200 to 200 ° C., although it depends on the type and amount of the amide compound. The range is about 230 ° C. By setting the melting temperature (resin temperature) to 190 ° C. or higher, generation of unmelted resin is suppressed, and by setting it to 260 ° C. or lower, physical properties such as rigidity and heat resistance of the polypropylene-based resin molded product are superior. There is a tendency to improve.
また、溶融温度を推奨範囲とすることにより、二次加工成形品へ良影響を及ぼす場合もある。例えば、二次加工時における熱成形工程での破断の発生を優位に抑制することができる。、 In addition, by setting the melting temperature within the recommended range, it may have a positive effect on the secondary processed molded product. For example, the occurrence of breakage in the thermoforming process during secondary processing can be significantly suppressed. ,
射出成形等の金型温度(結晶化温度)としては、通常30〜90℃程度、好ましくは40〜80℃程度の範囲が推奨される。当該推奨範囲において、得られた成形品の剛性、耐熱性が優位に向上する傾向が認められる。また生産性の面でも有利である。ポリプロピレン系成形体(射出成形品)のβ晶含量の観点から、同様の金型温度の範囲が推奨される。 As the mold temperature (crystallization temperature) for injection molding or the like, a range of usually about 30 to 90 ° C, preferably about 40 to 80 ° C is recommended. Within the recommended range, there is a tendency for the rigidity and heat resistance of the obtained molded product to be significantly improved. It is also advantageous in terms of productivity. From the viewpoint of the β crystal content of a polypropylene-based molded product (injection molded product), a similar mold temperature range is recommended.
また、押出シート成形の場合のチルロールの表面温度(結晶化温度)としては、通常50〜120℃程度、好ましくは70〜110℃程度が推奨される。ポリプロピレン系成形体(原反シート)のβ晶含量をできる限り高くしたい場合、110〜130℃程度が好ましく、特に115〜125℃程度が好ましい。 In addition, the surface temperature (crystallization temperature) of the chill roll in the case of extrusion sheet molding is usually about 50 to 120 ° C, preferably about 70 to 110 ° C. When it is desired to increase the β crystal content of the polypropylene-based molded body (raw fabric sheet) as much as possible, it is preferably about 110 to 130 ° C, particularly preferably about 115 to 125 ° C.
ポリプロピレン系樹脂成形体のβ晶含量としては、本発明の効果を損なわない範囲から選択されるが、通常、40〜90%程度とすることが好ましく、特に60〜90%程度とすることが好ましい。
尚、β晶含量は、ポリプロピレン系樹脂成形体を適当な大きさに切り取ったサンプルを、窒素雰囲気下、昇温速度20℃/minでDSC装置(パーキンエルマー社製「ダイヤモンドDSC」)により示差走査熱量分析を行い、このとき得られるDSCサーモグラムのα晶とβ晶の融解熱量から以下の式に従い求めた値である。
β晶含量(%)=100×Hβ/(Hα+Hβ)
[式中、Hβはβ晶の融解熱量を示し、Hαはα晶の融解熱量を示す。]。
The β crystal content of the polypropylene resin molded product is selected from a range that does not impair the effects of the present invention, but is usually preferably about 40 to 90%, particularly preferably about 60 to 90%. .
The β crystal content was measured by differential scanning with a DSC apparatus (“Diamond DSC” manufactured by PerkinElmer Co., Ltd.) under a nitrogen atmosphere at a heating rate of 20 ° C./min. A calorimetric analysis is performed, and a value obtained from the heat of fusion of α crystal and β crystal of the DSC thermogram obtained at this time according to the following formula.
β crystal content (%) = 100 × H β / (H α + H β )
[Wherein, H β represents the heat of fusion of the β crystal, and H α represents the heat of fusion of the α crystal. ].
<二次加工成形品>
本発明に係る二次加工方法としては、真空成形、圧空成形等の熱成形等の通常の方法が用いられる。
<Secondary processed molded products>
As the secondary processing method according to the present invention, usual methods such as thermoforming such as vacuum forming and pressure forming are used.
かくして得られた本発明に係るポリプロピレン系樹脂成形体は、剛性、耐熱性に優れており、いずれも、従来公知のポリプロピレン系樹脂成形体が使用されてきた分野と同様の分野において利用することができる。特に、衝撃強度が高いので、自動車部品、機械光学部品、化学工業部品、家電部品等の成形品として使用することができる。更に、得られた成形体は二次加工性に優れており、真空成形、圧空成形等の従来公知の二次加工成形に供することが可能であり、従来公知の二次加工成形品の分野において利用することができる。 The thus obtained polypropylene resin molded product according to the present invention is excellent in rigidity and heat resistance, both of which can be used in the same fields as those in which conventionally known polypropylene resin molded products have been used. it can. Particularly, since the impact strength is high, it can be used as a molded product such as an automobile part, a mechanical optical part, a chemical industry part, or a home appliance part. Further, the obtained molded body is excellent in secondary workability, and can be used for conventionally known secondary processing molding such as vacuum molding and pressure forming, and in the field of conventionally known secondary processing molded products. Can be used.
以下に実施例及び比較例を示し、本発明を詳しく説明するが、本発明はこれらの実施例によって制限されるものではない。尚、ストランド透明性、ポリプロピレン系樹脂組成物ペレット径の測定、結晶化完了時間、成形時の取り扱い性、ポリプロピレン系樹脂成形体の剛性(曲げ弾性率)、耐熱性(熱変形温度)、ポリプロピレン系樹脂成形体(押出シート)の引張弾性率は、以下の方法により求めた。 Hereinafter, the present invention will be described in detail with reference to examples and comparative examples, but the present invention is not limited to these examples. In addition, strand transparency, measurement of polypropylene resin composition pellet diameter, crystallization completion time, handling during molding, rigidity (flexural modulus) of polypropylene resin molding, heat resistance (thermal deformation temperature), polypropylene The tensile elastic modulus of the resin molded body (extruded sheet) was determined by the following method.
(1)ストランド透明性
ダイスから吐出された溶融ポリプロピレン系樹脂組成物を目視で観察した。アミド化合物が完全に溶解している場合は透明(○)であり、未溶解物が残っている場合は白濁(×)している。
(1) Strand transparency The molten polypropylene resin composition discharged from the dice was visually observed. When the amide compound is completely dissolved, it is transparent (o), and when an undissolved substance remains, it is cloudy (x).
(2)ペレット径(短径)の測定
各実施例及び比較例で得られたサンプルペレットについて、任意に10粒採取し、精密ノギスにてサンプルペレット径を測定し、平均値をペレット径(短径)とした。なお、ペレットが扁平となっている場合については、ペレット径の最も小さい箇所の径を短径として測定した。
(2) Measurement of pellet diameter (short diameter) About 10 sample pellets obtained in each Example and Comparative Example, 10 pellets were arbitrarily collected, the sample pellet diameter was measured with precision calipers, and the average value was determined as the pellet diameter (short Diameter). In addition, about the case where a pellet is flat, the diameter of the location with the smallest pellet diameter was measured as a short diameter.
(3)結晶化完了時間(Tend)
示差走査熱量計(パーキンエルマー社製、商品名「ダイヤモンドDSC」)を用いて、測定サンプル(サンプル重量=10mg、各実施例及び比較例で得られたペレット)を昇温速度100℃/分で200℃まで昇温させ、その温度の到達後5分間保持した。次に、冷却速度300℃/分で「結晶化終了時間」の測定温度135℃まで急冷し、ポリプロピレン系樹脂を等温結晶化させた。尚、急冷して測定温度に達した時間を「結晶化終了時間」の測定開始時間とした。得られた示差走査熱量法(DSC)のチャートから、長時間側のベースラインを短時間側に延長した延長線と、発熱ピークの長時間側の曲線勾配が最大になる点で引いた接線の交点に対応する時間を記録し、同測定、記録を3回繰り返し、平均値を「結晶化終了時間」(分)とした。なお、「結晶化終了時間」が短い程、核形成能力が高いことを示す。
(3) Crystallization completion time (Tend)
Using a differential scanning calorimeter (manufactured by Perkin Elmer, trade name “Diamond DSC”), a measurement sample (sample weight = 10 mg, pellets obtained in each example and comparative example) was heated at a rate of 100 ° C./min. The temperature was raised to 200 ° C. and held for 5 minutes after reaching that temperature. Next, the polypropylene resin was isothermally crystallized at a cooling rate of 300 ° C./minute and rapidly cooled to a measurement temperature of 135 ° C. of “crystallization end time”. The time when the sample was rapidly cooled and reached the measurement temperature was defined as the measurement start time of “crystallization end time”. From the obtained differential scanning calorimetry (DSC) chart, an extension line obtained by extending the long-time base line to the short-time side and a tangent line drawn at the point where the long-term curve slope of the exothermic peak is maximized. The time corresponding to the intersection point was recorded, and the same measurement and recording were repeated three times, and the average value was defined as “crystallization end time” (minutes). Note that the shorter the “crystallization end time”, the higher the nucleation ability.
(4)成形時の取り扱い性
各実施例及び比較例で得られたサンプルペレットについて、成形機のホッパーへの付着性及びスクリューへのペレット噛み込みを確認した。付着性のない、又は非常に弱く、かつ成形機のスクリュー噛み込みが良好なものを○、付着性が強いか、または押出機のスクリュー噛み込みが不良なものを×と判定した。付着性の強いものはホッパー等へペレットが付着し、また、スクリューへの噛み込みが不良のものは、工程(iii)の成形機への供給が困難であり、使用に耐え得ない。
(4) Handling at the time of molding About the sample pellet obtained by each Example and the comparative example, the adhesiveness to the hopper of a molding machine and the pellet biting to the screw were confirmed. The case where there was no adhesion or very weakness and the screwing of the molding machine was good was judged as ◯, and the case where the adhesion was strong or the screwing of the extruder was poor, was judged as x. In the case of a highly adherent material, pellets adhere to a hopper or the like, and in the case of poor biting into the screw, it is difficult to supply to the molding machine in step (iii) and cannot be used.
(5)剛性:曲げ弾性率
ASTM D790に準拠して、25℃にてポリプロピレン系樹脂成形体を用いて測定した。
(5) Rigidity: Flexural modulus Measured using a polypropylene resin molded body at 25 ° C. in accordance with ASTM D790.
(6)耐熱性:熱変形温度(HDT)
JIS K 7207に準拠して、ポリプロピレン系樹脂成形体の荷重4.6kgf/cm2における熱変形温度を測定した。熱変形温度が高いほど、耐熱性に優れていることを
(6) Heat resistance: heat distortion temperature (HDT)
In accordance with JIS K 7207, the heat distortion temperature of the polypropylene resin molded body at a load of 4.6 kgf / cm 2 was measured. The higher the heat distortion temperature, the better the heat resistance.
(7)引張弾性率(シート)
引張試験片は、樹脂の流れ方向(MD方向)に10mm幅の短冊上に切断し、測定長50mm、JIS K 7227に準拠して、引張速度50m/min、25℃にてポリプロピレン系樹脂成形体を用いて測定した。
<実施例1>
(7) Tensile modulus (sheet)
The tensile test piece was cut on a strip of 10 mm width in the resin flow direction (MD direction), and a polypropylene resin molded body at a measurement length of 50 mm and a tensile speed of 50 m / min at 25 ° C. in accordance with JIS K 7227. It measured using.
<Example 1>
ポリプロピレン系樹脂としてポリプロピレンホモポリマー(MFR=10g/10分(荷重2160g、温度230℃),融点;168℃)100重量部、アミド化合物としてN,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミド(商品名;エヌジェスターNU−100,新日本理化株式会社製)0.3重量部、及び脂肪酸カルシウム塩としてベヘン酸カルシウム(日東化成工業株式会社製、商品名「CS−7」)0.05重量部、並びにポリオレフィン用改質剤としてテトラキス[メチレン−3−(3,5−ジ−tert−ブチル−4−ヒドロキシフェニル)プロピオネート]メタン(チバスペシャルティーケミカルズ社製、商品名「IRGANOX1010」)0.05重量部、テトラキス(2,4−ジ−tert−ブチルフェニル)ホスファイト(チバスペシャルティーケミカルズ社製、商品名「IRGAFOS168」)0.10重量部、1,3,5−トリス(4−tert−ブチル−3−ヒドロキシ−2,6−ジメチルベンジル)イソシアヌル酸と(2,4−ジ−tert−ブチルフェニル)ホスファイトとの1:2(重量比)ブレンド(商品名、「サイアノックス2777」、サイテック・インダストリーズ社製)0.1重量部をドライブレンドした。そのドライブレンド物を二軸押出機((株)テクノベル社製 L/D=45、スクリュー径15mm、ダイス径5mm)にて混練温度(樹脂温度)300℃で溶融混練して、N,N’−ジシクロヘキシル−2,6−ナフタレンジカルボキサミドを溶解させ、押し出されたストランドを冷却し、ペレタイザーでカッティングして、ポリプロピレン系樹脂組成物ペレットを調製した。なお、当該ペレットは、ストランドを25℃の水槽を通過させ、ペレタイザーの引取速度を制御し、ペレット径が1.3mmとなるよう製造を行った。また、当該ストランドは透明であり、未溶解物は認められなかった。得られたポリプロピレン系樹脂組成物ペレットの結晶化完了時間を測定し、それらの結果を表1にまとめた。 Polypropylene homopolymer (MPR = 10 g / 10 min (load 2160 g, temperature 230 ° C.), melting point: 168 ° C.) 100 parts by weight as a polypropylene resin, N, N′-dicyclohexyl-2,6-naphthalenedicarboxamide ( Product name: NG Star NU-100, manufactured by Shin Nippon Rika Co., Ltd., 0.3 parts by weight, and fatty acid calcium salt, calcium behenate (manufactured by Nitto Kasei Kogyo Co., Ltd., product name “CS-7”) 0.05 weight Part, and tetrakis [methylene-3- (3,5-di-tert-butyl-4-hydroxyphenyl) propionate] methane (trade name “IRGANOX1010” manufactured by Ciba Specialty Chemicals) as a polyolefin modifier. 05 parts by weight, tetrakis (2,4-di-tert-butyl Nyl) phosphite (Ciba Specialty Chemicals, trade name “IRGAFOS168”) 0.10 parts by weight, 1,3,5-tris (4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanur Dry blend of 0.1 parts by weight of a 1: 2 (weight ratio) blend of acid and (2,4-di-tert-butylphenyl) phosphite (trade name, “Sianox 2777”, manufactured by Cytec Industries) did. The dry blend was melt-kneaded at a kneading temperature (resin temperature) of 300 ° C. with a twin-screw extruder (L / D = 45, manufactured by Technobel Co., Ltd., screw diameter 15 mm, die diameter 5 mm), and N, N ′ -Dicyclohexyl-2,6-naphthalenedicarboxamide was dissolved, and the extruded strand was cooled and cut with a pelletizer to prepare a polypropylene resin composition pellet. The pellets were produced so that the strands were passed through a 25 ° C. water tank, the take-up speed of the pelletizer was controlled, and the pellet diameter was 1.3 mm. Moreover, the said strand was transparent and the undissolved material was not recognized. The crystallization completion time of the obtained polypropylene resin composition pellets was measured, and the results are summarized in Table 1.
次に、得られたポリプロピレン系樹脂組成物を射出温度200℃、金型温度40℃の条件下で射出して、本発明のポリプロピレン系樹脂成形体(試験片)を得た。得られた試験片の曲げ弾性率、熱変形温度を測定し、それらの結果を表1にまとめた。
<実施例2>
Next, the obtained polypropylene resin composition was injected under conditions of an injection temperature of 200 ° C. and a mold temperature of 40 ° C. to obtain a polypropylene resin molded body (test piece) of the present invention. The obtained test pieces were measured for flexural modulus and heat distortion temperature, and the results are summarized in Table 1.
<Example 2>
ペレット径を0.8mmとなるようポリプロピレン系樹脂組成物ペレットの製造を行った以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例3>
Except that the polypropylene resin composition pellet was produced so that the pellet diameter was 0.8 mm, the same operation as in Example 1 was performed to obtain a polypropylene resin composition pellet and a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 3>
ペレット径を1.7mmとなるようポリプロピレン系樹脂組成物ペレットの製造を行った以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例4>
A polypropylene resin composition pellet and a polypropylene resin molded article were obtained in the same manner as in Example 1 except that the polypropylene resin composition pellet was produced so that the pellet diameter was 1.7 mm. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 4>
ストランド冷却に要する水槽の水温を55℃に代えた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例5>
A polypropylene resin molded body was obtained by performing the same operation as in Example 1 except that the water temperature of the water tank required for strand cooling was changed to 55 ° C. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 5>
アミド化合物の配合量を0.1重量部に、混練温度(樹脂温度)を ℃に代えた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例6>
A polypropylene resin molded article was obtained in the same manner as in Example 1 except that the amount of the amide compound was changed to 0.1 parts by weight and the kneading temperature (resin temperature) was changed to ° C. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 6>
射出成形温度を240℃に代えた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例7>
Except that the injection molding temperature was changed to 240 ° C., the same operation as in Example 1 was performed to obtain a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 7>
脂肪酸カルシウム塩として、ステアリン酸カルシウムを用いた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<実施例8>
Except for using calcium stearate as the fatty acid calcium salt, the same operation as in Example 1 was performed to obtain a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Example 8>
アミド化合物として、3,9-ビス[4-(N-シクロヘキシルカルバモイル)フェニル]-2,4,8,10-テトラオキサスピロ[5.5]ウンデカン0.2重量部を用いた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<比較例1>
Implementation was carried out except that 0.2 parts by weight of 3,9-bis [4- (N-cyclohexylcarbamoyl) phenyl] -2,4,8,10-tetraoxaspiro [5.5] undecane was used as the amide compound. The same operation as in Example 1 was performed to obtain a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Comparative Example 1>
ペレット径を2.4mmとなるようポリプロピレン系樹脂組成物ペレットの製造を行った以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<比較例2>
Except that the polypropylene resin composition pellets were produced so as to have a pellet diameter of 2.4 mm, the same operations as in Example 1 were performed to obtain polypropylene resin composition pellets and polypropylene resin molded bodies. The composition, production conditions, and results obtained are summarized in Table 1.
<Comparative example 2>
ペレット径を2.1mmとなるようポリプロピレン系樹脂組成物ペレットの製造を行った以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<比較例3>
Except that the polypropylene resin composition pellets were produced so as to have a pellet diameter of 2.1 mm, the same operations as in Example 1 were performed to obtain polypropylene resin composition pellets and a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Comparative Example 3>
ペレット径を0.4mmとなるようポリプロピレン系樹脂組成物ペレットの製造を行った以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
Except that the polypropylene resin composition pellets were manufactured to have a pellet diameter of 0.4 mm , the same operations as in Example 1 were performed to obtain polypropylene resin composition pellets and a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
混練温度(樹脂温度)を250℃で溶融混練した以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。
<比較例5>
Except for melt-kneading at a kneading temperature (resin temperature) of 250 ° C., the same operation as in Example 1 was performed to obtain a polypropylene resin composition pellet and a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 1.
<Comparative Example 5>
射出成形温度を280℃に変えた以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。 Except having changed the injection molding temperature to 280 degreeC , operation similar to Example 1 was performed and the polypropylene resin composition pellet and the polypropylene resin molding were obtained. The composition, production conditions, and results obtained are summarized in Table 1.
アミド系化合物を配合しない以外は、実施例1と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表1に示した。 Except not mix | blending an amide type compound, operation similar to Example 1 was performed and the polypropylene resin composition pellet and the polypropylene resin molding were obtained. The composition, production conditions, and results obtained are summarized in Table 1.
<実施例9>
<Example 9>
実施例1で得られたポリプロピレン系樹脂組成物ペレットを、Tダイ一軸押出機((株)テクノベル社製、L/D=28、スクリュー径25mm)を用いて、200℃の樹脂温度で溶融混練してスクリュー回転数20rpmにて溶融押出し、表面温度120℃のチルロールで冷却固化し、厚さ300μmのポリプロピレン系樹脂成形体(押出シート)を得た。組成、製造条件、及び得られた結果をまとめて表2に示した。
<実施例10>
The polypropylene resin composition pellets obtained in Example 1 were melt kneaded at a resin temperature of 200 ° C. using a T-die uniaxial extruder (manufactured by Technobell, L / D = 28, screw diameter 25 mm). Then, it was melt-extruded at a screw rotation number of 20 rpm and cooled and solidified with a chill roll having a surface temperature of 120 ° C. to obtain a polypropylene resin molded body (extruded sheet) having a thickness of 300 μm. The composition, production conditions, and results obtained are summarized in Table 2.
<Example 10>
実施例2で得られたポリプロピレン系樹脂組成物ペレットを用いた以外は、実施例9と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表2に示した。
<比較例7>
Except having used the polypropylene resin composition pellet obtained in Example 2, the same operation as in Example 9 was performed to obtain a polypropylene resin composition pellet and a polypropylene resin molded body. The composition, production conditions, and results obtained are summarized in Table 2.
<Comparative Example 7>
比較例1で得られたポリプロピレン系樹脂組成物ペレットを用いた以外は、実施例9と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表2に示した。
<比較例8>
Except having used the polypropylene resin composition pellet obtained in Comparative Example 1, the same operation as in Example 9 was performed to obtain a polypropylene resin composition pellet and a polypropylene resin molded article. The composition, production conditions, and results obtained are summarized in Table 2.
<Comparative Example 8>
比較例2で得られたポリプロピレン系樹脂組成物ペレットを用いた以外は、実施例9と同様の操作を行って、ポリプロピレン系樹脂組成物ペレットおよびポリプロピレン系樹脂成形体を得た。組成、製造条件、及び得られた結果をまとめて表2に示した。 Except having used the polypropylene resin composition pellet obtained in Comparative Example 2, the same operation as in Example 9 was performed to obtain a polypropylene resin composition pellet and a polypropylene resin molded article. The composition, production conditions, and results obtained are summarized in Table 2.
本発明により、ポリプロピレン系樹脂組成物中のアミド化合物の微細化が達成され、その結果、該ポリプロピレン系樹脂組成物を原料とした成形品の剛性や耐熱性の向上が可能となる。また、押出シートの引張弾性率も向上し、更に、二次加工成形品である熱成形品を生産する際の二次加工性や得られた二次加工品の特性も大きく改善することができる。 By this invention, refinement | miniaturization of the amide compound in a polypropylene resin composition is achieved, As a result, the rigidity and heat resistance of the molded article which used this polypropylene resin composition as a raw material are attained. In addition, the tensile modulus of the extruded sheet is improved, and further, the secondary workability and the properties of the obtained secondary work product when producing a thermoformed product that is a secondary work product can be greatly improved. .
Claims (17)
該ポリプロピレン系樹脂組成物の形状が短径0.5mm以上、2.0mm以下であるペレット状であり、かつ成形時に該アミド化合物の微細な針状結晶が溶融状態のポリプロピレン系樹脂中に存在していることを特徴とするポリプロピレン系樹脂成形体の製造方法。
一般式(1):
The shape of the polypropylene resin composition is a pellet having a minor axis of 0.5 mm or more and 2.0 mm or less, and fine needle crystals of the amide compound are present in the molten polypropylene resin at the time of molding. A method for producing a polypropylene-based resin molded product, wherein:
General formula (1):
前記工程(i)におけるポリプロピレン系樹脂組成物の溶融温度が、Tdis以上、Tdis+50℃以下(Tdisはポリプロピレン系樹脂にアミド化合物が溶解する温度を表す)の範囲であり、かつ、
前記工程(ii)において、冷却固化時のストランドの直径を0.5mm以上、2.0mm以下の範囲に調整することを特徴とする請求項1に記載のポリプロピレン系樹脂成形体の製造方法。 A step of dissolving a amide compound in a melted polypropylene resin by heating a non-kneaded raw material containing a polypropylene resin and an amide compound (i) a polypropylene resin composition containing fine acicular crystals of an amide compound; And (ii) a composition obtained by a production method comprising a step of cooling the molten polypropylene resin composition obtained in the step (i) to precipitate fine acicular crystals of an amide compound. ,
The melting temperature of the polypropylene resin composition in the step (i) is in the range of T dis or more and T dis + 50 ° C. or less (T dis represents the temperature at which the amide compound is dissolved in the polypropylene resin), and
In the said process (ii), the diameter of the strand at the time of cooling solidification is adjusted to the range of 0.5 mm or more and 2.0 mm or less, The manufacturing method of the polypropylene resin molding of Claim 1 characterized by the above-mentioned.
3が、同一又は異なって、それぞれ1個の炭素数1〜4のアルキル基で置換されていてもよいシクロヘキシル基又はフェニル基である請求項1〜3の何れかに記載のポリプロピレン系樹脂成形体の製造方法。 In the general formula (1), R 1 is a saturated aliphatic dicarboxylic acid residue having 4 to 8 carbon atoms, a saturated alicyclic dicarboxylic acid residue having 6 to 8 carbon atoms, or an aromatic dicarboxylic acid having 6 to 20 carbon atoms. Residues R 2 and R
3 is the same or different, and each is a cyclohexyl group or a phenyl group which may be substituted with one alkyl group having 1 to 4 carbon atoms, and a polypropylene resin molded article according to any one of claims 1 to 3 Manufacturing method.
(i)ポリプロピレン系樹脂及びアミド化合物を含む未混練原料を加熱し、溶融したポリプロピレン系樹脂中にアミド化合物を溶解させる工程、及び(ii)前記工程(i)で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の針状結晶を析出させる工程を具備する方法であり、かつ、
前記工程(ii)において、冷却固化時のストランドの直径を0.5mm以上、2.0mm以下の範囲に調整することを特徴とする方法。
一般式(1):
(I) a step of heating an unkneaded raw material containing a polypropylene resin and an amide compound to dissolve the amide compound in the molten polypropylene resin, and (ii) a molten polypropylene system obtained in the step (i). A method comprising cooling the resin composition to precipitate amide compound needle crystals; and
In the step (ii), the diameter of the strand at the time of cooling and solidification is adjusted to a range of 0.5 mm or more and 2.0 mm or less.
General formula (1):
(ii)前記工程(i)で得られた溶融状態のポリプロピレン系樹脂組成物を冷却して、アミド化合物の微細な針状結晶を析出させる工程、及び
(iii)前記工程(ii)で得られたアミド化合物の微細な針状結晶を析出させたポリプロピレン系樹脂組成物を、Tm+10℃以上、Tdis−10℃未満(Tmは、ポリプロピレン系樹脂の融点を表す)の温度範囲で溶融させ、成形する工程を含むポリプロピレン系樹脂成形体の製造方法であって、
前記工程(ii)で得られたアミド系化合物の針状結晶を含有するポリプロピレン系樹脂組成物がペレット形状であり、その短径が0.5mm以上、2.0mm以下の範囲であることを特徴とするポリプロピレン系樹脂成形体の製造方法。
一般式(1):
(Ii) a step of cooling the molten polypropylene resin composition obtained in the step (i) to precipitate fine acicular crystals of an amide compound; and (iii) obtained in the step (ii). A polypropylene resin composition in which fine acicular crystals of the amide compound were precipitated was melted in a temperature range of T m + 10 ° C. or higher and less than T dis −10 ° C. (T m represents the melting point of the polypropylene resin). is a manufacturing how polypropylene-based resin molded article comprising a step of forming,
The polypropylene resin composition containing acicular crystals of the amide compound obtained in the step (ii) has a pellet shape, and its minor axis is in the range of 0.5 mm or more and 2.0 mm or less. A method for producing a polypropylene resin molded product.
General formula (1):
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