JPH0799229A - Position aligning device - Google Patents

Abstract

PURPOSE:To align the giving and receiving position simply and accurately when a wafer is given and received between a wafer chuck for holding the wafer and a wafer holding toll tool for holding the wafer in a cleaning tank. CONSTITUTION:The images of a holding groove P1 of a holding rod on the side of a wafer chuck and a holding groove Q1 of a holding rod 43 on the side of a wafer holding tool 41 are picked up with an image pickup device 55. The respective images of the holding groove P1 and the holding groove Q1 are displayed on the same coordinate system in the screen of the same monitor. When the positions are deviated, the images are deviated and displayed on the same screen. Therefore, when the wafer chuck is adjusted so that both images agree, the positions can be aligned simply and accurately.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an alignment device.

[0002]

2. Description of the Related Art A cleaning process in a manufacturing process of a semiconductor device such as an LSI will be described as an example. Conventionally, contamination of particles, organic contaminants, metal impurities, etc. on the surface of a semiconductor wafer (hereinafter referred to as "wafer") is prevented. A cleaning processor is used to remove it,
Among them, the wet cleaning device can effectively remove particles and can perform batch processing,
Widely used.

In such a wet cleaning apparatus, a load mechanism for loading a predetermined number of wafers, for example, 25 wafers in a cassette unit, and a wafer transfer device for transporting a predetermined number of wafers, for example, 50 wafers, loaded by the load mechanism. And a plurality of cleaning processing tanks arranged to collectively clean the wafers transferred by the wafer transfer apparatus, and an unload mechanism for unloading the wafers cleaned by the cleaning processing tanks. Has been done.

The wafer transfer device has a holding device called a wafer chuck that simultaneously holds a predetermined number of wafers, for example, 50 wafers at the same time when the wafers are transferred to the cleaning processing tanks. This gripping device is usually
A plurality of gripping grooves corresponding to the number of wafers to be gripped are formed at predetermined intervals on a pair of facing gripping members that protrude in a substantially horizontal direction. The wafer is vertically held by the gripping device when the parts are inserted and the gripping members approach each other.

On the other hand, a holder called a boat for holding the wafer which is gripped and conveyed by the gripping device is provided in the cleaning processing tank for cleaning the wafer. Since this holder collectively receives and holds the wafers held by the holding device in a batch, a plurality of holding grooves corresponding to the holding grooves in the holding device are formed, and each wafer is held in each holding groove. Is configured to vertically receive the peripheral edge portion of and hold the wafer at a predetermined holding position.

Therefore, when a wafer is transferred between the holding device and the holder, the holding groove in the holding device and the holding groove in the holding device hold the wafer. If the relative positions of the transfer and reception are the same, that is, they are not on the same vertical plane, the wafer cannot be transferred and received smoothly. Therefore, the gripping position and the holding position need to be adjusted in advance between the gripping device and the holder. Usually, the holder is fixed in the cleaning treatment tank, and thus the position is adjusted by appropriately moving the holding device in the XY directions.

And regarding such alignment,
Conventionally, a plurality of dummy wafers are actually gripped by a gripping device and moved to a transfer position, and an operator manually adjusts the setting position of the gripping device as appropriate and carefully checks with eyes and ears each of the gripped wafers. The peripheral edges were aligned so that they could be correctly and vertically transferred into the corresponding holding grooves in the holder.

In addition, for example, the transfer position by the gripping device is accurately measured in advance to determine the reference position, an appropriate distance sensor is installed to constantly detect the position of the gripping device, and the difference from the reference position is calculated. For example, it has been proposed to detect a positional deviation by displaying a numerical value and adjust the set position of the gripping device as appropriate so that the difference becomes 0 to perform positional alignment.

[0009]

However, the method of aligning while checking with the eyes and ears of the former operator is as follows.
It depends on the skill of each operator, and it cannot be said that there are no human errors, and it lacks reliability. In addition, since it is necessary to directly look into the state of the actual transfer in the cleaning treatment tank, the working environment is bad, and it takes a lot of time and labor before adjustment.

On the other hand, in the latter method of aligning based on the reference position, an error is likely to occur in the actual measurement stage when determining the reference position of the gripping device, and the reliability is low as in the case of the manual operation. Moreover, since the gripping device is not in a simple form, it is necessary to install distance sensors necessary for detecting the position at many places, which complicates the device itself. In addition, since it is necessary to install such a sensor inside the cleaning tank, problems such as cleaning liquid resistance and watertightness newly occur.
This point is not preferable either.

The present invention has been made in view of such a problem, and the relative position between the gripping position of the gripping device and the holding position of the holder, that is, the alignment based on the relative position is easy with a simple device configuration. An object of the present invention is to provide a positioning device that can be quickly and accurately provided to solve the above problem.

[0012]

In order to achieve the above-mentioned object, according to claim 1, a plurality of objects to be processed in a state of being held at a predetermined holding position in a holding device are held at a predetermined holding position in a holder. A device for aligning the relative position of the gripping position and the holding position at the time of the transfer in a transfer system configured to transfer to and from a proper jig which is gripped by the gripping device. And an image pickup device for picking up the grip position and the holding position at the same time, and a display for superimposing and displaying the grip position and the holding position picked up by the image pickup device on the same coordinate system in the same image display unit. And a device,
An alignment device is provided.

According to a second aspect of the present invention, the transfer system is configured so as to transfer a plurality of objects to be processed held in a predetermined holding position in the holding device to a predetermined holding position in a holder. A device for aligning the relative position between the gripping position and the holding position at the time of, and image pickup devices are provided at two positions of an appropriate jig held by the gripping device. Is configured to simultaneously image the first gripping position and the holding position, and the other imaging device in the imaging device is configured to simultaneously image the other second gripping position and the holding position. A display device for displaying the gripping position and the holding position imaged by the image pickup device in an overlapping manner in the same coordinate system in the same image display unit for each of the image pickup devices. , Alignment device is provided.

In this case, as described in claim 3, the first gripping position and the holding position are the one end and the second gripping position and the holding position are the other gripping position and the holding position, respectively. Good.

In each of these alignment devices, as described in claim 4, the gripping position and the holding position imaged by each of the image pickup devices are the same in the same image display section for each of the image pickup devices. The coordinate system may be provided with a display device that divides each of the imaging devices and displays the images in an overlapping manner. That is, sharing the display device,
The image display unit may be divided and displayed for each imaging device.

Further, as in claim 5, a distance sensor for detecting a distance between the gripping device and the holder may be provided on an appropriate jig in each of the above-mentioned positioning devices.

According to a sixth aspect of the present invention, the transfer system is configured so as to transfer a plurality of objects to be processed held in a predetermined holding position in the holding device to a predetermined holding position in a holder. A device for performing relative position alignment between the gripping position and the holding position at the time of, and an image pickup device is provided on an appropriate support jig held by the holder, and the image pickup device is The holding position is constantly imaged, and the gripping position of the gripping device is also imaged at the same time when the gripping device is located near the height during the transfer (including, of course, the height during the transfer). And a display device for displaying the grip position and the holding position imaged by the imaging device as an image by superimposing them on the same coordinate system in the same image display unit. Location is provided.

According to a seventh aspect of the present invention, a plurality of objects to be processed held in a predetermined holding position in the holding device are provided.
An apparatus for aligning a relative position between the gripping position and the holding position at the time of the transfer in a transfer system configured to transfer to and from a predetermined holding position of the holding tool, which is held by the holding tool. The appropriate supporting jig is provided with image pickup devices at two positions. One image pickup device always takes an image of the first holding position, and the gripping device is close to the height at the time of the transfer (of course, the transfer is performed). (Including height of edge)
Is configured to simultaneously capture an image of the first gripping position of the gripping device, the other imaging device constantly captures an image of the second holding position, and the gripping device is configured to take a high image during the transfer. The second gripping position of the gripping device is also imaged at the same time when it is located near (including the height at the time of transfer), and the gripping position and the holding imaged by each of the image pickup devices. Position and
A positioning device is provided, which is provided with a display device that displays an image by superimposing it on the same coordinate system in the same image display unit for each imaging device.

In this case, as described in claim 8, the first gripping position and the holding position are set at one end and the second gripping position and the holding position are set at the other end, respectively. Good.

Further, as described in claim 9, the gripping position and the holding position imaged by each of the image pickup devices are set in the same coordinate system in the same image display unit for each of the image pickup devices. You may make it equip with the display apparatus which divides for every apparatus and superimposes and displays an image. That is, one display device may be shared, the image display unit may be divided, and each image pickup device may be displayed on each divided screen.

[0021]

According to the first aspect, the gripping position of the object to be processed in the gripping device and the holding position in the holder are simultaneously imaged by the same imaging device, and the imaged gripping position and the holding position are: Since images are displayed in an overlapping manner on the same coordinate system in the same image display unit, when the gripping position and the holding position are misaligned, both images are also misaligned and displayed. Therefore, the operator can easily and accurately align the gripping position and the holding position by simply adjusting the setting position of the gripping device so that the gripping position and the holding position match while observing the image.

According to a second aspect of the invention, the operation is basically the same as that of the first aspect, but the image pickup devices are provided at two locations, and the two image pickup devices are provided at both ends of the gripping device and the holder. The gripping position and the holding position of the unit are imaged.
Therefore, for example, when the gripping device and the holder have a certain length, each of the two positions may be set at the two positions.
Since the alignment is performed by, accurate alignment can be performed. According to the third aspect, since the imaging is performed at the one end portion and the other end portion, that is, both end portions, the position can be aligned more accurately than in the second aspect.

In the present invention, the display device, for example, the monitor is shared, so that the two image pickup devices are imaged, that is, the gripping position and the holding position at two places, on one screen of one display device. The image display overlaid with can be visually recognized.

When the gripping device moves up and down to a position where it is transferred to and from the holder, the position in the Z direction of the gripping device, that is, the height of the gripping device is also an important criterion for accurate transfer. Becomes According to claims 5 to 9, such a point can be dealt with. First, according to claim 5, the distance between the gripping device and the holder is detected by an appropriate jig in each of the alignment devices described above. Since the distance sensor is provided, the height of the gripping device with respect to the holder can be confirmed by monitoring the detection signal of the distance sensor, that is, the distance.

According to another aspect of the present invention, in the image pickup device in the position adjusting device, the holding position is constantly imaged, and when the gripping device is located near the height at the time of the transfer, the gripping position of the gripping device is simultaneously measured. Since it is configured to image, the gripping position is not imaged when the gripping device is not yet around the predetermined position at the time of the transfer, and the gripping position is imaged only when the gripping device is located near the predetermined height. And displayed on the image. Therefore, if the holding position and the gripping position are displayed on the image and the positions are overlapped with each other, it can be confirmed that the gripping device is positioned at a predetermined height at the time of transfer.

According to the seventh aspect, since the positioning according to the sixth aspect is performed at each of two places, accurate positioning can be performed. According to the eighth aspect, since the image pickup portion is performed at one end portion and the other end portion, that is, both end portions, more accurate alignment can be performed than in the seventh aspect.

According to the ninth aspect, as in the case of the fourth aspect, since the display device, for example, the monitor is shared,
On one screen of one display device, it is possible to visually recognize the images of the two imaging devices, that is, the superimposed image display of the gripping position and the holding position at two places.

[0028]

Embodiments of the present invention will now be described with reference to the accompanying drawings. This embodiment is an example applied to a semiconductor wafer (hereinafter referred to as "wafer") cleaning processing apparatus. Explaining the apparatus, as shown in FIG. 1, the entire cleaning processing apparatus 1 includes a carry-in section 2 for accommodating uncleaned wafers in cassette units, a cleaning processing section 3 for cleaning the wafers, and a cleaning processing section 3 for cleaning the wafers. It is composed of three zones of the carry-out section 4 for taking out the wafer after the cleaning processing in cassette units.

In the carry-in section 2, a waiting section 6 for waiting a cassette 5 containing a predetermined number of wafers before cleaning, for example, 25 wafers, and taking out the wafers from the cassette 5,
A loader unit 7 that performs orientation flat alignment and sheet-by-wafer detection, and a cassette 5 that is carried in from outside by a transfer robot or the like.
A transfer arm 8 for transferring the cassette 5 to the standby section 6 and between the standby section 6 and the loader section 7 is provided.

The cleaning processing section 3 has its front side (see FIG. 1).
Front side), three wafer transfer devices 11, 12,
13 are arranged, and above the cleaning processing unit 3, a cassette cleaning / drying process for cleaning and drying the empty cassette 5 after the wafers are taken out by the wafer transfer devices 11, 12, and 13. A line 14 is provided along the cleaning processing unit 3. Supply of the cassette to the cassette cleaning / drying line 14 is performed by the loader unit 7 and the elevating mechanism 15.

On the other hand, the carry-out section 4 is also provided with an elevator mechanism (not shown) similar to the elevator mechanism 15,
The empty cassette 5 that has passed through the cleaning / drying line 14 is configured to be set at a predetermined receiving position in the carry-out section 4 by this elevating mechanism.

In the cleaning processing section 3, the wafer chuck 1 of the wafer transfer apparatus 11 is sequentially installed from the loader section 7 side.
Chuck cleaning / drying processing tank 21 for cleaning and drying 6, and chemical cleaning processing tank 2 for cleaning impurities such as organic contaminants, metal impurities and particles on the wafer surface with a chemical solution
2. Two water cleaning treatment tanks 23 for cleaning the wafers cleaned in the chemical cleaning processing tank 22 with pure water, for example
4, a chemical cleaning treatment tank 25 for cleaning with a chemical different from the chemical in the chemical cleaning treatment tank 22, and two washing cleaning treatment tanks 26 for cleaning the wafer cleaned in the chemical cleaning treatment tank 25 with, for example, pure water. , 27, a chuck cleaning / drying treatment tank 28 for cleaning and drying the wafer chuck 17 of the wafer transfer device 13, and a drying process for vapor-drying the wafer from which the impurities have been removed by, for example, IPA (isopropyl alcohol). The processing tanks 29 are provided respectively.

The chemical cleaning treatment tanks 22 and 25 are
Each cleaning treatment liquid overflows and circulates, and during this circulation, impurities accumulated in each cleaning treatment liquid are removed.

The wafer transfer devices 11, 12, 13 are
The structure of the wafer transfer device 12 is basically the same, and the structure of the wafer transfer device 12 will be described with reference to FIGS. 1 and 2. The wafer transfer device 12 includes, for example, a pair of left and right gripping members that collectively grip 50 wafers. The wafer chuck 17 configured by 17a and 17b, and the wafer chuck 17 is moved up and down in the vertical direction (Z direction) and is moved in the front-back direction (Y
Direction) and the Y-axis drive mechanism 12d that is also moved, and the drive mechanism 12a equipped with this Y-axis drive mechanism 12d.
And a transfer base 12b for moving along the longitudinal direction (X direction). Also, the wafer chuck 1
When moving up and down 7, the sliding body protruding from the drive mechanism 12a and accommodated therein is covered with a bellows seal 12c, and is configured so that particles generated in the cleaning processing unit 3 do not directly adhere to this sliding body. There is.

Further, the entire drive mechanism 12a can be finely adjusted in the θ direction as shown in FIG. 2 within an appropriate range with the center in the plane as an axis by an appropriate adjusting mechanism (not shown). Further, the manual adjustment movement of the drive mechanism 12a in the X direction and the Y axis drive mechanism 12d in the Y direction for stopping or aligning the wafer chuck 17 at a predetermined position is controlled by the pulse motor control. It is configured so that it can be performed freely and its setting position can be stored.

As shown in FIGS. 3 and 4, the holding members 17a and 17b of the wafer chuck 17 are rotatable as indicated by reciprocating rotation arrows M and N in FIG. 2, respectively. Further, the gripping bars 33 and 34 are horizontally passed and fixed above and below between the support bodies 31 and 32 provided below both ends thereof, respectively.

Further, a gripping groove P is provided on the gripping bar 33 on the upper side.
The lower gripping bar 34 is also provided with gripping grooves Q under the same fixed intervals, respectively, a total of 50 gripping holes P _{1 to} P ₅₀ and Q _{1 to} Q ₅₀ , respectively. The periphery of the wafer has the gripping bars 3 of the gripping members 17a and 17b.
In a state where the inserted into each gripping groove P ₁ to P ₅₀ and Q ₁ to Q ₅₀ in the 3,34, by the gripping member 17a, 17b is rotated in a direction approaching each other, the wafer chuck 17 It is configured to be gripped by.

A wafer holder for processing a wafer being cleaned is provided near the bottom of each cleaning tank as described above. Now, referring to FIG. 2, FIG. 3, and FIG. The wafer holder 41 provided in the chemical cleaning tank 25 will be described. In the wafer holder 41, three holding rods 42, 43 and 44, which are also called boats, are provided near the bottom of the chemical cleaning tank 25. It is installed and fixed via a proper bracket 45 along the direction (Y direction).

Further, the holding rod 42 has a holding groove R, the central holding rod 43 has a holding groove S, the holding rod 44 has a holding groove T, and the holding grooves P and Q respectively. Under the same interval, R _{1 to} R ₅₀ , S _{1 to} S ₅₀ , T _{1 to} T _{50, respectively.}
There is a total of 50 each.

When the 50 wafers collectively held by the wafer chuck 17 of the wafer transfer device 12 are subjected to the chemical cleaning in the chemical cleaning processing bath 25, the wafer chuck 17 in the state of holding the wafers is used. Drive mechanism 12
The wafer chuck 41 is moved to a position immediately above the wafer holder 41 by a, and the wafer chuck 17 is lowered as it is into the chemical cleaning treatment bath 25, so that the peripheral edge of each wafer held by the wafer chuck 17 is moved to the wafer holder 41. Each holding rod 42, 4
The holding grooves R, S, and T in the grooves 3 and 44 receive them. Thereafter, the holding members 17a and 17b of the wafer chuck 17
Open the wafer, raise the wafer chuck 17 again,
The chemical cleaning treatment tank 25 is retracted to the outside.

After the predetermined immersion time has passed and the cleaning process is completed, the wafer chuck 17 is lowered into the chemical cleaning process tank 25 with the gripping members 17a and 17b open, and the wafer is held. It is stopped at the position when it is passed to the tool 41, and this time it is held by the wafer holder 41.
At the same time, the peripheral portions of the wafers are collectively gathered so that each holding member 17
a, 17b each gripping groove P in each gripping bar 33, 34,
Then, the holding members 17a and 17b are closed and the wafers are collectively held by the wafer chuck 1.
7 is raised and the gripped wafer is transferred to the washing / cleaning processing tank 24 for performing the next washing processing, ie, washing / washing.

In the above process, the wafer chuck 1
When 50 wafers are collectively transferred between the wafer holder 7 and the wafer holder 41, at the time of transfer, the wafer chuck 1
The gripping grooves P _{1 to} P ₅₀ , Q _{1 to} Q ₅₀ on the 7 side and the holding grooves R _{1 to} R ₅₀ , S _{1 to} S ₅₀ , T _{1 to} T ₅₀ on the wafer holder 41 side are correct relative positions, respectively. Must be in a relationship. Thus, for example As for gripping groove P _1, a grip groove P _1, Q _1, and the holding groove R _1, S _1, T ₁ is the must lie on the same vertical plane.

This embodiment is an example embodied as an apparatus for aligning the holding groove P and the holding groove S in such a case. First, the detection jig held by the wafer chuck 17 will be described. As shown in FIG. 5, this detection jig 51 integrates disc-shaped support plates 52 and 53 having the same diameter and the same thickness as the wafer via two connecting rods 54 and 54. The support plates 52 and 53 are configured to face each other in parallel. The length between the support plates 52 and 53 is set to be equal to the distance between the gripping groove P ₄ to P ₄₇ supra.

On the outside of each of the support plates 52 and 53, an image pickup device 55 as shown in FIG. 6 is fixed. The imaging device 55 includes a substantially rectangular parallelepiped case 5
6, an image pickup camera 57 is provided, and the image pickup camera 57 is provided with, for example, a magnifying lens 58 having an image pickup magnification of 20 times, and the focus of the magnifying lens 58 is the support plates 52, 53. Is fitted to the peripheral edge of.

Further, vertically below the magnifying lens 58,
A half mirror 59 tilted at 45 ° is provided. The half mirror 59 includes the support plates 52 and 53.
It is set to be located in the center of.

Then, on the bottom surface and the left side surface of the case 56,
For example, acrylic viewports 60 and 61 are provided. Therefore, the imaging camera 57 has a viewport 6
Through 0 and 61, it is possible to magnify the objects located vertically below and horizontally to the support plates 52 and 53 by 20 times, respectively, and simultaneously image them.

The image signals from the image pickup cameras 57 of the two image pickup devices 55, 55 provided on the support plates 52, 53 are, for example, signal lines 71 such as cables or optical fibers as shown in FIG. Through, to the appropriate mixing device 72 installed outside the cleaning processing device 1.
The mixing device 72 has an image processing function, and the processed image signal is input to the monitor 73.
In the monitor 73, based on the input image signal, the image pickup device 55 on the support plate 52 side is provided above the screen (A portion).
The image captured by the image capturing device 55 on the support plate 53 side is displayed below the screen (B portion).

This embodiment is constructed as described above,
The method of use and the operation thereof will be described below. First, as shown in FIG. 2, the detection jig 51 is held by the wafer chuck 17. In this case, this detection jig 5
The support plates located at both end portions of 1 are discs having the same diameter and the same thickness as the wafer to be processed, and the distance between the support plates 52 and 53 is as described above. Since the length is set to be the same as P _{4 to} P _47, the peripheral edge of the support plate 52 is inserted into the grip grooves P ₄ and Q ₄ , and the peripheral edge of the support plate 53 is inserted into the grip grooves P ₄₇ and Q ₄₇ . This allows the detection jig 51 to be easily gripped by the normal leg closing operation of the wafer chuck 17. At that time, the monitor 73 is also operated at the same time.

Then, on the screen of the monitor 73, as shown in FIG. 8, the gripping member 1 is provided above the screen (A portion).
The enlarged images of the gripping grooves P ₁ , P ₂ , P ₃ on the 7a side are clearly displayed, while the enlarged images of the gripping grooves P ₄₈ , P ₄₉ , P ₅₀ on the gripping member 17b side are displayed on the lower side of the screen (section B). Each is displayed clearly.

Then, with the detection jig 51 held in such a manner, the wafer chuck 17 is lowered into the chemical cleaning bath 25 just above the wafer holder 41 as in a normal operation, as shown in FIG. As shown in FIG. 5, when the wafer is stopped slightly before being received by the wafer holder 41, the monitor 7
An enlarged image of the holding grooves S ₁ , S ₂ , and S ₃ is provided above the screen of _No. 3 (A portion), and an enlarged image of the holding grooves S ₄₈ , S ₄₉ , and S ₅₀ is provided below the screen (B portion) of the screen. Are the gripping grooves P ₁ , P ₂ ,
The enlarged image of P _{3 and} the enlarged images of the grip grooves P ₄₈ , P ₄₉ , and P ₅₀ are displayed on the same coordinate system at the same magnification.

Therefore, if the holding grooves P ₁ , P ₂ , P ₃ and the holding grooves S ₁ , S ₂ , S ₃ and the holding grooves P ₄₈ , P ₄₉ , P ₅₀ and the holding grooves S ₄₈ , S ₄₉ , S are provided. _{When 50} and ₅₀ respectively correspond to each other and are located on the same vertical plane, both images are completely coincident with each other on the screen, as shown in FIGS. That is, it can be confirmed that the relative positions at the time of transfer between the wafer chuck 17 and the wafer holder 41 have a correct positional relationship.

However, when the wafer chuck 17 and the wafer holder 41 are exchanged, the relative positional relationship is X, Y,
When they are respectively displaced in the θ direction, on the screen of the monitor 73, as shown in FIG. 10, the image of the holding groove S ₂ is displaced with respect to the image of the gripping groove P ₂ accordingly. It This allows the operator to move the wafer chuck 1
The deviation of the relative positional relationship when the wafer 7 and the wafer holder 41 are transferred can be immediately confirmed.

When the deviation as shown in FIG. 10 is confirmed, for example, the drive mechanism 12a of the wafer transfer device 12 is appropriately adjusted in the θ direction so that the deviation in the θ direction as shown in FIG. To rectify. In this case, of course, the wafer holder 41 may be appropriately rotated in the θ direction for adjustment. Such an operation can be easily performed by the worker while looking at the screen of the monitor 73.

After the above adjustment in the θ direction, if the state shown in FIG. 11 is reached, the deviations in the X and Y directions can be corrected thereafter.
While looking at the monitor 73 in the same manner as described above, for example, regarding only the relationship between the gripping groove P ₂ and the holding groove S ₂ , the operator holds the gripping groove P _{2.
2 so} that the image of the holding groove S _{2 and} the image of the holding groove S ₂ completely match each other as shown in FIG.
It suffices to move and adjust the set position of a in the X and Y directions.

In this case, the images displayed on the monitor 73 are the holding grooves P ₁ , P ₂ , P ₃ and the holding grooves S ₁ , S ₂ , S ₃ and the holding grooves P ₄₈ , P ₄₉ , P ₅₀ and the holding grooves. Since it is an enlarged image of the grooves S ₄₈ , S ₄₉ , and S ₅₀ , it is easy to visually recognize and it is easy to confirm that they match. Therefore, it is possible to perform the alignment of the wafer chuck 17 and the wafer holder 41 when the wafer chuck 17 and the wafer holder 41 are transferred, extremely simply and quickly.

Further, in the above-described embodiment, the gripping groove P and the holding groove S at both ends of the wafer chuck 17 and the wafer holder 41 are respectively displayed on the monitor 73 by the two image pickup devices 55 as described above. Therefore, it is possible to detect the positional deviation at the both ends and correct it, and it is possible to perform extremely accurate positioning.

As described above, according to the above-described embodiment, the displacement components in the X, Y, and θ directions of the relative positional relationship when the wafer chuck 17 and the wafer holder 41 are transferred can be immediately confirmed. Can be corrected easily and quickly, and extremely accurate alignment can be performed. Moreover, the detection jig 51 used for that purpose can be easily attached to the wafer chuck 17, and the apparatus configuration itself is simple.

The wafer chuck 17 and the wafer holder 4
The relative position adjustment 1 may be performed automatically instead of manually by the operator. In this case, the signal from the image pickup device 55 is supplied to the mixing device 7
2. Not only the data is sent to the monitor 73, but also the data is input to the CPU 10 that controls the entire cleaning processing apparatus 1 including the wafer transfer apparatuses 11, 12, and 13 as shown in the section 7. Then, in the CPU 10, the images of the grooves P and S are compared with each other, and the wafer chuck 17 and, if necessary, the wafer holder 41 are controlled and driven so as to correct the deviation between the images, so that both images are automatically controlled. Relative position adjustment can be performed.

Further, in the above-mentioned embodiment, the magnifying lens 58 for magnifying the image is provided in the image pickup camera 57, but the viewports 60 and 61 are provided with the magnifying function. You may comprise.

Further, in the detection jig 51 used in the above-mentioned embodiment, the disc-shaped support plates 52 and 53 whose peripheral portions are inserted into the holding groove P on the wafer chuck 17 side are connected to the connecting rod 5.
4 and 54, and the image pickup device 55 is provided on the outer end surface of each of the support plates 52 and 53. However, instead of such a detection jig 51, the detection device shown in FIG. The jig 81 may be used.

The detection jig 81 has mounting portions 83 and 84 that project in the left-right horizontal direction at both ends in the longitudinal direction of a substantially rectangular support plate 82, and further, in the longitudinal direction of the support plate 82. The length is set to be the same as the distance between the gripping grooves P _{4 to} P ₄₇ of the wafer chuck 17 described above. Further, on the lower surface side of the support plate 82, claw portions 85 having a shape to be received by the grip groove P are provided at, for example, four places, and the claw portions 85 respectively project outward in the horizontal direction. The distance between the claws 85 in the longitudinal direction is set to be n times the distance between the gripping grooves P in the wafer chuck 17.

The image pickup device 55 used in the above-mentioned detection jig 51 is mounted on the support plate 8 by an appropriate mounting member 86.
The viewports 61 fixed to the centers of the two longitudinal end faces of the image pickup device 55 and located on the side surfaces of the image pickup device 55 are set to be at the same position as the height of the claws 85.

Even when the detection jig 81 having such a structure is used for alignment, the detection jig 81 is first set on the wafer chuck 17 as in the case of the above-described detection jig 51. According to this detection jig 81, as shown in FIG.
As shown in FIG. 3 and FIG. 14, when the holding members 17a and 17b of the wafer chuck 17 are in the closed state, the claw portion 8 is
5 are inserted into the gripping grooves P of the corresponding gripping members 17a, b, so that the mounting portions 83, 84 of the support plate 82 are placed on the gripping bars 33, 33 above the gripping members 17a, b. All you have to do is place it. Therefore, setting on the wafer chuck 17 is extremely easy.

Moreover, the insertion of the claw portion 85 into the holding groove P is merely an operation for aligning when setting it on the wafer chuck 17, and the entire detection jig 81 is placed on the mounting portions 83 and 84. Since the gripping rods 33, 33 are supported via the gripping rods 33, the gripping groove P is hardly loaded by the load of the detection jig 81 when the detection jig 81 is set. Therefore, there is no possibility that the grip groove P will be damaged. Moreover, the detection jig 81 is also set on the wafer chuck 17 in an extremely stable state.
Therefore, it is possible to obtain a more stable image than the detection jig 51.

When the wafer chuck 17 descends and moves to a position where wafers are transferred to and from the wafer holder 41, the wafer holder 4 of the wafer chuck 17 is moved.
The position in the Z direction with respect to 1, that is, the height of the wafer chuck 17 at the time of transfer is also important for accurate transfer.

The detection jig 91 shown in FIG. 15 has a structure capable of coping with such a request. That is, the basic structure of the detection jig 91 is the same as that of the above-mentioned detection jig 81, and the member structure referred to by the same number in FIG. It has exactly the same configuration. An opening 92 is formed in the center of the support plate 82 of the detection jig 91, and the opening 92 is further formed.
A distance sensor 94 is supported above by a suitable attachment 93 attached to the peripheral edge of the opening 92.

The distance sensor 94 is composed of, for example, an optical system sensor, has a light emitting portion and a light receiving portion, and the detection light such as laser light emitted from the light emitting portion is reflected and returned to another object. In this case, the reflected light is received by the light receiving unit, so that the distance to the other object can be detected. And this distance sensor 94
The detection signal of is input to, for example, the monitor 95, and the monitor 95 can confirm the distance detected by the distance sensor 94.

When the detection jig 91 having such a structure is used, an appropriate reflection plate (not shown) is set in advance on the central holding rod 43 of the wafer holder 41, for example. After that, like the detection jig 81, it may be set on the wafer chuck 17 and used. Then, according to this detection jig 91, the distance sensor 94 constantly detects the distance to the reflection plate through the opening 92 at the center of the support plate 82, and the distance is constantly displayed by the monitor 95. Therefore, the predetermined height of the wafer chuck 17, that is, the position of the wafer chuck 17 in the Z direction with respect to the wafer holder 41 can be confirmed.

Further, in order to confirm the predetermined position of the wafer chuck 17 in the Z direction with respect to the wafer holder 41, the above-mentioned detection jig 51 is set on the wafer holder 41 side as shown in FIG. You may. In this case,
The imaging device 55 always images the holding groove S of the holding rod 43 of the wafer holder 41 via the viewport 60, but regarding the holding groove P of the wafer chuck 17 on the holding rod 33 side, the viewport 61. Unless you come into view of
No image is taken. In other words, only when the wafer chuck 17 descends to a predetermined height, an image is taken through the viewport 61 and displayed on the monitor 73. Then, when it is located at a predetermined transfer position height, each groove P, S is displayed on the image.
Overlap. Therefore, also by this method, the predetermined position of the wafer chuck 17 in the Z direction can be confirmed.

In the image pickup device 55 used in each of the above-mentioned embodiments, the half mirror 59 is used for simultaneously picking up an image of an object in two directions with one image pickup camera 57, but instead of this, for example, As shown in FIG. 17, even when the prism 101 is used, the same effect can be obtained.
That is, the optical path from the image pickup camera 57 can be split. In this case, changing the shape of the prism 101,
By combining other optical elements, it is possible to split the optical path from the imaging camera 57 for two objects located at an angle other than a right angle. That is, the imaging camera 57
When the wafer chuck 17 and the wafer holder 41 are aligned, the holding groove Q of the holding rod 34 and the holding rod 42 or the holding rod 4 are appropriately divided by dividing the optical path from the.
It is possible to use three retaining grooves R or T.

Further, in each of the above-mentioned embodiments, the one gripping groove P and the holding groove S of the image pickup camera 57 of the image pickup device 55 are used.
I was trying to image and
As shown in FIG. 2, two image pickup cameras 57a and 57b are attached to the support plate 52, the grip groove P is imaged by the image pickup camera 57a, and the holding groove S is imaged by the image pickup camera 57b, respectively, and the image signals are mixed. Even if they are displayed on the monitor 73 in an overlapping manner, the same operational effects as those of the above-described respective embodiments can be obtained.

Although the above embodiment is an example applied to the transfer system between the wafer chuck and the wafer holder in the chemical cleaning processing tank in the wafer cleaning processing apparatus, the present invention is not limited to this, and the gripping method is not limited to this. A position of a relative position between the gripping position and the holding position in a transport system configured to transfer a plurality of objects to be processed, which are gripped at a predetermined gripping position in the device, to a predetermined holding position in a holder. It is applicable to the device for performing the matching.

[0073]

According to the first aspect of the present invention, the gripping position and the gripping position when transferring a plurality of objects to be processed held in the gripping device at the predetermined gripping position to the predetermined holding position of the holder. Easy to align the relative position with the holding position,
It can be done quickly and accurately. Claim 2
According to the third aspect, more accurate alignment can be performed, and according to the third aspect, more accurate alignment can be performed. Further, in claim 4, since the display device is shared, and the overlapping image display of the gripping position and the holding position at two positions can be visually recognized on one screen of one display device, It is easy to check the alignment.

According to the positioning device of the fifth to ninth aspects, since the positional relationship between the gripping device and the holder in the Z direction can also be confirmed, it is possible to perform the positioning in accordance with the actual transfer. . Particularly, in the sixth aspect, the positional relationship in the Z direction can be confirmed without separately providing the distance sensor according to the fifth aspect, and the alignment can be performed according to the actual transfer. Further, in the seventh aspect, more accurate alignment can be performed, and in the eighth aspect, more accurate alignment can be performed. Further, according to the ninth aspect, it is possible to visually confirm the overlapping image of the grip position and the holding position at the two positions on the screen of one display device, so that it is easy to confirm the alignment.

[Brief description of drawings]

FIG. 1 is a perspective view of a wafer cleaning processing apparatus in which an embodiment of the present invention is preferably used.

FIG. 2 is a perspective view of a wafer chuck in a state where a detection jig is held in the embodiment.

FIG. 3 is a perspective view showing a state in which the image pickup apparatus according to the embodiment simultaneously images a holding groove on the wafer chuck side and a holding groove on the wafer holder side.

FIG. 4 is an explanatory diagram showing a state in which the image pickup apparatus according to the embodiment simultaneously images a holding groove on the wafer chuck side and a holding groove on the wafer holder side.

FIG. 5 is a perspective view of a detection jig in the example.

FIG. 6 is a cross-sectional view of the image pickup apparatus in the embodiment.

FIG. 7 is an explanatory diagram showing a relationship between an image pickup apparatus and a monitor in the embodiment.

FIG. 8 is an image of a grip groove on the wafer chuck side displayed on a monitor according to an example.

FIG. 9 is a partially enlarged view of an image displayed on the monitor when the grip groove and the holding groove have the correct relative positional relationship when the embodiment is used.

FIG. 10 is a partially enlarged view of an image displayed on the monitor when the grip groove and the holding groove are displaced in the X, Y, and θ directions, respectively, when the embodiment is used.

FIG. 11 is a partial enlarged view of an image displayed on the monitor when the gripping groove and the holding groove are displaced in the X and Y directions when the embodiment is used.

FIG. 12 is a perspective view showing an example of another detection jig.

FIG. 13 is a front explanatory view when another detection jig is set on the wafer chuck.

FIG. 14 is an explanatory plan view when another detection jig is set on the wafer chuck.

FIG. 15 is a perspective view showing an example of another detection jig having a distance sensor.

16 is an explanatory diagram showing a state in which the detection jig of FIG. 5 is set on the wafer jig side.

FIG. 17 is a cross-sectional explanatory diagram of an image pickup apparatus that employs a prism.

FIG. 18 is a perspective view of a detection jig including an imaging camera for individual imaging.

[Explanation of symbols]

 1 Cleaning Processing Device 12 Wafer Transfer Device 17 Wafer Chuck 17a, 17b Gripping Member 25 Chemicals Cleaning Treatment Tank 33, 34 Gripping Rod 41 Wafer Holder 42, 43, 44 Holding Rod 51 Detection Jig 52, 53 Support Plate 55 Imaging Device 57 Imaging Camera 59 Half Mirror 60, 61 Viewport 73 Monitor P Gripping Groove S Holding Groove

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Internal reference number FI Technical display location G06T 7/00 H01L 21/304 341 C

Claims (9)

[Claims] 1. A gripping device at the time of transfer in a transfer system configured to transfer a plurality of objects to be processed held at a predetermined gripping position in a gripping device to a predetermined holding position in a holder. A device for aligning a relative position between a position and the holding position, which is provided in an appropriate jig held by the holding device, and an imaging device for simultaneously capturing the holding position and the holding position, A positioning device, comprising: a display device that displays the grip position and the holding position imaged by the imaging device as an image by superimposing them on the same coordinate system in the same image display unit. 2. The grip at the time of the transfer in a transfer system configured to transfer a plurality of objects to be processed held in a predetermined grip position of a grip device to a predetermined holding position of a holder. A device for aligning a relative position between a position and the holding position, wherein image pickup devices are provided at two positions of an appropriate jig held by the holding device, and one image pickup device in the image pickup device is The first gripping position and the holding position are imaged at the same time, and the other imaging device in the imaging device is configured to simultaneously image the other second gripping position and the holding position. The gripping position and the holding position are set in the same coordinate system in the same image display unit for each of the image pickup devices.
A positioning device comprising: a display device for displaying images in an overlapping manner. 3. The grip at the time of the transfer in a transfer system configured to transfer a plurality of objects to be processed held in a predetermined grip position in a grip device to a predetermined holding position in a holder. A device for aligning a relative position between a position and the holding position, wherein image pickup devices are provided near both ends of an appropriate jig held by the holding device, and one image pickup device in the image pickup device is provided. Is configured to simultaneously image the gripping position and the holding position at one end, and the other imaging device in the imaging device is configured to simultaneously image the gripping position and the holding position at the other end. A display device for displaying the grasped position and the held position, which are overlapped with each other, on the same coordinate system in the same image display unit for each of the imaging devices. Laying device. 4. The gripping position and the holding position imaged by each of the image pickup devices are divided and overlapped on the same coordinate system in the same image display unit for each of the image pickup devices for each of the image pickup devices. The alignment device according to claim 2 or 3, further comprising a display device for displaying an image. 5. The distance according to claim 1, wherein the appropriate jig is provided with a distance sensor for detecting a distance between the gripping device and the holder. Alignment device. 6. The grip at the time of the transfer in a transfer system configured to transfer a plurality of objects to be processed held in a predetermined grip position in a grip device to a predetermined holding position in a holder. A device for aligning the relative position between the holding position and the holding position, and an image pickup device is provided on an appropriate supporting jig held by the holder, and the image pickup device constantly images the holding position. In addition, when the gripping device is located near the height at the time of the transfer, the gripping position of the gripping device is also imaged at the same time, and the gripping position and the holding position imaged by the imaging device are And a display device for displaying an image in the same image display unit so as to be superimposed on the same coordinate system. 7. The grip at the time of the transfer in a transfer system configured to transfer a plurality of objects to be processed held at a predetermined grip position of a grip device to a predetermined holding position of a holder. A device for aligning a relative position between a position and the holding position, wherein an appropriate supporting jig held by the holder is provided with image pickup devices at two positions, and one image pickup device is the first image pickup device. Is always imaged at the holding position, and when the gripping device is located near the height at the time of the transfer, the first gripping position of the gripping device is also imaged at the same time. The second holding position is always imaged, and the second gripping position of the gripping device is also imaged at the same time when the gripping device is located in the vicinity of the height at the time of the transfer. By A positioning device, comprising: a display device that displays the imaged grip position and holding position for each imaging device by superimposing them on the same coordinate system in the same image display unit. 8. The grip at the time of the transfer in a transfer system configured to transfer a plurality of objects to be processed held in a predetermined grip position of a grip device to a predetermined holding position of a holder. A device for aligning a relative position between a position and the holding position, wherein imaging devices are provided near both ends of an appropriate supporting jig held by the holder, and one imaging device is The holding position of the part is constantly imaged, and when the gripping device is located near the height at the time of the transfer, the gripping position of one end of the gripping device is also imaged at the same time. , The holding position of the other end is always imaged, and the holding position of the other end of the holding device is also imaged at the same time when the holding device is located near the height at the time of the transfer. Each shoot Positioning, characterized by comprising a display device for displaying the grip position and the holding position imaged by the image device, for each image device, by superimposing and displaying the images on the same coordinate system in the same image display unit. apparatus. 9. The gripping position and the holding position imaged by each of the image pickup devices are divided and overlapped on the same coordinate system in the same image display unit for each of the image pickup devices for each of the image pickup devices. The alignment device according to claim 7 or 8, further comprising a display device for displaying an image.