JPH0794976A - Amplifier module for ultra high frequency - Google Patents

Abstract

PURPOSE:To prevent the generation of oscillation in an ultra high frequency amplifier module having a wide band and high gain to be used for amplifying a signal in a microwave band or the like. CONSTITUTION:In a microwave amplifier module constituted of storing and fixing n-stage amplifier minimodules in the recessed part of a casing 4 having connection parts 31, 32 on its both ends and the recessed part on its intermediate part, connecting the power supply terminal of a final amplifier minimodule to the power feeder of a corresponding connection part and covering the aperture part of the casing with a cover, an insulating line 6 formed by insulating a conductor line by a dielectric substance is penetrated into space generated between the minimodules and the cover, one end of the penetrated insulating line is connected to the power feeding line for an initial amplifier module side connecting part to which external power supply voltage is to be impressed and the other end is connected to the power feeder of a final amplifier minimodule side connection part and the insulating line in the space is filled with a conductive material 51.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wideband, high-gain, ultrahigh-frequency amplifier module used for amplifying signals in the microwave band, for example.

For example, amplifiers for amplifying microwave band signals are widely used for low noise amplification, high gain amplification, high output amplification and the like. As an amplifier, a plurality of metal cases (referred to as mini-modules) containing an amplifying portion composed of field-effect transistor FETs are connected in cascade to form a multi-stage amplifier mini-module.

And, a multi-stage amplifier mini-module 1
The amplifier module can be obtained by accommodating it in one housing and covering it with a lid. In the amplifier module, however, microwaves may return to the pre-stage amplifier and oscillate through various paths. It is necessary to prevent oscillation.

[0004]

2. Description of the Related Art FIG. 10 is an explanatory view of a conventional example, (a)-is a main part mounting view seen from above with a lid of a housing accommodating a three-stage amplifier mini-module, and (a)-( a)-XX 'cross section,
(b) is a cross-sectional view of (a)-when cut in the longitudinal direction, with a lid, and (c) is a diagram in which two amplifier modules shown in the equivalent circuit are cascade-connected, and an oscillation cause explanatory diagram. .

FIG. 11 is an explanatory view of the amplifier mini-module in FIG. 10, where is an internal connection diagram, is a sectional view taken along line XX ', and is a side view. FIG. 12 is an explanatory view of another conventional example, where (a)-is 3
Mounting view of the main part of the housing containing the individual amplifier mini-modules as seen from above, (a)-is a side view of the input side of (a)-, (a)-is a side view of the output side, (a)-is a side view and (b) is an equivalent circuit.

10 to 12 will be described below, it is assumed that three amplifier mini-modules are housed in the housing. Hereinafter, the internal connection of each amplifier mini-module is the same.

First, as for the input / output and internal connection of the amplifier mini-module 12, as shown in FIG. 11, the drain power supply terminal 121 and the gate power supply terminal 122 are connected to either the input side or the output side so that the modules can be connected in cascade. It can be connected even from. Further, the signal input terminal 123 and the gate of the FET 125, and the drain and the signal output terminal 124 are connected by a signal transmission line, and each terminal is formed in a gold pattern on a ceramic substrate, for example.

Then, as shown in FIG.
The connection board 11 is provided at the right end of the connector, the connection board 15 is provided at the left end, and the amplifier mini-modules 12, 13 and 14 are housed in the center, and then the terminals of the amplifier mini-modules 12 and 14 are connected to the connection board 1.
Lines 123, 151 above 1, 15 and amplifier mini-module 13
An ultra high-frequency amplifier module (hereinafter referred to as a microwave amplifier module) is configured by connecting the terminals to a gold ribbon, and this module is shown by an equivalent circuit shown in FIG. 10 (c).

The power supply voltages V ₁ and V ₂ supplied from the outside
Is applied to the power supply terminals 121, 122 of the amplifier mini-module 12 via the power supply lines 111, 112 formed on the connection board 11, so that the amplifier mini-module 12 is connected via the power supply terminals interconnected as described above. From Amplifier Mini Module 13,
Power supply voltage is supplied to 14.

On the other hand, the configuration of FIG. 12 (a) -is similar to the above, in which three amplifier mini-modules are connected in cascade, but as a power supply method, a power supply voltage V ₁ , V ₃ is connected to the power supply line 17
1, 172, enamel wires 19 and 20, and power supply lines 181 and 182 formed on the connection board 18 to apply the power to the power terminal of the amplifier mini-module 14. As a result, the power supply voltage is supplied from the rear stage to the front stage, so that the power supply direction is opposite to the above.

With the above-mentioned structure, a wide frequency band (for example, about 5 GHz to 15 GHz) and high gain are to be oscillated by the microwave feedback inside the microwave amplifier module. was there.

[0012]

There are various possible causes of the above-mentioned oscillation, and there are the following, for example. (1) As shown in Fig. 10 (b), the microwave appearing on the output side of the amplifier mini-module 14 enters the input side of the amplifier mini-module 12 through the gap between the lid 162 and the amplifier mini-modules 12-14. . (2) As shown in Fig. 10 (c), when two amplifier mini-modules connected in three stages are cascade-connected, the microwave output of the latter-stage amplifier mini-module is coupled to the output side power supply terminal as shown by. Then, this microwave passes through the power supply line, returns to the low-level pre-stage amplifier mini-module, is coupled to the signal line, and is mixed into the first-stage amplifier mini-module (~
reference).

As a result, a signal feedback loop is formed, and oscillation occurs where the phases match. (3) As shown in Fig. 12 (a), the power supply voltage supplied from the outside.
Amplifier mini-module 14 with V ₁ and V ₃ using enameled wire 19
When applied to the power supply terminal of, the microwave coupling as shown by the arrow in FIG. 12 (b) occurs and returns to the input side of the amplifier mini-module 12.

An object of the present invention is to prevent oscillation.

[0015]

FIG. 1 is a block diagram of the principle of the first aspect of the present invention, in which (a) is a main part mounting view seen from the top of a case housing an n-stage amplifier mini-module. , (B)
A cross-sectional view of (a) taken along the longitudinal direction is a case with a lid.

In the figure, 6 is an insulated wire in which a conductor wire is insulated with a dielectric substance, 21 is an amplifier, a signal terminal, an amplifier mini-module accommodating a power supply terminal that can be connected in cascade, and 41 is a signal transmission line at both ends. And a housing having a recess having a height slightly higher than the width and length of the n-stage amplifier mini-module, the width and length of which are to accommodate the connecting portion having the power supply line in the middle. Is a lid and 51 is a conductive material.

According to a first aspect of the present invention, an insulated wire in which a conductor wire is insulated by a dielectric substance is passed through a space formed between an n-stage amplifier mini-module and a lid, and one end of the penetrated insulated wire is
Connect the other end to the power supply line of the connection part of the first-stage amplifier mini-module side to which the power supply voltage from the outside is applied, and the other end to the power supply line of the connection part of the final-stage amplifier mini-module side, and use an electrically conductive material for the insulated wire in the space. I tried to fill it.

According to the second aspect of the present invention, the paths of the insulating wire in the conductive material and the insulating wire in the space of the cascade connection portion are meandered and lengthened by a predetermined amount or more. According to a third aspect of the present invention, when the other end of the insulated wire is connected to the power supply line of the connection part of the final stage amplifier mini module side, the path of the insulated wire is at a predetermined distance from the signal transmission line of the final stage amplifier mini module output side. I decided to move away.

According to a fourth aspect of the present invention, when the insulated wire passes through the cascade connection portion of the n-stage amplifier mini-module, it is separated from the signal terminal in the cascade connection portion by a predetermined distance or more.

[0020]

FIG. 2 is an explanatory view of FIG. 1, (a) is an example of the insulated wire size, (b) is an example of the size of the amplifier mini-module and the conductive material, and (c) is the equivalent circuit of (b). , (D) is another equivalent circuit corresponding to (c). Fig. 3 is a transmission characteristic diagram (calculated value) of Fig. 2 (c).

First, according to the first aspect of the present invention, when the power supply voltages V ₁ and V ₃ supplied from the outside are applied to the power supply terminals of the amplifier mini-module in the subsequent stage by using the insulation wire, the insulation wire passes through the low frequency band. By adopting a filter structure, it is possible to suppress the super high frequency from returning from the amplifier mini-module in the subsequent stage to the amplifier mini-module in the previous stage through the insulated wire.
This will be described in detail below, but the dimensions in the figure are examples.

FIG. 2 (a) is a cross section of an insulating wire (eg, enamel wire, formal wire, etc.) covered with a thin film.
With a diameter of 0.2 mm, a coating thickness of 10 μm, and a relative permittivity ε _r of the coating material of 2, when an insulated wire is embedded in a conductive material as shown in Figure (b), the capacitance C per cm of the insulated wire is as follows. (1) Ceremony (Isao Tanimura, published by Ohmsha on March 15, 1960: Wireless Engineering
According to the mathematical formulas on page 79), a capacitance of about 11 pf per cm of insulated wire is provided between the inner and outer conductors.

C = 0.0885 ε _r (A / t) (1) where A: flat plate area (cm ² ) and t: flat plate distance (dielectric thickness) (cm). In addition, when the size of the amplifier mini module is as shown in Fig. 2 (b), the inductance of the part (1.1 mm in length) that is not buried in the conductive material at both ends of the insulated wire.
When L is calculated from the following known formula (2), it becomes 0.515 nH.

L = 2s [ln (4s / d) −3/4] nH (2) However, s: 0.11 cm, d: 0.02 cm. From this, the equivalent circuit of FIG. 2 (b) becomes as shown in (c). In order to easily obtain the pass characteristic (S 21), if the portion of C is replaced by the line of the corresponding characteristic impedance Z _{0 in} the known equation (3), Z ₀ = as shown in Fig. 2 (d). It becomes a line of 4 Ω.

Z ₀ = 138 (ε _r ) ^-1/2 [log ₁₀ (D ₁ / D ₂ )] (3) However, D ₁ = 0.22 mm and D ₂ = 0.2 mm. In addition, (2), (3)
The formula is described on pages 52 and 191 of the above formula).

When the pass characteristic of the circuit shown in FIG. 2 (d) is measured with a signal source having a characteristic impedance Z ₀ = 50Ω, a low pass filter having the pass characteristic shown in FIG. 3 is obtained, and this is used for microwave transmission. It is designed to block the return of. As the conductive material, a conductive adhesive material is used also for bonding the lid and the casing.

[0027]

FIG. 4 is a block diagram of the first embodiment of the present invention.
(a) is a main part mounting view of the case containing the three-stage amplifier mini-module taken from the top, and (b) is an equivalent circuit of an insulated wire embedded in a conductive adhesive. FIG. 4 (a) is a detailed view of an essential part, FIG. 6 is a passage characteristic diagram (calculated value) of FIG. 4 (b), FIG. 7 is a configuration diagram of an embodiment of the second invention, and FIG. 8 is a third book. FIG. 9 is a configuration diagram of an embodiment of the invention, and FIG. 9 is a configuration diagram of an embodiment of the fourth invention.

Here, the same reference numerals denote the same objects throughout the drawings. 4 to 9 will be described below with n = 3, the parts described in detail above will be briefly described, and the part of the present invention will be described in detail.

As shown in FIG. 4A, the connection substrate 31 having the signal transmission line 311, the power supply lines 312, 313 at both ends of the housing 42, the signal transmission line 321, the power supply line 322, A connection board 32 having 323 is provided, and three amplifier mini-modules are housed in cascade in the recess of the middle part. It should be noted that the connection between the terminals and between the terminals and the line is made with a gold ribbon as shown in FIG.

The signal terminals of the first-stage and last-stage amplifier mini-modules 21 and 23 are connected to the signal transmission line 311 and the signal transmission line 32, respectively.
Power supply voltage V ₁ , V ₂ supplied from the outside by connecting to ₁ , power supply lines 312, 313, enamel lines 61, 62, power supply line 32
Since the voltage is applied to the power supply terminals of the final stage amplifier mini-module 23 via 2,323, the voltage is applied to all the amplifier mini-modules via the power supply terminals connected to each other.

Then, a conductive adhesive is put in the space between each amplifier mini-module and the lid of the housing, and the enamel wire is embedded in this adhesive, so that the enamel wire portion as shown in FIG. The filter has a low-pass characteristic as shown in (b), and the pass characteristic of this filter has the values shown in FIG.

Since the number of elements of the filter is larger than that in the case of FIG. 3, the attenuation amount becomes a large value. For example, at 10 GHz, it is 17.5 dB in FIG.
Therefore, the wraparound caused by the increase in the number of stages of the amplifier mini-module and the increase in gain can be reliably attenuated by the pass characteristic.

Further, since the gap between the lid and the amplifier mini-module is filled with the conductive adhesive, the gap which is not filled (the upper and lower ends of the casing of the amplifier mini-module of FIG. 4 and the end of the conductive adhesive are filled). Since the part between (spaces) serves as a cutoff waveguide, the microwaves that return through the space are also attenuated, and a more stable (no oscillation) circuit is obtained.

FIG. 7 shows the meandering of the enamel wire,
The cutoff frequency of the low-pass filter can be lowered by increasing the capacitance value and the inductance value. Figure 8
Made the connection point of the input side or output side enamel line as far away from the signal transmission line as possible to reduce the amount of microwave coupling to the enamel line.

FIG. 9 shows the amount of coupling of microwaves to the enamel line by forming the enamel line so that the enamel line passes as far as possible from the cascade connection part through which microwaves pass among the cascade connection parts between the amplifier mini-modules. I tried to reduce.

That is, by adopting the above configuration,
A wide-range, high-gain microwave module can obtain stable characteristics that do not oscillate, and a wide-band gain flat characteristic.

[0037]

As described above in detail, the present invention has an effect that it is possible to prevent oscillation of a microwave module having a wide band and a high gain.

[Brief description of drawings]

FIG. 1 is a principle configuration diagram of the first present invention, in which (a) is a main part mounting view seen from above by removing a lid of a housing accommodating an n-stage amplifier mini-module, and (b) is (a). FIG. 3 is a cross-sectional view taken along the longitudinal direction of the case with a lid.

FIG. 2 is an explanatory diagram of FIG. 1, (a) is an example diagram of an insulated wire dimension,
(b) is an example of the dimensions of the amplifier mini-module and conductive material,
(c) is the equivalent circuit of (b), and (d) is another equivalent circuit corresponding to (c).

FIG. 3 is a passage characteristic diagram (calculated value) of FIG. 2 (c).

FIG. 4 is a block diagram of a first embodiment of the present invention, (a)
Is a mounting view of the main part of the case housing the three-stage amplifier mini-module taken from above and (b) is an equivalent circuit of an insulated wire embedded in a conductive adhesive.

FIG. 5 is a detailed view of an essential part of FIG.

FIG. 6 is a transmission characteristic diagram (calculated value) of FIG. 4 (b).

FIG. 7 is a configuration diagram of an embodiment of the second invention.

FIG. 8 is a configuration diagram of a third embodiment of the present invention.

FIG. 9 is a configuration diagram of a fourth embodiment of the present invention.

10 is an explanatory view of a conventional example, (a)-is a main part mounting view seen from above by removing a lid of a housing accommodating a three-stage amplifier mini-module, and (a)-is (a)-. XX 'cross section, (b) is (a)-
In the cross-sectional view when the is cut in the longitudinal direction, with a lid,
(c) is a diagram in which two amplifier modules shown by an equivalent circuit are cascade-connected, and is an explanatory diagram of oscillation cause.

11 is an explanatory view of an amplifier mini-module in FIG. 10, in which an internal connection diagram, a XX ′ cross-sectional view of, and a side view.

FIG. 12 is an explanatory view of another conventional example, (a)-is a main part mounting view seen from above with a lid of a housing accommodating three amplifier mini-modules taken, and (a)-is (a )-Side view of input side, (a)-
Is a side view of the output side, (a)-is a side view, and (b) is an equivalent circuit.

[Explanation of symbols]

6 Insulated wire 21 Amplifier mini module 41 Recess 42 Lid 51 Conductive material

Claims (4)

[Claims] 1. An n-stage amplifier mini-module in which n-stage amplifier mini-modules (21) accommodating an amplifier, a signal terminal, and a power supply terminal capable of cascade connection are cascade-connected (n is a positive integer).
The connection parts (31, 32) having the signal transmission line and the power supply line at both ends should be accommodated, and the width and length should be accommodated in the middle part.
A housing (41) having a recess whose height and width are substantially the same as the width and length of the stage amplifier mini-module and a lid (42) are provided, and the n-stage amplifier mini-module is provided in the recess in the housing. In the ultra-high frequency amplifier module, in which the power supply terminal of the final stage amplifier mini-module is connected to the power supply line at the corresponding end and the lid covers the opening of the housing, the conductor wire is A first-stage amplifier mini-module in which an insulated wire (6) insulated with a substance penetrates a space formed between the n-stage amplifier mini-module and the lid, and one end of the penetrated insulated wire is applied with a power supply voltage from the outside. The power supply line of the side connection part, the other end is connected to the power supply line of the final stage amplifier mini module side connection part, and the insulated wire in the space is filled with a conductive material (51). Ultra high frequency amplifier module Le. 2. An ultrahigh frequency amplifier module, characterized in that the path of the insulated wire in the conductive material and the insulated wire in the space of the cascade connection portion is meandered and lengthened by a predetermined amount or more. 3. When the other end of the insulated wire is connected to the power supply line of the connection part of the final stage amplifier mini-module side, the path of the insulated wire is a predetermined distance or more from the signal transmission line of the final stage amplifier mini-module output side. A super high frequency amplifier module characterized by being separated. 4. An ultrahigh frequency amplifier module, characterized in that, when the insulated wire passes through a cascade connection portion of an n-stage amplifier mini-module, it is separated from a signal terminal in the cascade connection portion by a predetermined distance or more.