JPH0794078B2 - Multi-stage vacuum press equipment for printed wiring boards - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a multi-stage vacuum press device for a printed wiring board, which stacks laminated boards such as a printed wiring board in a vertical stack and presses them in a vacuum state.

[Prior Art] In general, when laminating a laminated board such as a printed wiring board, in order to eliminate residual air bubbles, improve the plane accuracy, and reduce the variation in dimensional change, the pressure and temperature should be kept under vacuum. It is preferable to control the molding. The applicant of the present invention has proposed a Japanese Patent Application No. Sho 61-31351 as a multi-stage vacuum press device capable of improving workability and obtaining products of constant quality.
No. has been filed. This product encloses the entire circumference of the multi-stage press in an enclosure, heats and presses the molded product in a vacuum state in this enclosure for a certain period of time, and then cools it in the enclosure to form the molded product. is there.

[Problems to be Solved by the Invention] However, in the conventional example as described above, when cooling is started after heating is finished, the hot air at the time of heating and pressurizing remains in the cooling step. It takes time to discharge the hot air by opening the door provided on the side of the enclosure.However, the vacuum pump generally operates only at the initial stage of molding and stops after several tens of minutes. The energy cost is reduced. For this reason, the inside of the enclosure returns to the atmospheric state within several tens of minutes, and even when the door is opened during cooling, hot air is collected in the upper part of the enclosure and is not exhausted. There was a problem in that the temperature difference between the upper part and the lower part of the film varied.

The present invention is intended to solve the above problems, and an object of the present invention is to provide a multi-stage vacuum press device for a printed wiring board, which can shorten a cooling time and can obtain a product of constant quality. There is.

[Means for Solving the Problems] In order to achieve the above-mentioned object, a multi-stage vacuum press device for a printed wiring board according to the present invention hermetically encloses the entire outer periphery of the multi-stage press 1 with an enclosure 2 and is enclosed by the enclosure 2. In a multi-stage vacuum press device for a printed wiring board, which is formed by connecting a vacuum pump 3 to a space, the canopy portion 2a of the enclosure 2 can be opened and closed to exhaust hot air generated in the enclosure 2 by heating and pressurizing the printed wiring board. The door 4 is provided.

[Operation] The molded product is heated and cooled by the multiple press 1 surrounded by the enclosure 2 to be molded. When moving from the heating process to the cooling process, the door 4 provided on the canopy portion 2a of the enclosure 2 is opened to exhaust hot air in the enclosure 2 before the cooling process, and then the cooling process is performed.

[Examples] The present invention will be described in detail below with reference to Examples.

The multi-stage press 1 is formed by arranging a plurality of heating plates 7 between upper and lower mold plates 5 and 6. Template 5 under this multi-stage press 1
Is located in the vicinity of the floor surface FL, and the lower template 5 is vertically movable up and down with respect to the base 8 arranged below the floor surface FL. The multi-stage press 1 is surrounded by a container-shaped enclosure 2 that surrounds the entire outer circumference. The enclosure 2 is surrounded by a material having a high bending strength such as an iron plate, and is made airtight by welding or a sealing material. A canopy portion 2a on the upper surface of the enclosure 2 is provided with an openable / closable door 4 which is automatically opened / closed by air drive, hydraulic drive or a motor. The space surrounded by the enclosure 2 and the vacuum pump 3 are communicated with each other by a communication pipe 9, and the space inside the enclosure 2 can be evacuated by suction of the vacuum pump 3. An entrance door 10 is provided on the side surface of the enclosure 2 so as to be airtightly closed. A loader 11 is arranged in the vicinity of the door 10 and the loader 11 is provided with a plurality of shelf plates 12 in the vertical direction so as to correspond to the heating plate 7.
A plurality of shelf boards 12 can be raised and lowered together.
A conveyor 13 is placed at the end of the loader 11
A molded product is conveyed from the conveyor 13 between the loader 13 and the loader 11.
A feeding device (not shown) is provided for feeding to the conveyor 11 or to the conveyor 13 from the loader 11.

Next, the operation of the apparatus configured as described above will be described. The loader 11 is for filling the laminated plate to be molded, and is initially lowered so that the uppermost shelf plate 12 comes close to the floor surface FL. And a conveyor on the carrier board with a feeder
The molded product with a proper number of laminated plates set in 13 is placed on the uppermost shelf plate 12, and the shelf plate 12 is moved up by one step.
Place the next molded product on the stage, place the molded products one after another while sequentially raising the shelf plate 12, place the molded product on the shelf plate 12 of each stage, and raise the plurality of shelf plates 12 to the top. Corresponds to the multi-stage press 1. In this state, the door 10 of the enclosure 2 is opened, each molded product is sent to the multi-stage press 1 side by the feeding device, and each molded product is placed between the hot plates 7 of the multi-stage press 1. When the molded product is put into the multi-stage press 1, the door 10 is closed, and the multi-stage press 1 heats and pressurizes the vacuum pump 3 to evacuate the enclosure 2 to a vacuum state. It is molded for a certain period of time. Next, after being heated and pressed, the molded product is cooled and pressed. At this time, before starting cooling, open the door 4 provided on the canopy portion 2a to exhaust hot air accumulated in the upper part of the enclosure 2 to eliminate the temperature difference between the upper part and the lower part of the enclosure 2 and to exhaust hot air. After lowering the temperature in the enclosure 2, the cooling process starts. In this way, by opening the door 4 provided on the canopy portion 2a, the hot air can easily flow upward, and the hot air in the enclosure 2 can be completely exhausted. After heating and pressurizing, the hot air is subsequently subjected to the cooling step. Cooling time is about 3 minutes to 5 compared to the conventional type
It can be shortened by about a minute, and the enclosure 2
There is no temperature difference between the upper part and the lower part of the product, and it is possible to obtain a product of constant quality. Multi-stage press 1
When the molded product is molded by, the door 10 of the enclosure 2 is opened again, and the molded product which has been molded by the feeding device is taken out from the lowermost shelf plate 12 by the feeding device and is transferred to the conveyor 13. Then, each shelf plate 12 of the loader 11 is lowered by one step, and the molded product is taken out from the second shelf plate 12 from the bottom, and the shelf plates are sequentially installed.
The molded product is taken out from each shelf plate 12 by lowering 12. loader
After taking out the molded product from each of the shelves 11 of 11, the respective shelves 12 of the loader 11 are moved to the uppermost part to prepare for receiving the next molded product. By repeating such a cycle, molded articles are sequentially molded.

[Effect of the Invention] As described above, the multi-stage vacuum press device for a printed wiring board of the present invention hermetically encloses the entire outer circumference of the multi-stage press.
In a multi-stage vacuum press device for printed wiring boards that connects a vacuum pump to the space enclosed by this enclosure, it can be opened and closed freely to exhaust hot air in the enclosure generated by heating and pressurizing the printed wiring board on the canopy of the enclosure Since a special door is provided, when moving from the heating process to the cooling process, by opening the door provided on the canopy part of the enclosure before the cooling process, the hot air in the enclosure can be easily exhausted from the canopy part. It is possible to evacuate, and it is possible to shorten the cooling time required for cooling by being able to enter the cooling process after exhausting hot air in this way, and there is a temperature difference between the upper part and the lower part in the enclosure. It is possible to obtain a product of constant quality without causing a problem.

[Brief description of drawings]

FIG. 1 is a perspective view in which a part of an embodiment of the present invention is omitted, and FIG.
The figure is a schematic front view of the apparatus, in which 1 is a multi-stage press, 2 is an enclosure, 2a is a canopy portion, 3 is a vacuum pump, and 4 is a door.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP 62-189125 (JP, A) Actual development 62-120198 (JP, U) Actual public 32-5490 (JP, Y1)

Claims (1)

[Claims] 1. A multi-stage vacuum press device for a printed wiring board, comprising a multi-stage press which is surrounded by an air-tight enclosure, and a vacuum pump is connected to a space surrounded by the enclosure.
A multi-stage vacuum press device comprising a canopy portion of an enclosure, which is provided with an openable and closable door for discharging hot air in the enclosure generated by heating and pressurizing a printed wiring board.