JPH078980U - Butt joint connector - Google Patents

Abstract

(57) [Summary] [Purpose] To obtain a butt joint connector capable of reducing the occurrence of conduction failure. [Structure] A plurality of contact portions 13 are formed on the surface of an insulating film 11a with a predetermined interval, and a conductive pattern 11b connected to these contact portions 13 is formed on the insulating film 11a. The film contact 10 in which the slits 17 and 18 are formed between the contact portions in the above is used. The butt joint connector 3 configured by using the film contact 10 has a connector housing 30 that holds the contact portion of the film contact 10 toward the outside, and a groove formed in the connector housing 30 in the film contact. An elastic member is provided so that the surface on the opposite side of the portion contacts. Then, by engaging the housing,
The contact portions of the film contacts can be brought into contact with each other by applying a predetermined contact force to electrically connect the conductive patterns.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a connector in which electrodes are brought into contact with each other, and more particularly, to a film contact having a plurality of contact portions formed on an insulating film and a butt joint connector using the film contact.

[0002]

[Prior art]

 The present applicant has proposed a butt joint connector having a structure in which there is almost no problem of wear of the contact portion and a positioning structure for accurately bringing the contact portions into contact with each other is simple. This butt joint connector constitutes a butt joint connector that brings the contact portions of the male and female film contacts into contact with each other while the housings are engaged with each other, and one of the contact portions has a plurality of bumps formed at equal intervals. And the other is formed from one bump located between the plurality of bumps and in contact with the plurality of bumps. By engaging the housings with each other, the contact portions of the male and female film contacts facing each other are brought into contact with each other to electrically connect the conductive patterns.

[0003]

[Problems to be solved by the device]

 In the connector having such a structure, the film forming the film contact having the bumps is formed of a single film member, and therefore the accuracy, distortion, and deformation of the film member, the cushion material, the film fixing mechanism, etc. However, there is a problem in that bump contact may not be uniform due to factors such as the possibility of poor continuity of the connector.

The present invention has been made in view of the above problems, and an object thereof is to provide a butt joint connector capable of reducing the occurrence of conduction failure.

[0005]

[Means and Actions for Solving the Problems]

 In order to achieve such an object, in the present invention, a plurality of contact portions are formed on the surface of the insulating film at a predetermined interval, and a conductive pattern connected to these contact portions is formed on the insulating film. , A film contact with a slit formed between the contact parts of the insulating film is used. In the film contact having such a structure, since each contact portion can independently swing in the thickness direction of the insulating film, even if there is a difference in height between the plurality of electrodes that abut and contact the contact portion, It is possible to make sure abutting contact. In addition, in the above film contact, when solder bumps are formed on the opposite side of the conductive pattern that is connected to the contact part and slits are formed between the solder bumps in the insulating film, the solder bumps are melted and other conductive It is possible to prevent the formation of a bridge with the adjacent solder bump when the member is fixed.

In the butt joint connector according to the present invention using the above film contact, the contact portion of the film contact is held outward in the connector housing, and the surface on the opposite side of the contact portion contacts. An elastic material is attached to the groove formed in the connector housing so as to be in contact with each other. In the connector having such a configuration, the elastic member disposed on the opposite side of the contact portion allows the contact portion to swing inward and outward and to impart a predetermined contact force. It is possible to surely contact each other and electrically connect the conductive patterns.

[0007]

【Example】

 Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings with reference to FIGS. 1, 2 and 3. This butt joint connector comprises a female connector 3 and a male connector 4. The female connector 3 includes a male housing 30 made of an insulating material, which has a pair of holding arms 31 and 32 that are extended between the left and right end portions 30a and 30b and extend in parallel, and is wound around these holding arms 31 and 32. And a holding member 35 that holds the pair of female film contacts 10 attached in such a manner as to press the holding arms 31 and 32.

The pair of left and right holding arms 31, 32 extend in parallel at a predetermined interval, and on their upper surfaces (the surfaces facing the male connector 4), grooves 31 a, 32 a having a rectangular cross section and extending in the longitudinal direction are formed. The elongated pressure receiving member 38 formed of an elastic material such as rubber is provided in each of the grooves 31a and 32a. Locking grooves 31b and 32b are also formed on the upper surfaces of the holding arms 31 and 32, and the front ends 10a of the female film contacts 10 are inserted into and locked by the locking grooves 31b and 32b, respectively. The holding arms 31 and 32 are arranged so as to pass through between the arms 31 and 32 and be wound around the holding arms 31 and 32. The holding member 35 is attached so as to press both film contacts 10 from below in the state of being arranged in this way. At this time, the tip portion 36 of the holding member 35 enters between the holding arms 31 and 32 and presses both film contacts 10 against the inner side surfaces of the left and right holding arms 31 and 32. In this state, the holding member 35 is separated from the female housing 30. They are connected by engaging means (not shown).

A fitting protrusion 36 a is formed on the tip portion 36 of the holding member 35, and the fitting protrusion 36 a projects upward from between the holding arms 31 and 32. Mounting bosses 33 projecting downward are formed on the left and right ends 30a, 30b of the female housing 30, and mounting brackets 37 made of L-shaped plates are mounted on the side surfaces of the left and right ends 30a, 30b. There is. These are used for mounting on the printed circuit board. For example, the mounting boss 33 is inserted into the mounting hole of the printed circuit board to perform mounting positioning, and the mounting bracket 37 is surface-mounted on the printed circuit board to set the connector 3 to a predetermined position. Can be mounted in position.

Next, a first embodiment of the film contact used in the connector will be described with reference to FIG. The film contact 10 is made by forming a plurality of conductive wiring patterns on an insulating film such as polyimide. Four contact bumps 13 are formed on the tip 10a side in a square shape at regular intervals for each wiring pattern, and solder bumps 15 are formed on the rear end 10b side for each wiring pattern. . In the film contact 10 configured as described above, the hemispherical raised electrodes are brought into contact with the central portions of the four contact bumps 13 so that they are surrounded and sandwiched by the four contact bumps 13. The electrodes come into contact with the contact bumps 13, and a reliable and good connection is made between them. Then, by welding another conductive member to the solder bump 15, the electrode and the conductive member can be electrically connected.

The film contact 10 is made of a base material called ASMAT manufactured by Nitto Denko Corporation. The insulating film layer 11a and a plurality of wiring pattern layers 11b formed on the lower surface of the insulating film layer 11a. Four small holes 11c are formed at the tip of the insulating film layer 11a corresponding to each wiring pattern layer 11b, and the small holes 11c are filled with metal (Ni, Au, Cu, etc.). The contact bumps 13 are formed in a set of four on the side opposite to the wiring pattern layer 11b. Further, at the rear end of the insulating film layer 11a, one through hole 11d is formed corresponding to each wiring pattern layer 11b, and a solder bump 15 that bulges vertically is formed at this position. ing. In addition, a plurality of solder bumps 15 may be formed by forming a plurality of through holes 11d here.

The slits 17 and 18 are formed between the contact bumps 13 and the solder bumps 15 and the adjacent bumps. These slits 17 and 18 may be formed by pressing or etching at the same time as the small holes 11c and the through holes 11d before filling each bump. Therefore, due to the action of these slits, the bumps 13 and 15 can be independently rocked with respect to the adjacent bumps in the thickness direction of the film.

According to the film contact 10 configured as described above, when a plurality of electrodes are formed on the same plane when the electrodes are brought into contact with the contact bumps 13 as described above, the height of each electrode is increased. Even if there is a slight difference, the bumps and the electrodes can be brought into contact with each other by pressing the film contact 10 or the electrodes with a predetermined pressing force. In addition, when a conductive member is welded to the solder bumps 15, the solder is melted if the solder bumps 15 are heated, so that pre-solder is unnecessary, and the solder bumps adjacent to each other are formed by the slits formed between the solder bumps. It is possible to prevent the formation of a bridge with 15.

The male film contact 50 is made in the same manner as the female film contact 10 described above, and one male contact bump 53 is formed at the tip of the insulating film layer corresponding to each wiring pattern. Only the points are different from the film contact 10. On the other hand, the male connector 4 has a structure similar to that of the female connector 3, and includes a pair of male film contacts 50 attached to a pair of holding arms 41 and 42 extending in parallel between the left and right end portions 40a and 40b. , A holding member 45. Grooves 41a, 42a having a rectangular cross section are formed on the lower surfaces of the holding arms 41, 42 (the surface facing the female connector 3), and the pressure receiving member 48 is disposed in the grooves 41a, 42a.

The male film contact 50 has its tip portion 50 a locked in the locking grooves 41 b, 42 b on the lower surface of the holding arms 41, 42 and wound between the holding arms 41, 42. And is attached by being pressed by the holding member 45 in this state. The tip portion 46 of the holding member 45 is pressed against the inner surfaces of the holding arms 41 and 42, and is connected to the male housing 40 by an engaging means (not shown). A fitting groove 46a is formed in the tip portion 46 of the holding member 45, and the fitting groove 46a is opened upward from between the holding arms 41 and 42. In addition, mounting bosses 43 projecting upward are formed on the left and right end portions 40a and 40b of the male housing 40, and mounting brackets 47 are mounted on the side surfaces.

The male and female connectors 3 and 4 having the above-described configuration are combined with the male and female housings 30 and 40 as shown by an arrow A in FIG. 3 and are integrally coupled as shown in FIG. At this time, the fitting protrusion 36a of the female housing 30 is fitted into the fitting groove 46a of the male housing 40, and the two housings 30, 40 are positioned and joined. In such a coupled state, the male contact bump 53 and the female contact bump 13 come into contact with each other. Here, slits 18 and 58 are formed between adjacent bumps of the contact bumps 13 and 53 of the film contacts 10 and 50, respectively, and below the contact bumps 13 and 53. Since the pressure receiving members 38 and 48 are provided, when the bumps vertically swing, the pressure receiving members 38 and 48 are elastically deformed to impart a predetermined contact force to the contact bumps 13 and 53. To do.

Therefore, the male contact bumps 53 come into contact with the female contact bumps 13 so as to be surrounded and sandwiched by the four female contact bumps 13, so that reliable and good connection is made between them. . Further, even when the position of the male contact bump 53 is slightly displaced from the center of the female contact bump 13 and comes into contact with the female contact bump 13, the male contact bump 53 is guided by the female contact bump 13 and moves to the center to make contact. Therefore, even if the formation positions of the male and female contact bumps 13 and 53 at the time of coupling the male and female connectors 3 and 4 or the formation heights of the formed contact bumps are slightly deviated, the self-position when the bumps contact each other. Adjusted and automatically positioned for precise abutment. For this reason, for example, there is a margin in the allowable accuracy of the attachment and positioning error of the male and female film contacts 10 and 50 to the male and female housings 30 and 40, and the manufacture of these can be facilitated.

Next, a film contact according to another embodiment of the present invention will be described with reference to FIG. In this film contact 20, a plurality of wiring pattern layers 11b are formed on an insulating film layer 11a, and a set of four contact bumps 13 and solder bumps 15 are formed on the middle portion and the rear end of the wiring pattern layer 11b, respectively. A slit 17 is formed between them. Here, since these constituent elements are the same as those of the film contact 10 according to the above-described embodiment, the same reference numerals are given and the description thereof will be omitted. In the film contact 20, when the contact bumps are formed on the plurality of wiring pattern layers 11b formed to extend in parallel at a predetermined interval, the adjacent contact bumps 13 are arranged in the extending direction of the wiring pattern layer 11b. It is formed by shifting the position. Then, slits 28 are formed on both sides of the contact bump 13 (between the adjacent wiring patterns).

As a result, like the film contact 10 according to the first embodiment, the contact bump 13 can be surely brought into contact with the electrodes and the like, and the formation density of the contact bumps 13 in the film contact 20 is increased. be able to. Therefore, even if the film contact has a small area, a large number of contact portions can be provided, and interference with adjacent contact portions can be prevented.

In this film contact 20, a wiring pattern is formed on both sides of the contact bump 13, so that the film contact 10 has a larger deflection than the contact bump in the film contact 10. Therefore, when the bumps are formed in the film contact 20, the slits 28 do not necessarily have to be provided when the bumps are arranged at different positions in the extending direction of the wiring pattern layer 11b.

[0021]

[Effect of device]

 As described above, in the butt joint connector according to the present invention, a plurality of contact portions are formed on the surface of the insulating film at a predetermined interval, and the conductive pattern connected to these contact portions is formed on the insulating film. The film contact is used to form a slit between the contact portions of this insulating film. In addition, a butt joint connector configured using this film contact has a connector housing that holds the contact portion of the film contact facing outward and a groove formed in this connector housing that has the contact portion of the film contact. An elastic material is provided so that the surface on the opposite side abuts. Then, by engaging the male and female housings with each other, the contact portions of the male and female film contacts facing each other are brought into contact with each other by applying a predetermined contact force to electrically connect the conductive patterns. it can. Therefore, it is possible to obtain a butt joint connector that is free from the possibility of poor contact.

Further, in the above film contact, when a solder bump is formed on the other end of the conductive pattern connected to the contact portion and a slit is formed between these solder bumps, another conductive member is not formed. Pre-solder is not required when welding and it is possible to prevent formation of a bridge with an adjacent solder bump.

[Brief description of drawings]

FIG. 1 is a perspective view showing a butt joint connector according to the present invention.

FIG. 2 is a sectional view of a slit portion formed in a film contact of this butt joint connector.

FIG. 3 is a cross-sectional view showing a coupled state of this butt joint connector.

FIG. 4 is a perspective view showing an example of a film contact used in this butt joint connector.

FIG. 5 is a top view showing another embodiment of the film contact used in this butt joint connector.

[Explanation of symbols]

 3 Female Connector 4 Male Connector 10, 20, 50 Film Contact 13 Female Contact Bump 53 Male Contact Bump 15, 55 Solder Bump 30 Female Housing 40 Male Housing

Claims (2)

[Scope of utility model registration request] 1. An insulating film comprising: a plurality of contact portions formed on the surface of the insulating film at predetermined intervals; and a conductive pattern formed on the insulating film by connecting to the contact portions. A film contact in which a slit is formed between the contact portions of the film, a connector housing for holding the contact portion of the film contact outward, and a surface of the film contact opposite to the contact portion are in contact with each other. A butt joint connector, comprising an elastic material attached to a groove formed in the connector housing so as to be in contact with each other. 2. The film contact comprises a plurality of contact portions formed on the surface of the insulating film with a predetermined gap, and one end of the film contact having a conductive shape formed on the insulating film by connecting to the contact portions. A pattern and a plurality of solder bumps connected to the other ends of these conductive patterns and formed on the insulating film, and slits are formed between the contact portions of the insulating film and between the solder bumps. The butt joint connector according to claim 1, wherein the butt joint connector is provided.