JPH078578B2 - Method for joining piezoelectric body and glass in ink jet recording head - Google Patents
Method for joining piezoelectric body and glass in ink jet recording headInfo
- Publication number
- JPH078578B2 JPH078578B2 JP25122386A JP25122386A JPH078578B2 JP H078578 B2 JPH078578 B2 JP H078578B2 JP 25122386 A JP25122386 A JP 25122386A JP 25122386 A JP25122386 A JP 25122386A JP H078578 B2 JPH078578 B2 JP H078578B2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- piezoelectric
- ink
- piezoelectric body
- recording head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000011521 glass Substances 0.000 title claims description 39
- 238000000034 method Methods 0.000 title claims description 20
- 238000005304 joining Methods 0.000 title description 10
- 229920000642 polymer Polymers 0.000 claims description 9
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000009792 diffusion process Methods 0.000 claims description 5
- 238000001020 plasma etching Methods 0.000 claims description 5
- 230000003213 activating effect Effects 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 description 10
- 239000000463 material Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 229910010413 TiO 2 Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- RZVAJINKPMORJF-UHFFFAOYSA-N Acetaminophen Chemical compound CC(=O)NC1=CC=C(O)C=C1 RZVAJINKPMORJF-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- BAECOWNUKCLBPZ-HIUWNOOHSA-N Triolein Natural products O([C@H](OCC(=O)CCCCCCC/C=C\CCCCCCCC)COC(=O)CCCCCCC/C=C\CCCCCCCC)C(=O)CCCCCCC/C=C\CCCCCCCC BAECOWNUKCLBPZ-HIUWNOOHSA-N 0.000 description 1
- PHYFQTYBJUILEZ-UHFFFAOYSA-N Trioleoylglycerol Natural products CCCCCCCCC=CCCCCCCCC(=O)OCC(OC(=O)CCCCCCCC=CCCCCCCCC)COC(=O)CCCCCCCC=CCCCCCCCC PHYFQTYBJUILEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000005297 pyrex Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- PHYFQTYBJUILEZ-IUPFWZBJSA-N triolein Chemical compound CCCCCCCC\C=C/CCCCCCCC(=O)OCC(OC(=O)CCCCCCC\C=C/CCCCCCCC)COC(=O)CCCCCCC\C=C/CCCCCCCC PHYFQTYBJUILEZ-IUPFWZBJSA-N 0.000 description 1
- 229940117972 triolein Drugs 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1607—Production of print heads with piezoelectric elements
- B41J2/1609—Production of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1623—Manufacturing processes bonding and adhesion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Ceramic Products (AREA)
Description
【発明の詳細な説明】 〔発明の属する技術分野〕 この発明はインクジェット記録ヘッドにおける圧電体と
ガラスの拡散接合方法に関する。Description: TECHNICAL FIELD The present invention relates to a diffusion bonding method for a piezoelectric body and glass in an inkjet recording head.
PbO,ZrO2,TiO2などを原料とし、Pb（Zr,Ti）O3を基本式
とする圧電セラミックは、最近その応用が多岐にわたっ
てきている。これに伴ない、圧電セラミ ク単体だけで
はなく、他の部材と接着もしくは接合した複合構造体と
して使用される例が多くなりつつある。Piezoelectric ceramics made of PbO, ZrO 2 , TiO 2 and the like and having Pb (Zr, Ti) O 3 as a basic formula have been widely applied recently. Along with this, not only the piezoelectric ceramic itself but also an example in which it is used as a composite structure bonded or joined with other members is increasing.
現在圧電セラミックと金属，セラミック，ガラスおよび
プラスチックなどの接着もしくは接合方法としては以下
のものがある。Currently, the following methods are available for bonding or joining piezoelectric ceramics to metals, ceramics, glass and plastics.
（１）有機系接着剤を用いる方法、 （２）接合しようとする部材にNiメッキなどを施こし、
ハンダまたはろう材を用いて接合する方法、 （３）圧電セラミックとガラスの接合をガラスの軟化点
以上に加熱して両者を融着する方法、 上記の方法はそれぞれ特徴をもっているので、それを活
かした用途に適用されている。しかしながら圧電セラミ
ックを用いた超精密機構部品の接合方法としては種々の
問題点を有している。例えば、インクジェット記録ヘッ
ドには第１図に示す構成のものがある。第１図の（Ａ）
は、インクジェット記録ヘッドの横断面図、同図（Ｂ）
はその縦断面図である。これらの図において、１は圧電
セラミックから成る一枚の平板状に成形された圧電体プ
レートである。この圧電体プレート１には第２図に詳細
に示すようにインクキャビティ用溝２およびこのインク
キャビティ用溝２に連通するインク供給路用溝３および
インクノズル用溝４が複数列形成されている。インクキ
ャビティ用溝２は、２つの深溝部5,6および両深溝部5,6
間に設けられた浅溝部７からなる。(1) Method using organic adhesive, (2) Applying Ni plating etc. to the members to be joined,
Method of joining using solder or brazing material, (3) Method of heating the joining of piezoelectric ceramic and glass above the softening point of glass and fusing both, The above methods have their respective characteristics. It has been applied to various uses. However, there are various problems as a method for joining ultra-precision mechanical parts using piezoelectric ceramics. For example, there is an inkjet recording head having the configuration shown in FIG. Figure 1 (A)
Is a cross-sectional view of the inkjet recording head, FIG.
Is a vertical sectional view thereof. In these figures, reference numeral 1 is a piezoelectric plate formed of a piezoelectric ceramic in the form of a flat plate. As shown in detail in FIG. 2, a plurality of rows of ink cavity grooves 2, ink supply channel grooves 3 and ink nozzle grooves 4 communicating with the ink cavity grooves 2 are formed on the piezoelectric plate 1. . The ink cavity groove 2 includes two deep groove portions 5 and 6 and both deep groove portions 5 and 6.
The shallow groove portion 7 is provided between them.
さらに、第１図において８は圧電体プレート１のインク
キャビティ用溝2,インクノズル用溝４等が形成されてい
る面に接合されたガラスからなるカバープレートであ
る。しかして、圧電体プレート１とガラスカバープレー
ト８との間ではインクキャビティ用溝２からインクキャ
ビティ2Aが、インクノズル用溝４からインクノズル4A
が、インク供給路用溝３からインク供給路3Aがそれぞれ
形成される。そして、インクキャビティ2Aにおいては浅
溝部７を形成する圧電体膨出部９に電圧印加用電極10が
設けられ、その電極10に対応する圧電体ブレーキ１の下
面に電極11が設けられている。Further, in FIG. 1, reference numeral 8 denotes a cover plate made of glass bonded to the surface of the piezoelectric plate 1 on which the ink cavity groove 2, ink nozzle groove 4 and the like are formed. Then, between the piezoelectric plate 1 and the glass cover plate 8, the ink cavity groove 2 to the ink cavity 2A, and the ink nozzle groove 4 to the ink nozzle 4A.
However, the ink supply path 3A is formed from the ink supply path groove 3. In the ink cavity 2A, the piezoelectric material bulging portion 9 forming the shallow groove portion 7 is provided with the voltage application electrode 10, and the electrode 11 is provided on the lower surface of the piezoelectric material brake 1 corresponding to the electrode 10.
しかして、このように構成されたインクジェット記録ヘ
ッドにおいて電極10,11間に電圧を印加すると、両電極1
0,11間の圧電体が膨張して、インクキャビティ2A内の体
積を減少させ、その結果インクキャビテイ2A内のインク
が当該インクキャビティ2Aに連通するインクノズル4Aか
ら液滴状に図示していない記録担体上に噴射される。Therefore, when a voltage is applied between the electrodes 10 and 11 in the ink jet recording head configured as described above, both electrodes 1
The piezoelectric body between 0 and 11 expands to reduce the volume in the ink cavity 2A, and as a result, the ink in the ink cavity 2A is not shown as a droplet from the ink nozzle 4A communicating with the ink cavity 2A. Ejected onto the record carrier.
インクジェット記録ヘッドにおいては第３図に詳細に示
すように、ノズル4Aの大きさは40μｍ×40μｍ、ノズル
4A,4Aの間隔Ｃはたとえば1mmに形成されている。さらに
圧電体プレートの厚さＬは0.5mm,インクキャビティ2Aの
幅B0は0.7mm,浅溝部７つまり圧電体膨出部９の幅B1は0.
6mmそして深溝部5,6の幅B2は50μｍに形成されている。
かかる微細で精密な構成においては圧電体プレート１と
ガラスカバープレート８の接合が重要な重要技術とな
る。例えば前記（１）の有機系接着剤を用いる場合は、
接着時の温度が低温のため、圧電体プレート１とガラス
カバープレート８の線膨張係数（α）の差は問題になら
ないが、接着剤がノズル4Aに進入してインクノズル詰ま
りが発生しやすく、さらにインク中に含まれる溶剤によ
って接着剤が侵食され、隣接するインクキャビティ間で
インクのクロストークを生じやすいなどの問題がある。
また前記（３）の融着で接合する場合は、この方法は一
種の固相接合であるためノズル4Aの詰まりは発生しない
が、処理温度が一般的には600゜〜900゜の範囲であるた
め圧電体プレート１とガラスカバープレート８の線膨張
係数の整合性がないとそのいずれかにクラックが発生し
てしまうという欠点がある。In the ink jet recording head, as shown in detail in FIG. 3, the size of the nozzle 4A is 40 μm × 40 μm,
The interval C between 4A and 4A is formed to be 1 mm, for example. Further, the thickness L of the piezoelectric plate is 0.5 mm, the width B 0 of the ink cavity 2A is 0.7 mm, and the width B 1 of the shallow groove portion 7, that is, the piezoelectric bulging portion 9 is 0.
The width B 2 of the deep groove portions 5 and 6 is 6 mm and is 50 μm.
In such a fine and precise structure, joining of the piezoelectric plate 1 and the glass cover plate 8 is an important and important technique. For example, when the organic adhesive of (1) above is used,
Since the temperature at the time of bonding is low, the difference in the linear expansion coefficient (α) between the piezoelectric plate 1 and the glass cover plate 8 does not pose a problem, but the adhesive easily enters the nozzle 4A to cause ink nozzle clogging, Further, there is a problem that the solvent is contained in the ink and the adhesive is eroded, which easily causes crosstalk of the ink between the adjacent ink cavities.
Further, in the case of joining by fusion of the above (3), since this method is a kind of solid phase joining, clogging of the nozzle 4A does not occur, but the treatment temperature is generally in the range of 600 ° to 900 °. Therefore, if the piezoelectric plate 1 and the glass cover plate 8 do not have a matching coefficient of linear expansion, there is a drawback that cracks occur in either of them.
この発明は、上記の点に鑑みてなされたものでありその
目的とするところは、精密な圧電セラミックス構成を可
能とするようなインクジェット記録ヘッドにおける圧電
体セラミックスとガラスとの簡易で信頼性の高い接合方
法を提供するにある。The present invention has been made in view of the above points, and it is an object of the present invention to provide a simple and highly reliable piezoelectric ceramic and glass in an ink jet recording head that enables a precise piezoelectric ceramic structure. It is to provide a joining method.
この発明はインクジェット記録ヘッドにおける圧電体と
ガラスを拡散接合させる方法において、 （イ）圧電体とガラスのうち少なくとも１つの表面を活
性化する工程、 （ロ）上記圧電体とガラスを重ね合わせて重合体を得る
工程、 （ハ）上記重合体を真空雰囲気中で加熱，加圧して重合
体を拡散接合させる工程、 を備えるのでその目的を達する。すなわち、圧電体とガ
ラスのうち少なくとも１つの表面を活性化し、低い温度
において拡散接合を行なわせるようにしたものである。The present invention relates to a method of diffusively bonding a piezoelectric body and glass in an ink jet recording head, including the step of: (a) activating at least one surface of the piezoelectric body and glass; The object is achieved by the steps of (a) heating and pressurizing the polymer in a vacuum atmosphere to diffuse-bond the polymer. That is, at least one surface of the piezoelectric body and the glass is activated so that diffusion bonding is performed at a low temperature.
次に図面にもとづいてこの発明の実施例を説明する。圧
電セラミックス用の原料粉末として試薬特級のPbO,Zr
O2,TiO2,Nb2O5,およびNiOを用い以下の配合組成とし
た。PbO70.0重量％,ZrO26,6重量％,TiO28.4重量％,Nb2O
514.0重量％,NiO4.0重量％。バインダとしてポリビニル
ブチラール、可塑剤はフタル酸ジオクチルとポリエチレ
ングリコール、分散剤としてトリオレイン、溶媒はトル
エンとイリプロピルアルコールを用い、ボールミルでよ
く分散混合してスラリー化した。減圧脱泡したのちドク
タブレード法でポリエステルフイルム上に約0.3mmの厚
さに成膜し、自然乾燥したあと、赤外線で乾燥してグリ
ーンシートを得た。次にこのグリーンシートを２枚背中
合わせに重合しホットプレスにより積層してから所定の
サイズにパンチし、電気炉で温度1250℃で２時間酸化雰
囲気中で焼成し厚さ0.5mm,巾30mm,長さ50mmの圧電体プ
レート１を得た。この圧電体プレート１の一方の表面を
鏡面研まして面を出し、次に鏡面研ましたのと同じサイ
ドから、ダイシングソー用いて第２図に示すようなイン
クキャビティ用溝２（インクキャビティ用深溝部5,6と
インクキャビティ用浅溝部７からなる），インク供給路
用溝３およびインクノズル用溝４を突設した。寸法は第
３図において前述したのと同様とした。電圧印加用電極
10,11はAgを蒸着させて形成した。ガラスカバープレー
ト８としては厚さ1mm,巾30mm,長さ50mmのガラス（パイ
レックスコード7740）を使用した。ガラスも圧電体プレ
ート１と同様鏡面研まを施した。溝加工した前記圧電体
プレート１と鏡面研ましたガラスカバープレート８の両
者を５分間アセトン中で超音波洗滌したのち、アルゴン
ガス中で45分間プラズマエッチング処理した。この処理
で表面が清浄化され、活性化される。鏡面研ました面を
接合面として両者を重ね合わせた。Next, an embodiment of the present invention will be described with reference to the drawings. Reagent grade PbO, Zr as raw material powder for piezoelectric ceramics
O 2 , TiO 2 , Nb 2 O 5 , and NiO were used in the following composition. PbO 70.0% by weight, ZrO 2 6,6% by weight, TiO 2 8.4% by weight, Nb 2 O
5 14.0% by weight, NiO 4.0% by weight. Polyvinyl butyral as a binder, dioctyl phthalate and polyethylene glycol as a plasticizer, triolein as a dispersant, and toluene and iripropyl alcohol as a solvent were well dispersed and mixed in a ball mill to form a slurry. After defoaming under reduced pressure, a film having a thickness of about 0.3 mm was formed on a polyester film by a doctor blade method, naturally dried and then dried by infrared rays to obtain a green sheet. Next, two sheets of this green sheet are polymerized back to back and laminated by hot pressing, punched to a specified size, and fired in an oxidizing atmosphere at a temperature of 1250 ° C for 2 hours in an oxidizing atmosphere. Thickness 0.5mm, width 30mm, length A 50 mm thick piezoelectric plate 1 was obtained. One surface of the piezoelectric plate 1 is mirror-polished to expose a surface, and then, from the same side as the mirror-polished surface, a dicing saw is used to form an ink cavity groove 2 (ink cavity deep groove) as shown in FIG. Parts 5, 6 and the shallow groove portion 7 for the ink cavity), the ink supply channel groove 3 and the ink nozzle groove 4 are provided in a protruding manner. The dimensions were the same as described above in FIG. Voltage application electrode
10 and 11 were formed by depositing Ag. As the glass cover plate 8, glass (Pyrex code 7740) having a thickness of 1 mm, a width of 30 mm and a length of 50 mm was used. The glass was also mirror-polished like the piezoelectric plate 1. Both the grooved piezoelectric plate 1 and the mirror-polished glass cover plate 8 were ultrasonically cleaned in acetone for 5 minutes and then plasma-etched in argon gas for 45 minutes. The surface is cleaned and activated by this treatment. The mirror-polished surface was used as the bonding surface and the two were overlaid.
次にこの重合体を約１×10-4Torr以下の真空中で温度30
0℃，圧力3kg/cm2の条件で60分間処理し、鉛の拡散によ
り圧電体プレート１とガラスカバープレート８の拡散接
合を行なって第１図に示すようなマルチノズル式インク
ジェット記録ヘッドを得た。室温に冷却してから両者の
厚さ方向をダイシンクソーで切断し、研ましてから接合
部を100倍の光学顕微鏡で観察した。接合部に空孔，ク
ラックなどの欠陥はなく良好であった。また圧電プレー
ト１のインク供給路3Aおよびインクノズル4Aに対するガ
ラスの詰まりはなく、さらにインクを注入してもインク
のクロストークは皆無であった。Next, this polymer was heated to a temperature of 30 ° C. in a vacuum of about 1 × 10 -4 Torr or less.
The multi-nozzle type ink jet recording head as shown in FIG. 1 was obtained by treating the piezoelectric plate 1 and the glass cover plate 8 by diffusion of lead for 60 minutes under the condition of 0 ° C. and a pressure of 3 kg / cm 2 . It was After cooling to room temperature, both thickness directions were cut with a die sink saw, polished, and the joint was observed with a 100 × optical microscope. The joint was good with no defects such as voids or cracks. Further, there was no clogging of the glass with respect to the ink supply path 3A and the ink nozzle 4A of the piezoelectric plate 1, and there was no ink crosstalk even when ink was injected.
このようにプラズマエッチング処理により良好な接合が
得られたのはプラズマエッチングによりガラスカバープ
レート８および圧電体プレート１の表面が清浄化され、
化学的に活性化して低い温度における接合が可能となっ
たためであり、さらにそのためにガラスと圧電体の熱膨
脹率の差によって接合面に発生する熱的な残留応力が少
なくなったことによる。Thus, good bonding was obtained by the plasma etching process because the surfaces of the glass cover plate 8 and the piezoelectric plate 1 were cleaned by the plasma etching.
This is because they are chemically activated to enable bonding at a low temperature, and because of that, the thermal residual stress generated on the bonding surface due to the difference in the coefficient of thermal expansion between the glass and the piezoelectric is reduced.
比較のため、プラズマエッチング処理を除き前記と同様
の条件で接合したものは、接合面で剥離を生じた。接合
表面の活性化の手段として上述の実施例ではプラズマエ
ッチングを例にとったがこれに限るものでなく、化学的
エッチング，機械的エッチングなどを用いても圧電体プ
レートとガラスを低温で接合することができる。また前
述の実施例では圧電体プレート１とガラスカバープレー
ト８の両方の面をエッチングしているがエッチングはそ
のいずれか一方の表面だけでも充分にその効果を発揮す
る。For comparison, those bonded under the same conditions as described above except for the plasma etching treatment caused peeling at the bonding surface. As the means for activating the bonding surface, plasma etching is taken as an example in the above-mentioned embodiment, but the invention is not limited to this, and the piezoelectric plate and the glass can be bonded at a low temperature by using chemical etching, mechanical etching or the like. be able to. Further, in the above-described embodiment, both the surfaces of the piezoelectric plate 1 and the glass cover plate 8 are etched, but the etching is sufficiently effective even if only one of the surfaces is etched.
エッチング後の接合条件すなわち真空度，加熱温度，印
加圧力などは接合する圧電体プレートとガラスの材質，
形状，エッチング程度により実験的に定まる。真空度を
より高真空度にし、加熱温度を高くし、または印加圧力
を大きくすると、当然ながら接合部の剥離強度などはそ
れに応じて増大するが、インクジエット記録ヘッドとし
て使用する圧電体プレートとガラスの拡散接合において
は、加熱温度250℃ないし400℃，印加圧力0.5kg/cm2な
いし10kg/cm2,真空度１×10-5Torrないし10×10-5Torr
の範囲で良好な接合を得ることができる。ガラスとして
はソーダガラス，ホーケイ酸ガラス，石英ガラスなどを
使用することができる。またこの発明にかかわる方法は
圧電体と金属との接合においても有効に適用できるもの
である。The bonding conditions after etching, that is, the degree of vacuum, heating temperature, applied pressure, etc.
Experimentally determined by shape and degree of etching. When the degree of vacuum is increased to a higher degree, the heating temperature is increased, or the applied pressure is increased, the peel strength of the joint portion naturally increases accordingly, but the piezoelectric plate and glass used as the ink jet recording head In diffusion bonding, the heating temperature is 250 ℃ to 400 ℃, the applied pressure is 0.5kg / cm 2 to 10kg / cm 2 , the degree of vacuum is 1 × 10 -5 Torr to 10 × 10 -5 Torr.
Good bonding can be obtained within the range. As the glass, soda glass, borosilicate glass, quartz glass or the like can be used. Further, the method according to the present invention can be effectively applied to joining a piezoelectric body and a metal.
この発明によればインクジェット記録ヘッドにおける圧
電体とガラスを拡散接合させる方法において、 （イ）圧電体とガラスの少なくともいずれか１つの表面
を活性化する工程、 （ロ）上記圧電体とガラスを重ね合わせて重合体を得る
工程、 （ハ）上記重合体を真空雰囲気中で加熱，加圧して重合
体を拡散接合させる工程、 を備えるので、圧電体とガラスのうち少なくとも１つの
表面が活性化して前記圧電体とガラスが低い温度におい
て拡散接合することとなり、そのために圧電体とガラス
の熱膨脹率の差によって接合面に発生する熱的な残留応
力が減少し、その結果簡易な方法で信頼性に富んだ圧電
体とガラスの接合を行なうことができ、マルチノズル式
インクジェット記録ヘッドのような圧電体を含む複合構
造の精密機構部品を容易量産することが可能となった。According to the present invention, in a method of diffusion-bonding a piezoelectric body and glass in an inkjet recording head, (a) a step of activating at least one surface of the piezoelectric body and glass; In addition, the step of obtaining a polymer, and (c) the step of heating and pressurizing the polymer in a vacuum atmosphere to diffuse-bond the polymer are provided, so that at least one surface of the piezoelectric body and the glass is activated. The piezoelectric body and the glass are diffusion-bonded at a low temperature, so that the thermal residual stress generated on the joint surface due to the difference in the coefficient of thermal expansion between the piezoelectric body and the glass is reduced, and as a result, the reliability is improved by a simple method. Capable of bonding abundant piezoelectric material and glass, and easy to manufacture precision mechanical parts with complex structure including piezoelectric material such as multi-nozzle type ink jet recording head. It became possible to produce.
第１図はマルチノズル式インクジェット記録ヘッドの構
成を示し、同図（Ａ）はその横断面図、同図（Ｂ）はそ
の縦断面図、第２図は第１図の圧電体プレートを示し、
同図（Ａ）はその平面図、同図（Ｂ）はその横断面図、
同図（Ｃ）はその縦断面図、第３図は第１図の部分拡大
断面図である。 1:圧電体プレート、8:ガラスカバープレート。FIG. 1 shows the structure of a multi-nozzle type ink jet recording head. FIG. 1 (A) is a transverse sectional view thereof, FIG. 1 (B) is a longitudinal sectional view thereof, and FIG. 2 shows the piezoelectric plate of FIG. ,
The same figure (A) is the top view, the same figure (B) is the cross-sectional view,
FIG. 3C is a vertical sectional view thereof, and FIG. 3 is a partially enlarged sectional view of FIG. 1: Piezoelectric plate, 8: Glass cover plate.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０４Ｂ 37/04 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 6 Identification code Office reference number FI technical display location C04B 37/04
Claims (2)
おいて （イ）圧電体とガラスの少なくともいずれか１つの表面
を活性化する工程、 （ロ）上記圧電体とガラスを重ね合わせて重合体を得る
工程、 （ハ）上記重合体を真空雰囲気中で加熱，加圧して重合
体を拡散接合させる工程、を備えることを特徴とするイ
ンクジェット記録ヘッドにおける圧電体とガラスの接合
方法。1. A method of diffusion bonding a piezoelectric body and glass (a) activating the surface of at least one of the piezoelectric body and glass, and (b) polymer by superposing the piezoelectric body and glass. And (c) heating and pressurizing the polymer in a vacuum atmosphere to diffuse-bond the polymer, the method for bonding a piezoelectric body and glass in an inkjet recording head.
いて、ガラスの圧電体と接合する面をプラズマエッチン
グを用いて活性化することを特徴とするインクジェット
記録ヘッドにおける圧電体とガラスの接合方法。2. The bonding method according to claim 1, wherein the surface of the glass to be bonded to the piezoelectric body is activated by using plasma etching. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25122386A JPH078578B2 (en) | 1986-10-22 | 1986-10-22 | Method for joining piezoelectric body and glass in ink jet recording head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25122386A JPH078578B2 (en) | 1986-10-22 | 1986-10-22 | Method for joining piezoelectric body and glass in ink jet recording head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63104845A JPS63104845A (en) | 1988-05-10 |
| JPH078578B2 true JPH078578B2 (en) | 1995-02-01 |
Family
ID=17219535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25122386A Expired - Lifetime JPH078578B2 (en) | 1986-10-22 | 1986-10-22 | Method for joining piezoelectric body and glass in ink jet recording head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078578B2 (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100519964B1 (en) | 2003-08-27 | 2005-10-13 | 삼성광주전자 주식회사 | Accessory assembly for vacuum cleaner |
| US8053951B2 (en) * | 2008-11-04 | 2011-11-08 | Fujifilm Corporation | Thin film piezoelectric actuators |
| JP2013214629A (en) * | 2012-04-03 | 2013-10-17 | Nippon Electric Glass Co Ltd | Wavelength conversion member and light emitting device |
| CN112897899B (en) * | 2021-01-21 | 2022-06-14 | 杭州中科神光科技有限公司 | Glass assembly bonding method |
| CN112919815B (en) * | 2021-01-21 | 2022-06-03 | 杭州中科神光科技有限公司 | Glass assembly bonding method |
-
1986
- 1986-10-22 JP JP25122386A patent/JPH078578B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63104845A (en) | 1988-05-10 |
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