JPH078217Y2 - Light emitting diode head - Google Patents
Light emitting diode headInfo
- Publication number
- JPH078217Y2 JPH078217Y2 JP1988090129U JP9012988U JPH078217Y2 JP H078217 Y2 JPH078217 Y2 JP H078217Y2 JP 1988090129 U JP1988090129 U JP 1988090129U JP 9012988 U JP9012988 U JP 9012988U JP H078217 Y2 JPH078217 Y2 JP H078217Y2
- Authority
- JP
- Japan
- Prior art keywords
- base
- light emitting
- emitting diode
- substrate
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Description
【考案の詳細な説明】 ［産業上の利用分野］ 本考案は、発光ダイオードヘッドに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a light emitting diode head.
［従来の技術］ 従来より用いられている発光ダイオードヘッドの構造を
第２図に示す。[Prior Art] FIG. 2 shows a structure of a light emitting diode head which has been conventionally used.
同図において１は発光ダイオードアレイ（以下LEDアレ
イと称する）、２はLEDアレイ１を搭載する基板、３は
基板２を固定するベース、４はLEDアレイ１から出射さ
れた光を集光するセルフォックレンズアレイ（以下SLA
と称する）、５はベース３に取付けられた固定治具、６
はSLA4を固定治具５に取付ける偏心ねじを示す。In the figure, 1 is a light emitting diode array (hereinafter referred to as LED array), 2 is a substrate on which the LED array 1 is mounted, 3 is a base for fixing the substrate 2, and 4 is a cell for condensing light emitted from the LED array 1. Fock lens array (hereinafter SLA
5) is a fixing jig attached to the base 3, 6
Shows an eccentric screw for attaching the SLA 4 to the fixing jig 5.
同図で基板２はベース３に樹脂等により固定されるが、
この場合樹脂等の厚さにより基板２の高さにバラツキが
生じるので、LEDアレイ１の発光面とSLA4の間の焦点距
離が最適となるよう偏心ねじ６でSLA4の高さの調節が行
われる。In the figure, the substrate 2 is fixed to the base 3 with resin or the like,
In this case, since the height of the substrate 2 varies due to the thickness of the resin or the like, the height of the SLA4 is adjusted by the eccentric screw 6 so that the focal length between the light emitting surface of the LED array 1 and the SLA4 becomes optimum. .
又、SLA4、基板２及びベース３の夫々の長手方向及び横
方向の位置合せはベース３に刻まれた基準線に基板２の
設定位置を合致させる合せ作業により行われる。The SLA 4, the substrate 2 and the base 3 are aligned with each other in the longitudinal direction and the lateral direction by the aligning work of matching the set position of the substrate 2 with the reference line engraved on the base 3.
［考案が解決しようとする課題］ 上述したように発光ダイオードヘッドを組立てる場合は
LEDアレイとSLAとの間の距離が最適になるよう偏心ねじ
で調節する一方、LEDアレイ、基板及びベースの夫々の
位置合せを行わなければならないが、一般にこれらの調
整作業は面倒で量産性に欠ける嫌いがある。[Problems to be Solved by the Invention] When assembling the light emitting diode head as described above,
While adjusting the eccentric screws to optimize the distance between the LED array and the SLA, the LED array, the board, and the base must be aligned, but these adjustments are generally cumbersome and mass-producible. I have a dislike to lack.
本考案の目的は、組立が容易で量産性を大幅に向上する
発光ダイオードヘッドを提供することにある。It is an object of the present invention to provide a light emitting diode head that is easy to assemble and greatly improves mass productivity.
［課題を解決するための手段］ 本考案の要旨とするところは、発光ダイオードアレイを
搭載した基板と、該基板を支持するベースと、前記発光
ダイオードアレイの上方に前記ベースに設けられた押え
板により固定されて前記発光ダイオードアレイの出射光
を集光するセルフォックレンズアレイとよりなる発光ダ
イオードヘッドにおいて、前記基板及び前記ベースの夫
々に同じ大きさの複数の位置合せ用貫通穴が設けられる
と共に、前記ベースの前記基板を搭載しない面側の位置
合せ用貫通穴内壁にねじが切られていると共に該ねじに
螺合する押ねじが取付けられており、前記基板及び前記
ベースの位置合せ用貫通穴に該貫通穴と同一太さを有す
る調整ピンを挿入することにより前記基板と前記ベース
の位置決めを行うと共に、前記調整用ピンは上端が前記
セルフォックレンズアレイの底部を支持し下端が前記ベ
ースの前記位置合せ用貫通穴に取付けられた押ねじの先
端と接しており、該押ねじの回転により調整ピンを上下
動させて前記発光ダイオードアレイと前記セルフォック
レンズアレイ間の焦点距離を調節するよう構成されたこ
とを特徴とする発光ダイオードヘッドにある。[Means for Solving the Problems] The gist of the present invention is to provide a substrate on which a light emitting diode array is mounted, a base for supporting the substrate, and a holding plate provided on the base above the light emitting diode array. In a light emitting diode head composed of a SELFOC lens array which is fixed by means of a selfoc lens array for condensing light emitted from the light emitting diode array, a plurality of through holes for alignment having the same size are provided in each of the substrate and the base. , A screw is cut on the inner wall of the through hole for alignment on the surface side of the base on which the substrate is not mounted, and a set screw that is screwed into the screw is attached to the through hole for aligning the substrate and the base. The adjustment pin having the same thickness as the through hole is inserted into the hole to position the substrate and the base, and the adjustment pin is used. Has an upper end supporting the bottom of the SELFOC lens array and a lower end in contact with the tip of a set screw attached to the positioning through hole of the base, and the adjustment pin is moved up and down by rotation of the set screw. The light emitting diode head is configured to adjust a focal length between the light emitting diode array and the SELFOC lens array.
［作用］ 本考案の発光ダイオードヘッドではLEDアレイが搭載さ
れている基板とこの基板を支持するベースの夫々に同じ
大きさの複数の位置合せ用貫通穴を設け、この位置合せ
用貫通穴に貫通穴と同一太さを有する調整ピンを挿入す
ることにより基板とベースとの位置合せを簡単化するこ
とができ、更に位置合せ用貫通穴を貫通して挿入された
調整用ピンは上端がセルフォックレンズアレイの底部を
支持し下端がベースに取付けられた押ねじの先端と接し
ており、押ねじの回転により調整ピンを上下動させるこ
とによりLEDアレイとSLA間の焦点合せを同時に行うこと
が可能となる。[Operation] In the light emitting diode head of the present invention, a plurality of positioning through holes having the same size are provided in each of the substrate on which the LED array is mounted and the base supporting the substrate, and the positioning through holes are penetrated. The adjustment pin with the same thickness as the hole can be inserted to simplify the alignment between the board and the base, and the adjustment pin inserted through the alignment through hole has a self-locking top end. The bottom of the lens array is supported and the lower end is in contact with the tip of a set screw attached to the base. By rotating the set screw, the adjustment pin can be moved up and down to simultaneously focus the LED array and SLA. Becomes
［実施例］ 以下、本考案の一実施例について図を用いて説明する。[Embodiment] An embodiment of the present invention will be described below with reference to the drawings.
第１図は本考案の発光ダイオードヘッドの一実施例を示
す断面図であり、第２図と同一部分には同一符号が付け
られている。1 is a sectional view showing an embodiment of a light emitting diode head of the present invention, and the same parts as those in FIG. 2 are designated by the same reference numerals.
同図において７はセラミック等の基板２及びベース３に
設けられた同じ大きさの位置合せ用貫通穴、８は位置合
せ用貫通穴７に挿入された貫通穴と同一太さの調整ピ
ン、９はベース３の基板２を搭載する反対面に位置合せ
用貫通穴と同位置で位置合せ用貫通穴よりも大きく内壁
にねじが切られた凹部にねじ螺合により挿入取付けられ
た押ねじ、10はSLA4を両側より押える押え板、11はSLA4
をベース３に固定するホルダである。SLAは押え板10に
樹脂等により接着されホルダ11で堅牢に保持される。In the figure, 7 is a through hole for alignment of the same size provided in the substrate 2 and base 3 made of ceramic or the like, 8 is an adjusting pin having the same thickness as the through hole inserted in the through hole 7 for alignment, 9 Is a set screw mounted on the opposite surface of the base 3 on which the substrate 2 is mounted at the same position as the through hole for alignment and larger than the through hole for alignment and inserted into a recessed portion having a threaded inner wall by screwing. Is a holding plate that holds SLA4 from both sides, 11 is SLA4
Is a holder for fixing to the base 3. The SLA is adhered to the holding plate 10 with resin or the like and is firmly held by the holder 11.
この発光ダイオードヘッドを組立てる場合は、基板２の
長手方向の両端にレーザ加工等により貫通穴をあけ、こ
の貫通穴とベース３に設けられている同じ大きさの貫通
穴に、貫通穴と同じ太さの調整ピン８を挿入することに
より両者の位置合せを行うことができる。When assembling this light-emitting diode head, through holes are formed at both ends in the longitudinal direction of the substrate 2 by laser processing or the like, and the through holes of the same size provided in the base 3 and the through holes have the same thickness as the through holes. By inserting the adjusting pin 8 of the height, the both can be aligned.
このとき調整ピン８の上端はSLA4の底部を支持し下端は
押ねじ９により支持されているので、押ねじ９を回転す
ることによりLEDアレイ１とSLA4間の焦点合せを行うこ
とができる。At this time, the upper end of the adjusting pin 8 supports the bottom of the SLA 4 and the lower end is supported by the set screw 9, so that the focus between the LED array 1 and the SLA 4 can be performed by rotating the set screw 9.
このように調整ピン８の設置により基板２とベース３と
の長手方向に対する位置合せを行なうことができ、又LE
Dアレイ１とSLA4間の焦点合せを同時に行うことができ
る。In this way, by installing the adjusting pin 8, the substrate 2 and the base 3 can be aligned in the longitudinal direction, and the LE
Focusing between the D array 1 and SLA4 can be performed simultaneously.
この場合、SLA4とベース３との間の横方向の位置合せは
機械加工の精度で必要精度が十分確保できるので調整手
段は不要となる。In this case, the lateral alignment between the SLA 4 and the base 3 can be sufficiently secured by the precision of machining so that the adjusting means is not necessary.
尚上記の実施例ではベース３とホルダ11とは別部品にな
っているが一体化することができる。Although the base 3 and the holder 11 are separate parts in the above embodiment, they can be integrated.
又基板２はセラミックの他にガラス、エポキシ等の材料
を用いることができる。In addition to ceramics, the substrate 2 may be made of glass, epoxy, or another material.
［考案の効果］ 以上述べたように本考案によれば次のような効果が得ら
れる。[Effect of the Invention] As described above, according to the present invention, the following effects can be obtained.
（１）発光ダイオードヘッドの組立作業が簡略化され量
産性を向上することができる。(1) The work of assembling the light emitting diode head is simplified and mass productivity can be improved.
（２）セルフォックレンズアレイを押え板で固定するこ
とにより機械的、光学的に安定化することができる。(2) The SELFOC lens array can be mechanically and optically stabilized by fixing it with a holding plate.
第１図は本考案の発光ダイオードヘッドの一実施例を示
す断面図、第２図は従来例の説明図である。 1:LEDアレイ、2:基板、3:ベース、4:SLA、7:位置合せ用
貫通穴、8:調整ピン、9:押ねじ、10:押え板。FIG. 1 is a sectional view showing an embodiment of a light emitting diode head of the present invention, and FIG. 2 is an explanatory view of a conventional example. 1: LED array, 2: Board, 3: Base, 4: SLA, 7: Positioning through hole, 8: Adjustment pin, 9: Set screw, 10: Holding plate.
───────────────────────────────────────────────────── フロントページの続き (72)考案者 佐藤 輝次 茨城県日立市日高町５丁目１番１号 日立 電線株式会社日高工場内 (72)考案者 芦塚 紀尋 茨城県日立市日高町５丁目１番１号 日立 電線株式会社電線研究所内 (56)参考文献 特開 昭62−250466（ＪＰ，Ａ) 実開 昭62−173754（ＪＰ，Ｕ) ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Teruji Sato, Inventor Teruji Sato, 5-1-1, Hidaka-cho, Hitachi-shi, Ibaraki Hitachi Electric Cable Co., Ltd. Hidaka factory (72) Inventor Norihiro Ashizuka, Hidaka, Hitachi-shi, Ibaraki 5-1-1, Machi, Hitachi Cable, Ltd., Electric Wire Research Laboratory (56) Reference JP-A-62-250466 (JP, A) Actually-made Shou 62-173754 (JP, U)
Claims (1)
該基板を支持するベースと、前記発光ダイオードアレイ
の上方に前記ベースに設けられた押え板により固定され
て前記発光ダイオードアレイの出射光を集光するセルフ
ォックレンズアレイとよりなる発光ダイオードヘッドに
おいて、前記基板及び前記ベースの夫々に同じ大きさの
複数の位置合せ用貫通穴が設けられると共に、前記ベー
スの前記基板を搭載しない面側の位置合せ用貫通穴内壁
にねじが切られていると共に該ねじに螺合する押ねじが
取付けられており、前記基板及び前記ベースの位置合せ
用貫通穴に該貫通穴と同一太さを有する調整ピンを挿入
することにより前記基板と前記ベースの位置決めを行う
と共に、前記調整用ピンは上端が前記セルフォックレン
ズアレイの底部を支持し下端が前記ベースの前記位置合
せ用貫通穴に取付けられた押ねじの先端と接しており、
該押ねじの回転により調整ピンを上下動させて前記発光
ダイオードアレイと前記セルフォックレンズアレイ間の
焦点距離を調節するよう構成されたことを特徴とする発
光ダイオードヘッド。1. A substrate on which a light emitting diode array is mounted,
A light emitting diode head comprising a base supporting the substrate and a selfoc lens array fixed above the light emitting diode array by a holding plate provided on the base to collect light emitted from the light emitting diode array, Each of the substrate and the base is provided with a plurality of through holes for alignment of the same size, and the inner wall of the through hole for alignment on the surface side of the base on which the substrate is not mounted is threaded and A push screw to be screwed with the screw is attached, and the board and the base are positioned by inserting an adjusting pin having the same thickness as the through hole into the through hole for alignment of the board and the base. In addition, the adjustment pin has an upper end that supports the bottom of the SELFOC lens array and a lower end that is attached to the alignment through hole of the base. It was in contact with the distal end of the push screw,
A light emitting diode head configured to adjust a focal length between the light emitting diode array and the SELFOC lens array by moving an adjusting pin up and down by rotation of the push screw.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090129U JPH078217Y2 (en) | 1988-07-07 | 1988-07-07 | Light emitting diode head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988090129U JPH078217Y2 (en) | 1988-07-07 | 1988-07-07 | Light emitting diode head |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0212845U JPH0212845U (en) | 1990-01-26 |
| JPH078217Y2 true JPH078217Y2 (en) | 1995-03-01 |
Family
ID=31314661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988090129U Expired - Lifetime JPH078217Y2 (en) | 1988-07-07 | 1988-07-07 | Light emitting diode head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH078217Y2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8945908B2 (en) | 2012-04-18 | 2015-02-03 | Solazyme, Inc. | Tailored oils |
| US9109239B2 (en) | 2010-05-28 | 2015-08-18 | Solazyme, Inc. | Hydroxylated triacylglycerides |
| US9353389B2 (en) | 2008-11-28 | 2016-05-31 | Solazyme, Inc. | Nucleic acids useful in the manufacture of oil |
| US9388435B2 (en) | 2010-11-03 | 2016-07-12 | Terravia Holdings, Inc. | Microbial oils with lowered pour points, dielectric fluids produced therefrom, and related methods |
| US9394550B2 (en) | 2014-03-28 | 2016-07-19 | Terravia Holdings, Inc. | Lauric ester compositions |
| US9499845B2 (en) | 2011-05-06 | 2016-11-22 | Terravia Holdings, Inc. | Genetically engineered microorganisms that metabolize xylose |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62173754U (en) * | 1986-04-22 | 1987-11-05 | ||
| JPS62250466A (en) * | 1986-04-23 | 1987-10-31 | Fuji Xerox Co Ltd | Optical writing device |
-
1988
- 1988-07-07 JP JP1988090129U patent/JPH078217Y2/en not_active Expired - Lifetime
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9353389B2 (en) | 2008-11-28 | 2016-05-31 | Solazyme, Inc. | Nucleic acids useful in the manufacture of oil |
| US9464304B2 (en) | 2008-11-28 | 2016-10-11 | Terravia Holdings, Inc. | Methods for producing a triglyceride composition from algae |
| US9109239B2 (en) | 2010-05-28 | 2015-08-18 | Solazyme, Inc. | Hydroxylated triacylglycerides |
| US9255282B2 (en) | 2010-05-28 | 2016-02-09 | Solazyme, Inc. | Tailored oils produced from recombinant heterotrophic microorganisms |
| US9279136B2 (en) | 2010-05-28 | 2016-03-08 | Solazyme, Inc. | Methods of producing triacylglyceride compositions comprising tailored oils |
| US9388435B2 (en) | 2010-11-03 | 2016-07-12 | Terravia Holdings, Inc. | Microbial oils with lowered pour points, dielectric fluids produced therefrom, and related methods |
| US9499845B2 (en) | 2011-05-06 | 2016-11-22 | Terravia Holdings, Inc. | Genetically engineered microorganisms that metabolize xylose |
| US8945908B2 (en) | 2012-04-18 | 2015-02-03 | Solazyme, Inc. | Tailored oils |
| US9200307B2 (en) | 2012-04-18 | 2015-12-01 | Solazyme, Inc. | Tailored oils |
| US9551017B2 (en) | 2012-04-18 | 2017-01-24 | Terravia Holdings, Inc. | Structuring fats and methods of producing structuring fats |
| US9394550B2 (en) | 2014-03-28 | 2016-07-19 | Terravia Holdings, Inc. | Lauric ester compositions |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0212845U (en) | 1990-01-26 |
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