JPH0782031B2 - Probe card - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <Field of Industrial Application> The present invention relates to a probe card used for measuring various electrical characteristics of an object to be measured such as a high-density and miniaturized IC chip.

<Prior Art> A conventional probe card will be described with reference to FIG.

As shown in FIG. 5, the conventional probe card is connected to the substrate 50 having an opening 51 formed substantially in the center and a conductive pattern (not shown) formed on the surface thereof, and connected to the conductive pattern. It is composed of a plurality of probes 56 radially attached to the opening 51.

The tip of the probe 56 bent into a substantially hook shape is pressed against the electrode of the IC chip, which is the object to be measured, and the IC chip is connected to a measuring device (not shown) for measurement.

<Problems to be Solved by the Invention> However, the above-described conventional probe card has the following problems.

That is, an extremely fine probe must be used for the probe card used for the measurement of the highly densified and miniaturized IC chip, but it is difficult to secure a predetermined contact pressure with such a probe. Therefore, it was difficult to make accurate measurements. In addition, the fine structure makes it difficult to manufacture.

The present invention was devised in view of the above circumstances, and an object thereof is to provide a probe card capable of measuring various electrical characteristics of a measurement target whose density and miniaturization have progressed.

<Means for Solving the Problems> A probe card according to the present invention is a flexible film having an insulating property in which a predetermined pattern having conductivity is formed on both front and back surfaces, and is punctured in the pattern to be connected to the pattern. A substantially nail-shaped contact needle, a substrate having an opening with a tapered cut end, a resin laminated on a flexible film fitted along the tapered surface of the opening, and attached to the substrate The pattern formed on the front surface side of the flexible film and the pattern formed on the back surface side of the flexible film are formed only partially and not completely overlapped with each other. The contact needle connected to the pattern on the front surface side and the contact needle connected to the pattern on the back surface side are independent of each other.

<Operation> In the probe card according to the present invention, the substantially nail-shaped contact needle is pressed against the electrode of the measurement object to connect the measurement objective and the measurement device.

<Embodiment> An embodiment according to the present invention will be described below with reference to the drawings.

FIG. 1 is a schematic cross-sectional view of a probe card according to an embodiment of the present invention, FIG. 2 is a partial plan view of a flexible film forming this probe card, and FIG. 3 is a flexible film forming this probe card. FIG. 4 is a partial sectional view, and FIG. 4 is a schematic plan view showing a part of the manufacturing process of the flexible film forming the probe card.

A probe card according to an embodiment of the present invention is a flexible film 10 having an insulating property in which predetermined patterns 22a and 22b having conductivity are formed on both front and back surfaces, and the pattern.
A substantially nail-shaped contact needle 35 that is punctured by 22a, 22b and connected to the pattern 22a, 22b, and an opening with a tapered cut end
A substrate 50 in which 51 is opened, a resin 56 laminated on the flexible film 10 fitted along the tapered surface of the opening 51, and a holder 55 attached to the substrate 50 and holding the resin 56 are provided. Have

The flexible film 10 is manufactured as follows.

First, a conductive film 20 such as a copper foil formed on both sides of a flexible film 10 made of polyimide or the like (however, only the front surface side is shown in FIG. 4) is etched to show it in FIG. 4 (A). Such a conductive portion 21 is formed.

The conductive portion 21 is composed of a substantially rectangular base portion 211 and a plurality of lead portions 212 extending from the base portion 211 to the peripheral portion. The steady state, dimensions, etc. of the conductive portion 21 are determined according to the IC chip 60 to be measured.

Next, the base portion 211 is irradiated with laser light to form a predetermined pattern 22a (see FIG. 4 (B)). This pattern 2
The lead portion 2a and the base portion 211 are integrated with each other at 2a, which is formed by forming a trench groove 23a in the conductive film 20 and exposing the flexible film 10. Therefore, the plurality of formed patterns 22a are electrically independent from each other. The laser light is set to output so that only the conductive film 20 is cut and the flexible film 10 is not affected at all.

The same operation is performed on the back side conductive film. At this time, it is assumed that the pattern 22a formed on the front surface side and the pattern 22b formed on the back surface side are formed only partially and not completely overlapped.

The contact needle 35 is punctured at the tip of each pattern 22a, 22b of the flexible film 10 thus formed. The contact needle 35 is formed of a conductive material such as tungsten into a substantially nail shape, and the base end portion 351 is spread flat (see FIG. 2).

First, the contact needle 35a is punctured in the pattern 22a on the front surface side. Then, the base end 351 of the contact needle 35a is connected to the pattern 22a by the solder 39. Similarly, the contact needle 35b is connected to the pattern 22b on the back surface side (see FIGS. 2 and 3).

Therefore, the contact needle 35a connected to the pattern 22a on the front surface side
And the contact needle 35b connected to the pattern 22b on the back surface side are independent of each other.

In this way, the flexible film 10 to which the contact needle 35 is attached is attached to the substrate 50 as follows.

First, the substrate 50 will be described.

As shown in FIG. 1, the substrate 50 has an opening 51 having a tapered peripheral surface. A printed wiring 52 that contacts the lead portion 212 is formed on the surface of the substrate 50.

The flexible film 10 is attached to such a substrate 50 with a holder 55 having a substantially thin plate shape. That is, the flexible film 10 is pushed into the opening 51 while being in close contact with the tapered surface of the opening 51. At this time, the tip of the contact needle 35 is made to project from the back surface side of the substrate 50. Further, at the same time, the lead portion 212 is brought into contact with the printed wiring 52.

In this way, when the flexible film 10 is attached to the substrate 50, the back surface side of the flexible film 10 becomes concave according to the shape of the opening 51. First, a resin 56 having an insulating property and flexibility is filled in the recessed portion, that is, above the base portion 221.

Next, the holder 55 holds down the resin 56. The holder 55 is integrally formed with a peripheral portion 551 that presses the lead portion 212 to the printed wiring 52, and a parallel portion 552 that is inside the peripheral portion 551 and that presses the resin 56 to apply a predetermined contact pressure. It was done.

By pressing the resin 56 with the holder 55 in this way, the flexible film 10 is attached to the substrate 50 in a state of protruding from the opening 51.

In the probe card configured as described above, as shown in FIG. 2, the contact needles 35a and 35b are applied to the IC chip 60 with a predetermined contact pressure.
It comes into contact with the electrode 61 of.

<Effects of the Invention> As described above, the probe card according to the present invention is connected by puncturing a pattern with a contact needle, and the patterns are formed on both sides of the flexible film. Since only the parts are overlapped with each other and the entire parts are not completely overlapped with each other, it is possible to deal with an IC chip having a higher density and a smaller size.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of a probe card according to an embodiment of the present invention, FIG. 2 is a partial plan view of a flexible film forming this probe card, and FIG. 3 is a flexible film forming this probe card. Partial sectional view, FIG. 4 is a schematic plan view showing a part of the manufacturing process of the flexible film constituting this probe card, and FIG. 5 is a schematic perspective view of a conventional probe card. 10 …… Flexible film, 22a …… Front side pattern, 22b …… Back side pattern, 35 …… Contact needle, 60 …… I
C chip (measurement object), 61 ... (IC chip) electrode.

Front page continued (72) Inventor Yasuyoshi Yoshimitsu 3-1, Nishi-Nagasumotodori, Amagasaki-shi, Hyogo Nihon Electronic Materials Co., Ltd. This Electronic Materials Co., Ltd. (56) Reference JP-A-1-128381 (JP, A) JP-A 64-4042 (JP, A) Actually opened 57-17466 (JP, U) Actually opened 61-179747 (JP, U)

Claims (1)

[Claims] 1. A flexible film having an insulating property in which a predetermined pattern having conductivity is formed on both front and back surfaces,
On a substantially nail-shaped contact needle that is punctured in the pattern and connected to the pattern, a substrate in which an opening having a tapered cut end is opened, and a flexible film fitted along the tapered surface of the opening And a holder attached to the substrate for holding the resin, and the pattern formed on the front surface side and the pattern formed on the back surface side of the flexible film partially overlap each other. The probe is characterized in that it is completely formed by itself without overlapping, and the contact needle connected to the pattern on the front surface side and the contact needle connected to the pattern on the back surface side are independent from each other. card.