JPH0778495A - Semiconductor storage device with built-in high speed self testing circuit - Google Patents

Semiconductor storage device with built-in high speed self testing circuit

Info

Publication number
JPH0778495A
JPH0778495A JP5222580A JP22258093A JPH0778495A JP H0778495 A JPH0778495 A JP H0778495A JP 5222580 A JP5222580 A JP 5222580A JP 22258093 A JP22258093 A JP 22258093A JP H0778495 A JPH0778495 A JP H0778495A
Authority
JP
Japan
Prior art keywords
signal
lsi
circuit
frequency
internal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP5222580A
Other languages
Japanese (ja)
Other versions
JP3061988B2 (en
Inventor
Kazuyuki Nakamura
和之 中村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP5222580A priority Critical patent/JP3061988B2/en
Publication of JPH0778495A publication Critical patent/JPH0778495A/en
Application granted granted Critical
Publication of JP3061988B2 publication Critical patent/JP3061988B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • For Increasing The Reliability Of Semiconductor Memories (AREA)

Abstract

PURPOSE:To reduce a testing cost and to reduce the shipping cost of an LSI by shortening the testing time of a memory LSI and diagnosing a high speed operation using of an expensive and low speed tester. CONSTITUTION:At the time of a testing, the inside of the LSI is operated with an external multiplied frequency by providing an internal clock generating PLL for multiplying an external clock. At this time, circuits (are an AGU and a DGU respectively) generating automatically the one part of an address and a data inputting signal with an internal frequency are mounted on a device. The data inputting signal is constituted so that the signal is started by an input signal from the outside and the '0' and '1' of the signal are switched alternately with the internal frequency. Moreover, a decision circuit DC deciding whether the output signal from the internal circuit is of the alternation of '0' and '1' or not, and the output signal coincides with an expected value from the outside or not is mounted in the device. With those circuits, the memory circuit of the inside of the LSI is tested with the external multiplied frequency.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、半導体記憶装置の大規
模化、テスト時間の短縮化、および、低コスト化に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor memory device having a large scale, a short test time, and a low cost.

【0002】[0002]

【従来の技術】従来の半導体集積回路(LSI)では、
LSIの内部動作の診断(テスト)を行う場合、外部よ
り入力ピンにテストパターンを印加して、LSIが期待
値どおりの結果を出力ピンから出力するかどうかを確認
することにより行っている。特に、メモリLSIにおい
ては、アドレス指定信号、書き込みデータ信号、書き込
み読みだし制御信号を入力として与え、メモリセルへの
情報の書き込み読みだし動作を、入力アドレスパターン
を変えながらすべてのメモリセルに対して行う。図3
に、従来のメモリの回路構成例、図4にその動作タイミ
ング図を示す。図3に示すLSIは、外部クロック周波
数(f)に同期して動作する構成のために、このLSI
の機能を診断するためには、図4に示すような入力信号
を周波数fで入力し、同時に出力結果を判定する装置が
必要になる。現在、これらの、LSIの機能テストを行
うためには、LSIテスターと呼ばれる専用の装置を用
いている。図5にLSIテスターを用いたLSIの機能
診断を行う場合の構成図を示す。LSIテスターは、テ
ストパターン発生器と、出力期待値パターン発生器、出
力結果判定器を持つ。テストパターン発生器より発生さ
れた信号は、被試験LSIに入力信号として印加され、
被試験LSIからの出力信号を、テスター内の期待値と
比較し、被試験LSIの良/不良を判定する。また、一
方では、このLSIテスターが持つ、LSI機能の診断
回路をLSI内に造り込み、その回路を用いて、LSI
自身をテストする発明が、特開昭63−184989号
公報に記載されている。
2. Description of the Related Art In a conventional semiconductor integrated circuit (LSI),
When diagnosing (testing) the internal operation of the LSI, a test pattern is applied to the input pin from the outside, and it is checked whether the LSI outputs the expected value from the output pin. Particularly, in a memory LSI, an address designation signal, a write data signal, and a write / read control signal are given as inputs, and a write / read operation of information to / from a memory cell is performed for all memory cells while changing an input address pattern. To do. Figure 3
FIG. 4 shows a circuit configuration example of a conventional memory, and FIG. 4 shows its operation timing chart. Since the LSI shown in FIG. 3 operates in synchronization with the external clock frequency (f), this LSI is
In order to diagnose the function of, the input signal as shown in FIG. 4 is input at the frequency f, and at the same time, an apparatus for determining the output result is required. Currently, a dedicated device called an LSI tester is used to perform the functional test of these LSIs. FIG. 5 shows a configuration diagram when performing a functional diagnosis of an LSI using an LSI tester. The LSI tester has a test pattern generator, an expected output value pattern generator, and an output result judging device. The signal generated by the test pattern generator is applied as an input signal to the LSI under test,
The output signal from the LSI under test is compared with the expected value in the tester to judge whether the LSI under test is good or bad. On the other hand, on the other hand, a diagnostic circuit for the LSI function, which this LSI tester has, is built in the LSI, and the circuit is used to
An invention for testing itself is described in JP-A-63-184989.

【0003】[0003]

【発明が解決しようとする課題】しかるに、前記LSI
テスターは、少なくとも、評価するLSI以上の動作速
度が要求されることになる。しかし、近年のLSIの高
速化・大規模化により、それを評価するために高速なL
SIテスターへの投資が必要となり、また、LSIのテ
ストのためのLSIテスター占有時間の増大がLSIの
出荷コストを増大させる大きな要因の一つになってい
る。また、近年においては、LSIの内部回路の高速化
に対して、LSI外部とのインターフェース回路の高速
化が伴わないため、高速に動作可能であるLSI内部回
路の動作速度を正しく評価することが出来ないという問
題が生じつつある。
However, the above-mentioned LSI
The tester is required to have at least an operation speed higher than that of the LSI to be evaluated. However, due to the increase in speed and scale of LSIs in recent years, high-speed L
Investment in the SI tester is required, and the increase in the LSI tester occupying time for testing the LSI is one of the major factors increasing the shipping cost of the LSI. Further, in recent years, since the speed of the interface circuit with the outside of the LSI is not accompanied by the speed increase of the LSI internal circuit, it is possible to correctly evaluate the operation speed of the LSI internal circuit that can operate at high speed. The problem of not being is emerging.

【0004】本発明の目的は、LSI自身の機能を高速
に診断するための補助的付加回路をLSI内に設けるこ
とにより、テスト効率を上げ、テスト時間の短縮化を図
るとともに、低速なテスターでも高速LSIの診断を可
能とし、LSIの出荷コストの低減を実現するものであ
る。
An object of the present invention is to provide an auxiliary additional circuit in the LSI for diagnosing the function of the LSI itself at a high speed, thereby improving the test efficiency and shortening the test time, and also for a low-speed tester. This enables high-speed LSI diagnosis and realizes a reduction in LSI shipping cost.

【0005】[0005]

【課題を解決するための手段】第1の発明は、外部より
その機能の診断のために印加される信号の周波数を内部
で逓倍する回路と、逓倍された周波数の入力信号に対応
する出力結果を前記外部印加の信号周波数と等しくなる
よう、圧縮する回路を持ち、外部印加の信号周波数の逓
倍の速度で、内部診断可能であることを特徴とする半導
体記憶装置である。
SUMMARY OF THE INVENTION A first invention is a circuit for internally multiplying the frequency of a signal applied from the outside for the diagnosis of its function, and an output result corresponding to an input signal of the multiplied frequency. Is provided with a circuit for compressing so that the signal frequency becomes equal to the externally applied signal frequency, and internal diagnosis is possible at a rate of multiplication of the externally applied signal frequency.

【0006】また上記外部より印加させる信号の周波数
を逓倍する回路において、内部の診断すべき半導体記憶
装置に書き込む1bit分のデータを、1と0の交互の
列として発生し、その列の先頭データを、外部印加の入
力信号に対応させる。
Further, in the circuit for multiplying the frequency of the signal applied from the outside, 1-bit data to be written in the internal semiconductor memory device to be diagnosed is generated as alternating columns of 1 and 0, and the head data of the column is generated. Correspond to an externally applied input signal.

【0007】また、上記出力結果を時間圧縮する回路に
おいて、内部の診断すべき半導体記憶装置からの読みだ
しデータが、1と0の交互の列であり、かつ、外部より
印加された期待値とその読みだし信号列の先頭データが
対応していれば、正常動作であるとする信号を出力す
る。
In the circuit for time-compressing the output result, the read data from the internal semiconductor memory device to be diagnosed is an alternating sequence of 1s and 0s and has an expected value applied from the outside. If the leading data of the read signal sequence corresponds, a signal indicating normal operation is output.

【0008】[0008]

【作用】本発明によれば、LSIの大規模化・高速化
が、さらに進展した場合でも、テストコストの増大を抑
制することができる。
According to the present invention, it is possible to suppress an increase in test cost even if the scale-up and speed-up of the LSI are further advanced.

【0009】[0009]

【実施例】次に、図1を参照して、本発明の実施例につ
いて説明する。図1は、内部回路としてスタティックメ
モリ(SRAM)を持つLSIをテストする場合の回路
構成図である。図2に動作タイミング図を示す。外部ク
ロック(CLK)、アドレス入力データ入力は周波数
(f)で与えられる。クロックはLSI内部の位相同期
ループ回路(PLL)回路により、逓倍(本実施例では
4倍)する。また、アドレスの一部(本実施例では、L
SI内部で4倍のクロックを使用するため、下位2ビッ
ト分)が内部のアドレス自動インクリメンタ(AGU)
により、内部クロック周波数でインクリメントされる。
内部データは、図2に示すように、外部データが1の場
合には、1−0−1−0、0の場合には、0−1−0−
1と書き込みデータ発生回路DGUで、内部周波数で自
動的に発生される。これらの入力信号がLSI内部のS
RAMマクロに印加され、外部周波数の逓倍でLSI内
部回路のテストが行われる。出力データは、出力値比較
圧縮回路DCにおいて、外部から与えられる期待値パタ
ーン(1なら、1−0−1−0、0なら、0−1−0−
1)と逓倍周期の間、順次比較され、出力データが、0
と1の交互の列であり、かつ、その先頭データが期待値
データと一致しているかどうかを判定し、外部周波数で
その結果を出力する。本実施例では、外部クロックの1
周期の間に、4倍された内部クロックにより4回のメモ
リ動作が行えるために、テスト時間を従来の場合の1/
4とすることができる。また、LSIの入出力回路は、
外部クロックで動作すればよいため、外部クロック周波
数よりも、より高速動作が可能な内部回路を、低速な入
出力回路越しに診断可能となる。さらには、低速なテス
ターによっても、高速LSIの診断が可能となる。例え
ば、50MHz動作程度の安価なテスターによっても、
200MHz動作の高速LSIの診断が可能となる。
EXAMPLES Next, examples of the present invention will be described with reference to FIG. FIG. 1 is a circuit configuration diagram when testing an LSI having a static memory (SRAM) as an internal circuit. FIG. 2 shows an operation timing chart. The external clock (CLK) and the address input data input are given at the frequency (f). The clock is multiplied (4 times in this embodiment) by a phase locked loop circuit (PLL) circuit inside the LSI. In addition, a part of the address (in this embodiment, L
Since the quadruple clock is used inside the SI, the lower 2 bits are internal address automatic incrementer (AGU)
Is incremented by the internal clock frequency.
As shown in FIG. 2, the internal data is 1-0-1-0 when the external data is 1, and 0-1-0- when the external data is 0.
1 and the write data generation circuit DGU are automatically generated at the internal frequency. These input signals are S in the LSI.
It is applied to the RAM macro and the LSI internal circuit is tested by multiplying the external frequency. The output data is an expected value pattern (1 if 1-0-1-0, if 0, 0-1-0- in the output value comparison / compression circuit DC) given from the outside.
1) and the multiplication cycle are sequentially compared, and the output data is 0
It is an alternating sequence of 1 and 1, and it is determined whether the leading data matches the expected value data, and the result is output at the external frequency. In this embodiment, the external clock 1
Since the memory operation can be performed four times by the internal clock that is quadrupled during the cycle, the test time can be reduced to 1 /
It can be 4. Also, the input / output circuit of the LSI is
Since it is sufficient to operate with an external clock, it is possible to diagnose an internal circuit that can operate at a higher speed than the external clock frequency through a low-speed input / output circuit. Furthermore, a high speed LSI can be diagnosed even with a low speed tester. For example, even with an inexpensive tester operating at about 50 MHz,
It is possible to diagnose a high-speed LSI operating at 200 MHz.

【0010】本発明を、複数のメモリセルブロックを同
時に活性化し、複数ビットを同時に読み出し、それらの
結果の一致を検出する従来の多ビット並列テスト手法と
組み合わせることで、LSIのテスト効率はさらに改善
される。
By combining the present invention with a conventional multi-bit parallel test method for simultaneously activating a plurality of memory cell blocks, reading a plurality of bits at the same time, and detecting a match of the results, LSI test efficiency is further improved. To be done.

【0011】[0011]

【発明の効果】本発明の効果は、請求の範囲に記載した
構成によって、テスト効率を上げ、テスト時間の短縮化
を図るとともに、低速なテスターでも高速LSIの診断
を可能とし、LSIの出荷コストの低減を実現するとい
う目的が達成されるというものである。
The effect of the present invention is to improve the test efficiency, shorten the test time, and enable the diagnosis of high-speed LSI even with a low-speed tester by the structure described in the claims, and the shipping cost of the LSI. The goal is to achieve the reduction of

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例を示す構成図。FIG. 1 is a configuration diagram showing an embodiment of the present invention.

【図2】第1図の回路の動作を示すタイミング図。FIG. 2 is a timing diagram showing the operation of the circuit of FIG.

【図3】従来例を示す構成図。FIG. 3 is a configuration diagram showing a conventional example.

【図4】従来例の動作を示すタイミング図。FIG. 4 is a timing chart showing an operation of a conventional example.

【図5】従来のLSIテスターによるLSIの評価を示
す構成図。
FIG. 5 is a configuration diagram showing evaluation of an LSI by a conventional LSI tester.

【符号の説明】[Explanation of symbols]

PLL(x4) 4倍周期クロック発生用位相同期ルー
プ回路 AGU 2bitアドレス自動インクリメント
回路 DGU 書き込みデータ発生回路 DC 4周期データ圧縮比較回路 AO〜An アドレス入力信号 D データ入力信号 WE 書き込み制御信号 Q データ出力信号 CLK クロック信号
PLL (x4) Quadruple cycle clock generation phase locked loop circuit AGU 2-bit address automatic increment circuit DGU write data generation circuit DC 4 cycle data compression comparison circuit AO-An address input signal D data input signal WE write control signal Q data output signal CLK clock signal

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 外部よりその機能の診断のために印加さ
れる信号の周波数を内部で逓倍する回路と、逓倍された
周波数の入力信号に対応する出力結果を前記外部印加の
信号周波数と等しくなるよう、圧縮する回路を持ち、外
部印加の信号周波数の逓倍の速度で、内部診断可能であ
ることを特徴とする半導体記憶装置。
1. A circuit for internally multiplying a frequency of a signal applied from the outside for diagnosing its function, and an output result corresponding to an input signal of the multiplied frequency becomes equal to the signal frequency of the external application. As described above, a semiconductor memory device having a compression circuit and capable of performing internal diagnosis at a rate of multiplication of an externally applied signal frequency.
【請求項2】 上記外部より印加させる信号の周波数を
逓倍する回路において、内部の診断すべき半導体記憶装
置に書き込む1bit分のデータを、1と0の交互の列
として発生し、その列の先頭データを、外部印加の入力
信号に対応させることを特徴とする請求項1記載の半導
体記憶装置。
2. In the circuit for multiplying the frequency of a signal applied from the outside, 1-bit data to be written in an internal semiconductor memory device to be diagnosed is generated as alternating columns of 1 and 0, and the head of the column is generated. 2. The semiconductor memory device according to claim 1, wherein the data is made to correspond to an externally applied input signal.
【請求項3】 上記出力結果を時間圧縮する回路におい
て、内部の診断すべき半導体記憶装置からの読みだしデ
ータが、1と0の交互の列であり、かつ、外部より印加
された期待値とその読みだし信号列の先頭データが対応
していれば、正常動作であるとする信号を出力すること
を特徴とする請求項1記載の半導体記憶装置。
3. In the circuit for time-compressing the output result, the read data from the internal semiconductor memory device to be diagnosed is an alternating sequence of 1 and 0 and has an expected value applied from the outside. 2. The semiconductor memory device according to claim 1, wherein a signal indicating normal operation is output if the leading data of the read-out signal sequence corresponds.
JP5222580A 1993-09-07 1993-09-07 Semiconductor memory device with built-in high-speed self-test circuit Expired - Lifetime JP3061988B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5222580A JP3061988B2 (en) 1993-09-07 1993-09-07 Semiconductor memory device with built-in high-speed self-test circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5222580A JP3061988B2 (en) 1993-09-07 1993-09-07 Semiconductor memory device with built-in high-speed self-test circuit

Publications (2)

Publication Number Publication Date
JPH0778495A true JPH0778495A (en) 1995-03-20
JP3061988B2 JP3061988B2 (en) 2000-07-10

Family

ID=16784702

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5222580A Expired - Lifetime JP3061988B2 (en) 1993-09-07 1993-09-07 Semiconductor memory device with built-in high-speed self-test circuit

Country Status (1)

Country Link
JP (1) JP3061988B2 (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000048599A (en) * 1998-07-24 2000-02-18 Mitsubishi Electric Corp Synchronization-type semiconductor storage device
JP2005174486A (en) * 2003-12-12 2005-06-30 Toshiba Corp Semiconductor storage device
US7181658B2 (en) 2002-11-29 2007-02-20 Nec Electronics Corporation Method for testing semiconductor memory device and test circuit for semiconductor memory device
US7194670B2 (en) 2004-02-13 2007-03-20 International Business Machines Corp. Command multiplier for built-in-self-test
JP2008538045A (en) * 2005-03-18 2008-10-02 イナパック テクノロジー インコーポレイテッド Integrated circuit test module
US7444564B2 (en) 2003-11-19 2008-10-28 International Business Machines Corporation Automatic bit fail mapping for embedded memories with clock multipliers
US7930601B2 (en) 2008-02-22 2011-04-19 International Business Machines Corporation AC ABIST diagnostic method, apparatus and program product
US10114073B2 (en) 2001-09-28 2018-10-30 Rambus Inc. Integrated circuit testing

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632200A (en) * 1986-06-20 1988-01-07 Fujitsu Ltd Memory test system
JPH04109500A (en) * 1990-08-29 1992-04-10 Nec Corp Memory testing circuit for semiconductor integrated circuit
JPH04227312A (en) * 1990-03-30 1992-08-17 Natl Semiconductor Corp <Ns> Clock signal multiplier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS632200A (en) * 1986-06-20 1988-01-07 Fujitsu Ltd Memory test system
JPH04227312A (en) * 1990-03-30 1992-08-17 Natl Semiconductor Corp <Ns> Clock signal multiplier
JPH04109500A (en) * 1990-08-29 1992-04-10 Nec Corp Memory testing circuit for semiconductor integrated circuit

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000048599A (en) * 1998-07-24 2000-02-18 Mitsubishi Electric Corp Synchronization-type semiconductor storage device
US10114073B2 (en) 2001-09-28 2018-10-30 Rambus Inc. Integrated circuit testing
US7181658B2 (en) 2002-11-29 2007-02-20 Nec Electronics Corporation Method for testing semiconductor memory device and test circuit for semiconductor memory device
CN100350508C (en) * 2002-11-29 2007-11-21 恩益禧电子股份有限公司 Method for testing semiconductor memory device and test circuit for semiconductor memory device
US7444564B2 (en) 2003-11-19 2008-10-28 International Business Machines Corporation Automatic bit fail mapping for embedded memories with clock multipliers
JP2005174486A (en) * 2003-12-12 2005-06-30 Toshiba Corp Semiconductor storage device
US7194670B2 (en) 2004-02-13 2007-03-20 International Business Machines Corp. Command multiplier for built-in-self-test
JP2008538045A (en) * 2005-03-18 2008-10-02 イナパック テクノロジー インコーポレイテッド Integrated circuit test module
US7930601B2 (en) 2008-02-22 2011-04-19 International Business Machines Corporation AC ABIST diagnostic method, apparatus and program product

Also Published As

Publication number Publication date
JP3061988B2 (en) 2000-07-10

Similar Documents

Publication Publication Date Title
KR970004074B1 (en) Memory device and integrated circuit thereof
US6249893B1 (en) Method and structure for testing embedded cores based system-on-a-chip
US5689466A (en) Built in self test (BIST) for multiple RAMs
JP4903365B2 (en) Method and apparatus for broadcasting scan patterns in a scan-based integrated circuit
US7444564B2 (en) Automatic bit fail mapping for embedded memories with clock multipliers
JP3216449B2 (en) Self-diagnosis device for semiconductor memory failure
US5383195A (en) BIST circuit with halt signal
US6779144B2 (en) Semiconductor integrated circuit device and method of testing it
US8037385B2 (en) Scan chain circuit and method
JPH05241882A (en) Built-in self testing circuit and method for executing self test
US6993696B1 (en) Semiconductor memory device with built-in self test circuit operating at high rate
US20050120284A1 (en) Memory testing
US6158033A (en) Multiple input signature testing &amp; diagnosis for embedded blocks in integrated circuits
JPH09128998A (en) Test circuit
US20050262401A1 (en) Central processing unit and micro computer
JPH0778495A (en) Semiconductor storage device with built-in high speed self testing circuit
US7149944B2 (en) Semiconductor integrated circuit device equipped with read sequencer and write sequencer
JP5169597B2 (en) Integrated circuit and test method
WO1998014954A1 (en) Memory tester
US6327683B1 (en) Device scan testing
KR100684548B1 (en) Self function testable system-on-chip and method for the function test
JP2006277821A (en) Semiconductor integrated circuit
JP4863547B2 (en) Semiconductor integrated circuit device with built-in BIST circuit
JP2002243801A (en) Semiconductor integrated circuit
JP3102600B2 (en) IC tester

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080428

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090428

Year of fee payment: 9

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100428

Year of fee payment: 10

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110428

Year of fee payment: 11

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120428

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120428

Year of fee payment: 12

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130428

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130428

Year of fee payment: 13

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140428

Year of fee payment: 14