JPH0777702B2 - Polishing device for rotating body and method for polishing rotating body - Google Patents
Polishing device for rotating body and method for polishing rotating bodyInfo
- Publication number
- JPH0777702B2 JPH0777702B2 JP60224925A JP22492585A JPH0777702B2 JP H0777702 B2 JPH0777702 B2 JP H0777702B2 JP 60224925 A JP60224925 A JP 60224925A JP 22492585 A JP22492585 A JP 22492585A JP H0777702 B2 JPH0777702 B2 JP H0777702B2
- Authority
- JP
- Japan
- Prior art keywords
- rotating body
- polishing
- cylindrical support
- polishing tape
- tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は回動体の研磨装置及び回動体の研磨方法に係
り、特に精密で均一な研磨の要求される回動体の研磨装
置及び回動体の研磨方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rotating body polishing apparatus and a rotating body polishing method, and more particularly to a rotating body polishing apparatus and a rotating body that require precise and uniform polishing. It relates to a polishing method.
回動体の研磨装置としては、例えば電子写真感光体の表
面を研磨して再生する装置のような精密で均一な研磨の
要求される研磨装置がある。Examples of the polishing device for the rotating body include a polishing device that requires precise and uniform polishing, such as a device that polishes and regenerates the surface of an electrophotographic photosensitive member.
電子写真感光体は所定の特性を得るため、あるいは適用
される電子写真プロセスの種類に応じて種々の構成をと
るものである。そして、電子写真感光体としては、支持
体上に光導電層が形成されている感光体、あるいは必要
に応じてその表面に更に表面保護層を備えた感光体があ
り、広く用いられている。支持体と光導電層から構成さ
れる感光体は、最も一般的な電子写真プロセスによる、
即ち、帯電、画像露光および現像、更に必要に応じて転
写による画像形成に用いられる。また、必要に応じて設
けられる表面保護層は、更に光導電層の保護、感光体の
機械的強度の改善、暗滅衰特性の改善、または、特定の
電子写真プロセスに適用される等の目的のために設けら
れるものである。The electrophotographic photosensitive member has various configurations in order to obtain predetermined characteristics or according to the type of electrophotographic process applied. As the electrophotographic photosensitive member, there are a photosensitive member having a photoconductive layer formed on a support, or a photosensitive member further having a surface protective layer on the surface thereof if necessary, and are widely used. A photoreceptor composed of a support and a photoconductive layer is produced by the most general electrophotographic process.
That is, it is used for charging, image exposure and development, and if necessary, for image formation by transfer. Further, the surface protective layer provided as necessary is for the purpose of further protecting the photoconductive layer, improving the mechanical strength of the photoconductor, improving the dark decay property, or being applied to a specific electrophotographic process. It is provided for.
電子写真感光体は、当然のことであるが、適用される電
子写真プロセスに応じた所定の感度、電気特性、更には
光学特性を備えていることが要求される。しかし、それ
ばかりでなく、感光体の機械的な耐久性も重要な性質で
ある。電子写真感光体の製造時あるいは、くり返し使用
により電子写真感光体の表面に100Å〜800Å程度の層厚
ムラが生じた場合、用いる電子写真プロセスに応じた所
定の感度が均一に得られなくなり、画像に濃度ムラとし
て出てしまう。特に、感光体がアモルファスシリコン
（以後「ａ−Si」と記す。）から成る場合にはそのビッ
カース硬さは1000kg/mm2以上であり、第１表に示すよう
にａ−Se等に比べてはるかに硬いため、上記のような層
厚ムラをÅオーダーで補正する事は困難であった。また
表面保護層として、例えばSiC層が更に設けられている
場合には、その硬度は更に大きくなり層厚ムラの補正は
より一層困難となってしまう。As a matter of course, the electrophotographic photosensitive member is required to have predetermined sensitivity, electric characteristics, and optical characteristics according to the electrophotographic process to be applied. However, not only that, but the mechanical durability of the photoreceptor is also an important property. When a layer thickness unevenness of about 100 Å ~ 800 Å occurs on the surface of the electrophotographic photoconductor during the manufacturing of the electrophotographic photoconductor or by repeated use, the predetermined sensitivity according to the electrophotographic process used cannot be uniformly obtained, and the image It appears as uneven density. Particularly, when the photoconductor is made of amorphous silicon (hereinafter referred to as “a-Si”), its Vickers hardness is 1000 kg / mm 2 or more, and as shown in Table 1, it is higher than that of a-Se. Since it is much harder, it was difficult to correct the above layer thickness unevenness on the order of Å. If a SiC layer, for example, is further provided as the surface protective layer, the hardness thereof is further increased and it becomes even more difficult to correct the unevenness of the layer thickness.
なおここでビッカース硬さとは、対面角が136度のダイ
ヤモンド四角すい（錐）圧子を用い、試験面にくぼみを
つけたときの試験荷重を、くぼみの対角線長さから求め
たくぼみの表面積で割って算出した値を示し、詳細はJI
SZ2244「ビッカース硬さ試験方法」に述べられている。Here, the Vickers hardness is a diamond square cone (cone) indenter with a facing angle of 136 degrees, and the test load when a depression is made on the test surface is divided by the surface area of the depression obtained from the diagonal length of the depression. The values calculated by JI
SZ2244 “Vickers hardness test method”.
〔発明が解決しようとする問題点〕 以上のように電子写真感光体の表面の層厚ムラをÅオー
ダーで除去するためには、精密で均一な研磨が要求され
るがこれら要求を満足する研磨装置はなく、高性能な回
動体の研磨装置が要望されていた。 [Problems to be solved by the invention] As described above, in order to remove the unevenness of the layer thickness on the surface of the electrophotographic photosensitive member in the order of Å, precise and uniform polishing is required. There is no device, and there has been a demand for a high-performance rotating body polishing device.
上記の問題点は円筒状支持体の表面にSiC層を有する電
子写真感光体を回動体とし、該回動体の回動順方向で、
この回動体の回転速度と異なる速度で送られる研磨テー
プを前記回動体の回転面に圧接する、前記回動体の直径
より小さい直径を有する円筒形の支持体を有することを
特徴とする本発明の回動体の研磨装置によって解決され
る。The above-mentioned problem is that the electrophotographic photosensitive member having the SiC layer on the surface of the cylindrical support is a rotating body, and in the rotation forward direction of the rotating body,
The present invention is characterized in that it has a cylindrical support body having a diameter smaller than the diameter of the rotating body, which presses the polishing tape fed at a speed different from the rotating speed of the rotating body against the rotating surface of the rotating body. It is solved by a polishing device for a rotating body.
また、円筒状支持体の表面にSiCを有する電子写真感光
体を回動体とし、該回動体を回動させ、該回動体の回動
順方向でこの回動体の回転速度と異なる速度で研磨テー
プを送り、該研磨テープを前記回動体の直径より小さい
直径を有する円筒形の支持体で前記回動体の回動面に圧
接して前記回動体表面を研磨することを特徴とする本発
明の回動体の研磨方法によって解決される。Further, an electrophotographic photosensitive member having SiC on the surface of a cylindrical support is used as a rotating body, the rotating body is rotated, and the polishing tape is rotated at a speed different from the rotation speed of the rotating body in the forward direction of rotation of the rotating body. And the polishing tape is pressed against the rotating surface of the rotating body with a cylindrical support having a diameter smaller than that of the rotating body to polish the surface of the rotating body. It is solved by a method of polishing a moving body.
以上のように、本発明においては回動体の回動速度と研
磨テープを送る速度とに差を設ける事により、回動体と
研磨テープとが摺擦され、研磨がなされる。また、研磨
テープには支持体によって均一な圧力がかけられるの
で、均一な研磨を行う事ができる。この支持体として
は、研磨テープを回動体の回動面に圧接し、均一な圧力
をかけることができるように回動体の直径より小さい直
径を有する円筒形のものを用いている。As described above, in the present invention, by providing a difference between the rotating speed of the rotating body and the feeding speed of the polishing tape, the rotating body and the polishing tape are rubbed against each other for polishing. Further, since uniform pressure is applied to the polishing tape by the support, uniform polishing can be performed. As this support, a cylindrical one having a diameter smaller than the diameter of the rotating body is used so that the polishing tape is pressed against the rotating surface of the rotating body and uniform pressure can be applied.
以下、本発明の実施例を図面を用いて詳細に説明する。
本発明の実施例として電子写真感光体の表面を研磨する
場合について述べる。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
The case of polishing the surface of an electrophotographic photosensitive member will be described as an example of the present invention.
第１図は電子写真感光体の表面の研磨装置の説明図であ
る。FIG. 1 is an illustration of an apparatus for polishing the surface of an electrophotographic photosensitive member.
１は電子写真感光体ドラムであり、その表面には、表面
保護層としてSiC層が設けられている。２は研磨面に結
晶SiCがコーティングされた研磨テープ，商品名（ラッ
ピングテープLT−C2000,製造元Fuji Film）である。３
は感光体ドラム１の表面と研磨テープ２とを接触させる
ための円筒形支持体であり、直径が1mm〜20mm,長さが5m
m〜50mm（例えば、平行ピン）の物が好ましく、また平
行度の誤差（感光体ドラム１の表面と円筒形支持体３の
表面との隙間の差）は10μｍ以内とすることが好まし
い。これは円筒形支持体３の直径と長さが上記値を超え
ると、研磨テープ２と感光体ドラム１との接触面積が増
して均一な圧力がかかりずらくなり、逆に小さくなる
と、接触面積が減り研磨効率が悪くなり、また平行度の
誤差が10μｍを超えると均一な接触ができなくなり、研
磨テープに均一な圧力がかからなくなる等の理由からで
ある。An electrophotographic photosensitive drum 1 has a SiC layer as a surface protective layer on the surface thereof. 2 is a polishing tape having a polished surface coated with crystalline SiC, a trade name (lapping tape LT-C2000, manufacturer Fuji Film). Three
Is a cylindrical support for contacting the surface of the photosensitive drum 1 and the polishing tape 2, with a diameter of 1 mm to 20 mm and a length of 5 m.
It is preferable that the distance is from m to 50 mm (for example, parallel pin), and the parallelism error (difference between the surface of the photosensitive drum 1 and the surface of the cylindrical support 3) is preferably within 10 μm. This is because when the diameter and length of the cylindrical support 3 exceed the above values, the contact area between the polishing tape 2 and the photoconductor drum 1 increases and it becomes difficult to apply a uniform pressure. The reason is that the polishing efficiency is deteriorated and the parallelism error exceeds 10 μm, uniform contact cannot be made, and uniform pressure is not applied to the polishing tape.
なお、ここで特に、円筒形支持体３の直径と感光ドラム
１の直径との関係に着目すると、第１図に示されるよう
に、感光体ドラム１と研磨テープ２との接触面を規定す
る円筒形支持体３の直径は感光体ドラム１の直径よりも
小さくなっているので、研磨テープ２と感光体ドラム１
との接触面積が大きくなりすぎることはなく、極めて均
一な圧力で研磨テープを感光体ドラム１に圧着すること
が可能である。これによって、後述する研磨テープ２の
送り方向と感光体ドラム１の回動方向との関係、及び感
光ドラム１の回動速度と研磨テープ２の送り速度との関
係とあいまってより均一で高精度な研磨を行なうことが
できる。ただし、円筒形支持体３の直径が小さすぎれば
上述したように接触面積が減って研磨効率が悪くなるの
でこの点には注意すべきである。好適には前記円筒形支
持体３にテトロンテープ等を巻き研磨テープとの摩擦抵
抗を下げる事が望ましい。本発明に用いられる研磨テー
プとしては、研磨面に結晶SiCがコーティングされたも
のの他に、酸化鉄，アルミナ，ダイヤモンドの粉末等を
コーティングしたものも好適なものとして用いることが
できる。４は円筒形支持体３の受台であり、感光体ドラ
ム１の回転軸方向と平行に配置され、５のおもりで荷重
が加えられる。６は研磨テープ２を送り出すための送り
出しモーターでありこれにより研磨テープ２は一定の速
度で送り出され、７のおもりにより研磨テープ２は引っ
張られ、一定の速度で送られる。その際、研磨テープ
は、感光体の回動の順方向に送られるので、研磨テープ
２と感光体ドラム１との間隙にSiCの研磨粉や異物がた
まることなく研磨される。Here, particularly when focusing on the relationship between the diameter of the cylindrical support 3 and the diameter of the photosensitive drum 1, as shown in FIG. 1, the contact surface between the photosensitive drum 1 and the polishing tape 2 is defined. Since the diameter of the cylindrical support 3 is smaller than the diameter of the photosensitive drum 1, the polishing tape 2 and the photosensitive drum 1
It is possible to press the polishing tape onto the photosensitive drum 1 with an extremely uniform pressure without causing the contact area with the contact surface to become too large. Accordingly, the relationship between the feeding direction of the polishing tape 2 and the rotating direction of the photosensitive drum 1 and the relationship between the rotating speed of the photosensitive drum 1 and the feeding speed of the polishing tape 2 which will be described later are more uniform and highly accurate. Polishing can be performed. However, if the diameter of the cylindrical support 3 is too small, the contact area is reduced and the polishing efficiency is deteriorated as described above. It is desirable to wind a Tetron tape or the like on the cylindrical support 3 to reduce the frictional resistance with the polishing tape. As the polishing tape used in the present invention, in addition to the one whose surface is coated with crystalline SiC, the one which is coated with iron oxide, alumina, diamond powder or the like can be preferably used. Reference numeral 4 denotes a pedestal for the cylindrical support 3, which is arranged in parallel with the rotation axis direction of the photosensitive drum 1 and is loaded with a weight of 5. Reference numeral 6 denotes a feed motor for feeding the polishing tape 2, whereby the polishing tape 2 is fed at a constant speed, and the weight of 7 pulls the polishing tape 2 to feed it at a constant speed. At that time, since the polishing tape is fed in the forward direction of rotation of the photosensitive member, the polishing powder of SiC and foreign matters are not accumulated in the gap between the polishing tape 2 and the photosensitive drum 1.
研磨テープ２を送る速度は、10mm/hour以上でおもり５
は、100g〜2kgが好ましい。The speed of sending the polishing tape 2 is 10 mm / hour or more and the weight is 5
Is preferably 100 g to 2 kg.
感光体ドラム１の回動速度は、研磨テープ２を送る速度
と等速にならなければ、いかなる速度でもよい。研磨量
はおもり５の重量、研磨テープ２を送る速度、感光ドラ
ム回動速度、研磨時間等によって決定されるが、好適に
は研磨時間によってコントロールする事が望ましい。The rotation speed of the photosensitive drum 1 may be any speed as long as it is not the same as the speed at which the polishing tape 2 is fed. The amount of polishing is determined by the weight of the weight 5, the speed at which the polishing tape 2 is fed, the rotation speed of the photosensitive drum, the polishing time, and the like, but it is preferable to control it by the polishing time.
本実施例ではおもり５を800g、研磨テープ２を送る速度
を160mm/hour、感光ドラム回動速度を180mm/secとした
条件下で10Å/minの研磨が可能であった。In this embodiment, it was possible to polish the weight 5 at 800 g, the polishing tape 2 at a feeding speed of 160 mm / hour, and the photosensitive drum rotating speed at 180 mm / sec, at 10 Å / min.
分光器（例えば反射光分析用MCPD−200,製造元ユニオン
技研）によりSiC層の干渉ピークを測定し、その値から
層膜厚を算出しながら、研磨を行えば任意の厚さのSiC
層を再生する事が可能となる。By measuring the interference peak of the SiC layer with a spectroscope (for example, MCPD-200 for reflected light analysis, manufacturer Union Giken), and calculating the layer thickness from that value, SiC with an arbitrary thickness can be obtained by polishing.
It is possible to regenerate layers.
第２図は第１図の研磨装置の表面保護層のAA′断面図で
ある。１の感光体ドラムは回動軸方向（Ｘ方向）に移動
が可能である。感光体ドラム１を研磨テープ２及び円筒
形支持体３に対して等速度で移動させると広範囲にわた
って均一な研磨ができる。また逆に研磨テープ２及び円
筒形支持体３を移動させてもよい。FIG. 2 is a sectional view taken along the line AA 'of the surface protective layer of the polishing apparatus shown in FIG. The first photosensitive drum is movable in the rotation axis direction (X direction). When the photosensitive drum 1 is moved at a constant speed with respect to the polishing tape 2 and the cylindrical support 3, uniform polishing can be performed over a wide range. On the contrary, the polishing tape 2 and the cylindrical support 3 may be moved.
以上、詳細に説明したように、本発明によれば、Åオー
ダーの精度で精密かつ均一な研磨をおこなう事ができ
る。又被研磨物の材質が代わることによって必要となる
研磨条件の変更を、研磨テープへの圧力を変えること、
または回動体の回動速度及び研磨テープを送る速度を変
える事等の手段により簡易におこなう事ができる。As described above in detail, according to the present invention, precise and uniform polishing can be performed with an accuracy of Å order. Also, changing the polishing conditions required by changing the material of the object to be polished is to change the pressure on the polishing tape,
Alternatively, the rotation speed of the rotary member and the speed at which the polishing tape is fed can be changed easily.
第１図は電子写真感光体ドラムの表面の研磨装置の説明
図である。 第２図は第１図の研磨装置のAA′断面図である。 １……感光体ドラム ２……研磨テープ ３……円筒形支持体 ４……受台 ５……おもり ６……研磨テープ送り出しモーターFIG. 1 is an illustration of a polishing device for the surface of an electrophotographic photosensitive drum. FIG. 2 is a sectional view taken along the line AA ′ of the polishing apparatus of FIG. 1 ... Photosensitive drum 2 ... Abrasive tape 3 ... Cylindrical support 4 ... Cradle 5 ... Weight 6 ... Abrasive tape feed motor
───────────────────────────────────────────────────── フロントページの続き (72)発明者 山崎 晃司 東京都大田区下丸子３丁目30番２号 キヤ ノン株式会社内 (56)参考文献 実公 昭46−25033（ＪＰ，Ｙ１) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Koji Yamazaki 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (56) Bibliographic references Shoko 46-25033 (JP, Y1)
Claims (7)
写真感光体を回動体とし、該回動体の回動順方向で、こ
の回動体の回転速度と異なる速度で送られる研磨テープ
を前記回動体の回転面に圧接する、前記回動体の直径よ
り小さい直径を有する円筒形の支持体を有することを特
徴とする回動体の研磨装置。1. A polishing tape which is made of an electrophotographic photosensitive member having a SiC layer on the surface of a cylindrical support as a rotating body and is fed at a speed different from the rotation speed of the rotating body in the forward direction of rotation of the rotating body. An apparatus for polishing a rotating body, comprising: a cylindrical support body having a diameter smaller than that of the rotating body, which is in pressure contact with a rotating surface of the rotating body.
と、前記回動体とを前記回動体の回転軸方向に相対的に
移動させる機構を有する特許請求の範囲第１項記載の回
動体の研磨装置。2. The rotating body according to claim 1, further comprising a mechanism for relatively moving the cylindrical support and the polishing tape, and the rotating body in a rotation axis direction of the rotating body. Polishing equipment.
る特許請求の範囲第１項又は第２項記載の回動体の研磨
装置。3. The rotating body polishing apparatus according to claim 1, wherein a polishing surface of the polishing tape has crystalline SiC.
さが5mm〜50mmであり、前記回動体の表面と前記円筒形
の支持体の表面との隙間の差が10μｍ以内である特許請
求の範囲第１項記載の回動体の研磨装置。4. The cylindrical support has a diameter of 1 mm to 20 mm; a length of 5 mm to 50 mm, and the difference between the surface of the rotating body and the surface of the cylindrical support is 10 μm or less. A polishing device for a rotating body according to claim 1.
真感光体を回動体とし、該回動体を回動させ、該回動体
の回動順方向でこの回動体の回転速度と異なる速度で研
磨テープを送り、該研磨テープを前記回動体の直径より
小さい直径を有する円筒形の支持体で前記回動体の回動
面に圧接して前記回動体表面を研磨することを特徴とす
る回動体の研磨方法。5. An electrophotographic photosensitive member having SiC on the surface of a cylindrical support is used as a rotating body, the rotating body is rotated, and a speed different from the rotation speed of the rotating body in the forward direction of rotation of the rotating body. The polishing tape is fed by means of, and the polishing tape is pressed against the rotating surface of the rotating body with a cylindrical support having a diameter smaller than that of the rotating body to polish the surface of the rotating body. Polishing method for moving objects.
圧接される前記研磨テープの位置を前記回動体に対し
て、前記回動体の回転軸方向に相対的に移動させながら
研磨する特許請求の範囲第５項記載の回動体の研磨方
法。6. The polishing method according to claim 1, wherein the position of the polishing tape pressed against the rotating body by the cylindrical support is moved relative to the rotating body in the direction of the rotation axis of the rotating body. 5. A method for polishing a rotating body according to claim 5, wherein:
る特許請求の範囲第５項又は第６項記載の回動体の研磨
方法。7. The method of polishing a rotating body according to claim 5, wherein the polishing tape has crystalline SiC on its polishing surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60224925A JPH0777702B2 (en) | 1985-10-11 | 1985-10-11 | Polishing device for rotating body and method for polishing rotating body |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60224925A JPH0777702B2 (en) | 1985-10-11 | 1985-10-11 | Polishing device for rotating body and method for polishing rotating body |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6284965A JPS6284965A (en) | 1987-04-18 |
| JPH0777702B2 true JPH0777702B2 (en) | 1995-08-23 |
Family
ID=16821316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60224925A Expired - Fee Related JPH0777702B2 (en) | 1985-10-11 | 1985-10-11 | Polishing device for rotating body and method for polishing rotating body |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0777702B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1813385A1 (en) * | 2006-01-27 | 2007-08-01 | Comadur S.A. | Method of burnishing a hard material and decorated workpiece made from a hard, burnished material |
-
1985
- 1985-10-11 JP JP60224925A patent/JPH0777702B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6284965A (en) | 1987-04-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |