JPH0775240B2 - Wire bonding method and device for covered wire - Google Patents
Wire bonding method and device for covered wireInfo
- Publication number
- JPH0775240B2 JPH0775240B2 JP63138371A JP13837188A JPH0775240B2 JP H0775240 B2 JPH0775240 B2 JP H0775240B2 JP 63138371 A JP63138371 A JP 63138371A JP 13837188 A JP13837188 A JP 13837188A JP H0775240 B2 JPH0775240 B2 JP H0775240B2
- Authority
- JP
- Japan
- Prior art keywords
- wire
- bonding
- flame
- covered wire
- ball
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/0401—Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
- H01L2224/13001—Core members of the bump connector
- H01L2224/13099—Material
- H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/13138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/13144—Gold [Au] as principal constituent
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45565—Single coating layer
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/4554—Coating
- H01L2224/45599—Material
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
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- H—ELECTRICITY
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
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- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
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- H01—ELECTRIC ELEMENTS
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85043—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a flame torch, e.g. hydrogen torch
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- H—ELECTRICITY
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01—ELECTRIC ELEMENTS
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- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、被覆線を用いたワイヤボンディングに係り、
被覆金線の被覆除去と、金ボールを形成する方法および
装置に関する。TECHNICAL FIELD The present invention relates to wire bonding using a covered wire,
The present invention relates to a method and apparatus for removing coating from a coated gold wire and forming a gold ball.
従来、金属線のボールボンディングのボール形成には、
たとえば特公昭57−39055号公報に記載されているよう
に、自由端を有する金属線を用意し、該金属線の軸方向
の位置に上記自由端と対向して配置された放電々極と上
記自由端の間に放電を生じさせることにより、上記自由
端を球状とするものが提案されている。Conventionally, for ball formation of ball bonding of metal wires,
For example, as described in Japanese Examined Patent Publication No. 57-39055, a metal wire having a free end is prepared, and a discharge pole arranged opposite to the free end at an axial position of the metal wire and the above-mentioned discharge pole. It has been proposed to make the free end spherical by generating an electric discharge between the free ends.
上記従来技術は、第21図に示すように、被覆金線２を放
電トーチ165を使用してボールを形成した場合、第22図
に示すように、耐熱性の高いことが要求される被覆金線
２では、被覆が充分に除去されないため、厚肉部をもっ
た被覆の盛り上り24が発生したり、第23図に示すよう
に、偏りのある盛り上り25が発生したりすることによっ
て金ボール23が第22図に示すように真球にならなかった
り、第23図に示すように偏心したりして充分な真球形状
に形成することができない問題があった。In the prior art described above, as shown in FIG. 21, when the coated gold wire 2 is formed into a ball by using a discharge torch 165, as shown in FIG. 22, the coated gold wire is required to have high heat resistance. In line 2, since the coating is not sufficiently removed, the coating has a swelling 24 having a thick portion, and as shown in FIG. There is a problem in that the ball 23 does not become a true sphere as shown in FIG. 22 or is eccentric as shown in FIG.
また、被覆部が第25図に示すように、除去されたとして
も、コブ状の盛り上り26ができたり、被覆の溶け上り部
の長さｌが必要以上に長すぎて絶縁不良になる問題が生
じていた。Further, as shown in FIG. 25, even if the coating is removed, bump-like bulges 26 are formed, or the length l of the melting portion of the coating is unnecessarily long, resulting in poor insulation. Was occurring.
本発明の目的は、被覆線あるいは耐熱の高い被覆線の除
去、金ボールを形成することが可能であり、かつリーク
電流発生の障害が発生しないようにし、かつワイヤ同士
の交差や飛び越し配線を可能とする被覆線ワイヤボンデ
ィング方法およびその装置を提供することにある。The object of the present invention is to enable removal of a coated wire or a coated wire with high heat resistance, formation of a gold ball, and prevention of a failure of leakage current generation, as well as crossing of wires or interlaced wiring. To provide a covered wire bonding method and apparatus therefor.
上記目的を達成するため、本発明の被覆線ワイヤボンデ
ィング方法においては、導電性の芯線の外周を絶縁被覆
した被覆線の端部を把持手段にて把持し、この把持手段
にて放熱しつつ該把持手段より突出した被覆線の端部に
向って火炎を照射して被覆を除去するとともに露出した
芯線にボールを形成し、このボールを圧着してワイヤボ
ンディングするものである。In order to achieve the above object, in the covered wire wire bonding method of the present invention, an end portion of the covered wire in which the outer periphery of the conductive core wire is insulation-coated is gripped by a gripping means, and the heat is radiated by the gripping means. The coating is removed by irradiating the end of the coated wire protruding from the gripping means with the coating to form a ball on the exposed core wire, and the ball is pressure-bonded for wire bonding.
また、把持手段は、放電効果を向上するため、金属にて
構成されたものである。The gripping means is made of metal in order to improve the discharge effect.
また火炎は、耐熱性の高い被覆を容易に除去するため、
水素ガスによる火炎を用いたものである。In addition, the flame easily removes the heat-resistant coating,
It uses a flame of hydrogen gas.
また火炎は、耐熱性の高い被覆を容易に除去するため、
水素ガスによる火炎を用いたものである。In addition, the flame easily removes the heat-resistant coating,
It uses a flame of hydrogen gas.
また火炎は、耐熱性の高い被覆を容易に除去するため、
酸水素ガスによる火炎を用いたものである。In addition, the flame easily removes the heat-resistant coating,
It uses a flame of oxyhydrogen gas.
また、圧着は、ボールの周面および圧着部材の表面の汚
れを防止するため、熱圧着である。Further, the pressure bonding is thermocompression bonding in order to prevent the peripheral surface of the ball and the surface of the pressure bonding member from being soiled.
また、圧着は、低温にて圧着を行いうるようにするため
超音波熱圧着である。The pressure bonding is ultrasonic thermocompression bonding so that the pressure bonding can be performed at a low temperature.
また、本発明の被覆線ワイヤボンディング装置において
は、導電性の芯線の外周を絶縁被覆した被覆線の端部を
把持する手段と、この把持手段より突出した被覆線の端
部のボール形成代を残して切断する手段と、被覆線の先
端のボール形成代部分に向って火炎を照射して被覆線の
被覆を除去し、露出された芯線にボールを形成する手段
と、ボールを圧着によってボンディングする手段とこれ
ら各手段を自動制御する手段とを備えたものである。Further, in the covered wire wire bonding apparatus of the present invention, a means for holding the end portion of the covered wire in which the outer periphery of the conductive core wire is insulation-coated and a ball forming allowance for the end portion of the covered wire protruding from the holding means are provided. Bonding is performed by leaving the cutting means, a means for irradiating a flame toward the ball forming marginal portion of the tip of the coated wire to remove the coating of the coated wire, and forming a ball on the exposed core wire, and a ball by pressure bonding. Means and means for automatically controlling each of these means are provided.
また、把持手段は、放熱効果を向上するため、金属にて
構成されたものである。The gripping means is made of metal in order to improve the heat dissipation effect.
また、被覆除去・ボール形成手段は、被覆線の先端部周
囲を除去しかつ芯線にボールを真球状に形成するため、
被覆線に向って揺動自在に形成されたトーチから火炎を
照射するように構成されたものである。Further, the coating removing / ball forming means removes the periphery of the tip end portion of the coated wire and forms the ball into a true spherical shape on the core wire.
The torch formed so as to be swingable toward the covered wire is configured to irradiate the flame.
また、トーチからの火炎は、耐熱性の被覆を容易に除去
するため、水素ガスによる火炎にて構成されたものであ
る。The flame from the torch is composed of a flame of hydrogen gas in order to easily remove the heat resistant coating.
また、トーチからの火炎は、耐熱性の被覆を容易に除去
するため、酸水素ガスによる火炎にて構成されたもので
ある。The flame from the torch is composed of a flame of oxyhydrogen gas in order to easily remove the heat resistant coating.
またボンディング手段は、ボールの周面および圧着部材
の表面の汚れを防止するため、熱圧着にてボールをボン
ディングするように構成したものである。Further, the bonding means is configured to bond the ball by thermocompression bonding in order to prevent the peripheral surface of the ball and the surface of the pressure bonding member from being soiled.
またボンディング手段は、低温にて圧着するため、超音
波圧着にてボールをボンディングするように構成したも
のである。Further, the bonding means is configured to bond the balls by ultrasonic pressure bonding since they are pressure bonded at a low temperature.
上記の被覆線ワイヤボンディング方法においては、被覆
線の被覆除去・ボール形成を行うことができ、かつ絶縁
されているので、接続チップの外周上端に接触してリー
ク電流発生の障害を発生するのを防止しかつ隣接線材間
の短絡およびエッジショートをするのを防止することが
できる。In the above-mentioned covered wire wire bonding method, the covering wire of the covered wire can be removed and the ball can be formed, and since it is insulated, it is possible to prevent the occurrence of leakage current by contacting the outer peripheral upper end of the connection chip. It is possible to prevent and prevent a short circuit between the adjacent wire rods and an edge short circuit.
また、把持手段は、金属線にて構成されているので、放
熱効果を向上し、これによって被覆除去およびボール形
成時、被覆の盛り上りや、必要以上の溶け上りを防止す
ることができる。Further, since the gripping means is made of a metal wire, it is possible to improve the heat radiation effect, thereby preventing the coating from rising and melting more than necessary when removing the coating and forming the balls.
また、火炎は、水素炎もしくは酸水素炎を用いたので、
耐熱性の高い被覆でも容易に除去することができる。Moreover, since the flame used the hydrogen flame or the oxyhydrogen flame,
Even a coating with high heat resistance can be easily removed.
また、圧着は熱圧着によるので、ボールの周面および圧
着部材の表面の汚れを防止することができる。Further, since the pressure bonding is thermocompression bonding, it is possible to prevent the peripheral surface of the ball and the surface of the pressure bonding member from being soiled.
また、圧着は超音波熱圧着によるので、低温でもボール
をボールボンディングすることができる。Further, since the pressure bonding is ultrasonic thermocompression bonding, the balls can be ball-bonded even at a low temperature.
また、上記のように構成された被覆線ワイヤボンディン
グ装置においては、自動的に被覆線の被覆除去・ボール
形成おおびボールのボンディングを行うことができ、か
つ被覆除去・ボール形成後ボールのボンディングを行う
ので被覆除去時の除去物，飛散ガスがボンディング部に
付着するのを防止するとともに高温のたとえば水素ガス
などがボンディング部に付着するのを防止することがで
き、かつボールが所定の形状に形成されたことを確認し
てからボンディングするので、ボールの不良によるボン
ディングの不良を排除することができる。Further, in the covered wire wire bonding apparatus configured as described above, it is possible to automatically perform covering removal of the covered wire, ball formation, and ball bonding, and removal of coating and ball bonding after ball formation. Since it is carried out, it is possible to prevent the removed matter and scattered gas at the time of coating removal from adhering to the bonding portion, and also to prevent high temperature hydrogen gas, for example, from adhering to the bonding portion, and to form the ball into a predetermined shape. Since the bonding is performed after confirming that the bonding has been performed, the bonding failure due to the ball failure can be eliminated.
以下、本発明の一実施例である被覆ワイヤボンディング
装置を示す第１図乃至第20図について説明する。Hereinafter, FIGS. 1 to 20 showing a covered wire bonding apparatus according to an embodiment of the present invention will be described.
第１図に示すように、本発明による被覆線ワイヤボンデ
ィング装置１は、基台10上にブラケット101を介して回
転自在に支持されたリール11と、ブラケット101に固定
支持され、リール11から繰り出された被覆線２の外周面
に付着する塵埃および異物（以下ゴミという）を除去す
るゴミ取り手段12と、このゴミ取り手段12からの被覆線
２の両端部を把持する把持手段13と、この把持手段13を
基台10上にそうて移動させる移動手段14と、基台10とは
別な位置に固定された切断手段15と、被覆除去・ボール
形成手段16と、上記各手段を自動制御する制御手段17と
から構成されている。As shown in FIG. 1, a covered wire bonding apparatus 1 according to the present invention includes a reel 11 rotatably supported on a base 10 through a bracket 101, and a reel 101 fixedly supported by the bracket 101. Dust removing means 12 for removing dust and foreign matter (hereinafter referred to as “dust”) attached to the outer peripheral surface of the covered wire 2 and gripping means 13 for holding both ends of the covered wire 2 from the dust removing means 12, A moving means 14 for moving the gripping means 13 on the base 10 in that way, a cutting means 15 fixed at a position different from the base 10, a coating removing / ball forming means 16, and the above-mentioned means are automatically controlled. And a control means 17 for controlling.
また本実施例で適用される被覆線２は芯線21が金で形成
されこの芯線21を絶縁材22にて被覆している。Further, in the covered wire 2 applied in this embodiment, the core wire 21 is made of gold, and the core wire 21 is covered with the insulating material 22.
つぎに上記各手段の構成について説明する。Next, the configuration of each of the above means will be described.
ゴミ取り手段12は２個で一対のゴミ取り部材121の先端
対向部にフィルタ122を固定し、このフィルタ122にて被
覆線２の外周面を挟持し、移動する被覆線２の外周面に
付着するゴミを除去する。Two pieces of the dust removing means 12 fix the filter 122 to the end facing portions of the pair of dust removing members 121, and the outer peripheral surface of the covered wire 2 is sandwiched by the filter 122 and attached to the outer peripheral surface of the moving covered wire 2. Remove the dust.
把持手段13は第２図および第３図に示すように始端グリ
ッパ131と、終端グリッパ132とマガジン133とから構成
されている。始端グリッパ131,132は、それぞれ固定側
の金属チャック1311,1321と、これら固定側金属チャッ
ク1311,1321に回動中心部をピン1331,1332を介して回動
自在に支持され、上端部が常時はバネ1313,1323の弾性
力によって固定側金属チャック1311,1321の上端部を押
圧している可動側金属チャック1312,1322と、これら可
動側金属チャック1312,1322がそれぞれ被覆線２の両端
部を把持する位置に達したとき、その下端部側面に対向
するように基台10上に支持され、下端部側面をバネ131
3,1323の弾性力に打ちかって押して可動側金属チャック
1312,1322の上端部を固定側金属チャック1311,1321の上
端部から開放させるアクチュエータ1314,1324とを備え
ている。マガジン133は、移動手段14の可動台143上に搭
載され、始端グリッパ131の固定側金属チャック1312を
一端部に固定し、終端グリッパ132の固定側金属チャッ
ク1321を被覆線２の長に応じて移動しうるように支持
し、かつ２個の位置決め穴1331を形成している。なお、
固定側金属チャック1311,1321および移動側金属チャッ
ク1312,1322は、放熱効果を向上するため、銀または銅
にて形成されている。また２個の位置決め穴1331は、被
覆線２の両端部にボール23が形成されたのち、被覆線２
を把持した状態で把持手段15を基台10上から取外し、つ
いで、把持手段15を基台10上に取付けるさいの位置決め
用である。As shown in FIGS. 2 and 3, the gripping means 13 is composed of a start end gripper 131, an end gripper 132 and a magazine 133. The starting-end grippers 131 and 132 are fixed to the fixed-side metal chucks 1311 and 1321, respectively, and the fixed-side metal chucks 1311 and 1321 are rotatably supported at their rotation centers via pins 1331 and 1332. The movable metal chucks 1312 and 1322 pressing the upper ends of the fixed metal chucks 1311 and 1321 by the elastic force of 1313 and 1323, and the movable metal chucks 1312 and 1322 grip both ends of the covered wire 2, respectively. When it reaches the position, it is supported on the base 10 so as to face the lower end side surface, and the lower end side surface is supported by the spring 131.
Metallic chuck on the movable side that can be pressed against the elastic force of 3,1323
Actuators 1314, 1324 for opening the upper ends of 1312, 1322 from the upper ends of the fixed-side metal chucks 1311, 1321 are provided. The magazine 133 is mounted on the movable base 143 of the moving means 14, fixes the fixed side metal chuck 1312 of the start end gripper 131 to one end, and fixes the fixed side metal chuck 1321 of the end gripper 132 according to the length of the covered wire 2. It is movably supported and has two positioning holes 1331 formed therein. In addition,
The fixed metal chucks 1311 and 1321 and the movable metal chucks 1312 and 1322 are made of silver or copper in order to improve the heat radiation effect. In addition, the two positioning holes 1331 have balls 23 formed at both ends of the covered wire 2 and then the covered wire 2
This is for positioning when the gripping means 15 is detached from the base 10 in a state of gripping, and then the gripping means 15 is mounted on the base 10.
移動手段14は基台10の端面に固定されたモータ141が駆
動したとき、ネジシャフト142が回転してこのネジシャ
フト142に螺合する可動台143がその上面に搭載する把持
手段13とともに移動して把持手段13の始端グリッパ131
および終端グリッパ132を被覆除去・ボール形成位置に
位置決めする。When the motor 141 fixed to the end surface of the base 10 is driven, the moving means 14 rotates the screw shaft 142 and the movable base 143 screwed to the screw shaft 142 moves together with the gripping means 13 mounted on the upper surface thereof. Gripper 131 of the gripping means 13
And the end gripper 132 is positioned at the coating removal / ball forming position.
切断手段15は、第４図に示すように、断面が形状をし
た台151と、この台151上にアクチュエータ1511によって
摺動しうるように搭載された摺動台152と、この摺動台1
52上に搭載された駆動部158にて長手方向に往復移動
し、その先端部長手方向に開先溝1531を有する切断ガイ
ド153と、この切断ガイド153を介挿するようにその両側
に配置され、それぞれ摺動台152上に揺動自在に支持さ
れ、後端部を切断用アクチュエータ154,155によって上
下動したとき先端部が上下動して切断ガイド153の対向
端面をガイドにして被覆線２を切断する２個の切断刃15
6,157とを備えている。なお、切断ガイド153はその厚さ
ａはボール形成代と一致するように形成されている。As shown in FIG. 4, the cutting means 15 includes a base 151 having a cross section, a slide base 152 mounted on the base 151 so as to be slidable by an actuator 1511, and the slide base 1.
A driving unit 158 mounted on the 52 reciprocates in the longitudinal direction and has a cutting guide 153 having a groove 1531 in the longitudinal direction of its distal end, and the cutting guide 153 is arranged on both sides of the cutting guide 153. , Each of which is swingably supported on the slide base 152, and when the rear end is moved up and down by the cutting actuators 154 and 155, the leading end moves up and down to cut the covered wire 2 by using the opposite end face of the cutting guide 153 as a guide. 2 cutting blades 15
It has 6,157 and. The cutting guide 153 is formed so that its thickness a matches the ball forming margin.
被覆除去・ボール形成手段16は、第５図に示すように、
固定台161とこの固定台161上にＸ方向アクチュエータ16
21によってＸ矢印方向に移動しうるように搭載されたＸ
方向移動台162と、このＸ方向移動台162上にＹ方向アク
チュエータ1631によって矢印方向に移動しうるように搭
載されたＹ方向移動台163とこのＹ方向移動台163に支持
され、回動したとき、この上面の取付台164の上下方向
の位置を調整する部材165と、取付台164上に搭載され、
トーチ支持具166を挟持するとともにトーチ支持具166の
先端部に支持されたトーチ167の先端噴出部1671を第11
図乃至第13図に示すように揺動させるトーチ揺動アクチ
ュエータ168とを備えている。なお、トーチ165は図示し
ていないが、酸水素ガスまたは水素ガスの供給源に接続
している。The coating removing / ball forming means 16 is, as shown in FIG.
The fixed base 161 and the actuator 16 in the X direction on the fixed base 161
X mounted so that it can be moved in the X arrow direction by 21
The direction moving base 162, the Y direction moving base 163 mounted on the X direction moving base 162 so as to be movable in the arrow direction by the Y direction actuator 1631, and the Y direction moving base 163 being supported by the Y direction moving base 163 and rotating. , A member 165 for adjusting the vertical position of the mounting base 164 on the upper surface, and mounted on the mounting base 164.
The tip ejection portion 1671 of the torch 167 supported by the tip portion of the torch support tool 166 while sandwiching the torch support tool 166
A torch swing actuator 168 that swings as shown in FIGS. Although not shown, the torch 165 is connected to a supply source of oxyhydrogen gas or hydrogen gas.
制御手段17は、第１図に１点鎖線にて囲んで示すよう
に、記憶手段172を有する主制御部171が設けられ、この
主制御部171には把持手段制御部173と、切断手段制御部
174と、被覆除去・ボール形成手段175と、移動手段制御
部176とを備えこれら各制御部173乃至176は、各手段13,
15,16,14に点線にて示すように接続されている。The control means 17 is provided with a main control part 171 having a storage means 172, as shown by being surrounded by a one-dot chain line in FIG. 1. The main control part 171 has a gripping means control part 173 and a cutting means control. Department
174, a coating removing / ball forming means 175, and a moving means control section 176.
It is connected to 15,16,14 as shown by the dotted line.
本発明による被覆線ワイヤボンディング装置１は前記の
ように構成されているから、つぎにその動作について第
６図に示すフローチャートに基いて第７図乃至第20図に
より説明する。Since the covered wire bonding apparatus 1 according to the present invention is configured as described above, its operation will be described below with reference to FIGS. 7 to 20 based on the flowchart shown in FIG.
まず、第７図に示すように、被覆線２をリール11より繰
出しゴミ取り手段12にて外周面に付着したゴミを取り除
いて始端グリッパ131の固定側金属製チャック1311の上
端部と可動側金属チャック1312の上端部との間で把持す
る。First, as shown in FIG. 7, the covered wire 2 is unwound from the reel 11 by the dust removing means 12 to remove dust adhering to the outer peripheral surface thereof, and the upper end portion of the fixed metal chuck 1311 of the starting end gripper 131 and the movable metal. It is gripped between the upper end of the chuck 1312.
このとき、切断ガイド153および切断刃156,157が第８図
に示す矢印方向に移動して切断ガイド153の開先溝1531
内に被覆線２の両チャック1311,1312から突出した部分
の一部が挿入する。そのため、被覆線２の一端部は両チ
ャック1311,1312から切断ガイド153の厚さａを除いた部
分が突出している。At this time, the cutting guide 153 and the cutting blades 156 and 157 move in the arrow direction shown in FIG.
A part of the portion of the covered wire 2 protruding from both chucks 1311 and 1312 is inserted therein. Therefore, one end portion of the covered wire 2 projects from both chucks 1311, 1312 except the thickness a of the cutting guide 153.
しかるのち、第９図に示すように一方の切断刃156の先
端部が切断ガイド153の対向面をガイドにして下方に移
動して被覆線２の一端部を切断するので、第10図に示す
ように、被覆線２の一端部は、両チャック1311,1312か
ら切断ガイド153の厚さａに相当する部分を残して切断
される。Thereafter, as shown in FIG. 9, the tip of one of the cutting blades 156 moves downward with the facing surface of the cutting guide 153 as a guide to cut one end of the covered wire 2, so that it is shown in FIG. Thus, one end of the covered wire 2 is cut from both chucks 1311, 1312, leaving a portion corresponding to the thickness a of the cutting guide 153.
ついで、一方の切断刃156を上昇して切断ガイド153と同
時に後退して元の位置に達すると、第11図に示すよう
に、被覆除去・ボール形成手段16に設けられたトーチ16
7がたとえば1.7mm/secというような低速で揺動してその
先端の噴出部1671から酸水素ガスまたは水素ガスによる
火炎1672が第12図に示すように、被覆線２の一端部の厚
さａに相当する部分に照射し、被覆22を除去して芯線21
を露出させる。Then, when one of the cutting blades 156 is raised and retracts at the same time as the cutting guide 153 to reach the original position, as shown in FIG. 11, the torch 16 provided in the coating removing / ball forming means 16 is removed.
7 oscillates at a low speed such as 1.7 mm / sec, and a flame 1672 due to oxyhydrogen gas or hydrogen gas is emitted from the jet portion 1671 at the tip thereof, as shown in FIG. Irradiate a portion corresponding to a, remove the coating 22, and remove the core wire 21.
Expose.
引続き、トーチ167を揺動させながら火炎1672を露出し
ている芯線21に照射すると第13図に示すように被覆線２
の一端部にボール23が形成される。なお、被覆22の除去
およびボール23の形成時に火炎1672によって発生する熱
は両チャック1311,1312によって放熱されるため、被覆
の盛り上りや必要以上に溶け上りするのを防止すること
ができる。Subsequently, when the exposed core wire 21 is irradiated with the flame 1672 while swinging the torch 167, as shown in FIG.
A ball 23 is formed at one end of the. Since the heat generated by the flame 1672 when the coating 22 is removed and the balls 23 are formed is radiated by the chucks 1311, 1312, it is possible to prevent the coating from rising or melting more than necessary.
このようにして、被覆線２の一端部にボール23が形成さ
れるとトーチ167の揺動を停止するとともにその先端の
噴出部1671から火炎1672の照射を停止したのち、移動手
段14のモータ141を駆動し、ネジシャフト142を回転して
終端グリッパ132を移動するとともに終端グリッパ132自
体をマガジン133より移動して被覆線２の長さに対応す
るように調整する。In this way, when the ball 23 is formed at one end of the covered wire 2, the torch 167 is stopped from swinging, and the irradiation of the flame 1672 from the jet portion 1671 at the tip thereof is stopped, and then the motor 141 of the moving means 14 is stopped. Is driven, the screw shaft 142 is rotated to move the terminal gripper 132, and the terminal gripper 132 itself is moved from the magazine 133 so as to correspond to the length of the covered wire 2.
ついで、終端グリッパ132が所定位置に達すると、終端
グリッパ132の両チャック1321,1322が被覆線２の他端部
を把持するとともに両チャック1321,1322より突出する
被覆線の他端部が切断ガイド153の移動によってその開
先溝1531内に挿入する。Next, when the end gripper 132 reaches a predetermined position, both chucks 1321, 1322 of the end gripper 132 grip the other end of the covered wire 2 and the other end of the covered wire protruding from both chucks 1321, 1322 is a cutting guide. It is inserted into the groove 1531 by the movement of 153.
しかるのち、第14図に示すように、他方の切断刃157の
先端部が切断ガイド153の対向面をガイドにして下方に
移動して被覆線２の他端部を切断するので、被覆線２の
他端部は、第15図に示すように両チャック1321,1322か
ら切断ガイド153の厚さａに相当する分だけ残して切断
される。Thereafter, as shown in FIG. 14, the tip end of the other cutting blade 157 moves downward with the facing surface of the cutting guide 153 as a guide to cut the other end of the covered wire 2, so that the covered wire 2 The other end is cut from both chucks 1321 and 1322, leaving only an amount corresponding to the thickness a of the cutting guide 153, as shown in FIG.
ついで、他方の切断刃157を上昇して切断ガイド153と同
時に後退して元の位置に達すると、第16図に示すように
被覆除去・ボール形成手段16のトーチ167が低速で揺動
しながらその先端の噴出部1671から酸水素ガスまたは水
素ガスによる火炎1672が被覆線２の他端部の厚さａに相
当する部分に照射し、第17図に示すように、被覆22を除
去して芯線21を露出させる。Then, when the other cutting blade 157 is raised and retracts at the same time as the cutting guide 153 to reach the original position, the torch 167 of the sheath removing / ball forming means 16 swings at a low speed as shown in FIG. A flame 1672 of oxyhydrogen gas or hydrogen gas irradiates the portion corresponding to the thickness a of the other end of the covered wire 2 from the jet portion 1671 at the tip thereof, and the coating 22 is removed as shown in FIG. The core wire 21 is exposed.
引続き、トーチ167を揺動させながら火炎を露出してい
る芯線21に照射すると、第18図に示すように被覆線２の
他端部にボール23が形成され、第19図に示すような被覆
線２が形成されるので、第20図に示すように、これらの
ボール23を熱圧着または超音波熱圧着して基板３に多数
形成された接続パッド31上にボンディングする。Then, when the core wire 21 exposing the flame is irradiated while swinging the torch 167, the balls 23 are formed at the other end of the covered wire 2 as shown in FIG. 18, and the covered wire as shown in FIG. Since the line 2 is formed, as shown in FIG. 20, these balls 23 are bonded by thermocompression bonding or ultrasonic thermocompression bonding on the connection pads 31 formed in large numbers on the substrate 3.
本発明は、以上説明したものであるので、以下に記載さ
れるような効果を奏する。Since the present invention has been described above, it has the following effects.
本発明の被覆線ワイヤボンディング方法においては、被
覆線の被覆除去・ボール形成を行うことができ、かつ絶
縁されているので接続チップの外周上端に接触してリー
ク電流発生の障害を発生するのを防止し、かつ隣接線材
間の短絡およびエッジショートをするのを防止すること
ができる。In the covered wire wire bonding method of the present invention, the covering wire of the covered wire can be removed and the balls can be formed, and since it is insulated, it is possible to prevent the occurrence of leakage current by contacting the upper end of the outer periphery of the connection chip. In addition, it is possible to prevent a short circuit and an edge short between adjacent wires.
また、把持手段は、金属線にて構成されているので、放
熱効果を向上し、これによって被覆除去およびボール形
成時、被覆の盛り上りや、必要以上の溶け上りを防止す
ることができる。Further, since the gripping means is made of a metal wire, it is possible to improve the heat radiation effect, thereby preventing the coating from rising and melting more than necessary when removing the coating and forming the balls.
また、火炎は、水素炎もしくは酸水素炎を用いたので、
耐熱性の高い被覆でも容易に除去することができる。Moreover, since the flame used the hydrogen flame or the oxyhydrogen flame,
Even a coating with high heat resistance can be easily removed.
また、圧着は熱圧着によるので、ボールの周面および圧
着部材の表面の汚れを防止することができる。Further, since the pressure bonding is thermocompression bonding, it is possible to prevent the peripheral surface of the ball and the surface of the pressure bonding member from being soiled.
また、圧着は超音波熱圧着によるので、低温でもボール
をボールボンディングすることができる。Further, since the pressure bonding is ultrasonic thermocompression bonding, the balls can be ball-bonded even at a low temperature.
また、上記のように構成された被覆線ワイヤボンディン
グ装置においては、自動的に被覆線の被覆除去・ボール
形成およびボールのボンディングを行うことができ、か
つ被覆除去・ボール形成後ボールのボンディングを行う
ので、被覆除去時の除去物、飛散ガスがボンディング部
に付着するのを防止するとともに高温のたとえば水素ガ
スなどがボンディング部に付着するのを防止することが
でき、かつボールが所定の形状に形成されたことを確認
してからボンディングするので、ボールの不良によるボ
ンディングの不良を排除することができる。Further, in the covered wire wire bonding apparatus configured as described above, it is possible to automatically perform the covering removal / ball formation and ball bonding of the covered wire, and the covering removal / ball bonding after the ball formation. Therefore, it is possible to prevent adhered substances and scattered gas at the time of coating removal from adhering to the bonding portion, and also prevent high temperature hydrogen gas, for example, from adhering to the bonding portion, and to form the ball into a predetermined shape. Since the bonding is performed after confirming that the bonding has been performed, the bonding failure due to the ball failure can be eliminated.
第１図は本発明の一実施例である被覆線ワイヤボンディ
ング装置を示す斜視図、第２図は把持手段の始端グリッ
パおよび終端グリッパを示す拡大斜視図、第３図は把持
手段のマガジンを示す拡大斜視図、第４図は切断手段を
示す拡大斜視図、第５図は被覆除去・ボール形成手段を
示す拡大斜視図、第６図は動作順序を示すフローチャー
ト、第７図乃至第20図は動作工程図、第21図は従来の被
覆線を放電トーチでボールを形成する前を示す説明図、
第22図乃至第24図は、従来の被覆線を放電トーチでボー
ルを形成したときの状態を示す説明図である。 １……被覆線ワイヤボンディング装置、２……被覆線、
３……基板、10……基台、11……リール、12……ゴミ取
り手段、13……把持手段、14……移動手段、15……切断
手段、16……被覆除去・ボール形成手段、17……制御手
段。FIG. 1 is a perspective view showing a covered wire bonding apparatus which is an embodiment of the present invention, FIG. 2 is an enlarged perspective view showing a start end gripper and an end gripper of gripping means, and FIG. 3 shows a magazine of gripping means. FIG. 4 is an enlarged perspective view showing the cutting means, FIG. 5 is an enlarged perspective view showing the coating removing / ball forming means, FIG. 6 is a flow chart showing the operation sequence, and FIGS. Fig. 21 is an operation process diagram, and Fig. 21 is an explanatory diagram showing a conventional covered wire before forming a ball with a discharge torch.
22 to 24 are explanatory views showing a state when a ball is formed on a conventional covered wire by a discharge torch. 1 ... Coated wire wire bonding device, 2 ... Coated wire,
3 ... Substrate, 10 ... Base, 11 ... Reel, 12 ... Dust removing means, 13 ... Gripping means, 14 ... Moving means, 15 ... Cutting means, 16 ... Coating removal / ball forming means , 17 ... Control means.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 浦山 敏 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内 (72)発明者 谷 光清 神奈川県秦野市堀山下１番地 株式会社日 立製作所神奈川工場内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Satoshi Urayama 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa Inside the Hitachi, Ltd. Institute of Industrial Science (72) Inventor, Mitsukiyo Tani, Horiyamashita, Hadano-shi, Kanagawa Company Nitate Works Kanagawa Factory
Claims (13)
の端部を把持手段にて把持し、この把持手段にて放熱し
つつ該把持手段より突出した被覆線の端部に向って火炎
を照射して被覆を除去するとともに露出した芯線にボー
ルを形成し、このボールを圧着にてワイヤボンディング
する被覆線ワイヤボンディング方法。1. An end portion of a coated wire in which an outer periphery of a conductive core wire is insulated and coated is held by a holding means, and heat is radiated by the holding means toward an end portion of the covered wire protruding from the holding means. A coated wire wire bonding method in which a coating is removed by irradiating a flame, a ball is formed on an exposed core wire, and the ball is wire bonded by pressure bonding.
載の被覆線ボンディング方法。2. The covered wire bonding method according to claim 1, wherein the holding means is made of metal.
１記載の被覆線ボンディング方法。3. The covered wire bonding method according to claim 1, wherein the flame is a hydrogen flame produced by hydrogen gas.
求項１記載の被覆線ボンディング方法。4. The covered wire bonding method according to claim 1, wherein the flame is an oxyhydrogen flame caused by oxyhydrogen gas.
線ワイヤボンディング方法。5. The covered wire wire bonding method according to claim 1, wherein the pressure bonding is thermocompression bonding.
の被覆線ワイヤボンディング方法。6. The covered wire bonding method according to claim 1, wherein the crimping is ultrasonic thermocompression.
の端部を把持する手段と、この把持手段より突出した被
覆線の先端部をボール形成代を残して切断する手段と、
被覆線の先端のボール形成代部分に火炎を照射して被覆
を除去し、露出された芯線にボールを形成する手段と、
ボールを圧着によってボンディングする手段と、これら
各手段を自動制御する手段を備えた被覆線ワイヤボンデ
ィング装置。7. A means for gripping an end portion of a covered wire in which an outer periphery of a core wire of a conductive material is insulated and coated, and a means for cutting a tip end portion of the covered wire protruding from the gripping means with a ball forming margin left.
A means for irradiating a flame to the ball forming margin portion of the tip of the coated wire to remove the coating, and forming a ball on the exposed core wire,
A covered wire wire bonding apparatus having means for bonding balls by pressure bonding and means for automatically controlling each of these means.
記載の被覆線ワイヤボンディング装置。8. The grip means is made of metal.
The covered wire wire bonding apparatus described.
端部に向かって揺動自在に形成されたトーチから火炎を
照射するように構成された請求項７記載の被覆線ワイヤ
ボンディング装置。9. The coated wire wire bonding apparatus according to claim 7, wherein the coating removing / ball forming means is configured to irradiate a flame from a torch formed so as to be swingable toward a tip portion of the coated wire.
た請求項７もしくは９記載の被覆線ワイヤボンディング
装置。10. The covered wire wire bonding apparatus according to claim 7, wherein the flame is a flame of hydrogen gas.
れた請求項７もしくは９記載の被覆線ワイヤボンディン
グ装置。11. The covered wire wire bonding apparatus according to claim 7, wherein the flame is a flame of oxyhydrogen gas.
着である請求項７記載の被覆線ワイヤボンディング装
置。12. The covered wire wire bonding apparatus according to claim 7, wherein the pressure bonding in the bonding means is thermocompression bonding.
波熱圧着である請求項７記載の被覆線ワイヤボンディン
グ装置。13. The covered wire wire bonding apparatus according to claim 7, wherein the crimping in the bonding means is ultrasonic thermocompression.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138371A JPH0775240B2 (en) | 1988-06-07 | 1988-06-07 | Wire bonding method and device for covered wire |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63138371A JPH0775240B2 (en) | 1988-06-07 | 1988-06-07 | Wire bonding method and device for covered wire |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01308040A JPH01308040A (en) | 1989-12-12 |
| JPH0775240B2 true JPH0775240B2 (en) | 1995-08-09 |
Family
ID=15220371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63138371A Expired - Fee Related JPH0775240B2 (en) | 1988-06-07 | 1988-06-07 | Wire bonding method and device for covered wire |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0775240B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015005170A (en) * | 2013-06-21 | 2015-01-08 | 凸版印刷株式会社 | Ic module and production method thereof |
-
1988
- 1988-06-07 JP JP63138371A patent/JPH0775240B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01308040A (en) | 1989-12-12 |
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