JPH077306B2 - Semiconductor element recognition device - Google Patents

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor element recognition device, and more particularly to a semiconductor element recognition device that individually detects and positions semiconductor elements.

[Conventional technology]

Conventionally, as shown in FIG. 4, this type of semiconductor device recognition apparatus has a stage 1 which can move in the X-axis and Y-axis directions and can rotate, and a semiconductor device 10 mounted on the stage 1 directly above the stage 1. A fixed TV camera 3a, an arithmetic control unit 4a for processing an image signal taken in from the TV camera 3a, a monitor unit 6 for displaying an image, and a stage drive for driving the stage 1 by the output signal of the arithmetic control unit 4a. The part 5a and the semiconductor element 10
It is composed of an illuminating section 2 for illuminating the upper part, and illuminates the semiconductor element 10 to capture brightness information with the TV camera 3a.
Presence / absence and shape of the semiconductor element 10 are detected by the arithmetic control unit 4a.
After calculating the center and inclination of the stage 1, the stage drive unit 5a moves and rotates the stage 1 to perform positioning.

The calculation was performed by dividing the brightness information captured by the TV camera 3a into grids (hereinafter referred to as dots) in the X-axis and Y-axis directions, and calculating the number of dots.

Further, the magnification of the TV camera 3a is set to a magnification that allows the semiconductor element 10 to be within the imaging range.

Next, the reference point set on the stage 1 and the method of calculating the deviation and inclination of the center point of the semiconductor element 10 with respect to the reference X-axis and the reference Y-axis intersecting the reference point are shown in FIG. This will be described with reference to the display image of the section 6.

First, in order to find a temporary center point of the semiconductor element 10, the number of dots x from the reference point 12 to each side of the reference X-axis 13 and the reference Y-axis 14
₁ , x ₂ and y ₁ , y ₂ are counted, and the calculation of formula (1) is performed to calculate the coordinates (x ₁ , y) of the temporary center point of the semiconductor element 10 from the reference point 12.
₀ ) is obtained, and the stage 1 is moved in the X-axis and Y-axis directions by the calculated coordinates (x ₀ , y ₀ ) to match the provisional center point with the reference point 12.

(X ₀ , y ₀ ) = [(x ₁ + x ₂ ) / 2, (y ₁ + y ₂ ) / 2] (1) Next, in order to perform the tilt correction, equations (2) and (3) )
Perform the calculation of.

x _θ = x _{θ 1} −x _θ 2 (2) Δθ = tan ⁻¹ (x _θ / y _θ ) (3) y _θ is a value (number of dots) preset by the operator,
x _θ1 and x _θ2 are the numbers of dots in the X-axis direction from the reference Y-axis 14 to the left side at a point separated by y _θ on the set reference Y-axis 14.

After the calculation, the inclination is corrected in stage 1, x ₁ −x ₂ = 0, y ₁ −y ₂ ＝
The above operation is repeated until 0, Δθ = 0, and the positioning is completed.

[Problems to be solved by the invention]

The above-described conventional semiconductor element recognition device has a configuration in which the semiconductor element 10 is calculated and controlled at a magnification such that the semiconductor element 10 is within the imaging range. If it is called a semiconductor device), TV camera
There was a drawback that the positioning accuracy in the direction of the short side and the inclination became poor due to the restriction of the resolution of 3a and the calculation control unit 4a.

In addition, the semiconductor element 10 has a large inclination and the long side direction is the reference X.
There is a drawback in that recognition is not possible when the axis and the reference Y axis are out of alignment, and recognition error occurs.

An object of the present invention is to provide a semiconductor element recognizing device capable of accurately positioning a semiconductor element having a significantly large ratio of long sides and short sides without erroneous recognition.

[Means for solving problems]

The semiconductor element recognition device of the present invention is mounted with a semiconductor element and has a reference point preset and a reference X intersecting at the reference point.
A stage that can rotate about the axis and the reference Y-axis and move in the X-axis and Y-axis directions and a semiconductor element on this stage are imaged at a predetermined magnification including the magnification until the portion of the semiconductor element protrudes from the imaging range. A TV camera that outputs an image signal, and the image signal is converted into the corresponding number of dots in the X-axis and Y-axis directions, and the number of dots with respect to the reference X-axis and the reference Y-axis at a plurality of positions of the semiconductor element and stage driving From the information, the relative position of the semiconductor element to the reference point and the reference X
Axis, a calculation control section for calculating a tilt with respect to a reference Y-axis and outputting a correction signal, and a stage for inputting the correction signal to move and rotate the stage in the X-axis and Y-axis directions and output the stage drive information And a drive unit.

〔Example〕

Next, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a block diagram showing an embodiment of the present invention.

The stage 1 is mounted with the semiconductor element 10, and rotates and rotates with respect to a reference point and a reference X-axis and a reference Y-axis set in advance, and the X-axis and Y-axis.
It is possible to move in the axial direction.

The TV camera 3 includes a high magnification that allows the semiconductor element 10 on the stage 1 to be projected from the imaging range by the illumination of the illumination unit 2 so that errors in counting and calculation in the short side direction are sufficiently small. The image is picked up at a preset magnification and an image signal is output.

The arithmetic control unit 4 converts the image signal from the TV camera 3 into binary information of white and black, determines the white information as the semiconductor element 10, and converts it into the corresponding number of dots in the X-axis and Y-axis directions. , The position of the semiconductor element 10 with respect to the reference point and the reference X-axis, based on the number of dots with respect to the reference X-axis and the reference Y-axis at a plurality of positions of the semiconductor element 10 and the stage drive information from the stage drive unit 5.
The inclination with respect to the reference Y axis is calculated and a correction signal is output.

The stage drive unit 5 receives the correction signal from the arithmetic control unit 4 and moves the stage 1 in the X-axis and Y-axis directions by the pulse motor and also rotates the stage 1.

The monitor unit 6 displays and monitors the position of the semiconductor element 10 on the stage 1.

Next, the position correction operation of the semiconductor device 10 of this embodiment will be described.

2 (a) to (c) and FIGS. 3 (a) and 3 (b) are image diagrams on the display screen of the monitor unit 6 for explaining the position correcting operation of the semiconductor device 10 according to this embodiment. Is.

First, as shown in FIG. 2A, the magnification is increased so that the counting error of the number of dots in the short side direction is sufficiently small, and the stage 1 is moved to the right or the semiconductor element 10 on the reference point 12. Move it to the left, and when the semiconductor element 10 is on the reference point 12, then move the semiconductor element 10 to both the upper and lower detection frames 15a and 15b.
Move stage 1 up or down to stop as if you were in. The detection frames 15a and 15b are set by an operator in advance.

When stopped, the dot numbers x ₁ and x ₂ from the reference point 12 to the left and right sides of the semiconductor element 10 are calculated along the reference X-axis 13, and the stage 1 is moved in the X-axis direction so that x ₁ = x _2. Set a temporary center point in the X-axis direction.

Next, the reference X-axis 14 separated by a preset distance y _dθ
The number of dots x _θ1 and x _θ2 in the X-axis direction from the point to the left side of the semiconductor element 10 is counted, the tilt with respect to the reference Y-axis 14 is calculated from this, and the tilt is corrected by moving the stage 1 (this is tentative). Called the θ origin).

Next, as shown in FIG. 2B, the stage 1 is moved downward until the semiconductor element 10 disappears from the detection frame 15a, and the dot number x in the X-axis direction from the reference point 12 to the left side of the semiconductor element 10 x _θ3 is counted and stored, and then, as shown in FIG. 2 (c), the stage 1 is moved upward until the semiconductor element 10 disappears from the detection frame 15b, and from the reference point 12 to the left side of the semiconductor element 10. After counting the number of dots _xθ4 in the X-axis direction, the inclination is detected by the stored _xθ3 and _xθ4, and the inclination is corrected again by the stage 1 centering on the reference point 12 (this is called the correct θ origin). .

After that, as shown in FIG. 2 (c), the number of dots y ₁ from the reference point 12 to the lower side of the semiconductor element 10 is counted, and the semiconductor element in the Y-axis direction is calculated based on the size of the semiconductor element 10 input in advance. The distance from the center point of 10 to the reference point 12 is calculated, and the stage 1 is moved downward to perform positioning in the Y-axis direction.

Next, the number of dots from the reference point 12 to the left side of the semiconductor element 10 is counted, the distance from the center point of the semiconductor element 10 in the X-axis direction to the reference point 12 is calculated, and the stage 1 is moved to the right or left, Positioning in the X-axis direction is completed and all positioning is completed.

Next, a pulse signal supplied to the pulse motor of the stage drive unit 5 that moves the stage 1 and a calculation method of position correction will be described.

First, how to find the provisional center point in the X-axis direction will be described.

In FIG. 2A, x _{1 is} the distance from the reference point 12 to the left side of the semiconductor element 10 (the number of dots) x _{2 is} the distance from the reference point 12 to the right side of the semiconductor element 10 (the number of dots) P _{xc is the} stage The number of pulses of the pulse motor required to move 1 in the X-axis direction by 1 mm (pulse number / mm) P _W : Width of the semiconductor element 10 in the X-axis direction (mm) P _WD : Width of the semiconductor element 10 in the X-axis direction (Number of dots), and the operator sets P _W and P _WD in advance.

The distance x _P (number of pulses) from the reference point 12 to the provisional center point in the X-axis direction is Therefore, from the state of FIG. 2 (a), x _P (pulse number)
Only by moving the stage 1 to the right or left, a temporary center point in the X-axis direction can be set.

Next, how to find the temporary θ origin will be described.

As shown in FIG. 2A, two points separated by a distance y _dθ (the number of dots) from the reference point 12 on the reference Y-axis 14 are set.

The inclination dθ of the semiconductor element 10 is x _dθ = x _θ1 −x _θ2 (the number of dots) dθ = tan ⁻¹ (x _dθ / y _dθ ) x _θ1 , x _θ2 : y _dθ
Distance to the left side of 10 (number of dots) The number of pulses θ _P to the temporary θ origin of the semiconductor element 10 is θ _P = dθ / Pθ _P (the number of pulses) Pθ _P : An angle per pulse of the rotation pulse motor Therefore, a temporary θ origin can be obtained by rotating the reference point 12 by θ _{P to the} right or left by the rotation pulse motor.

Next, how to obtain the correct θ origin will be described.

As shown in FIG. 3 (a), upper and lower lines 16a, 16b (shown in FIG. 2 (a)) separated by a distance y _D (number of dots) on both sides of the reference point 12 on the reference Y-axis 14. Detection frames 15a and 15b may be used).

The upper side of the semiconductor element 10 is aligned with the upper line 16a and then moved to align with the lower line 16b.

The number of pulses of the pulse motor at this time is set to y _DP, and then the stage 1 is moved as shown in FIGS. 2 (b) and 2 (c).

Y _P : Number of pulses in the y-axis direction when moving from FIG. 2 (b) to FIG. 2 (c) At this time, y _Δθ : Y moved from FIG. 2 (b) to FIG. 2 (c)
When the axial distance (number of dots), FIG. 3 (a), (b) from _{y Δθ = Y P × y D} / y DP) x Δθ = x θ3 -x θ4 Δθ = tan -1 (x Δθ / y _Δθ ). Number of pulses P given to the rotary pulse motor
_Δθ is P _Δθ = Δθ / P _θP (number of pulses) Therefore, the correct correction of the θ origin is completed by rotating the stage 1 rightward or leftward about the reference point 12 by P _Δθ (pulse).

Next, how to obtain the center point in the M-axis direction will be described.

P _YC : The number of pulses of the pulse motor required to move the stage 1 in the Y direction by 1 mm (pulses / mm) P _YW : The dimension of the semiconductor element 10 in the Y-axis direction (mm) P _YD : The Y-axis direction of the semiconductor element 10 _Let P _YD = P _YW × (P _YC × y _D / y _DP ). Here, P _YW is input first.

The distance y _CP (the number of pulses) from the reference point 12 to the center point in the Y-axis direction of the semiconductor element 10 in FIG. 2 (c) is y _CP = (P _YD / 2−y ₁ ) ÷ (y _D / y _DP ). Therefore, the center point in the Y-axis direction can be obtained by moving the stage 1 downward by y _CP (the number of pulses) from the state of FIG. 2 (c).

Then, when the center in the Y-axis direction is obtained, the same calculation is repeated again according to the method for obtaining the temporary center point in the Z-axis direction that is obtained first, so that the correct center point in the X-axis direction can be obtained. it can.

〔The invention's effect〕

As described above, according to the present invention, the magnification of the TV camera is increased so that the counting error of the number of dots in the short side direction becomes small even if the semiconductor element extends out of the imaging range, and the reference point, the reference X axis, and the reference Y are increased. With the configuration in which the position and the inclination of the semiconductor element with respect to the axis are calculated and corrected, the width of the short side of the elongated semiconductor element can be sufficiently expanded and corrected, so that there is no recognition error and accurate positioning is possible. There is an effect that can be done.

[Brief description of drawings]

FIG. 1 is a block diagram showing an embodiment of the present invention, and FIGS. 2 (a) to (c) and FIGS. 3 (a) and (b) are position corrections of the embodiment shown in FIG. 1, respectively. On the monitor screen for explaining the operation of FIG. 4, FIG. 4 is a block diagram showing an example of a conventional semiconductor element recognition device, and FIG. 5 is position correction of the semiconductor element recognition device shown in FIG. 5 is a video diagram on the screen of the monitor unit for explaining the operation of FIG. 1 ... stage, 2 ... illumination part, 3,3a ... TV camera, 4,
4a: arithmetic control unit 5, 5a: stage drive unit, 6 ... monitor unit, 10 ... semiconductor element, 11 ... imaging range, 12 ... reference point, 13 ... reference X axis, 14 ... reference Y axis.

Claims (1)

[Claims] 1. A stage on which a semiconductor element is mounted, and a preset reference point and a reference X-axis intersecting at this reference point, which can rotate and move in the X-axis and Y-direction with respect to the reference Y-axis, and a stage on this stage. A TV camera that picks up an image signal of a semiconductor element at a predetermined magnification including a magnification until the portion of the semiconductor element extends out of the image pickup range, and outputs an image signal;
The number of dots in the axial and Y-axis directions is converted to the reference X-axis at a plurality of positions of the semiconductor element, the number of dots with respect to the reference Y-axis, and stage drive information, and the relative position and the reference X of the semiconductor element with respect to the reference point. Axis, a calculation control section for calculating a tilt with respect to a reference Y-axis and outputting a correction signal, and a stage for inputting the correction signal to move and rotate the stage in the X-axis and Y-axis directions and output the stage drive information A semiconductor element recognizing device having a driving unit.