JPH0772359B2 - Multi-strand electric wire production equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial application] The present invention relates to a multi-strand electroplated wire manufacturing apparatus for electroplating a wire to be plated with solder, nickel, zinc or the like, and in particular,
The present invention relates to a multi-layer electroplated wire manufacturing apparatus in which the plating thickness is kept constant and the speed is increased to improve productivity.

[Conventional technology]

As a conventional electroplating wire manufacturing apparatus, for example, the actual Kaisho 58
-61466 or Japanese Utility Model Laid-Open No. 54-2715. In the electroplating wire manufacturing apparatus according to Japanese Utility Model Laid-Open No. 58-61466, at least two plating tanks are arranged side by side in two stages, an intermediate feeding roll is placed in the middle of the plating bath, and two feeding rolls are sandwiched between them. However, the wire to be plated comes into contact with the intermediate power supply roll when traveling between both power supply rolls. The intermediate power feeding roll is movable in the vertical direction, thereby adjusting the contact with the wire to be plated to obtain an appropriate current distribution in the plating bath. Further, in the electroplating wire manufacturing apparatus according to Japanese Utility Model Laid-Open No. 54-2715, a pair of rotatable drums are arranged in parallel so as to face each other, and plating tanks are provided between the drums in two upper and lower stages. The wire to be plated is wound multiple times and passed around, and the wire is made to sequentially pass through the plating tank alternately by the rotational force of the drum, and the current for plating is supplied to the wire through each drum. It has become.

Further, FIG. 3 shows a conventional multi-layer electroplated wire manufacturing apparatus, where 1 is a plating DC power source, 2 is a solder plating tank, 3 is an electrode plate, 4 is a plating storage tank, 5 is a wire to be plated,
6 is an electrode pulley.

In the above-mentioned configuration, when a plurality of wire rods 5 to be plated are made to run through the plating tank 2 with a negative DC voltage applied to the electrode pulley 6 and a positive DC voltage applied to the electrode plate 3 from the plating DC current 1, a medium of the plating solution is obtained. A current flows from the electrode plate 3 to each wire 5 to be plated, and the wire 5 to be plated is solder-plated.

[Problems to be solved by the invention]

However, according to the electroplating wire manufacturing apparatuses described in both of the above publications, the wire to be plated is wound around the common power supply roll or the rotating drum a plurality of times, and the wire diameter is gradually increased depending on the plating thickness. And line slippage, size reduction such as diameter reduction, etc. occur on the power supply roll or rotating drum. Further, according to the electroplating wire manufacturing apparatus of FIG. 3, since many wires to be plated are passed through one plating tank, the current density is different between the two lines at the center of the wire and the plating thickness is 1.5 times different. In some cases, the quality cannot be stabilized. Therefore, if one wire to be plated is manufactured so as to satisfy a certain plating thickness standard, there is a disadvantage that the plating metal is excessively adhered to another wire to be plated. Further, if one of several wires is broken, it will be entangled in another wire, current will be concentrated in another wire, and the plating layer of that wire will become thick, so that uniform quality cannot be maintained. Further, due to the above-mentioned current density, only a wire having the same wire diameter can be hung, and a wire having a special wire diameter has a poor efficiency of being plated alone.
In addition, in order to control the current one by one, the turn method becomes difficult due to the space limitation, and if the straight method is adopted, there is a disadvantage that the immersion length of the plating part is limited and the speed cannot be increased. It was

[Means for solving problems]

The present invention has been made in view of the above, the plating thickness of each plated wire does not differ even if the electroplating is performed with multiple wires, and many wires with the same wire diameter such as a special wire diameter also have multiple wires. In order to be able to achieve high speed plating, separate plating tanks that share the plating solution storage tank,
A DC power source is connected to the electrode plate and electrode pulley that are unique to each plating tank, and the wire to be plated is U-turned in the same plating tank by the turn pulley to repeat the underpass running. A wire manufacturing apparatus is provided.

That is, the multi-layer electroplated wire manufacturing apparatus of the present invention comprises the following means.

(1) Plating tank A plating solution that allows the wire to be plated to run through is stored, and a positive potential of a DC power source is applied to the wire to be plated with solder, nickel, zinc, etc. It is a tank to apply. This plating tank is divided into a plurality according to the number of wires to be plated, and the overflowing plating solution in each tank is returned to the common plating storage tank.

(2) Turn pulley (when making a U-turn) It is a roll that freely rotates so as to float based on the linear speed of the wire to be plated and repeatedly runs through the wire to be plated. This turn pulley is installed across each plating tank. For example, in order to make one turn, there are two on one side and one on the other side. Repeatedly drive underwater. this is,
For example, if it is made of high-density polyethylene or the like, the plated wire will not be damaged.

(3) DC power supply A positive potential is applied to the electrode plates uniquely provided in a plurality of plating tanks, and a negative potential is applied to the electrode pulleys, and the wire to be plated is plated with solder, nickel, zinc or the like through a medium of a plating solution. As described above, the plating tank is divided into a plurality of parts, and in this case, a plurality of electrode plates and electrode pulleys are provided according to the number of plating tanks.

[Action]

With the above configuration, the plurality of wires to be plated run underway in each of the separated plating tanks, and after leaving the plating tank, make a U-turn by the first turn pulley, and run idle on the plating tank. Further, it makes a U-turn by the second turn pulley, and runs again through the plating tank. At this time, a DC power source is applied by the electrode plates installed in each plating tank and the respective electrode pulleys to apply solder, nickel, zinc or the like to the plated wire.

〔Example〕

Hereinafter, the multi-layer electroplated wire manufacturing apparatus of the present invention will be described in detail.

FIGS. 1 (a) and 1 (b) show an example of a multi-piece electroplating apparatus (however, this does not correspond to the embodiment of the present invention), in which a plurality of independent plating tanks 2 in which a wire 5 to be plated is run in a latent manner.
An electrode plate 3 to which a positive potential is applied from a plating DC power source 1, a plating storage tank 4 for receiving a plating solution overflowing from a plating tank 2, and a wire 5 to be plated to be plated in the plating tank 2, and It is composed of an electrode pulley 6 to which a negative potential is applied from the plating DC power source 1. In other words, the plating tank 2 divided into a plurality is provided with the unique electrode plate 3, and the electrode pulleys 6 are also installed according to the number of the plating tanks 2 separated. A DC power source is individually connected to the electrode plate 3 and the electrode pulley 6. Therefore, even if one line stops, the other lines are not affected. Reference numerals 11, 12, and 13 are guide pulleys.

In the above configuration, when a plurality of wires 5 to be plated are individually passed through the plating tank 2 separated into a plurality of wires 5 to be plated, the plating DC power supply 1 plus the electrode plate 3 and the electrode pulley 6 Since the negative potential is applied, the plated wire 5 is solder-plated through the medium of the plating solution. After the solder-plated wire 5 comes out of the plating bath 2, the guide pulley 12, the electrode pulley 6, the guide pulley
It may be put into another plating tank 2A arranged in series via 13 or may be wound after undergoing a post-treatment.

FIGS. 2 (a), (b), and (c) show an embodiment of the present invention, in which turn pulleys 7a, 7b, 7c for making U-turns of the wire 5 to be plated are provided on both sides of the plating tank 2, This is different from the above example. The turn pulleys 7a, 7b, 7c are free with respect to the motor shaft 14.

In the above structure, the plurality of wire rods 5 to be plated run through the plating tank 2 separated into a plurality of pieces, and the first turn pulley
It makes a U-turn by 7a and runs over the plating tank 2. The idle run of the plated wire makes a U-turn by the second turn pulley 7b provided on the opposite side, runs through the plating tank 2 again and is solder-plated. As described above, the length of the tank is doubled by repeating the submerged running, the productivity is doubled, and the speed can be increased. Also, the turn pulley 6 is made of NULIGHT (high-density polyethylene) so as not to damage it. According to these examples, the precision of the plating thickness becomes a set value ± 0.5 μm, and since the plating operation can be controlled independently, it is possible to realize an apparatus with less scrap lines and a yield of 98%. Further, the present invention is applicable not only to solder plating but also to other plating, such as not only round wire but also square wire, strip, and the like. The first
In the example, the number of hooks is 10 and the plated wire is 0.4
~ 1.0mmφ, solder plating thickness 3 ~ 10μm, speed 10 ~ 50m
/ min, solder plating composition Sn35 ± 5%, Pb65 ± 5 %, the plating solution component was硼弗product of _{(Sn (BF 4) 2,} Pb (BF 4) 2, HBF 4). Further, in the second embodiment, except that the solder plating thickness is 3 to 15 μm and the speed is 10 to 10 m / min,
It is common to the first embodiment. Further, the entire apparatus has a total length of 50 m including the sending section, the pretreatment section, the plating section, the posttreatment section, and the winding section.

〔The invention's effect〕

As described above, according to the multi-layer electroplated wire manufacturing apparatus of the present invention, the plating tank is divided into a plurality of parts, and each plating tank is provided with its own electrode plate and electrode pulley. A DC power supply was connected to the pulley, and the wire to be plated was made a U-turn in the same plating tank by the turn pulley, so that the latent running was repeated. There is no difference, and it is possible to hang a large number of non-uniform wire diameters, such as special wire diameters, and to perform high-speed plating.

[Brief description of drawings]

1 (a) and 1 (b) show an example of a multi-layer electroplating wire manufacturing apparatus, FIG. 1 (a) is a side view, and FIG. 1 (b) is a plan view. 2 (a), (b), and (c) show one embodiment of the present invention, FIG. 2 (a) is a side view, FIG. 2 (b) is a plan view, and FIG. 2 (c). Is an explanatory view showing a turn pulley. FIG. 3 is an explanatory view showing a conventional multi-layer electroplated wire manufacturing apparatus. Explanation of symbols 1 ... Plating DC power supply 2 ... Plating tank, 3 ... Electrode plate 4 ... Plating tank, 5 ... Wire to be plated 6 ... Electrode pulley, 7a, 7b, 7c ... Turn pulley 11, 12, 13 …… Guide pulley

Claims (1)

[Claims] 1. An electroplating wire manufacturing apparatus for electroplating a wire material to be plated with solder, nickel, zinc or the like, which has a common plating solution storage tank and a unique electrode plate, wherein a plurality of said wire materials to be plated are provided. Between a plurality of separated plating baths for electroplating with multiple hangings, an electrode pulley installed according to the number of the plating baths separated into the plurality, on which the wire to be plated is stretched, and the individual electrode plate A plurality of separate plating tanks having a DC power supply connected between them make U-turns of the wire to be plated in the same plating tank, respectively, and a free pulley that idles and rotates according to the speed. An apparatus for producing a multi-layer electroplated wire, which has a configuration having the above.