JPH076988A - Substrate transfer apparatus - Google Patents

Abstract

PURPOSE:To provide a substrate transfer apparatus which is able to transfer a wafer surely holding it without causing any damage. CONSTITUTION:In a substrate transfer device which transfers a semiconductor wafer W holding it by the edge with a holding groove 27 provided to the holding rod 26 of a wafer chuck 20, at least either of the two side walls of the holding groove 27 provided to the holding rod 26 of the wafer chuck 20 is formed of an elastically deformable flexible member 26. A compressed air introducing room 28 is provided inside the side wall of the groove 27, and the compressed air introducing room 28 is connected to a compressed air supply source 30. By this setup, the side wall of the holding groove 27 is deformed inwards being expanded by the compressed air fed into the compressed air introducing room 28 from the compressed air supply source 30 to hold the edge of a semiconductor wafer W coming into point or line contact with it, so that a wafer W can be transferred as it is held by the edge.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer device.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process, particles such as particles, organic contaminants, metal impurities, etc. adhering to the surface of a semiconductor wafer (hereinafter referred to as a wafer) which is an object to be processed are contaminated or naturally formed on the surface. A cleaning device is used to remove the oxide film and the like. This type of cleaning apparatus is usually loaded by a load mechanism for loading a predetermined number of wafers in a cassette unit, a wafer transfer apparatus for transferring a predetermined number of wafers loaded by the load mechanism, and transferred by this wafer transfer apparatus. It is provided with a plurality of types of cleaning processing tanks arranged so as to collectively clean a plurality of wafers, and an unload mechanism for unloading the wafers cleaned by the cleaning processing tanks.

By the way, in this type of cleaning apparatus, conventionally, a predetermined number of wafers were accommodated in a carrier for carrying in, cleaning processing and unloading wafers. However, the cleaning performance is improved, the apparatus is miniaturized and the cost is reduced. In order to improve the cost reduction and the like, recently, a carrierless method of holding and cleaning a plurality of wafers without using a carrier has been widely adopted. A wafer transfer apparatus used in such a carrierless cleaning apparatus has a wafer chuck or a wafer fork that collectively holds (holds) a predetermined number of wafers when transferring them to the cleaning processing tanks. . In this wafer chuck or the like, a pair of holding rods having a plurality of holding grooves corresponding to the number of wafers to be gripped are arranged at predetermined intervals so that the holding rods can be moved toward and away from each other. It is configured to hold a peripheral portion of the wafer and hold a plurality of wafers at predetermined intervals.

[0004]

However, in the conventional substrate transfer apparatus of this type, when the peripheral portion of the wafer is held by the holding groove provided on the holding rod of the wafer chuck, the holding groove and the wafer are not separated from each other. Since there is a fixed gap between them and the wafer is not fixed, there is a risk of dropping the wafer during transfer, and damage to the wafer such as scratches and chipping due to vibration etc. However, there is a problem that the generation of particles contaminates the wafer and contaminates the wafer, thereby lowering the product yield.

The present invention has been made in view of the above circumstances, and it is an object of the present invention to provide a substrate transfer apparatus which can surely hold and transfer a substrate without damaging the substrate.

[0006]

In order to achieve the above object, the first substrate transfer device of the present invention transfers the substrate by holding the edge portion of the substrate by the holding groove provided in the holding means. At least one of both side walls of the holding groove of the holding means is formed of an elastically deformable flexible member, and a pressurized fluid introduction space is formed inside the side wall. In addition, the pressurized fluid introduction space is connected to a pressurized fluid supply source.

The second substrate transfer apparatus of the present invention is
Similar to the first substrate transfer device described above, the substrate transfer device that transfers the substrate by holding the edge portion of the substrate in the holding groove provided in the holding means is premised on the substrate transfer device that holds the substrate in the holding groove. It is characterized in that it comprises a fixing means for supporting the free end.

The third substrate transfer device of the present invention is
Like the first and second substrate transfer devices, the holding groove of the holding device is premised on the substrate transfer device that holds the edge portion of the substrate by the holding groove provided in the holding device and transfers the substrate. At least one of the both side walls of the side wall is formed of an elastically deformable flexible member to form a pressurized fluid introduction space inside the side wall, and the pressurized fluid introduction space is provided in the pressurized fluid supply source. And a fixing means for supporting the free end of the substrate held in the holding groove.

In the present invention, as the pressurized fluid supplied from the pressurized fluid supply source into the pressurized fluid introduction space,
For example, pressurized air or an inert gas such as nitrogen, or an inert liquid such as water or alcohol can be used.

The fixing means may have any structure as long as it supports the free end of the substrate held in the holding groove of the holding means, but preferably the fixing means is provided at the edge of the substrate. It is preferable to use a spring member that makes elastic contact or a flexible elastic member that makes elastic contact with the edge of the substrate.

[0011]

According to the substrate transfer apparatus of the present invention configured as described above, at least one of both side walls of the holding groove of the holding means is formed of an elastically deformable flexible member, and the inside of the side wall is formed. By forming a pressurized fluid introduction space in one direction and connecting this pressurized fluid introduction space to a pressurized fluid supply source,
After positioning the substrate in the holding groove, when the pressurized fluid is supplied from the pressurized fluid supply source into the pressurized fluid introduction space, the sidewall of the holding groove bulges inward by the fluid pressure supplied. And presses and supports the edge of the substrate. Therefore, the substrate can be transported to a predetermined place while being surely held.

Further, by supporting the free end portion of the substrate held in the holding groove by a fixing means such as a spring member or a flexible elastic member, the substrate is fixed at two points of the holding groove and the fixing means. The substrate can be held and the substrate can be reliably transported.

Further, the side wall of the holding groove is bulged and deformed by the pressurized fluid to hold the substrate in the holding groove, and the free end of the substrate held in the holding groove is a spring member or a flexible elastic member. By being supported by a fixing means such as the above, the substrate can be held more securely in a fixed state, and the substrate can be transported more reliably.

[0014]

Embodiments of the present invention will be described in detail below with reference to the drawings. Here, a case where the substrate transfer apparatus of the present invention is applied to a semiconductor wafer cleaning apparatus will be described.

As shown in FIG. 1, the semiconductor wafer cleaning apparatus includes a carry-in section 1 for accommodating a semiconductor wafer W (hereinafter referred to as a wafer) which is an unprocessed substrate, and a wafer transfer apparatus which is a substrate transfer apparatus of the present invention. A cleaning processing unit 3 that performs a cleaning process such as a chemical process and a water cleaning process on the wafer W transported by the apparatus 2 and a unloading unit 4 that stores the cleaned wafer W are the main components.

The carrying-in section 1 is a waiting section 6 for a carrier C for accommodating the wafer W, a loader section 5 for taking out the wafer W from the carrier C, aligning the orientation flat, and detecting the single wafer of the wafer W, and the like. The carrier transport arm 7 is provided for transporting the carrier C to the standby unit 6 and transporting the carrier C between the standby unit 6 and the loader unit 5.

A carrier cleaning / drying line 8 for cleaning and drying the empty carrier C after the wafer W is taken out by the wafer transfer device 2 is provided above the cleaning processing unit 3 above the cleaning processing unit 3. Are arranged along. The carrier cleaning / drying line 8 has a lifting mechanism 9
The empty carrier C is configured to be lifted from the loader unit 5 and supplied via the. A similar lifting mechanism (not shown) is also provided on the unloading unit 4 side, and the carrier C after cleaning and drying is supplied to the unloading unit 4 via this lifting mechanism. A treatment liquid tank / pipe region 10 including a tank and a pipe group (not shown) for containing a treatment liquid such as a chemical liquid is provided on the back side of the cleaning treatment unit 3.

On the other hand, the cleaning processing section 3 includes the wafer transfer device 2, a chuck cleaning / drying processing tank 11 for cleaning and drying the wafer chuck 20 of the wafer transfer device 2, and the chuck cleaning / drying processing tank 11. A first chemical cleaning device 12a, which is sequentially disposed on the downstream side and processes unnecessary substances such as organic contaminants, metal impurities or particles on the surface of the wafer W by cleaning, and the wafer W after the chemical processing is rinsed with water 2
Second first and second water washing / cleaning devices 13a, 13b, second chemical liquid treatment different from the first chemical liquid washing device 12a
Chemical cleaning device 12b, two third and fourth water cleaning devices 13c and 13d, a chuck cleaning / drying treatment tank 11 for cleaning and drying the wafer chuck 20, and a wafer W from which impurities have been removed, for example, isopropyl. Alcohol (I
And a drying treatment tank 14 for performing steam drying with PA) or the like. Then, the first and second chemical cleaning devices 12a,
12b and 1st thru | or 4th washing washing | cleaning apparatus 13a-13
In the case of d, the washing treatment liquid overflows, and the overflowing washing treatment liquid is discharged in the case of water washing treatment, and the overflowing washing treatment liquid is circulated in the case of chemical treatment to remove accumulated impurities. It is equipped with a processing tank 15 that is circulated.

Next, the substrate transfer apparatus of the present invention used in the semiconductor wafer cleaning apparatus configured as described above will be described with reference to FIGS.

First Embodiment FIG. 2 is a perspective view of a first embodiment of the substrate transfer apparatus of the present invention,
FIG. 3 is a sectional view showing a main part of the first embodiment before holding the substrate, and FIG. 4 is a sectional view showing a holding state of the substrate.

The substrate transfer apparatus of the present invention, that is, the wafer transfer apparatus 2 is a wafer chuck 20 which is a holding means for holding, for example, 50 wafers W at a time, and the wafer chuck 20 in the horizontal direction (X, Y directions). And up and down direction (Z
Drive mechanism 21 for moving in the direction) and a plurality of processing tanks 15
And a transport path 22 disposed along the transport path 22 and configured to reciprocate along the transport path 22. A bellows 23 is attached between the wafer chuck 20 and the driving mechanism 21 to prevent particles generated inside from scattering to the outside.

As shown in FIG. 2, the wafer chuck 20 has two rotary arms 24 that horizontally project from the main body of the wafer transfer device 2 and that can rotate in the horizontal direction, and the two lower ends of the rotary arms 24. And two holding rods that are provided between the brackets 25 and 25 and that are provided between the brackets 25 and 25 and that hold the wafer W in a row at appropriate intervals. 26, and is configured to be able to hold the edge portion of the wafer W in the holding groove by moving the rotary arms 24, 24 in and out by the drive of the drive mechanism 21.

In this case, as shown in FIGS. 3 and 4, the holding rod 26 has a holding rod main body 26a having corrosion resistance and rigidity such as quartz and a holding groove 27, for example, polyether ether ketone (PEEK). ), Fluorine resin or resin such as vinyl chloride, nylon, polyethylene, polypropylene, Kalrez (trade name), rubber such as silicon rubber, and further elastic deformation of inorganic materials such as silicon carbide, silicon nitride, alumina and zirconia Flexible member 26b
The pressurizing air introducing space 28 is formed inside the side wall forming the holding groove 27, and the pressurizing air introducing space 28 is provided longitudinally through the center of the holding rod body 26a. In addition to being connected to the pressurized air introduction path 29, it is also connected to a pressurized air supply source 30 such as a compressor or an air cylinder via an opening / closing valve 31.

The wafer chuck 20 having the above structure
In the above, when the opening / closing valve 31 is opened and the pressurized air is introduced from the pressurized air supply source 30 into the pressurized air introducing passage 29, the pressurized air introduced into the pressurized air introducing passage 29 becomes the pressurized air introducing space 28. Is supplied to the inside of the holding groove 27 and the side wall of the holding groove 27 is bulged toward the inside of the holding groove to press and hold the edge portion of the wafer W in a point or line contact state. It is possible to prevent the wafer W from rattling or dropping.

In the above description, the case where the pressurized air introducing space 28 is formed inside the side walls forming the holding groove 27 has been described, but the pressurized air is not necessarily formed inside the side walls of the holding groove 27. It is not necessary to provide the introduction space 28, and if the pressurized air introduction space 28 is formed inside at least one of the side walls, the wafer W is reliably held in the holding groove 27 by the bulging displacement of the side wall as described above. can do.

Second Embodiment FIG. 5 is a perspective view of a second embodiment of the substrate transfer apparatus according to the present invention,
FIG. 6 is a perspective view of the substrate fixing means in the second embodiment, and FIG.
FIG. 8 is a plan view of an essential part of the substrate holding state in the second embodiment, and FIG. 8 is a side sectional view of an essential part of the substrate holding state in the second embodiment.

The substrate transfer apparatus in the second embodiment is a case where the substrate transfer apparatus in the second embodiment is provided with a fixing means for supporting the free end portion of the substrate in addition to the holding means. That is, the fixing means 40 is provided with a quartz support rod 41 that is installed above the holding rod 26 between the brackets 25, 25 of the wafer chuck 20, and is projected from the support rod 41 at appropriate intervals. Quartz, silicon carbide, silicon nitride,
Inorganic materials such as alumina, zirconia and diamond, fluororesins, vinyl chloride, polyether ether ketone (PEEK), nylon, polyethylene and other resins, or metals such as stainless steel and aluminum are coated with the above inorganic materials or resins. This is a case where it is configured with a fin-shaped spring member 42 having elasticity such as a material. In this case, by bending the tip of the spring member 42, the contact between the spring member 42 and the wafer edge can be made into a point or line contact, and damage to the wafer surface due to the contact can be reduced. With this configuration, when the wafer W is held, the edge of the wafer W is held in the holding groove 27 of the holding rod 26 and the fixing means 4 is provided.
The wafer W can be transferred by supporting the free end portion of the wafer W by each spring member 42 of 0.

In the second embodiment, the holding rod 26
As shown in FIG. 8, at least the surface of the holding groove of the holding rod body 26a made of quartz has polyether ether ketone (PEEK) or polytetrafluoroethylene (PTF).
E) or a chemical-resistant and heat-resistant resin layer 26 having a surface hardness lower than that of a wafer W such as a tetrafluoroethylene-perfluoroalkylvinyl ether copolymer (PFA).
The one coated with c is used. The reason why the surface of the quartz holding rod body 26a is coated with the chemical resistant and heat resistant resin layer 26c such as PEEK in this way is that the strength of the holding rod 26 is maintained and the wafer W is held by the wafer chuck 20. This is to solve problems such as particles and scratches due to chipping during transfer. That is, if the holding rod 26 is made of quartz itself, the strength of the holding rod 26 can be maintained, but when holding the wafer W, chipping may cause scratches on the wafer surface or particles may occur. On the other hand, by coating the surface of the quartz holding rod body 26a with a chemical resistant and heat resistant resin layer 26c such as PEEK,
It is possible to maintain the strength of the holding rod 26 and prevent generation of particles and scratches on the wafer surface.

Since the other parts of the second embodiment are the same as those of the first embodiment, the same parts are designated by the same reference numerals and the description thereof will be omitted.

Third Embodiment FIG. 9 is a perspective view of a substrate fixing means in a third embodiment of the present invention, FIG. 10 is a plan view of a main portion of a substrate holding state in the third embodiment, and FIG. 11 is a third embodiment. The side sectional view of the main part of the holding state of the substrate in the example is shown.

In the substrate transfer apparatus in the third embodiment, similarly to the second embodiment, a quartz support rod 41 is installed above the holding rod 26 between the brackets 25, 25 of the wafer chuck 20, and The wafer supporting portion of the supporting rod 41 is provided with a flexible elastic member 43 such as an airbag.
It is the case of forming in. In this case, the elastic member 43 is made of synthetic resin such as fluororesin or vinyl chloride.

As described above, the elastic member 43 having flexibility at the wafer supporting portion of the supporting rod 41 provided on the wafer chuck 20.
Since the elastic member 43 softly contacts the free end portion of the wafer W held in the holding groove 27 of the holding rod 26 by forming the above, the wafer W is securely fixed without damaging the surface of the wafer W. can do.

Since the other parts of the third embodiment are the same as those of the first and second embodiments, the same parts are designated by the same reference numerals and the description thereof will be omitted.

[Fourth Embodiment] FIG. 12 is a side sectional view showing an essential part of a holding state of a substrate in a fourth embodiment of the present invention. The fourth embodiment is a case where the wafer W, which is a substrate, is securely held and the free end portion of the held wafer W is securely fixed.

That is, as in the first embodiment, the holding rod 26 has a holding rod main body 26a having corrosion resistance and rigidity such as quartz, and a holding groove 27 such as polyether ether ketone (PEEK). A flexible member 26b that is elastically deformable, such as fluororesin or vinyl chloride, and a compressed air introduction space 28 is formed inside the side wall that constitutes the holding groove 27. Two
8 is connected to a pressurized air introducing passage 29 provided longitudinally through the center of the holding rod body 26a, and is also connected to a pressurized air supply source 30 via an opening / closing valve 31. On the other hand, similarly to the third embodiment, the bracket 25 of the wafer chuck 20,
A support rod 41 made of quartz is erected above the holding rod 26 between 25, and a wafer supporting portion of the support rod 41 is a flexible elastic member such as an airbag made of fluororesin or vinyl chloride. This is the case of forming at 43.

As described above, the side wall of the holding groove 27 of the holding rod 26 is elastically deformable toward the inside of the groove, and the wafer supporting portion of the supporting rod 41 is formed by the elastic member 43 having flexibility. Since the edge of the wafer W can be held by point or line contact during transportation and the free end of the held wafer W can be fixed by point or line contact, the wafer W can be securely held in a fixed state. Can be held.

In the fourth embodiment, the elastic member 43
Alternatively, the spring member 42 of the second embodiment can be used.

Next, the operation of the semiconductor wafer cleaning apparatus incorporating the substrate transfer apparatus 2 configured as described above will be described with reference to the substrate transfer apparatus of the first embodiment. First,
When the wafers W stored in the carrier C in units of 25 are supplied to the carry-in unit 1, the carrier transfer arm 7 is driven to transfer the supplied carriers C in units of two to the loader unit 5.
Then, the carrier C supplied thereafter is transferred to the standby unit 6 by the carrier transfer arm 7, and the wafer W of the subsequent carrier C is temporarily stored in the standby unit 6.

When the two carriers C are supplied to the loader unit 5, the loader unit 5 is driven to align the orientation flats of the wafers W in the two carriers C in one direction to form 50 wafers W. While positioning, the wafer transfer device 2 is driven to move the wafer chuck 20 into the chuck cleaning / drying processing bath 11 and is ready to receive the wafer W. Then, the loader unit 5 is driven to drive the two carriers C.
When the wafers W of each carrier C are brought close to each other while the wafers W are collectively lifted from the
The rotation arm 24 is rotated by the driving of No. 1 and the left and right brackets 25 are opened and then approached to hold the wafer W in the holding groove 27 of the holding rod 26. At this time, when the wafer W is inserted into the holding groove 27, the opening / closing valve 31 is opened and the pressurized air is supplied from the pressurized air supply source 30 into the pressurized air introducing space 28 through the pressurized air introducing passage 29. Since the flexible member 26b is supplied and bulges toward the inside of the groove, the wafer W is reliably held in the holding groove 27.

Wafer chuck 20 holding wafer W
Is moved to the first chemical cleaning device 12a along the transfer path 22 by driving the wafer transfer device 2, and then the wafer chuck 20 is lowered at that position to move the first chemical cleaning device 1a.
50 wafers W to the wafer holder in the processing tank 15 of 2a
And is immersed in the cleaning treatment liquid L. When the wafer W is transferred from the wafer chuck 20 to the wafer holder, the opening / closing valve 31 is closed and the supply of the pressurized air from the pressurized air supply source 30 is shut off.

When the cleaning process of the wafer W in the first chemical cleaning device 12a is completed, the wafer chuck 20 of the wafer transfer device 2 collectively receives the wafer W from the wafer holder by the operation reverse to the above. Next, the wafer is transferred to the wafer holder 16 of the first first water cleaning / cleaning apparatus 13a, and the water cleaning processing is performed by the same operation as described above. Further, the same second water cleaning processing is performed by the second second water cleaning / cleaning apparatus 13b. To complete. After that, the chemical solution treatment and the water washing treatment are repeatedly performed as needed, and the wafer W after the washing treatment is discharged to the next step via the carry-out section 4 in a carrier unit.

In the above embodiment, the case where the wafer is held by the wafer chuck has been described as an object, but the present invention is not limited to this, and the same applies when the wafer is held by the wafer fork or the wafer boat. Is applicable to.

Further, in the above embodiment, the case where the substrate transfer apparatus of the present invention is applied to the semiconductor wafer cleaning apparatus has been described, but it can be applied to other cleaning apparatuses such as LCD glass substrates and etching apparatuses. Of course.

[0044]

As described above, since the substrate transfer apparatus of the present invention is constructed as described above, the following effects can be obtained.

1) According to the substrate transfer device of the first aspect, at least one of both side walls of the holding groove of the holding means is formed of an elastically deformable flexible member, and is provided inside the side wall. Since the pressurized fluid introduction space is formed and the pressurized fluid introduction space is connected to the pressurized fluid supply source, the sidewall of the holding groove is bulged inward by the pressurized fluid to press and support the edge of the substrate. Therefore, the substrate can be transported to a predetermined place while being surely held, and the safety and reliability of substrate transportation can be improved.

2) According to the substrate transfer device of the second, fourth, and fifth aspects, the free end portion of the substrate held in the holding groove is fixed by a fixing means such as a spring member or a flexible elastic member. Since it is supported, the substrate can be fixed and held at the two positions of the holding groove and the fixing means, the substrate can be reliably transported, and the safety and reliability of the substrate transportation can be improved.

3) According to the substrate transfer device of the third, fourth and fifth aspects, the side wall of the holding groove is bulged and deformed by the pressurized fluid to hold the substrate in the holding groove, and the substrate is held in the holding groove. Since the free end portion of the substrate is supported by the fixing means such as the spring member or the elastic member having flexibility, the substrate can be more securely held in the fixed state, and the substrate can be transported more reliably. Therefore, the safety and reliability of substrate transportation can be further improved.

[Brief description of drawings]

FIG. 1 is a perspective view showing a semiconductor wafer cleaning apparatus to which a substrate transfer apparatus of the present invention is applied.

FIG. 2 is a perspective view showing a first embodiment of the substrate transfer device of the present invention.

FIG. 3 is a cross-sectional view showing a state before holding a substrate according to the first embodiment.

FIG. 4 is a cross-sectional view showing a substrate holding state of the first embodiment.

FIG. 5 is a perspective view showing a second embodiment of the present invention.

FIG. 6 is a schematic perspective view showing a substrate fixing means in the second embodiment.

FIG. 7 is a main part plan view showing a substrate holding state of a second embodiment.

FIG. 8 is a side sectional view of an essential part showing a substrate holding state of a second embodiment.

FIG. 9 is a schematic perspective view showing a substrate fixing means in a third embodiment of the present invention.

FIG. 10 is a plan view of relevant parts showing a substrate holding state of a third embodiment.

FIG. 11 is a side sectional view of a main portion showing a substrate holding state of a third embodiment.

FIG. 12 is a side sectional view of an essential part showing a substrate holding state of a fourth embodiment of the present invention.

[Explanation of symbols]

 20 wafer chuck (holding means) 26 holding rod 26a holding rod body 26b flexible member 27 holding groove 28 pressurized air introduction space (pressurized fluid introduction space) 30 pressurized air supply source (pressurized fluid supply source) 40 fixed Means 41 Support Rod 42 Spring Member 43 Elastic Member W Semiconductor Wafer (Substrate)

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yukihiro Babamoto 1375 Nishishinmachi 41, Tosu City, Saga 41 Tokyo Electron Kyushu Co., Ltd. Saga Works (72) Inventor Naoki Shindo 1375 Nishishincho 41, Tosu City, Saga 41 Tokyo (72) Inventor Tomooki Onohara 1375 Nishishinmachi, Tosu City, Saga Prefecture 41 Tokyo Electrotron Kyushu Co., Ltd. Saga Works

Claims (5)

[Claims] 1. A substrate transfer device for transferring a substrate by holding an edge of a substrate by a holding groove provided in the holding means, wherein at least one of both side walls of the holding groove of the holding means is elastically deformed. It is formed of a flexible member capable of forming a pressurized fluid introduction space inside the side wall,
A substrate transfer apparatus characterized in that the pressurized fluid introduction space is connected to a pressurized fluid supply source. 2. A substrate carrying device for carrying a substrate by holding an edge portion of a substrate in a holding groove provided in a holding means, and a fixing means for supporting a free end portion of the substrate held in the holding groove. A substrate transfer apparatus comprising: 3. A substrate carrying device for carrying a substrate by holding an edge portion of a substrate by a holding groove provided in a holding means, wherein at least one of both side walls of the holding groove of the holding means is elastically deformed. It is formed of a flexible member capable of forming a pressurized fluid introduction space inside the side wall,
A substrate transfer apparatus comprising: a fixing means for connecting the pressurized fluid introduction space to a pressurized fluid supply source and supporting a free end portion of the substrate held in the holding groove. 4. The substrate transfer apparatus according to claim 2, wherein the fixing means is formed by a spring member that elastically contacts the edge portion of the substrate. 5. The substrate transfer apparatus according to claim 2, wherein the fixing means is formed of a flexible elastic member that elastically contacts the edge of the substrate.