JPH0767932B2 - Carrier tape manufacturing method - Google Patents
Carrier tape manufacturing methodInfo
- Publication number
- JPH0767932B2 JPH0767932B2 JP3263121A JP26312191A JPH0767932B2 JP H0767932 B2 JPH0767932 B2 JP H0767932B2 JP 3263121 A JP3263121 A JP 3263121A JP 26312191 A JP26312191 A JP 26312191A JP H0767932 B2 JPH0767932 B2 JP H0767932B2
- Authority
- JP
- Japan
- Prior art keywords
- carrier tape
- material sheet
- hole
- embossed
- embossing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Containers And Plastic Fillers For Packaging (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は、熱可塑性合成樹脂から
なる材料シートを用いて、エンボス成形による寸法精度
の高い電子部品搬送用キャリアテープの製造方法に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a carrier tape for conveying electronic parts with high dimensional accuracy by embossing using a material sheet made of a thermoplastic synthetic resin.
【０００２】[0002]
【従来の技術】電子部品搬送用キャリアテープの製造方
法として、特開昭６３−２５１１９７号公報に、材料シ
一トに電子部品を収納するエンボス部を真空成形により
形成した後、送り穴をあける方法が、特開平３−１４４
２７号公報に、材料シートの進行方向に沿う両側部領域
を残して加熱しプレス成形によりエンボス部を成形する
方法がそれぞれ提案されている。2. Description of the Related Art As a method for manufacturing a carrier tape for transporting electronic parts, Japanese Patent Laid-Open No. 63-251197 discloses that an embossed part for accommodating an electronic part is formed in a material sheet by vacuum forming . A method of making a sprocket hole is disclosed in Japanese Patent Laid-Open No. 3-144.
In Japanese Patent Publication No. 27, a method is proposed in which both side regions along the traveling direction of the material sheet are heated and the embossed portion is formed by press forming .
【０００３】[0003]
【発明が解決しようとする課題】しかしながら前者で
は、回転ドラムで真空成形されたキャリアテープの、電
子部品収納後に蓋材として使用するカバーテープを熱接
着する部分の平滑性が悪く、キャリアテープからカバー
テープを剥離する時、カバーテープの剥離強度のバラツ
キが大きくなり、セラミックコンデンサーやチップ抵抗
などの極小チップ部品が跳びはねるような問題があり、
また、次工程で送り穴をあけるため、エンボス部と送り
穴との位置精度が悪く、電子部品のキャリアテープから
基板などへの実装効率が低下するという不利があった。
後者は、プレス成形にあたり材料シートの両面を直接ヒ
ー夕ーで加熱するため、材料シートがヒーターに融着し
てシートが切れたり、キャリアテープの成形中、シート
の両面部が冷却されていないので伸されて、シートの幅
が部分的にくびれて狭くなり、次工程で送り穴をあける
部分がなくなるなどの問題があるほか、前者同様カバー
テープを熱融着する部分の平滑性やエンボス部成形後送
り穴をあけるため位置精度が悪くなる欠点があった。However, in the former case, the smoothness of the portion of the carrier tape vacuum-formed on the rotary drum, which is heat-bonded to the cover tape used as the lid material after storing the electronic components, is poor, and the carrier tape is covered.
When peeling off the tape, variations in the peel strength of the cover tape is increased, there are problems as tiny chip components such as a ceramic capacitor or a chip resistor splashing jump,
In addition, since the feed hole is opened in the next process, the positional accuracy of the embossed part and the feed hole is poor, and the carrier tape of the electronic component
However, there is a disadvantage that the mounting efficiency on the board is reduced.
Since the latter heats both sides of the material sheet directly by heating during press molding, the material sheet is fused to the heater and cuts, or the sheet is cut during carrier tape molding.
Since both sides of the sheet are not cooled, it is stretched and the width of the sheet
Part is narrowed and narrowed, and a sprouting hole is opened in the next process
There are problems such as missing parts, and the same cover as the former
Smoothness and embossed portions forming after feed holes for positional accuracy of the portion to thermally fuse the tape had adversely Kunar drawbacks.
【０００４】さらにこれら従来の方法では、エンボス部
を正確に成形するためにプレス雄型と雌型の間に材料シ
ートを完全に挟み込んで成形するので、電子部品の寸法
（高さ）に変更があった場合は、その寸法に適応したプ
レス雄型と雌型を新しく製作する必要があってコスト高
となることを避けることはできなかった。Further, in these conventional methods, in order to accurately form the embossed portion, the material sheet is completely sandwiched between the press male mold and the female mold, and therefore the dimensions (height) of the electronic component can be changed. In that case, it was inevitable that the press male and female molds adapted to the dimensions would have to be newly manufactured, resulting in high cost.
【０００５】[0005]
【課題を解決するための手段】本発明は前記課題を解決
するもので、これは熱可塑性合成樹脂からなる材料シー
トをエンボス成形してキャリアテープを製造するにあた
り、熱遮蔽板と強制冷却された中板との間を通る材料シ
ートのエンボス部が形成される部分のみを熱遮蔽板に設
けた開口をとおしてヒーターにより放射加熱し、それ以
外の部分を冷却し、プレスピストンと送り穴あけピンと
を備えた雄型およびピストン孔とピン孔とを備えた雌型
によりエンボス成形すると同時に送り穴をあけ、所定長
ずつ間欠移動させることを特徴とするキャリアテープの
製造方法を要旨とするものである。SUMMARY OF THE INVENTION The present invention is to solve the above-mentioned problems, in which a sheet of material made of thermoplastic synthetic resin was embossed to produce a carrier tape, which was forcibly cooled with a heat shield plate. Only the part where the embossed part of the material sheet that passes between the intermediate plate and the intermediate plate is formed is radiantly heated by the heater through the opening provided in the heat shield plate, and the other part is cooled, and the press piston and the feed hole drilling pin are
With a male hole and with a piston hole and a pin hole
The gist of the present invention is to provide a method of manufacturing a carrier tape, characterized in that the feed hole is formed at the same time as the embossing by, and intermittent movement is performed by a predetermined length.
【０００６】以下図を用いて本発明を説明する。図１
（ａ）は本発明を実施する装置の一例の全体説明図、
（ｂ）はその装置の中の加熱機、（ｃ）はプレス成形機
の詳細を示す縦断面図、（ｄ）は本発明により製造され
たキャリアテープの斜視図である。この装置の送り出し
用ローラー１より送り出された熱可塑性合成樹脂からな
る材料シート２は、まず加熱機３のヒーター４の下に位
置するニッケルメッキされた熱遮蔽板５と中板６の間の
隙間７に入る。熱遮蔽板５は、材料シート２に成形する
エンボス部８に対する位置に開口９を有し、材料シート
２の両側部１０を挟んで中板６と密着している。中板６
は冷却媒体還送路１１によって冷却されているので、材
料シート２の両側部１０およびエンボス部８を結ぶ連結
部１２は冷却され、エンボス部８が成形される部分のみ
が加熱され他は十分低温に保たれる。The present invention will be described below with reference to the drawings. Figure 1
(A) is an overall explanatory view of an example of an apparatus for carrying out the present invention,
(B) is a longitudinal sectional view showing the details of a heating machine in the apparatus, (c) is a press molding machine, and (d) is a perspective view of a carrier tape manufactured according to the present invention. The material sheet 2 made of thermoplastic synthetic resin sent out from the sending roller 1 of this device is firstly provided with a gap between the nickel-plated heat shield plate 5 and the middle plate 6 located below the heater 4 of the heater 3. Enter 7. The heat shield plate 5 has an opening 9 at a position corresponding to the embossed portion 8 formed on the material sheet 2, and is in close contact with the intermediate plate 6 with both side portions 10 of the material sheet 2 sandwiched therebetween. Middle plate 6
Is cooled by the cooling medium return passage 11, the side portions 10 of the material sheet 2 and the connecting portion 12 connecting the embossed portion 8 are cooled, only the portion where the embossed portion 8 is molded is heated, and the other is sufficiently low temperature. Kept in.
【０００７】つぎに材料シート２はエンボス部がエンボ
ス成形されるが、エンボス成形としては、プレス成形、
真空成形、圧空成形、真空圧空成形などが挙げられ、こ
れらの中でプレス成形が好ましく用いられる。そしてエ
ンボス成形について説明すると、エンボス部８が成形さ
れる部分のみが加熱された材料シート２は、プレス成形
機１３に入るが、これは雄型１４と雌型１５よりなり、
雄型１４はエンボス部を成形するプレスピストン１６と
送り穴１７をあける送り穴あけピン１８を備え、雌型１
３にはプレスピストン１６が嵌合するピストン孔１９と
送り穴あけピン１８に嵌合するピン孔２０が設けられ、
ピストン孔１９の底部にはエンボス部成形後材料シート
２を押し出す突き出し棒２１を有す。しかしてプレスピ
ストン１６には、プレス成形時に雄型１４と材料シート
２の面に回り込む空気によってエンボス部８が膨らむの
を防ぎ、雄型と材料シートの密着性を良くしてエンボス
部を正確に成形するため、直径１ｍｍ程度の空気逃がし
穴２２が設けられている。ついで材料シート２は、間欠
送り出し装置２３に入るが、ここでは材料シートの両側
部１０をクランプしてエアフィーダー２４で所定長ずつ
間欠移送してプレス成形を繰り返す。Next, the embossed portion of the material sheet 2 is embossed.
As the embossing, press molding,
Examples include vacuum forming, pressure forming, and vacuum forming.
Of these, press molding is preferably used. And d
The embossed portion 8 will be molded.
The material sheet 2 whose only heated portion is heated enters the press molding machine 13, which comprises a male mold 14 and a female mold 15.
The male die 14 includes a press piston 16 for forming an embossed portion and a feed hole drilling pin 18 for forming a feed hole 17,
3 is provided with a piston hole 19 into which the press piston 16 fits and a pin hole 20 into which the feed hole drilling pin 18 fits,
At the bottom of the piston hole 19, there is a protruding rod 21 for pushing out the material sheet 2 after forming the embossed portion. Therefore, the press piston 16 prevents the embossed portion 8 from swelling by the air that flows around the surface of the male die 14 and the material sheet 2 during press molding, and improves the adhesion between the male die and the material sheet to accurately form the embossed portion. For molding, an air escape hole 22 having a diameter of about 1 mm is provided. Next, the material sheet 2 enters the intermittent feeding device 23. Here, both side portions 10 of the material sheet are clamped and intermittently transferred by the air feeder 24 by a predetermined length, and press molding is repeated.
【０００８】本発明で得られるキャリアテープは、熱可
塑性合成樹脂のポリスチレン，ポリ塩化ビニル，ポリカ
ーボネート，ポリエチレンテレフタレートなどの材料シ
ートを使用し、キャリアテープを安定的に連続して成形
し、ＪＩＳ規格で定められている各種寸法を十分満足す
るような精度を得た。また材料シートのエンボス部が成
形される部分のみを加熱、電子部品収納後に蓋材として
使用するカバーテープが熱接着される部分は非加熱領域
となり、十分な平滑性をもつため、安定したカバーテー
プの剥離強度２０〜７０ｇｆ／ｍｍを得ることができ
た。The carrier tape obtained in the present invention uses a material sheet of thermoplastic synthetic resin such as polystyrene, polyvinyl chloride, polycarbonate, polyethylene terephthalate, etc., and the carrier tape is stably and continuously molded according to JIS standard. We have obtained the accuracy that is sufficient to satisfy the specified dimensions. Also, only the portion of the material sheet where the embossed portion is formed is heated, and the portion to which the cover tape used as a lid material after the electronic components are heat-bonded is a non-heated area and has sufficient smoothness. It was possible to obtain a stable peel strength of the cover tape of 20 to 70 gf / mm.
【０００９】[0009]
【実施例】（実施例１） 厚みが０．３ｍｍのポリスチレンシートをヒーター設定
温度６００℃、冷却媒体温度１８℃、成形サイクル１秒
／回、金型取り数２０個、間欠送り量８０ｍｍ／回の条
件で、エンボス深さ３ｍｍのキャリアテープを成形した
ところ、安定したキャリアテープを製造することができ
た。 （実施例２） 厚みが０．４ｍｍのポリスチレンシートをヒーター設定
温度６５０℃、他は実施例１と同じ条件で、エンボス深
さ５ｍｍのキャリアテープを成形したところ、安定した
キャリアテープを製造することができた。 （実施例３） 厚みが０．３ｍｍのポリ塩化ビニルシートを、実施例１
と同じ条件で、エンボス深さ３ｍｍのキャリアテープを
成形したところ、安定したキャリアテープを製造するこ
とができた。[Example] (Example 1) A polystyrene sheet having a thickness of 0.3 mm was set at a heater temperature of 600 ° C, a cooling medium temperature of 18 ° C, a molding cycle of 1 second / time, a die number of 20, and an intermittent feed amount of 80 mm / time. When a carrier tape having an embossing depth of 3 mm was molded under the conditions described above, a stable carrier tape could be manufactured. Example 2 A polystyrene sheet having a thickness of 0.4 mm was molded into a carrier tape having an emboss depth of 5 mm under the same conditions as in Example 1 except that the heater set temperature was 650 ° C., and a stable carrier tape was produced. I was able to. (Example 3) A polyvinyl chloride sheet having a thickness of 0.3 mm was prepared as in Example 1.
When a carrier tape having an embossing depth of 3 mm was molded under the same conditions as above, a stable carrier tape could be manufactured.
【００１０】[0010]
【発明の効果】本発明では、材料シートのエンボス部を
成形する部分のみを加熱し、エンボス部成形と送り穴あ
けを一組の雌型、雄型で同時に行うため、従来のような
エンボス部成形の次工程で穴あけしたキャリアテープよ
りも高い位置精度が得られる。また電子部品の高さが変
わりエンボス部の深さが変動しても、プレスピストンの
雌型への押し込み量を変えるだけでよいから、同じ金型
で電子部品の高さに適合した深さのエンボス部の成形が
可能となった。According to the present invention, only the portion of the material sheet where the embossed portion is formed is heated, and the embossed portion formation and the perforation hole formation are simultaneously performed by one set of female die and male die. Higher positional accuracy can be obtained than the carrier tape punched in the next step. Also, even if the height of the electronic component changes and the depth of the embossed portion changes, it is only necessary to change the pushing amount of the press piston into the female die, so the same die can be used to adjust the depth to match the height of the electronic component. The embossed part can be molded.
【図１】（ａ）は本発明を行う装置の説明用全体図、
（ｂ）は加熱機の縦断面図、（ｃ）はプレス成形機の縦
断面図、（ｄ）は本発明により製造されたキャリアテー
プの斜視図である。FIG. 1 (a) is an overall view for explaining an apparatus for carrying out the present invention,
(B) is a longitudinal sectional view of a heating machine, (c) is a longitudinal sectional view of a press molding machine, and (d) is a perspective view of a carrier tape manufactured by the present invention.
１ 送り出し用ローラー ２ 材料シート ３ 加熱機 ４ ヒーター ５ 熱遮蔽板 ６ 中板 ７ 隙間 ８ エンボス部 ９ 開口 １０ 両側部 １１ 冷却媒体還送路 １２ 連結部 １３ プレス成形機 １４ 雄型 １５ 雌型 １６ プレスピストン １７ 送り穴 １８ 送り穴あけピン １９ ピストン孔 ２０ ピン孔 ２１ 突き出し棒 ２２ 空気逃がし穴 ２３ 間欠送り出し装置 ２４ エアーフィーダー 1 Feeding Roller 2 Material Sheet 3 Heater 4 Heater 5 Heat Shielding Plate 6 Middle Plate 7 Gap 8 Embossing 9 Opening 10 Both Sides 11 Cooling Medium Return Channel 12 Connection 13 Press Forming Machine 14 Male 15 Female 16 Press Piston 17 Feed hole 18 Feed hole drilling pin 19 Piston hole 20 Pin hole 21 Extruding rod 22 Air escape hole 23 Intermittent feeding device 24 Air feeder
フロントページの続き (72)発明者 工藤 重和 東京都中央区日本橋本町四丁目３番５号 信越ポリマー株式会社 本社内 (56)参考文献 特開 平３−289421（ＪＰ，Ａ)Front page continuation (72) Inventor Shigekazu Kudo 4-3-5 Nihonbashihonmachi, Chuo-ku, Tokyo Shin-Etsu Polymer Co., Ltd. Head office (56) Reference JP-A-3-289421 (JP, A)
Claims (1)
エンボス成形してキャリアテープを製造するにあたり、
熱遮蔽板と強制冷却された中板との間を通る材料シート
のエンボス部が形成される部分のみを熱遮蔽板に設けた
開口をとおしてヒーターにより放射加熱し、それ以外の
部分を冷却し、プレスピストンと送り穴あけピンとを備
えた雄型およびピストン孔とピン孔とを備えた雌型によ
りエンボス成形すると同時に送り穴をあけ、所定長ずつ
間欠移動させることを特徴とするキャリアテープの製造
方法。1. A material sheet made of thermoplastic synthetic resin
When manufacturing a carrier tape by embossing ,
Only the part where the embossed part of the material sheet that passes between the heat shield plate and the forcedly cooled middle plate is formed is radiantly heated by the heater through the opening provided in the heat shield plate, and the other parts are cooled. Equipped with press piston and feed hole drilling pin
The male type and the female type having a piston hole and a pin hole
A method of manufacturing a carrier tape, characterized in that a feed hole is formed at the same time as the re-embossing is performed, and the carrier tape is intermittently moved by a predetermined length.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263121A JPH0767932B2 (en) | 1991-09-13 | 1991-09-13 | Carrier tape manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3263121A JPH0767932B2 (en) | 1991-09-13 | 1991-09-13 | Carrier tape manufacturing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05147606A JPH05147606A (en) | 1993-06-15 |
| JPH0767932B2 true JPH0767932B2 (en) | 1995-07-26 |
Family
ID=17385119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3263121A Expired - Lifetime JPH0767932B2 (en) | 1991-09-13 | 1991-09-13 | Carrier tape manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0767932B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2690243B2 (en) * | 1992-07-23 | 1997-12-10 | シーケーディ株式会社 | Blister packaging method |
| EP0733934B1 (en) * | 1995-03-20 | 2003-09-03 | Fuji Photo Film Co., Ltd. | Disk producing method and apparatus |
| US6003676A (en) * | 1997-12-05 | 1999-12-21 | Tek Pak, Inc. | Product carrier and method of making same |
| IT1311383B1 (en) * | 1999-12-30 | 2002-03-12 | Ima Spa | METHOD AND EQUIPMENT FOR THE FORMING OF AN ALVEOLED TAPE BLISTER PACKAGING IN BLISTERING MACHINES. |
| JP3985942B2 (en) * | 2001-10-17 | 2007-10-03 | 住友ベークライト株式会社 | Manufacturing method of embossed carrier tape |
| MY156478A (en) | 2003-04-01 | 2016-02-26 | Adaptsys Ltd | Plastic embossed carrier tape process |
| US7987653B2 (en) * | 2004-03-03 | 2011-08-02 | Adaptsys Limited | Plastic embossed carrier tape process |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5884500A (en) * | 1981-11-12 | 1983-05-20 | 松下電器産業株式会社 | Device for taping electronic part |
-
1991
- 1991-09-13 JP JP3263121A patent/JPH0767932B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05147606A (en) | 1993-06-15 |
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