JPH0766534A - Manufacture of three-dimensional circuitry - Google Patents
Manufacture of three-dimensional circuitryInfo
- Publication number
- JPH0766534A JPH0766534A JP21438993A JP21438993A JPH0766534A JP H0766534 A JPH0766534 A JP H0766534A JP 21438993 A JP21438993 A JP 21438993A JP 21438993 A JP21438993 A JP 21438993A JP H0766534 A JPH0766534 A JP H0766534A
- Authority
- JP
- Japan
- Prior art keywords
- resin substrate
- circuit
- dimensional
- electroless plating
- sheet piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、樹脂基板を三次元形状
に成形した後で該樹脂基板上に無電解メッキの導電回路
を形成させる三次元回路体の製造方法に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a three-dimensional circuit body in which a resin substrate is molded into a three-dimensional shape and electroconductive plating conductive circuits are formed on the resin substrate.
【0002】[0002]
【従来の技術】図7〜8は、特開昭62−237798
号公報に記載された従来の三次元回路体の製造方法を示
すものである。この方法は、成形用の雄型21と雌型2
2との間に導電回路(銅箔)23を有するシート24を
位置させると共に、該雌型22の底部開孔25から樹脂
材26,27を射出して三次元形状に型成形することに
より、樹脂基板28の表面に回路シート24を転写させ
るものである。2. Description of the Related Art FIGS. 7 to 8 show Japanese Patent Laid-Open No. 62-237798.
2 shows a conventional method for manufacturing a three-dimensional circuit body described in Japanese Patent Laid-Open Publication No. This method is used for molding a male mold 21 and a female mold 2.
A sheet 24 having a conductive circuit (copper foil) 23 is positioned between the two and the resin material 26, 27 is injected from the bottom opening 25 of the female die 22 to form a three-dimensional shape. The circuit sheet 24 is transferred onto the surface of the resin substrate 28.
【0003】しかしながら、上記従来の方法にあって
は、成形時に導電回路23が大きく屈曲した場合に回路
23に亀裂を生じたり、またそれを防ぐために複雑な形
状の回路体29を製造できないという問題があった。さ
らに回路23上に電子部品等をハンダ接続させる場合は
耐熱性の高い高価な樹脂材27を使用しなければならな
いという問題もあった。また導電回路23としてAgや
Cuのペースト材を使用した場合もペースト内で導電性
を確保するためのフィラー同士の接合が弱まるために大
きな屈曲成形ができず、ペースト材を加熱硬化させるた
めにも耐熱性の高い高価な樹脂基板27が必要であっ
た。However, in the above-mentioned conventional method, when the conductive circuit 23 is greatly bent at the time of molding, the circuit 23 is cracked, and in order to prevent it, a circuit body 29 having a complicated shape cannot be manufactured. was there. Further, there is a problem that an expensive resin material 27 having high heat resistance must be used when soldering an electronic component or the like onto the circuit 23. Also, when a paste material of Ag or Cu is used as the conductive circuit 23, large bending cannot be performed because the joining of the fillers for securing the conductivity in the paste is weakened, and the paste material is hardened by heating. An expensive resin substrate 27 having high heat resistance was required.
【0004】[0004]
【発明が解決しようとする課題】本発明は、上記した点
に鑑み、回路の亀裂を生じることなく複雑な三次元形状
の回路体を得ることができると共に、安価な樹脂基板を
用いてもハンダ接続時等の耐熱を行うことのできる三次
元回路体の製造方法を提供することを目的とする。In view of the above points, the present invention makes it possible to obtain a circuit body having a complicated three-dimensional shape without causing cracks in the circuit, and to solder even if an inexpensive resin substrate is used. An object of the present invention is to provide a method for manufacturing a three-dimensional circuit body that can withstand heat during connection and the like.
【0005】[0005]
【課題を解決するための手段】上記目的を達成するため
に、本発明は、回路を形成する熱可塑性の樹脂基板を加
熱した状態で成形型の形状に沿って真空吸引成形する三
次元回路体の製造方法において、該樹脂基板に無電解メ
ッキ用の触媒で回路パターンを形成し、該樹脂基板を真
空吸引で三次元形状に成形した後、該回路パターン上に
導電性の無電解メッキ層を鍍着させることを基本とす
る。また、接着剤付ベースフィルムの上にハンダ接続部
に対応して耐熱性のエンプラシート片を載置すると共に
該エンプラシート片の上から熱可塑性樹脂を押出成形し
て前記樹脂基板を形成させることも可能である。In order to achieve the above object, the present invention provides a three-dimensional circuit body in which a thermoplastic resin substrate forming a circuit is vacuum suction molded along the shape of a molding die in a heated state. In the method of manufacturing, a circuit pattern is formed on the resin substrate with a catalyst for electroless plating, the resin substrate is molded into a three-dimensional shape by vacuum suction, and then a conductive electroless plating layer is formed on the circuit pattern. It is basically made to plate. In addition, a heat-resistant engineering plastic sheet piece is placed on the adhesive-attached base film corresponding to the solder connection portion, and a thermoplastic resin is extruded from the engineering plastic sheet piece to form the resin substrate. Is also possible.
【0006】[0006]
【作用】樹脂基板が三次元形状に成形された後に無電解
メッキにより回路が形成される。樹脂基板上の触媒は含
有量の調節により深絞りが可能であり、樹脂基板を複雑
な形状に成形可能である。また耐熱性のエンプラシート
片の上で回路と被接続体とをハンダ接続させることによ
り安価な樹脂基板の使用が可能となる。The circuit is formed by electroless plating after the resin substrate is molded into a three-dimensional shape. The catalyst on the resin substrate can be deep-drawn by adjusting the content, and the resin substrate can be molded into a complicated shape. In addition, an inexpensive resin substrate can be used by soldering the circuit and the connected body on the heat-resistant engineering plastic sheet piece.
【0007】[0007]
【実施例】図1〜6は本発明に係る三次元回路体の製造
方法を工程順に示すものである。図1は、表面に接着剤
1を塗布した薄いベースフィルム2の上にハンダ接続部
に対応して複数の耐熱性のエンプラシート片3を載置さ
せると共に、該エンプラシート片3の上から該ベースフ
ィルム2上に熱可塑性樹脂4を押出機5により押出成形
して、樹脂基板帯6′を形成させる工程を示す。1 to 6 show a method of manufacturing a three-dimensional circuit body according to the present invention in the order of steps. FIG. 1 shows that a plurality of heat-resistant engineering plastic sheet pieces 3 are placed on a thin base film 2 having an adhesive 1 applied on the surface thereof in correspondence with solder joints, and A step of forming the resin substrate strip 6'by extrusion molding the thermoplastic resin 4 on the base film 2 by the extruder 5 will be described.
【0008】ここでエンプラとはエンジニアリングプラ
スチックの略で耐熱性の特に高いスーパーエンプラを使
用してもよい。エンプラシート片3はベースフィルム2
と熱可塑性樹脂4との間に挟まれて配置される。熱可塑
性樹脂4としては安価なPVC、PP、ABS等を使用
可能である。樹脂基板帯6′は鎖線イの如く適宜長さに
切断されて図2のような樹脂基板6となる。Here, engineering plastic is an abbreviation for engineering plastic, and super engineering plastic having particularly high heat resistance may be used. The engineering plastic sheet piece 3 is the base film 2
And the thermoplastic resin 4. As the thermoplastic resin 4, inexpensive PVC, PP, ABS or the like can be used. The resin substrate strip 6'is cut into an appropriate length as indicated by a chain line a to form the resin substrate 6 as shown in FIG.
【0009】該樹脂基板6の表面すなわちベースフィル
ム2上には図3の如く無電解メッキ用の触媒7を回路パ
ターン形状に塗布する。触媒7としてはポリエステル系
ホットメルト樹脂に塩化パラジューム等を含有させたも
のが好適である。回路パターンの各端末部8の下には前
記エンプラシート片3が位置する。On the surface of the resin substrate 6, that is, on the base film 2, a catalyst 7 for electroless plating is applied in a circuit pattern shape as shown in FIG. As the catalyst 7, a polyester hot melt resin containing palladium chloride or the like is preferable. The engineering plastic sheet piece 3 is located under each terminal portion 8 of the circuit pattern.
【0010】図4〜5は上記触媒付樹脂基板9を真空成
形機10を用いて三次元形状に成形する工程を示す。該
触媒付樹脂基板9の周縁には係止用枠部11を設けて真
空成形機10の成形型14の上壁段部12に該枠部11
を係止させる。そして遠赤外線ヒータ13により触媒付
樹脂基板9を加熱して柔軟化させると共に真空成形機1
0の下側から真空引きをして触媒付樹脂基板9を成形型
14の形状に沿って三次元形状に成形させる。該成形型
14の底壁15には複数の真空引き孔16が設けられ、
該真空引き孔16はエア抜き管17に連通している。FIGS. 4 to 5 show steps of molding the resin substrate with catalyst 9 into a three-dimensional shape using a vacuum molding machine 10. A frame 11 for locking is provided on the periphery of the resin substrate 9 with catalyst, and the frame 11 is provided on the upper wall step 12 of the molding die 14 of the vacuum forming machine 10.
Lock. Then, the far-infrared heater 13 heats the resin substrate 9 with the catalyst to soften it and the vacuum forming machine 1
Vacuum is applied from the lower side of 0 to mold the resin substrate with catalyst 9 into a three-dimensional shape along the shape of the molding die 14. A plurality of vacuum suction holes 16 are provided in the bottom wall 15 of the mold 14.
The vacuum suction hole 16 communicates with an air vent pipe 17.
【0011】三次元形状に成形された触媒付樹脂基板
9′には図6の如く無電解メッキにより回路パターン形
状の触媒7上に導電性の無電解メッキ層18を鍍着させ
て三次元回路体19を形成させる。なお、大電流回路の
場合は無電解メッキ層18の上にさらに電気メッキ層を
鍍着させてもよい。On the resin substrate 9'with a catalyst formed in a three-dimensional shape, a conductive electroless plating layer 18 is plated on the catalyst 7 having a circuit pattern shape by electroless plating as shown in FIG. The body 19 is formed. In the case of a large current circuit, an electroplating layer may be further plated on the electroless plating layer 18.
【0012】[0012]
【発明の効果】以上の如くに、本発明によれば、樹脂基
板を三次元形状に成形した後で回路を形成させるから、
回路に屈曲による亀裂が発生せず、それゆえに複雑な形
状の回路体が形成できる。また、電子部品等のハンダ接
続部に対応して耐熱性の高いエンプラシート片を部分的
に用いたことにより、材料コストが低減される。As described above, according to the present invention, the circuit is formed after the resin substrate is molded into a three-dimensional shape.
A crack due to bending does not occur in the circuit, and therefore a circuit body having a complicated shape can be formed. Further, the material cost is reduced by partially using the engineering plastic sheet piece having high heat resistance corresponding to the solder connection portion of the electronic component or the like.
【図1】本発明に係る三次元回路体の製造方法における
樹脂基板の製法を示す斜視図である。FIG. 1 is a perspective view showing a method of manufacturing a resin substrate in a method of manufacturing a three-dimensional circuit body according to the present invention.
【図2】樹脂基板を示す斜視図である。FIG. 2 is a perspective view showing a resin substrate.
【図3】樹脂基板上に触媒を回路パターンに塗布した状
態の斜視図である。FIG. 3 is a perspective view showing a state in which a catalyst is applied on a resin substrate in a circuit pattern.
【図4】触媒付樹脂基板をヒータで加熱して真空成形機
で成形する状態の縦断面図である。FIG. 4 is a vertical cross-sectional view showing a state in which a resin substrate with a catalyst is heated by a heater and is molded by a vacuum molding machine.
【図5】同じく成形後の状態を示す縦断面図である。FIG. 5 is a vertical cross-sectional view showing a state after the same molding.
【図6】完成した三次元回路体を示す斜視図である。FIG. 6 is a perspective view showing a completed three-dimensional circuit body.
【図7】従来例を示す縦断面図である。FIG. 7 is a vertical sectional view showing a conventional example.
【図8】同じく回路体を示す縦断面図である。FIG. 8 is a vertical sectional view showing the same circuit body.
2 ベースフィルム 3 エンプラシート片 4 熱可塑性樹脂 6 樹脂基板 7 触媒 10 真空成形機 14 成形型 18 無電解メッキ層 19 三次元回路体 2 base film 3 engineering plastic sheet piece 4 thermoplastic resin 6 resin substrate 7 catalyst 10 vacuum forming machine 14 molding die 18 electroless plating layer 19 three-dimensional circuit body
Claims (2)
熱した状態で成形型の形状に沿って真空吸引成形する三
次元回路体の製造方法において、該樹脂基板に無電解メ
ッキ用の触媒で回路パターンを形成し、該樹脂基板を真
空吸引で三次元形状に成形した後、該回路パターン上に
導電性の無電解メッキ層を鍍着させることを特徴とする
三次元回路体の製造方法。1. A method for producing a three-dimensional circuit body in which a thermoplastic resin substrate for forming a circuit is vacuum suction-molded along the shape of a mold in a heated state, wherein a catalyst for electroless plating is applied to the resin substrate. A method for manufacturing a three-dimensional circuit body, comprising forming a circuit pattern, molding the resin substrate into a three-dimensional shape by vacuum suction, and then depositing a conductive electroless plating layer on the circuit pattern.
続部に対応して耐熱性のエンプラシート片を載置すると
共に該エンプラシート片の上から熱可塑性樹脂を押出成
形して前記樹脂基板を形成させることを特徴とする請求
項1記載の三次元回路体の製造方法。2. A resin substrate is prepared by placing a heat-resistant engineering plastic sheet piece on the adhesive-attached base film corresponding to the solder connection portion and extruding a thermoplastic resin from the engineering plastic sheet piece. The three-dimensional circuit body manufacturing method according to claim 1, wherein the three-dimensional circuit body is formed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21438993A JP3379072B2 (en) | 1993-08-30 | 1993-08-30 | Method for manufacturing three-dimensional circuit body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP21438993A JP3379072B2 (en) | 1993-08-30 | 1993-08-30 | Method for manufacturing three-dimensional circuit body |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0766534A true JPH0766534A (en) | 1995-03-10 |
JP3379072B2 JP3379072B2 (en) | 2003-02-17 |
Family
ID=16654984
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP21438993A Expired - Fee Related JP3379072B2 (en) | 1993-08-30 | 1993-08-30 | Method for manufacturing three-dimensional circuit body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3379072B2 (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008192789A (en) * | 2007-02-05 | 2008-08-21 | Sumitomo Metal Mining Co Ltd | Circuit board for fabrication and waveguide circuit board obtained by fabricating the same |
JP2012045819A (en) * | 2010-08-26 | 2012-03-08 | Sakaiya:Kk | Method for producing resin sheet including decorative film layer and metallic film layer |
WO2014168220A1 (en) * | 2013-04-12 | 2014-10-16 | セーレン株式会社 | Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein |
-
1993
- 1993-08-30 JP JP21438993A patent/JP3379072B2/en not_active Expired - Fee Related
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008192789A (en) * | 2007-02-05 | 2008-08-21 | Sumitomo Metal Mining Co Ltd | Circuit board for fabrication and waveguide circuit board obtained by fabricating the same |
JP2012045819A (en) * | 2010-08-26 | 2012-03-08 | Sakaiya:Kk | Method for producing resin sheet including decorative film layer and metallic film layer |
WO2014168220A1 (en) * | 2013-04-12 | 2014-10-16 | セーレン株式会社 | Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein |
CN105121700A (en) * | 2013-04-12 | 2015-12-02 | 世联株式会社 | Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein |
US20160037651A1 (en) * | 2013-04-12 | 2016-02-04 | Seiren Co., Ltd. | Process for producing three-dimensional conductive pattern structure, and material for three-dimensional molding for use therein |
JPWO2014168220A1 (en) * | 2013-04-12 | 2017-02-16 | セーレン株式会社 | Manufacturing method of three-dimensional conductive pattern structure and three-dimensional molding material used therefor |
TWI627885B (en) * | 2013-04-12 | 2018-06-21 | Seiren Co Ltd | Method for producing three-dimensional conductive pattern structure and material for three-dimensional molding used there |
Also Published As
Publication number | Publication date |
---|---|
JP3379072B2 (en) | 2003-02-17 |
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Legal Events
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A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20021029 |
|
LAPS | Cancellation because of no payment of annual fees |