JPH0766534A - Manufacture of three-dimensional circuitry - Google Patents

Abstract

PURPOSE:To provide a method of manufacturing a three-dimensional circuitry, which is capable of molding the circuit into a complicated three-dimensional form without generating a crack in a circuit and is low is cost. CONSTITUTION:In a method of manufacturing a three-dimensional circuitry which molds 10 a thermoplastic resin substrate 6 to be formed with a circuit by suction along the form of a molding die 14 in a state that the substrate 6 is heated, a circuit pattern is formed of a catalyst for electroless plating on the substrate 6 and after the resin substrate 6 is molded into a three- dimensional form by suction, a conductive electroless plating layer is made to plate on the circuit pattern. Or a heat-resistant engineering plastic sheet piece is placed on a base film with a bonding agent in such a way as to correspond to a solder connection part and at the same time, a thermoplastic resin is subjected to extrusion molding from on the sheet piece to make a resin substrate 6 form.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a three-dimensional circuit body in which a resin substrate is molded into a three-dimensional shape and electroconductive plating conductive circuits are formed on the resin substrate.

[0002]

2. Description of the Related Art FIGS. 7 to 8 show Japanese Patent Laid-Open No. 62-237798.
2 shows a conventional method for manufacturing a three-dimensional circuit body described in Japanese Patent Laid-Open Publication No. This method is used for molding a male mold 21 and a female mold 2.
A sheet 24 having a conductive circuit (copper foil) 23 is positioned between the two and the resin material 26, 27 is injected from the bottom opening 25 of the female die 22 to form a three-dimensional shape. The circuit sheet 24 is transferred onto the surface of the resin substrate 28.

However, in the above-mentioned conventional method, when the conductive circuit 23 is greatly bent at the time of molding, the circuit 23 is cracked, and in order to prevent it, a circuit body 29 having a complicated shape cannot be manufactured. was there. Further, there is a problem that an expensive resin material 27 having high heat resistance must be used when soldering an electronic component or the like onto the circuit 23. Also, when a paste material of Ag or Cu is used as the conductive circuit 23, large bending cannot be performed because the joining of the fillers for securing the conductivity in the paste is weakened, and the paste material is hardened by heating. An expensive resin substrate 27 having high heat resistance was required.

[0004]

In view of the above points, the present invention makes it possible to obtain a circuit body having a complicated three-dimensional shape without causing cracks in the circuit, and to solder even if an inexpensive resin substrate is used. An object of the present invention is to provide a method for manufacturing a three-dimensional circuit body that can withstand heat during connection and the like.

[0005]

In order to achieve the above object, the present invention provides a three-dimensional circuit body in which a thermoplastic resin substrate forming a circuit is vacuum suction molded along the shape of a molding die in a heated state. In the method of manufacturing, a circuit pattern is formed on the resin substrate with a catalyst for electroless plating, the resin substrate is molded into a three-dimensional shape by vacuum suction, and then a conductive electroless plating layer is formed on the circuit pattern. It is basically made to plate. In addition, a heat-resistant engineering plastic sheet piece is placed on the adhesive-attached base film corresponding to the solder connection portion, and a thermoplastic resin is extruded from the engineering plastic sheet piece to form the resin substrate. Is also possible.

[0006]

The circuit is formed by electroless plating after the resin substrate is molded into a three-dimensional shape. The catalyst on the resin substrate can be deep-drawn by adjusting the content, and the resin substrate can be molded into a complicated shape. In addition, an inexpensive resin substrate can be used by soldering the circuit and the connected body on the heat-resistant engineering plastic sheet piece.

[0007]

1 to 6 show a method of manufacturing a three-dimensional circuit body according to the present invention in the order of steps. FIG. 1 shows that a plurality of heat-resistant engineering plastic sheet pieces 3 are placed on a thin base film 2 having an adhesive 1 applied on the surface thereof in correspondence with solder joints, and A step of forming the resin substrate strip 6'by extrusion molding the thermoplastic resin 4 on the base film 2 by the extruder 5 will be described.

Here, engineering plastic is an abbreviation for engineering plastic, and super engineering plastic having particularly high heat resistance may be used. The engineering plastic sheet piece 3 is the base film 2
And the thermoplastic resin 4. As the thermoplastic resin 4, inexpensive PVC, PP, ABS or the like can be used. The resin substrate strip 6'is cut into an appropriate length as indicated by a chain line a to form the resin substrate 6 as shown in FIG.

On the surface of the resin substrate 6, that is, on the base film 2, a catalyst 7 for electroless plating is applied in a circuit pattern shape as shown in FIG. As the catalyst 7, a polyester hot melt resin containing palladium chloride or the like is preferable. The engineering plastic sheet piece 3 is located under each terminal portion 8 of the circuit pattern.

FIGS. 4 to 5 show steps of molding the resin substrate with catalyst 9 into a three-dimensional shape using a vacuum molding machine 10. A frame 11 for locking is provided on the periphery of the resin substrate 9 with catalyst, and the frame 11 is provided on the upper wall step 12 of the molding die 14 of the vacuum forming machine 10.
Lock. Then, the far-infrared heater 13 heats the resin substrate 9 with the catalyst to soften it and the vacuum forming machine 1
Vacuum is applied from the lower side of 0 to mold the resin substrate with catalyst 9 into a three-dimensional shape along the shape of the molding die 14. A plurality of vacuum suction holes 16 are provided in the bottom wall 15 of the mold 14.
The vacuum suction hole 16 communicates with an air vent pipe 17.

On the resin substrate 9'with a catalyst formed in a three-dimensional shape, a conductive electroless plating layer 18 is plated on the catalyst 7 having a circuit pattern shape by electroless plating as shown in FIG. The body 19 is formed. In the case of a large current circuit, an electroplating layer may be further plated on the electroless plating layer 18.

[0012]

As described above, according to the present invention, the circuit is formed after the resin substrate is molded into a three-dimensional shape.
A crack due to bending does not occur in the circuit, and therefore a circuit body having a complicated shape can be formed. Further, the material cost is reduced by partially using the engineering plastic sheet piece having high heat resistance corresponding to the solder connection portion of the electronic component or the like.

[Brief description of drawings]

FIG. 1 is a perspective view showing a method of manufacturing a resin substrate in a method of manufacturing a three-dimensional circuit body according to the present invention.

FIG. 2 is a perspective view showing a resin substrate.

FIG. 3 is a perspective view showing a state in which a catalyst is applied on a resin substrate in a circuit pattern.

FIG. 4 is a vertical cross-sectional view showing a state in which a resin substrate with a catalyst is heated by a heater and is molded by a vacuum molding machine.

FIG. 5 is a vertical cross-sectional view showing a state after the same molding.

FIG. 6 is a perspective view showing a completed three-dimensional circuit body.

FIG. 7 is a vertical sectional view showing a conventional example.

FIG. 8 is a vertical sectional view showing the same circuit body.

[Explanation of symbols]

 2 base film 3 engineering plastic sheet piece 4 thermoplastic resin 6 resin substrate 7 catalyst 10 vacuum forming machine 14 molding die 18 electroless plating layer 19 three-dimensional circuit body

Claims (2)

[Claims] 1. A method for producing a three-dimensional circuit body in which a thermoplastic resin substrate for forming a circuit is vacuum suction-molded along the shape of a mold in a heated state, wherein a catalyst for electroless plating is applied to the resin substrate. A method for manufacturing a three-dimensional circuit body, comprising forming a circuit pattern, molding the resin substrate into a three-dimensional shape by vacuum suction, and then depositing a conductive electroless plating layer on the circuit pattern. 2. A resin substrate is prepared by placing a heat-resistant engineering plastic sheet piece on the adhesive-attached base film corresponding to the solder connection portion and extruding a thermoplastic resin from the engineering plastic sheet piece. The three-dimensional circuit body manufacturing method according to claim 1, wherein the three-dimensional circuit body is formed.