JPH0766338A - Cooling device for integrated circuit element - Google Patents

Abstract

PURPOSE:To highly efficiently cool an integrated circuit element and laser diode element which generate plenty of heat by providing a heat transferring surface for cooling on which a coolant is made to flow through each gap between a plurality of parallel thin fins and a flow passage structure which is brought into contact with the heat transfer surface with a compressive force and has an inlet and outlet counterposed to each other in the horizontal direction. CONSTITUTION:A coolant enters a flow passage structure 20 from its entrance 50 and flows to the outlet 52 of the structure 20 through an inlet flow passage 44, flow passages 32 formed between each fin 34 on the element 10 of a laser diode or computer, and outlet flow passage 44 which is separated from the flow passage 44 by a wall 42. The structure 20 has side faces 54 and an upper surface 48 and the lower surface of the structure 20 is press-contacted with the upper surface 36 of micro flow passages with a compressive force. The surface 30 of the micro flow passages is constituted of the fins 34 and flow passages 32. Therefore, an integrated circuit element and the element of a laser diode which generates plenty of heat can be cooled with a high efficiency.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION The present invention relates to an LSI, a diode,
The present invention relates to a mounting structure of an integrated circuit for cooling heat generated from an element of an electronic device such as an IGBT and a thyristor.

[0002]

2. Description of the Related Art An apparatus using a bellows and a cold water passage for cooling an integrated circuit element has been conventionally used. For example, Journal of Micromechanics and Micro Engineering 9/91, pp. 152 to 156, "Direct Bonding of Micromachined Silicon Wafers Forum".
The Diode Heat Exchanger Applications "(Hunt et al.," Direct
Bonding of Micromachined
Silicon Wafers for Laser
Diode Heat Exchanger Appl
ications ”, Journalof Micr
omechanics and Microengin
eeering, 9/91, pp. 152-15
6) uses He gas or heat conductive grease to reduce the contact thermal resistance on the contact surface of the heat conductive element between the cold water flow path and the element, and the contact thermal resistance is 1 cm ^{2 for} the element. 0.2
It is described that the temperature is C / W or higher.

[0003]

A computer device,
Alternatively, in the laser diode element, it is necessary to shorten the signal transmission time in order to improve the calculation speed, and to minimize the temperature variation among the individual elements.

Further, in a cooling structure in which a coolant flow path, which is a heat sink, is fixedly in contact with the element, there are problems of a device for fixing from the element and strength reliability due to a difference in thermal swelling rate. Further, in order to reduce the contact thermal resistance between the element and the heat sink, it is necessary to make contact with a certain degree of contact force. In addition, it is necessary to cool elements that have a high heat load.

An object of the present invention is to provide an integrated circuit element cooling device capable of cooling the integrated circuit element and the laser diode element which generate a large amount of heat with high efficiency.

[0006]

In order to achieve the above object, the cooling device for an integrated circuit element according to the present invention is a parallel cooling device for an integrated circuit element, in which a cooling medium is flowed between fine fins for cooling. A flow path structure having a heat transfer surface that cools by flowing a refrigerant between a plurality of fine fins, is in contact with the surface of the heat transfer surface by a compressive force, and has an inlet and an outlet in opposite horizontal directions. It is characterized by having.

Further, the compression force is obtained by the compression force of a spring or an elastic compression structure. Further, the flow path structure is provided in plural. Further, the flow channel structure is arranged on a substrate on which a plurality of elements are mounted. A flow path for the secondary fluid is installed so as to be in contact with the flow path structure.

[0008]

In the case of a multi-chip module equipped with a large number of elements or laser diodes, a large number of flow path structures are required, so reducing pressure loss is an important issue. With the above-described structure, the refrigerant that has entered from the inlet of each flow channel structure absorbs the heat generated from the element on the micro flow channel, passes through the flow channel structure again, and flows out from the outlet. In this case, the refrigerant circulates by the pump, but the pump power can be reduced because the flow path length is shortened. Further, since it passes through the fine micro flow paths, heat transfer is promoted, and the element that generates heat with a high heat load can be cooled.

Further, the pressure loss can be reduced by providing a large number of flow paths having a very short flow path in parallel on each element. The flow path structure is in contact with the micro flow path with a light contact force by a spring or an elastic body.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described with reference to FIGS. 1 is a partial cross-sectional perspective view showing a microfin and a flow channel structure showing an embodiment of the present invention, FIG. 2 is a cross-sectional view of the microfin and the flow channel structure shown in FIG. 1, and FIG. 4 is a cross-sectional view of the microfins and the flow channel structure seen from another direction, FIG. 4 is a top view of the cooling system of the multichip module of this embodiment, and FIG. FIG. 6 is a side view of the system, and FIG. 6 is a cross-sectional view of the multichip module shown in FIG.

As shown in FIG. 1, the coolant flows through the flow path structure 2
0 through the inlet side 50, through the inlet channel 44, through the channel 32 between the laser diode or the fins 34 on the computer device 10, and further through the inlet channel 44.
From the outlet flow path 46 separated by the wall surface 42 to the outlet side 52. In this case, the flow path structure 20 includes the side surface 54 and the upper surface 4
8, the lower surface 40 of the channel structure 20 is in contact with the upper surface 36 of the microchannel in a state of being pressed by a compressive force. Here, the surface 30 of the microchannel is the fin 3
4 and the flow path 32.

As can be seen in FIGS. 2 and 3 which show the flow channel structure 20 and the device 10 from the side and FIG. 4 which shows the flow channel structure 20 and the device 10 from the top, a number of integrated circuit devices and lasers are shown. Substrate 60 on which diode element 10 is mounted
Are connected by a solder ball 38.

Further, there is a space between the flow passage structure 20 between the inlet flow passage 64 and the outlet flow passage 66, and an elastic body is inserted between them to prevent leakage between the inlet flow passage 64 and the outlet flow passage. It is preventing.

Refrigerant enters through the inlet 68 of the multichip module, enters through the inlet duct 64 of the module, passes through the microchannels, and exits the duct 6 of the module.
6 and exits from the outlet 70 of the multichip module. Inlet 68 of multichip module on substrate 60
Are provided on the inlet wall surface 72, and the outlet portion 70 of the multichip module is provided on the outlet wall surface 74.
As shown in FIG. 5, the elastic body 76 allows the lower surface 40 of the flow channel structure 20 to move from the upper surface 36 of the fin above the row 10 of elements.
The force to press against is generated.

Further, as shown in FIG. 6, there is an I / O pin 78 for connecting the substrate 60, and a module upper plate 80 for encapsulating the multi-chip module, and an upper surface 82 thereof. Is cooled by the secondary fluid.

[0016]

As described above, according to the cooling device for an integrated circuit element of the present invention, a flow path structure of a system using a micro flow path is provided for cooling the integrated circuit or the laser diode element. It is possible to efficiently cool the integrated circuit device and the laser diode device that generate high heat.

Further, it is a flexible connection structure on the micro fins by means of springs or elastic bodies, and the cooling system can easily form an inlet and an outlet structure when cooling the multi-chip module.

[0018]

[Brief description of drawings]

FIG. 1 is a partial cross-sectional perspective view showing a microfin and a flow channel structure showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view of the micro fin and the flow channel structure shown in FIG.

FIG. 3 is a cross-sectional view of the microfin shown in FIG. 1 and the flow channel structure as viewed from another direction.

FIG. 4 is a top view of a cooling system of the multi-chip module of this embodiment.

5 is a side view of a cooling system of the multi-chip module shown in FIG.

6 is a cross-sectional view of the multi-chip module shown in FIG.

[Explanation of symbols]

10 ... Integrated circuit device or laser diode device,
20 ... Channel structure, 30 ... Micro channel surface, 32 ...
Micro channel, 34 ... Fin, 36 ... Fin upper surface, 3
8 ... Solder ball, 40 ... Lower surface of flow path structure, 42 ... Wall surface,
44 ... Inlet flow path of flow path structure, 46 ... Exit flow path of flow path structure, 48 ... Upper surface of flow path structure, 50 ... Inlet side of flow path structure, 52 ... Exit side of flow path structure , 54 ... Side surface of flow path structure, 60 ... Substrate, 62 ... Elastic structure, 64 ... Flow path inlet of multichip module, 70 ... Flow path outlet of multichip module, 72 ... Inlet wall surface, 74 ... Exit part Walls, 76 ... Elastic load bodies, 78 ... I / O pins, 80 ... Multichip module top plate, 82 ... Multichip module top plate surface.

Claims (5)

[Claims] 1. A cooling device for an integrated circuit device, which cools by flowing a refrigerant between fine fins, having a heat transfer surface for flowing a coolant between a plurality of parallel fine fins for cooling, and a compressive force. 2. A cooling device for an integrated circuit element, comprising: a flow path structure which is in contact with the surface of the heat transfer surface and has an inlet and an outlet in the horizontal direction facing each other. 2. A cooling device for an integrated circuit element according to claim 1, wherein the compression force is obtained by a compression force of a spring or an elastic compression structure. 3. A cooling device for an integrated circuit element according to claim 1, wherein a plurality of the flow path structures are provided. 4. The cooling device for an integrated circuit element according to claim 1, wherein the flow path structure is arranged on a substrate on which a plurality of elements are mounted. 5. The cooling device for an integrated circuit element according to claim 3, wherein a flow path for the secondary fluid is installed so as to be in contact with the flow path structure.