JPH0765527A - Floating magnetic head and its manufacture - Google Patents

Abstract

PURPOSE:To eliminate a wrapping work by hands, to improve working efficiency, to mass-produce easily and to enhance quality by layering a thin film on a surface of a slide rail and shaping the slide rail like a crown. CONSTITUTION:A crown is formed on a rail surface 3A so that a central part of a slide rail 3 on a slide face of a head chip 2 of a floating magnetic head projects a predetermined amount DELTAt. At this time, the crown is formed by the thickness of a thin film 5 layered on the rail surface 3A. In order to form the crown, the head chip 2 is accommodated in a U-shaped jig 10 and subjected to sputtering, whereby a side wall 10A of a height H projects from the rail surface 3A and positioned at each end of the slide rail 3. Accordingly, tone thin film 5 is so controlled as to be thick at the central part and thin at both ends. It becomes unnecessary to wrap each rail surface by hands to form a crown, and the working efficiency is improved with irregularities eliminated.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin film having a crown shape formed on a rail surface of a slide rail, or
The present invention relates to a levitation type magnetic head formed by bending a head chip and a method for manufacturing the same.

In recent years, magnetic disk devices have been remarkably improved in performance such as high density and high capacity with the spread of computers.
Reducing the distance from the recording medium is an essential condition.

Therefore, the flying height of the magnetic head tends to decrease, and in order to stably fly the magnetic head while the flying height decreases, it is necessary to avoid contact between the magnetic head and the recording medium. The surface roughness of the recording medium must be reduced.

However, when the surface roughness of the recording medium is reduced, the adhesion of the lubricant or water interposed between the magnetic head and the recording medium, so-called stiction, is generated to drive the motor for rotating the recording medium. Stops, or
Problems such as deformation of the support spring that supports the magnetic head occur.

Therefore, a crown shape has been formed on the slide rail of the magnetic head so as to avoid the occurrence of such stiction.

[0006]

2. Description of the Related Art Conventionally, the structure was formed as shown in the conventional explanatory view of FIG. 8A is a perspective view of a substrate, FIG. 8B is a perspective view of a rod-shaped body, and FIG. 8C is a perspective view of a head chip.

As shown in FIG. 8 (a), a magnetic head element 4 consisting of a core 4A, a coil 4B and a connection pad 4C is formed on an AI ₂ O ₃ -TiC ceramic substrate 1 by a thin film method, and formed in this way. By cutting the formed wafer-shaped ceramic substrate 1 as shown by the one-dot chain line, the rod-shaped body 1A on which the slide rail 3 is formed is formed on the side that becomes the slide surface 2B as shown in FIG. 8 (b). Done.

Next, the rail surface 3A of the slide rail 3 of the rod-shaped body 1A is polished and further cut by the one-dot chain line to form the head chip 2 as shown in FIG. 8 (c). Was there.

Therefore, the wafer-shaped ceramic substrate 1
By cutting the head, the back surface 2B side is flat, the slide rail 3 is formed on the slide surface 2A side, and the magnetic head element 4 is provided at a predetermined position on the end surface of the slide rail 3. Chip 2 was being manufactured at the same time.

[0010]

However, when the head chip 2 is formed by cutting such a wafer-shaped ceramic substrate 1, the distortion of the slide surface 3A on the slide rail 3 caused by the cutting occurs. In addition to removing the above, the rail surface 3A of each head chip 2 has been hand-wrapped so as to form the above-mentioned crown shape.

[0011] Such hand wrapping work is inefficient and requires skill, resulting in variations in quality.
Moreover, there is a problem that mass productivity cannot be obtained. Furthermore,
Since the core 4A of the magnetic head element 4 is exposed on the rail surface 3A, there is a problem that a recess is caused by hand lapping work or corrosion is likely to occur.

[0012]

FIG. 1 is a diagram illustrating the principle of the first invention, and FIG. 2 is a diagram illustrating the principle of the second invention.
As shown in FIG. 1, a magnetic head element 4 is provided at a predetermined position of a head chip 2 formed to have a slide rail 3 on a slide surface, and a central portion in the length direction of the slide rail 3 projects a predetermined amount Δt. In the flying magnetic head in which a crown shape is formed on the rail surface 3A of the slide rail 3, the crown shape is formed by the thickness of the thin film 5 laminated on the rail surface 3A. 2 (a), the head chip 2 is bent so that the crown shape is formed by bending the head chip 2.
As shown in FIG. 2B, the protective film 6 that exerts an internal stress is formed on the rail surface 3A of the slide rail, or the head chip 2 is bent to form a crown shape. Rail surface 3A and slide rail as done
The protective film 6 having an internal stress in the opposite direction is formed on the back surface 2B on the opposite side where 3 is formed, and further,
When the thin film 5 is formed, the head chip 2 is housed in a U-shaped jig 10 having a side wall 10A to perform sputtering, and the height H of the side wall 10A is set to the rail surface.
By projecting the side wall 10A at both ends of the slide rail 3 while projecting it from 3A, the thickness of the thin film 5 is controlled to be thick at the center of the slide rail 3 and thin at both ends. The protective film 6 is formed on the surface of the rod-shaped body 1A forming the head chip 2 by sputtering or CVD, or further,
The substrate 11 for forming the head chip 2 is formed so as to be formed by forming a film on the back surface by sputtering, or by laminating a plurality of strip-shaped plate members 11A on which the protective film 6 is formed. Then, the magnetic head element 4 is formed on the substrate 11, and then the head chip 2 for cutting the substrate 11 is formed so that the protective film 6 is formed on the rail surface 3A. Is.

With this configuration, the above-mentioned problems can be solved.

[0014]

Operation: That is, in the first invention, the slide rail
The thin film 5 is laminated on the rail surface 3A of 3 to form the crown shape. Also, by forming such a thin film 5 to form the crown shape, the head chip 2 is formed on the side wall. U-shaped jig with 10A
It can be easily formed by housing in 10 and performing sputtering so that the film thickness is thin on the end face of the slide rail 3 close to the side wall 10A and thick on the center part.

Therefore, as compared with forming a crown shape on the rail surface 3A by hand-wrapping each piece, quality and work efficiency can be improved and mass productivity can be improved.

In the second aspect of the invention, the protective film 6 is formed on the rail surface 3A of the head chip 2, or the protective film 6 is formed on the rail surface 3A of the head chip 2 and the back surface 2B. However, the crown shape is formed by bending the head chip 2 by the internal stress of the protective film 6, and such a protective film 6 is formed on the rod-shaped body 1A forming the head chip 2 by sputtering. Alternatively, when the head chip 2 is formed by cutting the rod-shaped body 1A by CVD, a protective film is formed on the rail surface 3A of the slide rail 3 and on the rail surface 3A and the back surface 2B.
Also, the rail surface 3A and the rear surface 2B so that the formation of 6 is performed.
When the protective film 6 is formed on the and the protective film 6, the strip-shaped member 11A on which the protective film 6 is formed is formed so that the internal stresses in the protective films 6 are opposite to each other or by performing sputtering in advance. The magnetic head element 4 is formed on the substrate 11 by laminating the substrate 11 and the protective film 6 is formed on the rail surface 3A by cutting the substrate 11 forming the head chip 2. is there.

Therefore, the formation of such a protective film 6 can be easily performed as in the case of forming the above-mentioned thin film 5, so that the quality, the work efficiency and the mass productivity can be improved.

[0018]

The present invention will be described in detail below with reference to FIGS. FIG. 3 is an explanatory view of an embodiment according to the first invention,
(a) is a perspective view, (b) is a perspective view of a jig, FIG. 4 is an explanatory view of the thin film formation of the present invention, (a) (b1) (b2) (b3) is a side view, and FIG. 2 is an explanatory view of an embodiment according to the invention of FIG. 2, (a) and (b) are perspective views,
6A and 6B are explanatory views (No. 1) of forming a protective film of the present invention. (A) is a perspective view of a rod-shaped body, (b) is an attachment explanatory diagram of the rod-shaped body, (c) is a film formation explanatory diagram, and FIG. Illustration of formation of protective film of the present invention (Part 2)
Here, (a) is a perspective view of a plate member, (b) is a plan view of a substrate, (c) is a formation view of a magnetic head element, and (d) is an explanatory view of cutting. Throughout the drawings, the same reference numerals denote the same objects.

The first aspect of the present invention is as shown in FIG.
A flat back surface 2B is formed on one surface of the head chip 2, and a slide surface forming a slide rail 3 is formed on the other surface, and a core 4A, a coil 4B and a connection pad formed by thin film technology are formed on the end surface of the slide rail 3. It is formed by providing the magnetic head element 4 consisting of 4C, and the thin film 5 is laminated on the rail surface 3A of the slide rail 3, and the thickness of the thin film 5 is thin on both end surfaces of the slide rail 3 In the above, the rail surface 3A is formed with a crown shape in which the central portion has a predetermined protrusion amount Δt so as to be thick.

Moreover, the rail surface 3A is formed by such a thin film 5.
As shown in FIG. 3 (b), the rod-shaped body 1A formed by cutting from the above-mentioned ceramic substrate 1 is formed into a U-shape having a side wall 10A of height H as shown in FIG. 3 (b). The head chip 2 is formed by accommodating it in a jig 10 and performing sputtering from the opening 10B, forming a crown shape by the thin film 5 on the slide surface 3A of the slide rail 3 by sputtering, and then cutting.

In this case, the sputtering is carried out as shown in FIG.
As shown in Fig. 3, the jig 10 containing the rod-shaped body 1 is fixed to the holder 16 of the sputtering device, and the opening 10B of the jig 10 is positioned so as to face the target 12. The oblique components of the sputtered particles in various directions indicated by arrow F are blocked by the side wall 10A.

Therefore, the thin film 5 is thick in the central portion of the opening 10B and thin in the vicinity of the side wall 10A so that a crown shape can be formed, but the crown is formed by cutting the components of the sputtered particles in the oblique direction. In order to form the shape more efficiently, the surface area of the target 12 is sufficiently larger than the surface area of the rod-shaped body 1A, and the distance L between the film-formed surface of the rod-shaped body 1A and the surface of the target 12 is as small as possible. Smaller is desirable.

Usually, the wafer-shaped substrate 1 is formed to have a diameter of 3 to 4 inches, and the slide rail 3 is formed to have a length of about 4 mm, so that the rod-shaped body 1A has a size of about 4 × 100 mm.
Therefore, carbon having a diameter of 8 in is used as the target 12 so that the surface area of the target 12 is sufficiently larger than the surface area of the rod-shaped body 1A.
If the slide rail 3 has a length of 4 mm by positioning so that the distance L from the surface of the slide rail is 20 mm, then if the protruding height of the side wall 10A is 2 mm, the distance from the center of the slide rail 3 is 45 mm.
Incident particles from the target surface within a
Incident particles from the target surface within 60 ° are deposited at a position 1 mm away from 10A, and only vertical incident particles are deposited at the end part in contact with the side wall 10A, so that a crown shape is formed. It is obvious that

Further, in the sputtering apparatus, (b1) (b2) in FIG.
As shown in (b3), the holder 16 for fixing the jig 10 may be rotated. Even in this case, when the jig 10 shown in (b1) and (b3) of FIG. 4 is inclined, Since incident particles are not vapor-deposited on the rail surface 3A close to one side wall 10A, the film thickness is small at the end surface of the rail surface 3A, and the film thickness at the central portion is large.
The crown shape can be formed even if the rotation is performed as shown in (b1) (b2) (b3) of FIG.

Actually, the inside of the chamber of the sputtering apparatus is
Evacuate below 10 ^-6 Torr and use Ar 90%, CH ₄ 10% atmosphere gas.
When the film was formed by injecting up to 10 ^-3 Torr and applying a DC power supply P of 1 KW, the thin film 5 is a carbon film with an amorphous structure, and it is possible to form a hard film with high electrical insulation. It was confirmed that a good thin film 5 that can be formed, has durability, and can avoid a discharge phenomenon and the like can be formed.

Further, with this structure, the thin film 5 is thinly formed at the portion of the rail surface 3A where the core 4A is exposed, so that the thin film 5 does not adversely affect the recording / reproducing characteristics, and Corrosion and wear of the core 4A can be prevented.

In the description of the first aspect of the present invention, the carbon film is used for the formation.
The thin film 5 can be formed of O ₂ , Zr ₂ , Al ₂ O _2, etc., and the same effect can be obtained.

Furthermore, the second aspect of the present invention is, as shown in FIG. 5A, a rail surface of a slide rail 3 formed on a slide surface 2A of a head chip 2 provided with a magnetic head element 4.
A protective film 6 is formed on 3A, and the head chip 2 is bent by the action of internal stress of the protective film 6 so that a crown shape having a protrusion amount Δt is formed.

Further, in the case of FIG. 5B, the rail surface 3A of the slide rail 3 formed on the slide surface 2A of the head chip 2 provided with the magnetic head element 4 and the slide surface 2A.
Protective film 6 is formed on the back side 2B opposite to
By projecting the head chip 2 by the action of internal stress of the reinforcing film 6 formed on both sides of 3A and the back surface 2B, the protrusion amount Δt
The crown shape is formed.

The formation of such a protective film 6 is performed by forming a plurality of rod-shaped bodies 1A on which a magnetic head element 4 including a core 4A, a coil 4B and a connection pad 4C shown in FIG. 6B is formed. As shown in FIG. 6 (b), the rod-shaped body 1A held by the frame 13 and held by the frame 13 is placed in the chamber shown in FIG. 6 (c).
It is done by inserting it into 14A inside 14A.

For example, when the protective film 6 is formed of a thin film of SiO ₂ , the pressure inside the chamber 14A is set to 10 ⁻⁶ To.
Evacuate below rr, inject argon gas to 10mTorr, and target inside the chamber 14A 14A.
Alumina material is used as 12 and the target 12 has 1K of electric power.
A film can be formed by a power supply P that supplies W.

The protective film 6 thus formed contains
Normally, it has an internal stress of 0.1 GP and a force that compresses the rail surface 3A acts. In this case, the relational expression between the protective film 6 and the deflection amount of the head chip 2 can be expressed as follows (1 formula)
As shown in.

Here, E is the Young's modulus of the head chip 2, b is the thickness of the head chip 2, L is the length of the slide rail 3, and δ
Is the amount of deflection of the slide surface 3A, σ is the internal stress of the reinforcing film 6, and ν
Is the Poisson's ratio and d is the thickness of the protective film 6, d = Eb ² δ / 3 σ (1−ν) L ²・ ・ ・ ・ ・ ・ (Equation 1) ₂ O ₃ -TiC ceramic material, L is 2 mm, b is 0.5 mm, ν is 0.5, and E is 4 GPa.
Can be set to 50 nm.

Therefore, a SiO ₂ film having a film thickness of 50 nm is formed on the rail surface 3A.
By forming the protective film 6 of (3), it is possible to form a crown shape in which Δt has a protrusion amount of 30 nm. Also, the protective film 6
When using a hydrogen carbon film, the chamber
The internal 14A pressure of 14 was evacuated to 10 ^-6 Torr or less, and a mixed gas of argon gas and hydrocarbon gas such as methane was discharged at 10 mT.
It is possible to form a film by injecting so as to become orr, by providing a target made of a carbon material in the interior 14A of the chamber 14, and by supplying a power P of DC power of 1 KW.

The internal stress due to such a hydrogen carbon film can be controlled in the range of 0.3 GPa to 1 GPa according to the hydrogen content, so that if the internal stress is set to 1 GPa, the film thickness is more than The bending amount δ can be set to 30 nm by reducing d to about 5 nm.

Further, in the case of the hydrogen carbon film, the slidability is excellent, and since the reinforcing film 6 is formed so as to cover the core 4A, the characteristics of the core 4A are adversely affected by forming the film as thin as possible. Can be prevented.

Further, the formation of such a hydrogen carbon film can also be performed by a plasma CVD method,
In this case, the pressure inside the chamber 14 14A is set to 10 ^-4 Torr.
Evacuate below, inject a mixed gas of argon gas and hydrocarbon such as diphenylethane to 100 mTorr, and apply FR power of 100 W between the electrodes.The protective film 6 thus formed is 2 GPa. It is possible to have an internal stress of, and the bending amount δ can be set to 30 nm by setting the film thickness d to about 2.5 nm.

On the other hand, in addition to the formation of the protective film 6 on the rail surface 3A of the slide rail 3, a protective film which causes tensile stress on the rear surface 2B side.
When 6 is deposited, the crown-shaped protrusion amount Δt can be further increased.

The protective film 6 having such a tensile stress is, for example, a FR power source in which a target 12 made of an alumina material is provided inside a chamber 14, an argon pressure is set to 50 mTorr, and a power density is 6 W / cm or more. By depositing a film with a film thickness d of 100 nm or more by sputtering, a tensile internal stress of 0.4 GPa is obtained, and the amount of deflection δ can be easily set to 60 nm.

Further, as shown in FIG. 7A, forming the protective film 6 on the rail surface 3A of the slider rail 3 is carried out by sputtering or CVD as described above to form SiO _{2 on the} strip-shaped plate member 11A. A protective film 6 made of a film or a hydrogen carbon film is formed in advance, and a plurality of plate members 11A are stacked so that the reinforcing film 6 is sandwiched.
The substrate 11 is formed by clamping with the clamper 15 as shown in (b), and the magnetic head element 4 is formed on the surface of the substrate 11 as shown in (c) of FIG. After the element 4 is formed, the head chip 2 is formed by cutting as shown by the alternate long and short dash line in (d) of FIG. 7 to form the protective film 6 on the rail surface 3A. it can.

When formed in this way, the core 4A of the magnetic head element 4 can be exposed on the surface of the protective film 6 formed on the rail surface 3A of the slide rail 3, and the core 4A described above can be used as a protective film. Compared to when covered by 6,
The recording / reproducing characteristics of the magnetic head element 4 can be improved.

Although the thin film 5 and the protective film 6 are formed only on the rail surface 3A of the slide rail 3 in the explanatory view of the present invention, the film formation on the rail surface 3A is not shown. It is also possible to form a film on the slider surface 2A at the same time, and even in this case, the same effect can be obtained.

[0043]

As described above, according to the present invention, the crown shape is formed by the thickness of the thin film formed on the rail surface of the slide rail, and the rail surface of the slide rail or the rail of the slide rail. The head chip is bent by forming a protective film on the surface and the back surface to form the crown shape, and the crown shape on the rail surface can be easily formed, and the quality is improved. It is possible to form a stable crown shape.

Therefore, in comparison with the conventional crown shape obtained by the hand wrap, the quality, durability and mass productivity are improved, and the practical effect is great.

[Brief description of drawings]

FIG. 1 is an explanatory view of the principle of the first invention.

FIG. 2 is an explanatory view of the principle of the second invention.

FIG. 3 is an explanatory diagram of an embodiment according to the first invention.

FIG. 4 is an explanatory view of forming a thin film of the present invention.

FIG. 5 is an explanatory diagram of an embodiment according to the second invention.

FIG. 6 is an explanatory view (No. 1) of forming a protective film of the present invention.

FIG. 7 is an explanatory view (No. 2) of forming a protective film of the present invention.

FIG. 8 is a conventional explanatory diagram.

[Explanation of symbols]

2 head chip 3 slide rail 4 magnetic head element 5 thin film 6 protective film 2B back surface 3A rail surface

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuyuki Sagara 1015 Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture, Fujitsu Limited

Claims (7)

[Claims] 1. A magnetic head element (4) is provided at a predetermined position of a head chip (2) formed so as to have a slide rail (3) on an air bearing surface, and a central portion of the slide rail (3) in the longitudinal direction. Is a flying magnetic head in which a crown shape is formed on the rail surface (3A) of the slide rail (3) so that the crown shape protrudes by a predetermined amount Δt, and the crown shape is a thin film laminated on the rail surface (3A).
A floating magnetic head formed by the thickness of (5). 2. A magnetic head element (4) is provided at a predetermined position of a head chip (2) formed to have a slide rail (3) on an air bearing surface, and the slide rail (3) has a central portion in the longitudinal direction. Is a flying magnetic head in which a crown shape is formed on the rail surface (3A) of the slide rail (3) so as to project a predetermined amount Δt, and the crown shape is formed by bending the head chip (2). The flying magnetic head characterized in that a reinforcing film (6) for exerting an internal stress action on the head chip (2) is formed on the rail surface (3A) so as to perform the above. 3. A magnetic head element (4) is provided at a predetermined position of a head chip (2) formed to have a slide rail (3) on an air bearing surface, and the slide rail (3) has a central portion in the longitudinal direction. Is a flying magnetic head in which a crown shape is formed on the rail surface (3A) of the slide rail (3) so as to project a predetermined amount Δt, and the crown shape is formed by bending the head chip (2). So that the rail surface (3A) and the back surface (2B) opposite the slide rail (3) are formed with a protective film (6) having an internal stress in the opposite direction. A floating magnetic head. 4. When forming the thin film (5) according to claim 1, sputtering is performed by accommodating the head chip (2) in a U-shaped jig (10) having a side wall (10A). , The height of the side wall (10A) at the time of the spattering
(H) is formed so as to protrude from the rail surface (3A), and the side walls (10A) are provided at both ends of the slide rail (3).
Is located so that the thickness of the thin film (5) is controlled to be thicker at the center of the slide rail (3) and thinner at both ends of the slide rail (3). 5. The protective film (6) according to claim 2, which is formed by forming a film on the rod-shaped body (1A) forming the head chip (2) by sputtering or CVD, and after forming the film, Manufacturing of the flying magnetic head, characterized in that the head chip (2) is formed by forming the protective film (6) on the slide surface (3A) by cutting the rod-shaped body (1A). Method. 6. The rod-shaped body according to claim 3, wherein the protective film (6) is formed on the surface of the rod-shaped body (1A) forming the head chip (2) by sputtering or CVD.
(1A) is formed by depositing a film on the back surface by sputtering, and by cutting the rod-shaped body (1A), the rail surface (3A) and the back surface (2B) have internal stresses in opposite directions. A method of manufacturing a flying magnetic head, characterized in that the head chip (2) on which a protective film (6) is formed is formed. 7. The substrate (11) forming the head chip (2) according to claim 2, is provided with a plurality of strip-shaped plate members (11A) on which the protective film (6) is formed in advance. 6) are laminated so as to be sandwiched, the magnetic head element (4) is formed on the substrate (11), then the substrate (11) is cut, and the rail surface (3A) is formed. By exposing the protective film (6) to the rail surface, the protective film (6) is
A method of manufacturing a flying magnetic head, comprising forming the head chip (2) formed on (3A).