JPH0764024A - Integrate type optical device and its manufacture - Google Patents

Abstract

PURPOSE:To improve the processing accuracy and the optical characteristic of an integrated type optical device provided with a transmission type diffraction optical element and a reflection type diffraction optical element on the identical main surface of a substrate and to provide a suitable manufacturing method therefor. CONSTITUTION:The reflection type diffraction optical elements 3, 4 and 5 are formed out of a second resin on the main surface 1a of the substrate 1 and a reflecting layer 5a is formed on the surfaces of the elements 3, 4 and 5. Besides, a first resin layer 7 whose property is different from the second resin is provided so as to cover the elements 3, 4 and 5. Then, a transmission type condensing lens 2 is formed out of the first resin 7 at a different position from the forming positions of the elements 3, 4 and 5. Besides, a semiconductor laser 13, an optical detector 14 and a reflecting layer 6b are provided on the back surface 1b of the substrate 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated optical device having a transmission type diffractive optical element and a reflection type diffractive optical element on the same substrate, and more particularly to an integrated type optical device having good processing accuracy and optical characteristics. The present invention relates to a mold optical device and a manufacturing method thereof.

[0002]

2. Description of the Related Art A diffractive optical element is thin and lightweight and suitable for integration, and has been attracting attention as an important component of an integrated optical device. For example, compact disc (CD)
6 and 7 show a conventional integrated optical device, which is used as an optical head for reading out signals from an optical recording element such as an optical disk, an optical card memory, or the like, for example, disclosed in Japanese Patent Laid-Open No. 4-219640. . FIG. 6 is a plan view showing the structure of a conventional integrated optical device, and FIG. 7 is a side view thereof. FIG. 8 shows a method of manufacturing this conventional integrated optical device.

As shown in FIGS. 6 and 8, in a conventional integrated optical device, two types of reflection type diffractive optical elements (reflection type collimator lens 16 and reflection type position signal detecting element 17) are provided on a glass substrate 1. A transmissive diffractive optical element (transmissive light condensing lenses 15a and 15b) is provided at a predetermined position. A semiconductor laser 13, a photodetector 14, and a reflective layer 6e are provided at predetermined positions on the back surface of the glass substrate 1.

As shown in FIG. 7, the light emitted obliquely from the semiconductor laser 13 toward the inside of the glass substrate 1 becomes a propagating light beam 9 a and enters the reflection type collimator lens 16. The light beam incident on the reflection type collimator lens 16 is reflected by the reflection layer 6c and is converted into a parallel light beam. The collimated light beam propagates inside the glass substrate 1 and is reflected by the reflection layer 6
It is reflected again by e and enters the transmission type light condensing lens 15a. The light beam incident on the transmissive light condensing lens 15a is obliquely output to the outside of the glass substrate 1 and becomes the light beam 10a condensed on the optical disc 12. The light beam 10a is reflected by the reflecting surface of the optical disc 12, and the reflected light beam 10b
Enters the transmissive light condensing lens 15b. The light beam incident on the transmissive light condensing lens 15b is collimated and becomes a propagating light beam 9b. The propagating light beam 9b is reflected by the reflecting layer 6e and is incident on the reflection type position signal detecting element (focus / track error signal detecting means) 17. The propagating light beam 9b is divided into two by the reflection type position signal detecting element 17, propagates inside the glass substrate 1, and is condensed by the four-division photodetector 14. Based on the signal detected by the photodetector 14,
The focus error signal and the track error signal, which are the reproduction signal and the position signal, are read out.

Next, a method of manufacturing the above conventional integrated optical device will be described with reference to FIG. As shown in FIG. 8, first, an electron beam resist such as PMMA or CMS is applied as the photosensitive resin 18 on the substrate 1 (step (a)). next,
The electron beam 11 is irradiated according to the film thickness distribution of the diffractive optical elements 15, 16 and 17 to be manufactured (step (b)),
The film thickness of the photosensitive resin 18 is changed by the development process (step (c)). Furthermore, the reflective diffractive optical elements 16 and 17
Reflective layers 6c, 6d, and 6e on the upper surface and the back surface of the substrate 1, respectively.
Are deposited and the semiconductor laser 13 and the photodetector 14 are attached to the back surface of the substrate 1 (step (d)). This completes the conventional integrated optical device.

[0006]

As is apparent from FIGS. 6 and 7, in the conventional integrated optical device, the reflective diffractive optical elements 16 and 17 and the transmissive diffractive optical elements 15a and 15 are used.
b is provided on the same surface of the substrate 1. On the other hand, as can be seen from the manufacturing method shown in FIG. 8, these reflective and transmissive diffractive optical elements are both formed by finely processing the same photosensitive resin by an electron beam drawing method. . However, the optimum grating shapes of the reflective diffractive optical element and the transmissive diffractive optical element are different from each other. The maximum groove depth of the reflective diffractive optical elements 16 and 17 is, for example, 0.24 μm. However, the maximum groove depth of the transmissive diffractive optical elements 15a and 15b is 1.3 μm. That is, the reflection type diffractive optical elements 16 and 17 are about 1/6 as thin as the transmission type diffractive optical elements 15a and 15b.

Reflective diffractive optical elements 16 and 1 are formed on the same substrate.
7 and the transmissive diffractive optical elements 15a and 15b are formed of the same resin, the transmissive diffractive optical element 15a, which has a deep groove depth, is formed on the substrate.
It is necessary to make the thickness 1.3 μm or more so as to conform to 15b. On the other hand, in the reflective diffractive optical elements 16 and 17, the maximum groove depth must be about 0.24 μm, and therefore the exposure amount of the electron beam is adjusted. However, when controlling so that the maximum groove depth is 0.24 μm for a resin film thickness of 1.3 μm, the groove depth is controlled according to the thickness ratio (about 6 times). The sex becomes worse. That is, the conventional manufacturing method has a problem that the processing accuracy is low and it is difficult to realize good optical characteristics. The transmission type diffractive optical elements (condensing lenses) 15a and 15b have a cycle smaller than that of the reflection type diffractive optical elements 16 and 17, for example, about 1/3. Therefore, a photosensitive resin having a high resolution is suitable for achieving further fine workability. However, with respect to the reflective diffractive optical elements 16 and 17, such a photosensitive resin having a high resolution is difficult to realize a smooth slope of the groove of the grating because of the shallow depth of these grooves, which is preferable. It has a problem that it is difficult to realize optical characteristics. That is, due to the difference in the characteristics required between the transmission type diffractive optical elements 15a and 15b and the reflection type diffractive optical elements 16 and 17, these optical elements are formed on the same surface of the glass substrate 1 using the same resin. However, there is a problem in that it is practically impossible to form both devices at the same time. The present invention has been made to solve the above-mentioned problems, and has good processing accuracy and optical characteristics while having a transmission type diffractive optical element and a reflection type diffractive optical element on the same surface of a substrate. An object is to provide an integrated optical device and a manufacturing method thereof.

[0008]

In order to solve the above problems, an integrated optical device according to the present invention has a transmission type diffractive optical element and a reflection type diffractive optical element on the same main surface of a substrate. An integrated optical device provided at different positions, wherein the transmissive diffractive optical element is formed of a first resin,
The reflective diffractive optical element is formed of a second resin different from the first resin. In the above structure, it is preferable that the first resin layer is provided on the reflective diffractive optical element. Further, a first resin layer is provided on the main surface of the substrate, and the first resin layer is formed.
It is preferable that the reflective diffractive optical element is formed on the resin layer. Further, each of the first resin and the second resin is preferably a photosensitive resin. Further, it is preferable that the first resin is a positive photosensitive resin and the second resin is a negative photosensitive resin. Further, it is preferable that the transmission type diffractive optical element is a light condensing lens and the reflection type diffractive optical element is a position signal detection optical element, a collimator lens and a wavelength selection lens. On the other hand, in the method for manufacturing an integrated optical device of the present invention, (1) a step of applying a second resin on the main surface of the substrate, (2) forming a reflective diffractive optical element on the second resin. Irradiating the position with a charged beam so as to correspond to the film thickness distribution of the reflective diffractive optical element, (3) developing the second resin, and changing the film thickness of the second resin , (4) a step of depositing a reflective layer so as to include a position where the reflective diffractive optical element is formed, (5) a step of applying a first resin on the main surface, (6) a first resin A step of irradiating a charged beam so as to correspond to a film thickness distribution of the transmission type diffractive optical element at a position where the transmission type diffractive optical element is formed, (7) developing the first resin,
It is configured to include a step of changing the film thickness of the first resin. Alternatively, in the method for manufacturing an integrated optical device according to the present invention, (1) a step of applying a first resin on the main surface of the substrate, (2) a step of applying a second resin on the first resin. And (3) a step of irradiating a position on the second resin where a reflective diffractive optical element is formed with a charged beam so as to correspond to a film thickness distribution of the reflective diffractive optical element, (4) the second Developing the resin to change the film thickness of the second resin, and (5) charging the film at the position where the transmission type diffractive optical element is formed so as to correspond to the film thickness distribution of the transmission type diffractive optical element. A step of irradiating a beam, (6) a step of developing the first resin to change the film thickness of the first resin, and (7) a step of forming the reflective diffractive optical element so as to include a position. It is configured to include a step of depositing a reflective layer. In each of the above structures, the thickness of the second resin applied is 0.55 λ / n to λ / n with respect to the refractive index (n) of the second resin and the wavelength (λ) of the incident light. It is preferable. Further, in the method for manufacturing an integrated optical device of the present invention, (1) a step of applying a first photosensitive resin on the main surface of the substrate, (2) a second photosensitive resin on the first resin. A step of applying a resin, and (3) a step of irradiating a position on the second photosensitive resin where a reflective diffractive optical element is formed with a charged beam so as to correspond to a film thickness distribution of the reflective diffractive optical element. , (4) a step of developing the second photosensitive resin, (5) a film thickness distribution of the transmissive diffractive optical element at a position where the transmissive diffractive optical element is formed on the first photosensitive resin. Irradiating a charged beam so as to correspond to (6)
Developing the first photosensitive resin, (7) creating a mold including the reflective diffractive optical element and the transmissive diffractive optical element, (8) using the mold to perform the reflection Type diffractive optical element and the transmissive diffractive optical element are simultaneously reproduced, and (9) a step of depositing a reflective layer so as to include a position where the reflective diffractive optical element is formed may be configured. Good.

[0009]

Since the transmissive type diffractive optical element and the reflective type diffractive optical element are formed on the same main surface of the substrate by using different resins, the optimum type according to the purpose of each element Optimum processing accuracy and optical characteristics are realized by selecting the resin and the coating thickness.

[0010]

【Example】

<First Embodiment> An integrated optical device of the present invention will be described with reference to FIGS. 1 and 2 showing a preferred first embodiment of the present invention. FIG. 1 is a side view showing the configuration of the integrated optical device according to the first embodiment and how the light beam propagates, collects light, etc., and FIG. 2 is a plan view thereof. The integrated optical device of the first embodiment is specifically an optical head for reading signals from optical recording elements such as compact discs (CDs), optical discs, and optical card memories. In FIG. 1, three reflection type diffractive optical elements (reflection type wavelength selection lens 5, reflection type collimator lens 4, reflection type position signal) formed of a second resin are provided on the surface (main surface) 1 a of the substrate 1. A detection element 3) is provided, and the surface of each reflective diffractive optical element 3, 4, 5 is covered with a reflective layer 6a. Further, a first resin layer 7 is provided on the reflective layer 6a so as to cover these elements 3, 4, and 5. Further, the transmission type light condensing lens 2 formed of the first resin is provided at a position different from the position where the reflection type diffractive optical elements 3, 4, 5 are formed on the main surface 1a of the substrate 1. On the back surface 1b of the substrate 1, the semiconductor laser 1
3, the photodetector 14 and the reflective layer 6b are provided.

The substrate 1 has only to be transparent with respect to the wavelength used, and has a thickness (dimension in the Z-axis direction) of 3 mm, a width (dimension in the X-axis direction) of 5 mm, and a length (dimension in the Y-axis direction) of 10 mm. Use glass. In particular, glass substrates such as quartz and BK7
It is stable in temperature. The reflective layers 6a and 6b are, for example, A
It is a metal layer of g, Al, Au, or the like. Also, the first and second
The resin is a photosensitive resin that is sensitive to a charged beam such as an electron beam and an ion beam, and is, for example, an electron beam resist. In this embodiment, the first resin is a positive type electron beam resist such as PMMA, and the second resin is a negative type electron beam resist such as CMS. The positive type photosensitive resin is such that when a charged beam is irradiated and development processing is performed, the residual film rate of the resin becomes smaller as the irradiation amount increases, and the negative type is the opposite.
The integrated optical device of the first embodiment has a structure in which the layer 7 of the first resin forming the transmissive diffractive optical element 2 is provided on the reflective layer 6a of the reflective diffractive optical elements 3, 4, and 5. . This has the effect of preventing oxidation of the metal reflective layer 6a and improving the environmental resistance of the reflective diffractive optical elements 3, 4, 5.
Further, although not shown, forming a resin layer also on the reflective layer 6b on the back surface 1b of the substrate 1 has the same effect.

Next, the operation of the integrated optical device of the first embodiment will be described. For example, the propagating light beam 9 emitted from the surface emitting end of the semiconductor laser 13 having a wavelength of 0.78 μm in an oblique direction with respect to the Z axis at an angle of, for example, 20 ° is, for example, a wavelength having a focal length of 1.6 mm and a diameter of 1 mm. Selection lens 5
Incident on. The wavelength selection lens 5 has a cycle that gradually decreases in the Y-axis direction and has a rectangular cross section.
It is also composed of a curved grating which is a part of the elliptic curve. The light beam incident on the wavelength selection lens 5 is reflected and diffracted with a diffraction efficiency of, for example, 5%, and only the diffracted light of the selected wavelength (for example, 0.78 μm) is emitted from the semiconductor laser 13
The light is condensed and incident on the surface emission end of. Since the first-order diffracted light of other wavelengths (for example, 0.77 to 0.79 μm) is not focused on the surface emission end and is blurred, the amount of incident light decreases as the distance from the selected wavelength increases. As a result, the laser oscillation wavelength of the semiconductor laser 13 is dragged to the selected wavelength, and the wavelength fluctuation is suppressed to about 0.2 nm.

Light transmitted through the wavelength selection lens 5 (zero-order diffracted light)
Is reflected by the reflective layer 6b, propagates through the substrate 1, and enters the reflective collimator lens 4 having a focal length of 9.6 mm and an aperture of 2 mm, for example. The light beam incident on the reflection type collimator lens 4 is reflected at the angle (propagation angle θ) of the optical axis as it is (for example, 20 °), and becomes a parallel light beam. The reflective collimator lens 4 is composed of an elliptical grating having a sawtooth-shaped cross section whose cycle becomes smaller toward the outer circumference. The center position of this elliptical grating has a structure that gradually shifts in the Y-axis direction toward the outer peripheral portion. By forming the reflective collimator lens 4 into such a shape, coma and astigmatism that are generally caused by the influence of oblique incidence are reduced, and a parallel light flux can be excellently formed.

For example, a collimated light beam having a width of 2 mm is repeatedly reflected and propagated inside the substrate 1, passes through the reflection type position signal detecting element 3, and its transmitted light has a diameter of 2 m, for example.
It is incident on the transmission type light condensing lens 2 having a focal length of 2 mm and a focal length of 2 mm. The light flux that has entered the transmissive light condenser lens 2 is output in the vertical direction and is condensed on the optical disk 12. Focused light flux 1
0 is reflected by the optical disc 12, and the reflected light flux is similarly incident on the transmissive light condensing lens 2 and is converted into a parallel light flux.
The collimated propagating light beam 9 ′ is repeatedly reflected and propagates in the opposite direction in the substrate 1, and the reflection type position signal detecting element 3
Incident on. The reflection-type position signal detection element 3 has, for example, a dimension of 2 mm in the X-axis direction, a dimension of 2 mm in the Y-axis direction, and a focal length of 10.4 mm, and functions as a focus / track error signal detection element. The reflection type position signal detecting element 3 is
It has a structure in which two reflective lenses having the same specifications and configured by a curved grating that is a part of an elliptic curve are arranged in an array (see FIG. 2). The propagating light beam 9'is divided into two by the reflection-type position signal detecting element 3 into the first-order diffracted light, and the substrate 1 is divided at a propagation angle of, for example, 30 ° on the optical axis.
Is repeatedly reflected and propagated in the inside of, and is condensed on the photodetector 14. Based on the signals detected by the two photodetectors 14, the focus error signal and the track error signal, which are the reproduction signal and the position signal, are read out.

The reflective collimator lens 4 is, for example, an in-line reflective diffractive optical lens having a saw-tooth cross section and a maximum groove depth of 0.24 μm. The transmissive objective lens 2 is an off-axis transmissive diffractive optical lens having a rectangular cross section and, for example, a groove depth of 0.80 μm. The reflection type wavelength selection lens 5 and the reflection type position signal detection lens 3 are of the off-axis type having the maximum groove depth of 0.12 μm, for example. All of these four optical elements are diffractive optical elements that collect light using the diffraction phenomenon of light. An in-line type diffractive optical lens is a lens in which the angle of the optical axis of the incident light and the angle of the optical axis of the emitted light match, and an off-axis type diffractive optical lens is the angle of the optical axis of the incident light. And a lens in which the angle of the optical axis of the emitted light is different. Since a diffractive optical element having a film thickness of at most about several μm is used as the optical element, it is possible to accurately align and integrate each diffractive optical element on the main surface 1a of the substrate 1 by using a known planar technique. It is possible to reduce the size and weight of the entire device and to stabilize the product.

Next, a manufacturing method suitable for manufacturing the integrated optical device according to the first embodiment will be described with reference to FIG.
First, the second resin 8 is applied to the substrate 1 by 0.3 μm, for example (step (a)). Next, the reflective diffractive optical element 3,
The positions where 4 and 5 are formed are irradiated with the electron beam 11 so as to correspond to the film thickness distribution (step (b)). further,
Development processing is performed to change the film thickness of the second resin 8 (step (c)). A reflection layer 6a is deposited, for example, 4000 angstrom so as to include these elements 3, 4, and 5 (step (d)). After that, the first resin 7 is, for example,
85 μm is applied (step (e)). From above, the electron beam 11 is irradiated to the position where the transmission type diffractive optical element 2 is formed so as to correspond to the film thickness distribution (step (f)).
Further, the first resin 7 is subjected to a development process to obtain the first resin 7
The film thickness of is changed (step (g)). At the same time, a reflection layer 6b is deposited on the back surface 1b of the substrate 1 by, for example, 2000 angstrom, and the semiconductor laser 13 and the photodetector 14 are mounted on the back surface of the substrate 1 (step (g)). As described above, the integrated optical device shown in FIGS. 1 and 2 is completed.

In the method of manufacturing the integrated optical device according to the first embodiment, the resin coating and the reflection diffractive optics for forming the transmissive diffractive optical lens 2 are performed only by coating the first resin 7 once. Application of resin for protecting the elements 3, 4, and 5 can be realized at the same time. Although the photosensitive resin is irradiated with the electron beam in this embodiment, it may be another charged beam such as an ion beam. The coating thickness of the second resin 8 needs to be thicker than the maximum depth of the grooves of the reflective diffractive optical elements 3, 4 and 5 to be manufactured. It was confirmed that when the film thickness is selected to be double to double, it is possible to absorb the film loss that occurs when the period of the diffractive optical element is small, and to form a diffractive optical element having a desired groove depth. That is, the maximum groove depth of the reflective collimator lens 4 is the refractive index n of the second resin.
And the wavelength λ of the incident light is approximately given by L _R = λ / 2n, the coating thickness of the second resin 8 is 0.55λ
It has been found that it is preferably in the range of / n to λ / n. Further, the coating film thickness of the first resin 7 needs to be larger than the maximum depth of the groove of the transmission type diffractive optical element 2 to be manufactured. However, in the case of using a positive resist, it is as large as in the case of a negative resist. It was not necessary to do it, but at most 1.2 times was sufficient. That is, the maximum groove depth of the transmissive light condensing lens 2 is approximately L _T = λ / 2 (n′−1) with respect to the refractive index n ′ of the first resin and the wavelength λ of the incident light. ), The coating thickness of the first resin 7 is 0.6λ /
It has been found that the value may be (n'-1) or less.

<Second Embodiment> An integrated optical device according to the present invention will be described with reference to FIG. 4 showing a preferred second embodiment thereof. FIG. 4 is a side view showing the configuration of the integrated optical device according to the second embodiment and the manner of propagation and collection of light beams. Note that the plan view is substantially the same as FIG.
The integrated optical device of the second embodiment is an optical head that reads out the signal of the optical recording element, like the integrated optical device of the first embodiment. Further, the constituent elements denoted by the same reference numerals as those of the first embodiment shown in FIGS. 1 and 2 are substantially the same, and thus the description thereof will be omitted. In the integrated optical device of the present embodiment shown in FIG. 4, the first resin layer 7 is provided on the main surface (front surface) of the substrate 1, and the reflection type diffractive optical element 3 is provided on the first resin layer 7. 4 and 5 are formed. A positive electron beam resist such as PMMA was used as the first resin, and a negative electron beam resist such as CMS was used as the second resin. Other configurations are the same as those in the first embodiment.

Next, the second integrated optical device according to the present invention described above.
A manufacturing method suitable for the embodiment will be described with reference to FIG. As shown in FIG. 5, first, the first resin 7 is applied on the main surface 1a of the substrate 1, and then the second resin 8 is applied thereon (step (a)). Next, the reflective diffractive optical elements 3, 4,
The position where 5 is formed is irradiated with the electron beam 11 so as to correspond to the film thickness distribution of the reflective diffractive optical elements 3, 4, and 5 (step (b)). Further, development processing is performed to change the film thickness of the second resin 8 (step (c)). After that, the position where the transmission type diffractive optical element 2 is formed is irradiated with the electron beam 11 so as to correspond to the film thickness distribution of the transmission type diffractive optical element 2 (step (d)). Then, development processing is performed to change the film thickness of the first resin 7 (step (e)). The reflective layer 6a is deposited so as to include the positions where the reflective diffractive optical elements 3, 4, and 5 are formed (step (f)). At the same time, a reflection layer 6b is deposited on the back surface 1b of the substrate 1, for example, 2000 angstrom, and the semiconductor laser 13 and the photodetector 14 are mounted on the back surface of the substrate 1 (step (f)). In this way, the integrated optical device according to the second example is completed.

In the integrated optical device according to the second embodiment, the deposition of the reflective layer 6a is performed by processing the shapes of both the transmissive diffractive optical element 2 and the reflective diffractive optical elements 3 ', 4', 5 '. It is suitable for mass production using the replication method because it is performed after the completion of. That is, after manufacturing an integrated optical device by the step (e) shown in FIG. , Nickel electroforming, for example. By using this mold, the reflective diffractive optical elements 3 ′, 4 ′ and 5 ′ and the transmissive diffractive optical element 2 are separated by, for example, U
The V-curable resin allows for simultaneous replication.
Then, the reflective layer 6a is deposited so as to include the positions where the reflective diffractive optical elements 3 ', 4', 5'are formed. Therefore,
Once the prototype device (step (e) in FIG. 5) is formed, thereafter, it is possible to mass-produce by a replication method without using electron beam drawing each time.

In the first and second embodiments, the light condensing lens, the collimator lens and the like are named for the sake of convenience, and have the same meanings as lenses in general. Further, in each of the above-described embodiments, the case of the optical head for reading the signal of the optical recording element is described, but the same effect can be obtained for other optical devices including the transmission type and the reflection type diffractive optical elements on the substrate. is there.

[0022]

According to the present invention, since the transmission type diffractive optical element and the reflection type diffractive optical element are formed on the same main surface of the substrate by using resins having different properties, respectively. It is possible to realize the processing accuracy and optical characteristics required by the optical element. Moreover, since a diffractive optical element with a film thickness of at most about several μm is used as an optical element, it is possible to accurately align and integrate each diffractive optical element on the main surface of the substrate by using a known planar technology. become.

[Brief description of drawings]

FIG. 1 is a side view showing a configuration of a preferred first embodiment of an integrated optical device according to the present invention, and how light beams are propagated and condensed.

FIG. 2 is a plan view showing the configuration of the first embodiment.

FIG. 3 is a process chart showing a manufacturing method suitable for the integrated optical device according to the first example.

FIG. 4 is a side view showing the configuration of a second preferred embodiment of the integrated optical device of the present invention and how the light beam propagates and is condensed.

FIG. 5 is a process diagram showing a manufacturing method suitable for an integrated optical device according to a second example.

FIG. 6 is a plan view showing the configuration of a conventional integrated optical device.

FIG. 7 is a side view showing the configuration of a conventional integrated optical device.

FIG. 8 is a process diagram showing a method for manufacturing a conventional integrated optical device.

[Explanation of symbols]

 1 substrate 2 transmission type light condensing lens 3 reflection type position signal detecting element 4 reflection type collimator lens 5 reflection type wavelength selection lens 6 reflection layer 7 first resin 8 second resin 9 propagating light 10 outgoing light 11 electron beam 12 Optical disc 13 Semiconductor laser 14 Photodetector

Claims (10)

[Claims] 1. An integrated optical device in which a transmissive diffractive optical element and a reflective diffractive optical element are provided at different positions on the same main surface of a substrate, wherein the transmissive diffractive optical element is a first resin. And the reflection type diffractive optical element is formed of a second resin different from the first resin. 2. The integrated optical device according to claim 1, wherein a first resin layer is provided on the reflective diffractive optical element. 3. The integrated optical device according to claim 1, wherein a first resin layer is provided on the main surface of the substrate, and a reflective diffractive optical element is formed on the first resin layer. 4. The integrated optical device according to claim 1, wherein each of the first resin and the second resin is a photosensitive resin. 5. The first resin is a positive photosensitive resin,
The integrated optical device according to claim 4, wherein the second resin is a negative photosensitive resin. 6. The integrated type according to claim 1, wherein the transmission type diffractive optical element is a light condensing lens, and the reflection type diffractive optical element is a position signal detection optical element, a collimator lens and a wavelength selection lens. Optical device. 7. (1) a step of applying a second resin on the main surface of the substrate; (2) the reflection type diffractive optical element at a position where the reflection type diffractive optical element on the second resin is formed. Irradiating the charged beam so as to correspond to the film thickness distribution of (3) developing the second resin to change the film thickness of the second resin, (4) the reflective diffraction optics A step of depositing a reflection layer so as to include a position where an element is formed, (5) a step of applying a first resin on the main surface, (6) a transmission type diffractive optical element formed on the first resin A step of irradiating a charged beam to a position corresponding to the film thickness distribution of the transmissive diffractive optical element, (7) developing the first resin to change the film thickness of the first resin A method of manufacturing an integrated optical device, comprising the steps of: 8. (1) A step of applying a first resin on a main surface of a substrate, (2) A step of applying a second resin on the first resin, (3) A second resin A step of irradiating a charged beam to a position where the upper reflective diffractive optical element is formed so as to correspond to a film thickness distribution of the reflective diffractive optical element, (4) developing the second resin, and 2) changing the film thickness of the resin, (5) irradiating the position where the transmission type diffractive optical element is formed with a charged beam so as to correspond to the film thickness distribution of the transmission type diffractive optical element, (6) Developing the first resin to change the film thickness of the first resin; and (7) depositing a reflective layer so as to include a position where the reflective diffractive optical element is formed. Manufacturing method of integrated optical device. 9. The film thickness of the second resin applied, with respect to the refractive index (n) of the second resin and the wavelength (λ) of incident light,
The method for manufacturing an integrated optical device according to claim 8 or 9, wherein 0.55 λ / n to λ / n is set. 10. (1) A step of applying a first photosensitive resin on the main surface of a substrate, (2) A step of applying a second photosensitive resin on the first resin, (3) A step of irradiating a position on the second photosensitive resin where the reflective diffractive optical element is formed with a charged beam so as to correspond to the film thickness distribution of the reflective diffractive optical element, (4) the second photosensitive material (5) Irradiating a position on the first photosensitive resin where a transmission type diffractive optical element is formed with a charged beam so as to correspond to the film thickness distribution of the transmission type diffractive optical element. (6) a step of developing the first photosensitive resin, (7) a step of producing a mold including the reflective diffractive optical element and the transmissive diffractive optical element, (8) the mold Simultaneously replicate the reflective diffractive optical element and the transmissive diffractive optical element using That step, (9) so as to include a position for forming the reflection type diffractive optical element, manufacturing method of an integrated optical device comprising the step of depositing a reflective layer.