JPH0763914A - Method and device for smoothing of resin coating film - Google Patents

Abstract

PURPOSE:To decrease defects caused by a peeling member and to efficiently smooth a film by using such a resin film as a peeling member that has specified thickness and contains infusible silicone resin having a specified average particle size. CONSTITUTION:A supporting substrate 2a on which a resin coating film 2b is formed is mounted by vacuum sucking on a heating surface plate 1 which can be travelled at a constant speed. A smoothing roller 6 for heating and pressing is disposed above the zone where the heating surface plate 1 is travelled. A supplying device 3 for the peeling member is also disposed so that the peeling member 4 is supplied through a guide roller 5 to separate the smoothing roller 6 and the heating surface plate 1. As for the peeling member 4, such a resin film is used that has 25-100mum thickness and contains 1-30wt.% infusible silicone resin particles having 0.1-5mum average particle size. The resin film is preferably a film showing little thermal deformation during pressing and heating, and a polyethylene terephthalate film or the like is used.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for smoothing a resin film on a member having a resin film on a supporting substrate.

[0002]

2. Description of the Related Art In recent years, resin-coated substrates have been widely used for various electronic component materials. Examples thereof include thermal heads, hybrid IC multilayer circuit boards, and color filters used in liquid crystal display devices. In particular, since the smoothness of the coated resin surface of the thermal head, the color filter, etc. directly affects the characteristics of electronic parts, a smoothing method having efficient and excellent surface flatness is desired.

A conventional smoothing method will be described by taking a thermal head and a color filter as an example. In place of the high-resistor formed as a heat insulating layer that controls heat dissipation and heat storage on the ceramic substrate, a heat-resistant insulating substrate made of polyimide resin as a heat insulating layer is used as a thermal head. Attention has been paid. Such a thermal head has excellent thermal efficiency because the thermal diffusivity of the polyimide resin is 1/3 to 1/6 smaller than that of the conventional glaze glass layer. Further, when a flexible substrate such as a metal substrate is used, it is possible to perform a bending process, and a compact and inexpensive high-performance thermal head can be obtained. But,
In such a thermal head, since an inorganic thin film or a metal thin film for forming a heating resistor or an electrode is required on the polyimide resin layer of the heat insulating layer, defects such as voids and protrusions and surface irregularities are minimized. It is necessary to suppress it and smooth the surface. As a method of smoothing the surface, a polyamic acid varnish, which is a precursor of a polyimide resin, is applied on a supporting substrate and heated at a temperature at which imidization is not performed to remove the solvent to remove the polyamic acid thin film formed on the substrate. A method has been proposed in which a polyamic acid thin film is imidized to form a polyimide resin layer by heating after heating and pressing with a smoothing roller to smooth the surface.

Further, in a color filter used in a color liquid crystal display device, a colored layer in which a pigment or a dye is dispersed in a resin binder is formed on a glass substrate, and a protective layer made of a transparent resin and a transparent electrode are formed thereon. It has a formed structure. In this case, in order to maintain the cell gap of the liquid crystal display device and prevent various optical losses, it is necessary to minimize defects such as voids and protrusions and surface irregularities. In the case of a color filter, in the dry state where the solvent contained in the colored layer formed on the glass substrate is evaporated, this colored layer is heated and pressed by a smoothing roller through a peeling member to be smoothed, and then the colored layer. There has been proposed a method of heat curing the. In addition, a transparent protective layer such as epoxy resin or acrylic resin is formed on the colored layer, and in a dry state where the solvent contained in the transparent protective layer is evaporated, the transparent protective layer is heated and heated by a smoothing roller through a peeling member. A method has been proposed in which the material is pressed and smoothed, and then heat-cured.

As a device for automatically and smoothly smoothing the above resin coating, a transporting means for transporting the support substrate on which the resin coating is formed, and a peeling member supplying section having a stopping mechanism for feeding the peeling member. A smoothing processing device including a smoothing roller that heats and presses a peeling member and a resin coating, a peeling roller that peels the peeling member after smoothing, and a winding unit that has a motor mechanism that winds the peeling member. Proposed.

Conventionally, as a peeling member of a smoothing apparatus, a silicone resin is applied as a release layer on the surface of a polyethylene terephthalate (PET) film having a thickness of 25 to 100 μm, which is strong against heat and whose tension can be easily controlled. Peel force is 10
A release film of ~ 50g / 50mm is often used. As a coating method of the silicone resin, after the resin is diluted and dissolved with a solvent, a catalyst is mixed just before the start of use and coating is carried out with a roll coater or the like. ing.

[0007]

However, the conventional peeling member has the following problems. The film coated with the silicone resin is sequentially wound up, but if air is entrained at that time, unevenness in winding of the film occurs. Once uneven winding occurs, the film tries to return to the original axis, and the peeling member and the back surface of the film rub against each other. At this time, the release layer is damaged and the release layer is lost. If the smoothing process is performed in this state, there arises a problem that defects such as transfer of scratches to the coloring layer of the color filter are caused.

In order to prevent the entrainment of air during winding, inorganic fine particles called a lubricant are mixed in the resin film,
There is a method to make the film surface slippery, but in this case, the smoothness of the film surface deteriorates and it is not suitable for smoothing treatment, and the problem that the lubricant damages the colored layer of the color filter at the time of peeling the film is there.

The present invention has been made to address such a problem, and in smoothing the resin film by applying pressure through the peeling member, the defects caused by the peeling member are reduced and the smoothing is efficiently performed. It is an object of the present invention to provide an apparatus and a method capable of doing the above.

[0010]

The method for smoothing a resin coating of the present invention is a method for smoothing a resin coating, wherein the surface of the resin coating formed on a supporting substrate is smoothed by applying pressure through a peeling member. , The peeling member has an average particle size of 0.1 to 5 μ
A resin film having a thickness of 25 to 100 μm and containing 1 to 30% by weight of m non-melting silicone resin particles.

Further, the apparatus for smoothing a resin film of the present invention comprises a conveying means for conveying a supporting substrate, a peeling member supply section for feeding the peeling member, a heating member for heating the peeling member and the resin film.
In a smoothing apparatus for a resin film, which comprises a smoothing roller for pressing, a peeling roller for peeling the peeling member, and a winding section for winding the peeling member, the peeling member has an average particle size of
A resin film having a thickness of 25 to 100 μm and containing 1 to 30% by weight of non-melting silicone resin particles of 0.1 to 5 μm.

The resin film according to the present invention is preferably a film which is less likely to be deformed by heat during pressurization and heating. Polyethylene terephthalate (PET) as such a film
Examples thereof include films and polyethylene naphthalate (PEN) films. Film thickness is 25-100
The thickness of μm, preferably 38 to 75 μm, can efficiently smooth the resin film. That is, if the film thickness is less than 25 μm, it is difficult to control the tension sufficiently, and if the film thickness exceeds 100 μm, the heat transfer to the resin coating is deteriorated and the smoothing efficiency is lowered.

The non-melting silicone resin particles according to the present invention are fine particles of polyorganosiloxane resin having a three-dimensional network structure due to siloxane bonds. The organic group bonded to the silicon atom of the polyorganosiloxane is a monovalent substituted or unsubstituted hydrocarbon group, which is an aliphatic hydrocarbon group such as a methyl group or an ethyl group, or an aromatic hydrocarbon group such as a phenyl group. And unsaturated hydrocarbon groups such as vinyl groups. The organic group bonded to the silicon atom of the polyorganosiloxane is an important factor involved in the releasability of the non-melting silicone resin particles, and it is desirable to change it depending on the resin film material used. For example,
A phenyl group is desirable in a PET film.

The silicone resin is generally available as a silicone varnish obtained by dissolving the precondensate in a suitable solvent, but the non-melting silicone resin particles are substantially cured by, for example, removing the solvent of the silicone varnish. It is an insoluble and infusible powdery substance.

The particle size of the non-melting silicone resin particles when blended in the resin film is such that the average particle size is from 0.1 to 5 μm, preferably from 0.5 to 2 μm. If the average particle size exceeds 5 μm, the flatness of the film becomes insufficient, and if it is less than 0.1 μm, it becomes difficult to obtain monodisperse particles, and surface projections are easily formed.

The shape of the non-melting silicone resin particles is preferably spherical, and the sphericity f represented by the following formula (I) is preferably 0.7 or more, more preferably 0.8 or more. f = (A / (π / 4) / D _max ) ^1/2 …………………… (I) where A is the cross-sectional area of the resin particles and D _max is the cross-section of the resin particles. Is the longest diameter of.

Further, the blending amount of the non-melting silicone resin particles is 1 to 30% by weight, preferably 5 to 20% by weight, based on the resin film. If the content is less than 1% by weight, sufficient releasability cannot be obtained, and if it exceeds 30% by weight, the releasability effect is saturated.

Alternatively, a resin film containing non-melting silicone resin particles coated with a silicone-based release agent having a release force of 10 to 50 g / 50 mm may be used as the release member.

[0019]

By adding non-melting silicone resin particles satisfying the above-mentioned conditions to the resin film, the density of the non-melting silicone resin particles becomes high near the surface of the resin film. As a result, it is possible to prevent scratches caused by rubbing of the resin film and scratches in the colored layer when a large amount of lubricant is contained.

[0020]

Embodiments of the present invention will be described below with reference to the drawings. Example 1 A smoothing processing apparatus is shown in FIG. The smoothing processing procedure is shown in FIG. An outline of the device will be described with reference to FIG. 1a. For example, with a combination of AC servo motor / LM guide / ball screw screw, heating platen 1 capable of running at a constant speed
A support substrate 2a on which a resin coating 2b is formed is vacuum-sucked and placed. Taking a color filter for a liquid crystal display device as an example, the resin coating 2b corresponds to a colored layer and the support substrate 2a corresponds to a glass substrate. A smoothing roller 6 for heating and pressing is installed above the heating platen 1. Further, a peeling member supply device 3 is provided so that the peeling member 4 can be supplied between the heating platen 1 and the smoothing roller 6 via the guide roller 5.
A peeling roller 7 is provided downstream of the smoothing roller 6, and automatic peeling is possible by combination with the film feed roller 8 including a drive roller 8a and a guide roller 8b. The peeling member 4 is finally wound up by the peeling member winding device 9. The peeling member supply device 3 is provided with a reverse rotation drive device, a braking device, a bower brake, etc., which are not shown, and the peeling member winding device 9 is provided with a torque motor and a braking device, which are not shown. The tension of the member 4 is controlled. An enlarged cross-sectional view of the peeling member 4 is shown in FIG. 1b.

Next, the procedure for smoothing the resin coating using this apparatus will be described with reference to FIG. First, after setting the heating platen 1 and the smoothing roller 6 to a predetermined temperature, the supporting substrate 2b having the resin film 2a formed thereon is vacuum-adsorbed on the heating platen 1 with the resin film 2a facing upward and preheated for a predetermined time. I do. Until the heating platen 1 reaches below the smoothing roller 6, the smoothing roller 6 and the peeling roller 7 are above the heating platen 1 (FIG. 2A).

Immediately before the tip of the heating platen 1 reaches below the smoothing roller 6, the peeling member winding device 9 is rotationally driven to move the peeling member 4 to the right, whereby the peeling member 4 is not moved. The surface to be used faces the resin film 2a whose surface should be smooth (FIG. 2 (b)).

Next, when the tip of the support substrate 2b having the resin coating 2a formed thereon reaches below the smoothing roller 6,
The smoothing roller 6 and the peeling roller 7 descend and start smoothing. While the smoothing process is being performed, the peeling member supply device 3 and the peeling member winding device 9 are driven to apply an appropriate tension to the peeling member 4, and the film is heated and pressed by the peeling member 4. It absorbs elongation and prevents unevenness on the smooth surface of the resin coating. The smoothed resin film surface keeps the peeling member 4 in close contact with the surface of the smoothed resin film until the smoothing of the entire surface is completed in order to prevent the occurrence of lateral stripes (FIG. 2C).

Next, when the smoothing of the entire surface of the resin coating 2a is completed, the peeling roller 7 is raised and the
(D)), The peeling member 4 that is in close contact with the resin coating 2a is peeled off at once with the film feed roller 8 suppressing the slack of the film (FIG. 2 (e)).

Finally, the smoothing roller 6 is raised to return the heating platen 1 to its original position, and a series of smoothing processing is completed (FIG. 2 (f)).

Example 2 The surface of the color filter of the liquid crystal display device was smoothed by using the apparatus shown in Example 1. The surface of a 1.15-mm thick 4095F glass substrate (trade name, manufactured by Corning Incorporated) on which a black matrix made of metallic chromium is formed is washed by light cleaning using UV / O _3, and then the intaglio offset printing method is used. A colored ink film mainly composed of an epoxy resin varnish containing at least an organic pigment and a solvent is used to form a colored ink film having a maximum film thickness of 3.5 to 4.5 μm in a predetermined pattern. After that, the solvent in the colored ink film is removed at a temperature of 70 to 100 ° C. at which thermal curing does not occur, and then smoothing treatment is performed.

The peeling member and the smoothing treatment conditions are as follows. Separation member: Biaxially stretched PET film having a thickness of 38 to 100 μm, an average particle size of 0.8 to 1.0 μm, a sphericity f 0.87 to 0.93,
Non-melting Silicone Resin Powder Using Phenyl Group as Organic Group Bonding to Silicon Atom of Polyorganosiloxane 10
Release film with added weight%.

Smoothing conditions: preheating temperature 85 to 100 ° C. smoothing roll temperature 85 to 100 ° C. pressure 10 to 15 kg / cm feeding speed 15 to 30 cm / min. The color filter coloring layer obtained by performing the smoothing treatment. No scratches were found.

Example 3 The apparatus shown in Example 1 was used to smooth the surface of a thermal head using a resin-coated metal plate. 16 ~ 0.5mm thick
After activating the surface of 18% Cr-Fe alloy in dilute sulfuric acid at 40 to 60 ° C for 1 to 2 minutes, polyamic acid, which is a precursor of polyimide, is applied using a roll coater, and imidization at 60 to 120 ° C occurs. After removing the solvent in the coating film at a non-existent temperature, smoothing treatment is performed.

The peeling member and the smoothing treatment conditions are as follows. Separation member: A biaxially stretched PEN film having a thickness of 25 to 100 μm, an average particle size of 0.5 to 0.8 μm, a sphericity f 0.75 to 0.85,
Non-melting Silicone Resin Powder Using Phenyl Group as Organic Group Bonding to Silicon Atom of Polyorganosiloxane 7
Release film with added weight%.

Smoothing conditions: preheating temperature 85 to 90 ° C. smoothing roll temperature 90 to 105 ° C. pressure 10 to 15 kg / cm feeding speed 20 to 50 cm / min. Surface layer of a thermal head obtained by performing smoothing treatment No scratches were found on.

Example 4 Example 2 except that the surface of the non-melting silicone resin powder-added release member used in Example 2 was coated with a silicone release agent having a release force of 10 to 50 g / 50 mm was used as the release member. The surface of the color filter of the liquid crystal display device prepared in Example 2 was smoothed using the same apparatus and under the same conditions.

No scratch was observed in the color filter coloring layer obtained by the smoothing treatment. Further, no release layer was observed on the surface of the peeling member.

Comparative Example 1 A biaxially stretched PET film having a thickness of 38 to 100 μm has a peeling force.
The surface of the color filter of the liquid crystal display device prepared in Example 2 was smoothed under the same conditions and conditions as in Example 2 except that the release member was coated with 10 to 50 g / 50 mm of silicone release agent. did.

Although the surface condition of the peeling member is excellent in smoothness, the peeling layer on the film is found to be missing, and a defect having the same shape as the release layer is generated on the color filter side obtained by performing the smoothing treatment. It was recognized that

Comparative Example 2 A peeling force of 10 to 50 g / 50 was applied to the surface of the peeling member used in Example 2 except that 35% by weight of non-melting silicone resin powder was added.
The surface of the color filter of the liquid crystal display device prepared in Example 2 was smoothed under the same apparatus and conditions as in Example 2 except that a silicone-based release agent having a thickness of 3 mm was used as the release member.

The surface condition of the peeling member was poor in smoothness, the peeling layer on the film was missing, and a large amount of scratches were generated on the color filter side obtained by performing the smoothing treatment. Admitted.

[0038]

The method for smoothing a resin coating, which is smoothed by pressing through the peeling member of the present invention, comprises 1 to 30 weight of non-melting silicone resin particles having an average particle diameter of 0.1 to 5 μm as the peeling member. %, A resin film having a thickness of 25 to 100 μm is used, so that the surface of the resin film is less likely to be scratched, and unevenness due to the release film having a smooth surface can be easily prevented.

Further, since the smoothing apparatus of the present invention uses the above-mentioned resin film as a peeling member, it is possible to perform a stable smoothing treatment without damaging the surface of the resin coating.

[Brief description of drawings]

FIG. 1 is a diagram showing a smoothing processing apparatus of the present invention.

FIG. 2 is a diagram showing a smoothing processing procedure of the present invention.

[Explanation of symbols]

1 ... Heating platen, 2a ... Support substrate, 2b ... Resin coating, 3 ... Stripping member supply device, 4 ... Stripping member, 5 ... Guide roller, 6 ... Smooth Roller, 7
……… Peeling roller, 8a ……… Film feed roller, 9
……… Peeling member winding device.

Claims (2)

[Claims] 1. A method for smoothing a resin coating formed by pressing the surface of a resin coating formed on a supporting substrate through a peeling member, wherein the peeling member has a mean particle size of 0.1 to 5 μm. Containing 1 to 30% by weight of meltable silicone resin particles, thickness 25 to 100
A method for smoothing a resin coating, which is a resin film having a thickness of μm. 2. A conveying means for conveying a supporting substrate, a peeling member supply section for feeding a peeling member, a smoothing roller for heating / pressurizing the peeling member and the resin coating, and a peeling roller for peeling the peeling member. In a smoothing device for a resin film, comprising: a winding unit that winds the peeling member, the peeling member contains 1 to 30% by weight of non-melting silicone resin particles having an average particle diameter of 0.1 to 5 μm, Thickness 25-100
An apparatus for smoothing a resin coating, which is a resin film of μm.