JPH0762112A - Heat bonding of olefin resin molding - Google Patents

Abstract

PURPOSE:To provide a method of heat-bonding an olefin resin molding which can give an easy-release container (packaging material) by forming a coating layer of a specified quat. ammonium salt type acrylic copolymer on the surface of a molding. CONSTITUTION:A quat. ammonium salt type acrylic polymer layer is formed on the surface of a propylene resin molding, and the obtained molding is laminated with a molding having an ethylene resin layer of a melting point at least 15 deg.C-below that of the propylene resin, and both the molding are heat-bonded to each other. The above quat. ammonium salt type acrylic polymer comprises structural units of formula I (wherein A is -O- or -NH-; R<1> is H or methyl; R<2> is 2-4C alkylene, -CH2-CH(OH)-CH2-; R<3> to R<6> are each 1-3C alkyl; R<7> is 1-10C alkyl or 7-10 C aralkyl; n is 1-3; and X is chlorine, bromine or iodine, structural units of formula II (wherein R<8> is H or methyl; R<9> is 1-22C alkyl, 7-22C aralkyl or 5-22C cycloalkyl) and structural units of other copolymerizable monomers. The ratio by weight among them is (30-7):(30-70):(0-40).

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat of an olefin resin molded article suitable for providing an easily peelable container (packaging body) for providing a container for electronic parts, a container for jams, a container for foodstuffs such as broth and the like. Regarding the bonding method.

[0002]

2. Description of the Related Art Conventionally, as a tape for storing electronic parts, JIS-C0806-1990 and JP-A-2-5757 have been used.
As disclosed in Japanese Patent No. 6 and the like, the following and are known. A carrier tape (a) made of pulp paper in which a square hole 2 for storing electronic parts, a large number of feed holes 3 provided in parallel with the square hole are provided in a regular arrangement, and the front surface and the back surface of the carrier tape are provided. A resin top cover film (b) comprising a laminate of a polyethylene terephthalate base layer and an ethylene / vinyl acetate copolymer adhesive layer, which seals the attached square holes 2 for storage but does not seal the feed holes 3; A square hole punch carrier type electronic component storage tape 1 (see FIG. 2) made of a resin bottom cover film (c). A recess 2'for accommodating electronic parts obtained by forming a sheet of polyvinyl chloride, polystyrene, polyethylene terephthalate or the like by vacuum forming or the like, and a resin embossed carrier tape a'provided with feed holes 3 formed by perforation. An embossed carrier type electronic component storage tape 1 '(see FIG. 3) having a top cover film b made of the above-mentioned laminated body adhered on the upper surface, which seals the storage recess 2'and does not seal the feed hole 3 .

This electronic component storage tape is obtained by storing electronic components in a carrier tape, laminating a top cover film, and heating and adhering from the top cover film side. However, since the carrier tape is a pulp paper, the storage tape of (1) has a large surface smoothness (Beck's smoothness) and its average roughness is not uniform. There is a large variation in fusion strength, and there are places where the top cover film can be easily peeled off with a force of usually 20 to 70 g, and there are also places where the heat fusion strength is as large as 150 to 200 g. In peeling off the strong portion, delamination of the pulp paper may occur, the carrier tape may dance, the storage position of the electronic component may be slightly displaced, and a mistake may occur in the work of taking out the electronic component by a vacuum process in a later step. Further, the wall thickness obtained by making pulp fiber as the carrier tape a is 400 to 1,000 μm.
Square hole 2 for storing parts because the paper is used as a material
When a hole is punched with a cutter blade, pulp fiber fibers are fluffed on its peripheral wall, and this fiber waste is generated by the chip fixing resistor, I
There was a drawback that 1-2 pieces out of 100,000 pieces were erroneously operated by being attached to electronic parts such as C chips, LSIs, and transistors. In addition, the storage tape has a problem that the carrier tape and the top cover film have a low thermal adhesive force, and when twisted, they are separated from each other, and the stored electronic components fall off.

On the other hand, in a storage container composed of a storage container for jams, broths and the like and a cover, the heat-sealed cover has a practical adhesive strength which does not peel off by stress such as vibration during sealing. The adhesive strength should be such that it can be easily peeled off from the container body by hand when opening.

[0005]

Therefore, the present invention has no problem of paper dust trouble, can easily peel the top cover film from the carrier tape, or can be peeled off by the stress such as vibration during sealing. The present invention provides a method for heat-bonding an olefin-based resin molded article, which has a high adhesive strength, but provides a package in which the container body and the lid can be easily peeled off by hand when opened.

[0006]

[Means for Solving the Problems]

[Summary of the Invention] The present inventors have conducted extensive studies in view of the above problems, and as a result, a propylene-based resin molded article having a coating layer of a quaternary ammonium salt-type acrylic copolymer formed on the surface thereof On the surface of the coating layer, the melting point of the propylene-based resin is 15
After laminating the molded products formed with the ethylene resin layer having a melting point lower than ℃, by heat-bonding both molded products,
The present invention has been completed based on the finding that a package capable of solving the above problems can be provided. That is, the method for heat-bonding an olefin-based resin molded article of the present invention comprises a structural unit (A) represented by the following general formula (I), a structural unit (B) represented by the following general formula (II), and the above (A). And a structural unit (C) obtained from a monomer copolymerizable with the component (B), and their weight ratio is (A) :( B) :( C) = 30 to 70:30 to 70. : 0
15 ° C. or more lower than the melting point of the propylene-based resin on the surface of the coating layer of the propylene-based resin molded article having the coating layer of the quaternary ammonium salt type acrylic copolymer in the range of 40 to 40. It is characterized in that after molding products having an ethylene-based resin layer having a melting point are laminated, both the molding products are heat-bonded.

[0007]

[Chemical 3]

(Wherein A represents --O-- or --NH--, R ¹ represents a hydrogen atom or a methyl group, and R ²
Is an alkylene group having 2 to 4 carbon atoms or --CH ₂ --C
H (OH) -CH ₂ - ^{represents, R 3, R 4, R} 5 and R ⁶ represents an alkyl group having 1 to 3 carbon atoms, they may be the same or be different, R ⁷ represents an alkyl group having 1 to 10 carbon atoms or an aralkyl group having 7 to 10 carbon atoms, n represents an integer of 1 to 3, and X represents a chlorine atom, a bromine atom, or an iodine atom. )

[0009]

[Chemical 4]

(In the formula, R ⁸ represents a hydrogen atom or a methyl group, R ⁹ represents an alkyl group having 1 to 22 carbon atoms, an aralkyl group having 7 to 22 carbon atoms, or 5 to 2 carbon atoms.
2 represents a cycloalkyl group. )

[0011]

[Function] The quaternary ammonium salt type acrylic copolymer functions as an antistatic agent and an adhesive, and the adhesive strength between the propylene resin molded product and the molded product having the ethylene resin layer is practically used. It exhibits sufficient adhesive strength and can be peeled off by hand.

DETAILED DESCRIPTION OF THE INVENTION The present invention is hereinafter described as an olefin-based material suitable for providing an easily peelable container (packaging body) for providing a container for electronic parts, a container for food such as jam, and water amniotic fluid. Although it is a heat-bonding method for a resin molded product, a storage tape for electronic components, which is excellent in its effect and economical efficiency, will be specifically described below as a representative example. As shown in FIGS. 1 and 2, an electronic component storage tape 1 basically has a regular square hole 2 for storing electronic components and a large number of feed holes 3 provided in parallel with the square hole 2 in a regular manner. The propylene-based resin carrier tape (a) provided in an array and the storage square holes 2 attached to the front and back surfaces of the carrier tape (a) are sealed but the feed holes 3 are not sealed. Resin top cover film (b) having an ethylene resin layer
And a rectangular hole punch carrier type storage tape composed of a resin bottom cover film (c).

The propylene resin as the material of the carrier tape (a) is mainly composed of propylene homopolymer and propylene, and ethylene, butene-1, hexene-1, pentene-1, 4-methylpentene-1 and the like. Α-
A copolymer with one or two or more olefins can be used. Such propylene-based resin generally has a melting point of 130 to 175 ° C. This propylene resin is an inorganic fine powder, a heat stabilizer,
It may contain a dispersant and a cross-linking agent. The molded product may be stretch-oriented. Among them, the density is 0.60
It is preferable to use a stretched microporous propylene-based resin film having a porosity of 1.1 g / cm ³ and a porosity of 10 to 60% because it is easy to perforate the storage portion. As a specific example of such a microporous propylene-based resin stretched film, as shown in FIG. 1, a film inside obtained by stretching a propylene-based resin film 7 containing an inorganic fine powder 6 at a temperature lower than the melting point of the resin. It is a stretched resin film alone having a large number of fine voids 8 or a laminated film obtained by laminating the stretched resin film and another resin film.

Specific examples of such a carrier tape include the following. Biaxially-stretched propylene-based resin microporous film 7 containing 5 to 30% by weight of the inorganic fine powder 6, the biaxially-stretched propylene-based resin film as a core layer, and 8 to 65% by weight of the inorganic fine powder on one or both sides thereof. A stretched resin film having a multi-layer structure in which uniaxially stretched propylene-based resin microporous films contained therein are laminated (Japanese Patent Publication Nos. 46-40794 and 63).
-1183). A surface layer having a large number of fine voids 8 inside the uniaxially stretched propylene resin film containing an inorganic fine powder, a core layer made of a biaxially stretched propylene resin film, and no fine voids 8 inside the film. A laminated body composed of a laminate comprising a propylene-based resin film back surface layer having voids 8 having a porosity lower than the porosity of the surface, if any. Inorganic fine powder (excluding scale-like inorganic fine powder) 6 to 8
Surface layer having a large number of fine voids 8 inside a film made of a stretched product of a propylene-based resin film containing ~ 65 wt% and a back surface made of a propylene-based resin film containing 5-70 wt% of scale-like inorganic fine powder 6. A laminate comprising at least two layers. A pearl-like microporous film obtained by biaxially stretching a film made of a mixture of inorganic fine powder 5 to 35% by weight, propylene resin 40 to 65% by weight, and polyethylene resin 3 to 25% by weight.

(2) Constituent material Inorganic fine powder The above-mentioned inorganic fine powder generally has a particle size of 0.03 to 1.
Scale-like inorganic fine powder such as talc and mica having an aspect ratio of 8 to 35, preferably 10 to 20 and a particle size of 0.03 to 15
Examples include calcined clay having a size of μm, calcium carbonate, diatomaceous earth, titanium oxide, balm culite and the like. Elongation The propylene resin film containing the inorganic fine powder is stretched at a temperature lower than the melting point of the propylene resin. At this time, the draw ratio is 1.3 to unidirectional or bidirectional.
It is 15 times, preferably 3.5 to 10 times. The number of stretching axes is uniaxial or biaxial.

(3) Physical Properties Porosity (Void) Inside the propylene-based resin stretched film used as a carrier tape constituting a storage tape for electronic parts, a large number of fine voids 8 having an inorganic fine powder as a core are provided. ing. Therefore, such a stretched propylene resin film has a porosity of 10 to 60%, preferably 15 to 5 calculated by the following formula.
0%, particularly preferably 15 to 45%. Porosity = [(ρ ₀ −ρ) / ρ ₀ ] × 100 ρ ₀ : Density of film before stretching ρ: Density of film after stretching When the above void ratio is less than 10%, when forming square holes. It becomes difficult to cut, and if it exceeds 60%, the tensile stress decreases when winding it on a reel, and it meanders or cuts, which makes it impractical.

Carrier tape (a) constituting a tape for storing dense electronic components
The propylene-based resin stretched film used for has a large number of fine voids inside the film, and therefore has a density of 0.60 to 1.1 g / cm ³ , preferably 0.70 to 0.70 g / cm ³ .
It is 0.9 g / cm ³ . The density is 0.60g
If it is less than / cm ³ , the strength will decrease, and 1.1g / c
If it exceeds m ³ , the piercing property is deteriorated, so that it becomes impractical.

Tensile Elastic Modulus The tensile elastic modulus of the tape is generally 9,000-3.
6,000 kg / cm ² , preferably 12,000-2
Those of 8,000 kg / cm ² are good.

Primer On the surface of the carrier tape (a) made of the propylene-based resin stretched film, easy peeling adhesion between the carrier tape (a) and the top cover film (b) (with a force of 15 to 70 g, the top cover film ( A primer is applied so that b) can be peeled off). This primer comprises a structural unit (A) represented by the following general formula (I), a structural unit (B) represented by the following general formula (II), and a monomer which is copolymerizable with the above-mentioned components (A) and (B). It contains structural units (C) obtained from the body and their weight proportion is (A):
(B): (C) = A quaternary ammonium salt type acrylic copolymer in the range of 30 to 70:30 to 70: 0 to 40.

[0020]

[Chemical 5]

(In the formula, A represents --O-- or --NH--, R ¹ represents a hydrogen atom or a methyl group, and R ²
Is an alkylene group having 2 to 4 carbon atoms or --CH ₂ --C
H (OH) -CH ₂ - ^{represents, R 3, R 4, R} 5 and R ⁶ represents an alkyl group having 1 to 3 carbon atoms, they may be the same or be different, R ⁷ represents an alkyl group having 1 to 10 carbon atoms or an aralkyl group having 7 to 10 carbon atoms, n represents an integer of 1 to 3, and X represents a chlorine atom, a bromine atom, or an iodine atom. )

[0022]

[Chemical 6]

(In the formula, R ⁸ represents a hydrogen atom or a methyl group, R ⁹ represents an alkyl group having 1 to 22 carbon atoms, an aralkyl group having 7 to 22 carbon atoms, or 5 to 2 carbon atoms.
2 represents a cycloalkyl group. ) Examples of the monomer forming the structural unit represented by the general formula (I) include dimethylaminoethyl acrylate, diethylaminoethyl acrylate, and their methacrylate equivalents, dimethylaminopropyl acrylamide, and their methacrylate equivalents. A quaternary amine-containing monomer represented by the following general formula (III) is modified with a modifier of the following general formula (V) such as 3-chloro-2-hydroxypropyltrimethylammonium chloride before or after polymerization. Can be obtained by doing. General formula

[0024]

[Chemical 7]

(In the formula, each of A, R ¹ , R ² , R ³ and R ⁴ has the following meaning. A is —O— or —NH—.
, R ¹ is —H or —CH ₃ , R ² is an alkylene group having 2 to 4 carbon atoms, or

[0026]

[Chemical 8]

R ³ and R ⁴ may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms, X is a chlorine atom, a bromine atom, or iodine. It is an atom. ) General formula

[0028]

[Chemical 9]

(In the formula, R ⁵ and R ⁶ may be the same or different and each represents an alkyl group having 1 to 3 carbon atoms, and R ⁷ is an alkyl group having 1 to 10 carbon atoms. A group or an aralkyl group having 7 to 10 carbon atoms, n is an integer of 1 to 3, X is a chlorine atom, a bromine atom, or an iodine atom.) (B) Hydrophobic monomer Body Unit As the hydrophobic monomer unit forming the structural unit (B), those represented by the following general formula can be mentioned.

[0030]

[Chemical 10]

[0031]

[Chemical 11]

[0032]

[Chemical 12]

[0033]

[Chemical 13]

[0034]

[Chemical 14] Examples of other vinyl monomers constituting the structural unit (C) include styrene, acrylic acid, methacrylic acid, maleic acid, glycidyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl ethyl acrylate, and the like.

(D) Amount ratio Here, the weight ratio of the above structural units (A), (B) and (C) is (A) :( B) :( C) = 30 to 70:30.
70: 0-40, preferably 35-65: 35-65:
0-20, particularly preferably 40-60: 40-60: 0
It is -10. The component (A) is a component that contributes to the antistatic property, and if it is less than 30% by weight, the carrier tape cannot have a sufficient antistatic effect. Also, 7
If it exceeds 0% by weight, it becomes excessively water-soluble, the adhesive strength between the carrier tape and the top cover film is low, and when the storage tape is wound on the winding frame, they are separated from each other and the chip fixing resistor may drop. The component (B) is a component that improves the adhesiveness, and if it is less than 30% by weight, this effect is reduced. Further, if it exceeds 70% by weight, the antistatic effect is relatively lowered. The component (C) compensates for the shortage of the copolymer (A + B + C = 100%), and adjusts the glass transition temperature of the copolymer, or adds a functional group such as an epoxy group, a hydroxyl group or a carboxyl group to the copolymer. Used to introduce.

(E) Copolymerization As a polymerization method for obtaining the above copolymer, known polymerization methods such as bulk polymerization, solution polymerization and emulsion polymerization using a radical initiator can be adopted. Of these, the preferred polymerization method is a solution polymerization method, and the polymerization is carried out by dissolving each monomer in a solvent, adding a radical polymerization initiator, and heating and stirring under a nitrogen stream. The solvent is water, methyl alcohol, ethyl alcohol,
Alcohols such as isopropyl alcohol are preferable, and these solvents may be mixed and used. As the polymerization initiator, peroxides such as benzoyl peroxide and lauroyl peroxide, and azo compounds such as azobisisobutyronitrile and azobisvaleronitrile are preferably used. The monomer concentration is usually 10 to 60% by weight, and the concentration of the polymerization initiator is usually 0.1 to 10% by weight based on the monomers.

The molecular weight of the quaternary ammonium salt type copolymer is determined by the polymerization temperature, the type and amount of the polymerization initiator, the amount of the solvent used,
It can be set at an arbitrary level depending on the polymerization conditions such as a chain transfer agent. Generally, the resulting polymer has a molecular weight of 100
0 to 1,000,000, but especially 1,000 to
A range of 500,000 is preferred. This quaternary ammonium salt type acrylic copolymer can be mentioned as a primer having an antistatic function. When a polyethyleneimine-based copolymer is added to the quaternary ammonium salt-type acrylic copolymer of this primer, the peel strength can be increased. Examples of such polyethyleneimine-based copolymers include polyethyleneimine adducts of polyethyleneimine or polyamine polyamide, and alkyl (C ₁ -C ₈ ) compounds of polyethyleneimine (see JP-A-1-141736). ). Above all, it is possible to use polyethyleneimine modified with a halogenated alkyl having 1 to 24 carbon atoms, an alkenyl halide, a cycloalkyl halide, or a benzyl halide in a polyethyleneimine adduct of polyethyleneimine or polyamine polyamide as a carrier tape and a top cover. It is preferable from the viewpoint of improving the adhesion to the film. The polyethyleneimine-based polymer may have any degree of polymerization, but is preferably 20 to 300.

Further, the primer can be blended with a polyamine polyamide / epichlorohydrin adduct to improve heat resistance. Such polyamine polyamide
The epichlorohydrin adduct is a water-soluble, cationic thermosetting resin obtained by reacting a polyamide containing a saturated dibasic carboxylic acid having 3 to 10 carbon atoms and a polyalkylene polyamine with epichlorohydrin. Details of such resins are described in Japanese Patent Publication No. 35-3547. The amount of the polyethyleneimine-based polymer blended is 5 to 200 relative to 100 parts by weight of the quaternary ammonium salt type acrylic copolymer in the primer component.
Parts by weight, preferably 20 to 100 parts by weight. The compounding amount of the polyamine polyamide / epichlorohydrin adduct is 0 to 100 parts by weight, preferably 20 to 100 parts by weight.

Each of the above components is used after being dissolved in water or a hydrophilic solvent such as methyl alcohol, ethyl alcohol, isopropyl alcohol, etc. Among them, it is usually used in the form of an aqueous solution. The solution concentration is usually 0.5 to 3% by weight, preferably about 1 to 2% by weight. The coating method is performed with a roll coater, a blade coater, an air knife coater, a size press coater, etc., and the coating film of the primer is formed by drying. The coating amount of the solid content is generally 0.01 to 8 g / m ² , and preferably 0.05 to 3 g / m ² .

(4) Thickness The thickness of the carrier tape (a) is generally 400 to 1,000.
The thickness is 0 μm, preferably 400 to 750 μm.
Therefore, a plurality of the stretched propylene-based resin microporous films may be laminated by adhering them with an adhesive such as a urethane adhesive or an acrylic adhesive.

(5) Square Hole The square hole 2 of the storage recess varies depending on the size of the component, but generally, the length direction is 0.6 to 6 mm and the width direction is 1.2 to 8 mm.
And the diameter of the feed hole is 1-3 mmφ
And the tape width is 8 mm to 56 mm. The number of pitches of the square hole and the feed hole 3 is the same as that of JIS C0806-1 described above.
Although defined by 990, it is generally 2 to 8 mm.

[III] Top Cover Film (b) and Bottom Cover Film (c) (1) Material The top cover film (b) and bottom cover film (c) laminated on the front and back surfaces of the carrier tape are as follows: An ethylene-based resin single-layer film having a melting point of 80 to 135 ° C., or a transparent base material film having a thickness of 7.5 to 38 μm such as polypropylene, polyethylene terephthalate, and nylon-6, and an ethylene-based resin as a heat-sealable resin film. A resin film having a thickness of 0.5 to 18 μm is used. Specific examples of the ethylene-based resin include low density polyethylene, linear low density polyethylene, ethylene / vinyl acetate copolymer (preferably ethylene / vinyl acetate copolymer having a vinyl acetate content of 12% by weight or less), ethylene / acrylic. Acid copolymer (preferably ethylene / acrylic acid copolymer having ethylene content of 65 to 94% by weight), ethylene / methacrylic acid alkyl ester copolymer, ionomer (metal salt of ethylene / acrylic acid copolymer, ethylene. Metal salt of methacrylic acid polymer),
Examples thereof include ethylene / propylene copolymers and ethylene / propylene / butene-1 copolymers.

Therefore, the thickness of the top cover film (b) and the bottom cover film (c) is generally 8 to 60 μm, preferably 18 to 25 μm. The widths of the top cover film (b) and the bottom cover film (c) are such that the cover film is adhered to the front surface and the back surface of the carrier tape, and the electronic components housed by sealing the square holes for storage. It is stored securely so as not to drop it. However, it is important that the cover film has a width that does not seal the feed hole 3 of the storage tape 1. Therefore, the width of the top cover film and the bottom cover film is generally 4 to 50 mm, preferably 4 to 4 mm.
It is 5 mm.

[IV] Storage (Lamination) The electronic component storage tape 1 thus obtained is, for example, a chip taping machine SCT-30 manufactured by Seiwa Sangyo Co., Ltd.
00 (commercial name), after storing the electronic component 5 that has been inspected in the square hole 2 of the carrier tape (a),
The top cover film (b) is heat-sealed (both ends are linearly heat-sealed 9, 9), wound on the reel 4, further packed in a cushioning material, and shipped to the user.

[0045]

EXAMPLES The present invention will be described more specifically with reference to Examples and Comparative Examples below. [I] Preparation of coating agent (A) Production of quaternary ammonium salt type acrylic copolymer Production of A-1 Four-neck equipped with reflux condenser, thermometer, glass tube for nitrogen substitution, and stirrer Dimethylaminoethyl methacrylate: 35 parts, ethyl methacrylate: 20 parts, cyclohexyl methacrylate: 20 parts, stearyl methacrylate: 25 parts, ethyl alcohol: 150 parts, azobisisobutyronitrile: 1 part, and nitrogen were added. The polymerization reaction was carried out at a temperature of 80 ° C. for 6 hours under an air stream. Then a 60% aqueous solution of 3-chloro-2-hydroxypropyltrimethylammonium chloride:
After adding 70 parts and further reacting at a temperature of 80 ° C. for 15 hours, ethyl alcohol was distilled off while adding water dropwise to give a final solid content of 20% quaternary ammonium salt type copolymer (A-1). ) Got.

Production of A-2 In the same manner as in the production of A-1 above, dimethylaminoethyl methacrylate: 30 parts, methyl methacrylate: 30 parts, butyl methacrylate: 40 parts, ethyl alcohol: 150 parts, azobisisobutyro Nitrile: 1 part was added and the polymerization reaction was carried out at a temperature of 80 ° C. for 6 hours under a nitrogen stream. Then a 60% aqueous solution of 3-chloro-2-hydroxypropyltrimethylammonium chloride:
After adding 55 parts and further reacting at a temperature of 80 ° C. for 15 hours, ethyl alcohol was distilled off while dropping water to obtain 20% of a quaternary ammonium salt type copolymer (A-2 as a final solid content). ) Got.

Production of A-3 In the same manner as in the production of A-1 above, dimethylaminoethyl methacrylate: 35 parts, methyl methacrylate: 30 parts, ethyl methacrylate: 40 parts, ethyl alcohol: 150 parts, azobisisobutyro Nitrile: 1 part was added and the polymerization reaction was carried out at a temperature of 80 ° C. for 6 hours under a nitrogen stream. Then, 147 parts of a 40% aqueous solution of 3-chloro-2-hydroxypropyldimethylbenzylammonium chloride was added, and the mixture was further reacted at a temperature of 80 ° C. for 15 hours, and then ethyl alcohol was distilled off while adding water dropwise. A quaternary ammonium salt type copolymer (A-3) having a solid content of 20% was obtained.

Production of A-4 In the same manner as in the production of A-1 above, methacryloxyethyltrimethylammonium chloride 80% aqueous solution: 50 parts, methyl methacrylate: 30 parts, ethyl methacrylate: 30 parts, ethyl alcohol: 150 parts, Azobisisobutyronitrile (1 part) was added, and a polymerization reaction was carried out at a temperature of 80 ° C. for 6 hours under a nitrogen stream. Then, ethyl alcohol was distilled off while adding water dropwise to obtain 20% quaternary ammonium salt type copolymer (A-4) as a final solid content.

(B) Polyethyleneimine type polymer The following were used as the polyethyleneimine type polymer. B-1 : "Polymin SN" manufactured by BASF (polyethyleneimine adduct of polyamidoamine)

(C) Polyamine polyamide-epichlorohydrin adduct The followings were used as the polyamine polyamide-epichlorohydrin adduct. C-1 : "Arafix 100" manufactured by Arakawa Chemical Co., Ltd. C-2 : "Kaimen 557" manufactured by Dick Hercules Co., Ltd.
H "

[II] Application to carrier tape Example 1 Production of carrier tape (1) Melt flow rate (MFR) 0.8 g / 10
Minute polypropylene 81% by weight, high density polyethylene 3% by weight and calcium carbonate 16 having an average particle size of 1.5 μm
The composition (A) in which the weight% was mixed was kneaded by an extruder set at 270 ° C., extruded into a sheet, and cooled by a cooling device to obtain an unstretched sheet. Then, after heating this sheet again to a temperature of 140 ° C.
It was stretched twice.

(2) A composition (B) prepared by mixing 54% by weight of polypropylene having an MFR of 4.0 g / 10 min and 46% by weight of calcium carbonate having an average particle size of 1.5 μm was kneaded in another extruder. After that, this was extruded in a sheet form from a die and laminated on both sides of the 5 times stretched film of (1) above to obtain a laminated film having a three-layer structure.

Then, this laminated film having a three-layer structure
After cooling to 0 ° C., it is heated again to a temperature of about 160 ° C. and stretched 7.5 times in the transverse direction using a tenter.
Annealing treatment at a temperature of 5 ° C, cooling to a temperature of 60 ° C, slitting of the ears, three-layer structure (uniaxial stretching / biaxial stretching / uniaxial stretching), wall thickness 200 μm (B / A / B =
20 μm / 160 μm / 20 μm) was obtained. The porosity of each layer is (B / A / B = 30% / 46%
/ 30%). The overall porosity was 42.8%. The overall density was 0.65 g / cm ³ .

Both sides of this laminate film were subjected to corona discharge treatment. Two sheets of the above laminate film were prepared and adhered with a urethane adhesive (2 g / m ² ) composed of a mixture of polyether polyol / polyisocyanate to form a thick laminate (wall thickness 401 μm), The coating composition prepared by mixing the solid components of the following primer in 100 parts by weight of water was coated on both surfaces of the laminate by a roll so that the solid content was 0.05 g / m ^2, and then dried at a temperature of 65 ° C. To form a film. A-1: 0.5 part B-1: 0.5 part C-1: 0.4 part Then, this was slit into a width of 8 mm. These slits were subjected to a surface resistivity meter “GIGA OHM METERMODEL VE-4” manufactured by Kawaguchi Electric Co., Ltd. under the conditions of a relative humidity of 30% and 60% at a temperature of 23 ° C.
The surface resistivity was measured to be 4.2 × 10 ¹⁰ Ω / □ by using "0 (trade name)".

Top cover film and bottom cover film
Production of film MFR 4 g / 10 min polypropylene (A) and ethylene / vinyl acetate copolymer (B) having an ethylene content of 8% by weight are respectively put in separate extruders at 230 ° C. and 22 ° C., respectively.
Melt-knead at 0 ° C and supply to one co-extrusion die for 22
Co-extrusion at a temperature of 0 ° C., cooling to a wall thickness of 40 μm (A /
B = 32 μm / 8 μm) was obtained, and this was slit into a width of 5 mm.

[0056] retract and the carrier tape of the production and the top cover film and the carrier tape and the top cover film and bottom cover film obtained in the production of bottom cover film Masakazu Sangyo Co., Ltd. of chip taping machine SC
It was attached to the reel of T-3000. Then, first, with a punching device of the device, a square hole of 0.7 × 1.2 mm and a diameter of 1.
After 5 mmφ feed holes were punched at a pitch of 4 mm (1,500 holes per minute), the bottom cover film was heat-sealed to the carrier tape. Then, the chip fixed resistor which has been inspected is stored in a square hole, and the top cover film is heat-sealed to form a chip fixed resistor storing tape, which is then wound on a reel (chip fixed resistor 1
Ten thousand). 100 of this were produced.

Evaluation At the time of winding, the storage tape had no meandering and did not grow. Further, this was rewound, the top cover film was peeled off, and the chip fixing resistors were all taken out and re-examined. As a result, none of them deteriorated (the chip fixing resistors had an operation error). Further, the peel strength of the top cover film from the carrier tape measured with a universal tensile tester “RTM-250” manufactured by Orientec Co., Ltd. under a condition of a tensile speed of 300 mm / min was 35.
It was about 41 g, and there was no displacement in the square hole for storing the chip fixed resistor at the time of rewinding or peeling, and there were no mistakes in the picking up work of the chip fixed resistor.

Example 2 A chip fixed resistor accommodating tape was manufactured in the same manner as in Example 1 except that the carrier tape obtained by the following method was used as the carrier tape. Production of carrier tape (1) Composition (A) obtained by mixing 55% by weight of polypropylene having a MFR of 4 g / 10 min with 29% by weight of high density polyethylene and 16% by weight of calcium carbonate having an average particle size of 1.5 μm at 270 ° C. After kneading with the set extruder,
It was extruded into a sheet and cooled by a cooling device to obtain a non-stretched sheet. Then, the sheet was heated again to a temperature of 140 ° C., and then stretched 5 times in the machine direction, and then 155
Heated to ℃, stretched 5 times in the transverse direction, the porosity is 23%,
A microporous biaxially stretched film having a density of 0.84 g / cm ³ was obtained. Two microporous biaxially stretched films were prepared and adhered with a urethane adhesive (2 g / m ² ) to form a thick laminate (thickness 401 μm), and then slit into a width of 8 mm.

Evaluation : Using the microporous biaxially stretched film, the perforation, feeding, and rewinding were good, and the chip fixing resistor was not deteriorated. Also, the peeling force of the top cover film is 3
It was 4-42 g.

Comparative Example 1 A carrier tape weighed 328 g / m ² and had a wall thickness of 4
A chip fixing resistor was sealed in a carrier tape in the same manner as in Example 1 except that 10 μm pulp paper (paperboard) was used. This is a chip fixed resistor 10
The above was found at a rate of 3 out of 0,000 (paper dust trouble). Further, the peel strength of the top cover film was wide, ranging from 5 to 60 g, and there was a pickup error of 140 when the chip fixing resistor was taken out by the suction tool. Examples 3 to 6 and Comparative Examples 2 to 3 Carrier tapes were manufactured in the same manner as in Example 1 except that the composition shown in Table 1 was used or not used as the coating agent, and the chip fixed resistor was housed. Was done. The evaluation results are shown in Table 1.

[0061]

[Table 1]

[III] Application to Easily Peelable Container Up to this point, the storage tape for electronic parts has been described, but the present invention comprises a polypropylene container body and an ethylene-based resin lid, and a jam, a water amniotic fluid, etc. It can also be used for an easily peelable container (packaging body) which is a food storage body.

[0063]

According to the bonding method of the present invention, it is possible to obtain a package having a practical adhesive strength that can be easily peeled by hand and that is not peeled by stress such as vibration during sealing.

[Brief description of drawings]

FIG. 1 shows a sectional view of a storage tape for electronic components.

FIG. 2 is a perspective view of a square hole punch carrier type tape in which a part of a top cover film and a bottom cover film are peeled off.

FIG. 3 shows a perspective view of an embossed carrier type tape containing electronic components.

[Explanation of symbols]

 1 Electronic component storage tape (square hole punch carrier type) 1'Emboss carrier type electronic component storage tape 2 Storage square hole 2'Groove 3 Feed hole 4 Reel 5 Electronic component 6 Inorganic fine powder 7 Stretched resin microporous Film 8 Void 9 Linear heat seal part a Carrier tape a'Embossed tape b Top cover c Bottom cover

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification number Reference number within the agency FI Technical indication location C08L 23:00 (72) Inventor Koichi Asami 23 Tohada, Kamisu-cho, Kashima-gun, Ibaraki Kayoji Synthetic Paper Co., Ltd. Kashima Factory (72) Inventor Ryoji Takahashi 1-5-1, Marunouchi, Chiyoda-ku, Tokyo Oji Petrochemical Synthetic Paper Co., Ltd. Market Development Department

Claims (2)

[Claims] 1. A structural unit (A) represented by the following general formula (I), a structural unit (B) represented by the following general formula (II), and a monomer copolymerizable with the above-mentioned components (A) and (B). Containing the structural unit (C) obtained from the monomer, and their weight ratio is (A) :( B) :( C) = 30 to 70:30.
On the surface of the coating layer of the propylene-based resin molded article having the coating layer of the quaternary ammonium salt type acrylic copolymer in the range of 70: 0 to 40 formed on the surface thereof, the temperature is higher than the melting point of the propylene-based resin by 15 A method for heat-bonding an olefin-based resin molded article, comprising laminating a molded article having an ethylene-based resin layer having a melting point lower than or equal to 0 ° C. and then thermally bonding both molded articles. [Chemical 1] (In the formula, A represents —O— or —NH—, R ¹ represents a hydrogen atom or a methyl group, and R ² has ² carbon atoms.
To 4 alkylene group or -CH ₂ -CH (OH) -
CH ₂ —, R ³ , R ⁴ , R ⁵ and R ⁶ represent an alkyl group having 1 to 3 carbon atoms, which may be the same or different, and R ⁷ has a carbon number. It represents an alkyl group having 1 to 10 or an aralkyl group having 7 to 10 carbon atoms, n represents an integer of 1 to 3, and X represents a chlorine atom, a bromine atom, or an iodine atom. ) [Chemical 2] (In the formula, R ⁸ represents a hydrogen atom or a methyl group, and R ^8
9 is an alkyl group having 1 to 22 carbon atoms, 7 to 22 carbon atoms
Represents an aralkyl group or a cycloalkyl group having 5 to 22 carbon atoms. ) 2. The method for heat-bonding an olefin resin molded article according to claim 1, wherein the coating layer contains a quaternary ammonium salt type acrylic copolymer and polyethyleneimine or a polyethyleneimine modified product.