JPH0760637A - Polishing device - Google Patents

Abstract

PURPOSE:To realize high flatness polishing work of a polishing object by controlling a nonuniform load on the polishing object by thermal stress, load stress or the like. CONSTITUTION:Plural actuators 7 capable of adjusting pressurizing force independently are arranged under a mount head 3, and a mount plate 2 holding a polishing object 5 is pressed through these pressurizing actuators 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus.

[0002]

2. Description of the Related Art As a conventional polishing apparatus, one shown in FIG. 5 is known. In FIG. 5, 1 is a surface plate, 2 is a mount plate, and 3 is a mount head mounted on the mount plate 2. The surface plate 1 has a circular rotary disk shape when viewed in plan, and a polishing cloth 4 is attached to the upper surface thereof.

The mount plate 2 is a disk made of ceramics or glass material. This mount plate 2
As shown in FIG. 5, one or more plural objects to be polished 5 are fixed to the lower surface of the. In this way, the surface to which the object to be polished 5 is fixed is pressed against the polishing cloth 4 on the surface plate 1 by the pressing shaft 6,
Polishing is performed by the relative movement of the polishing cloth 4 and the object 5 to be polished.

In order to apply a uniform pressure to the mount plate 2, in the conventional polishing apparatus, the mount head 3
A method of performing polishing by pressing the mount plate 2 against the surface plate 1 via a helical elastic tube filled with a fluid (Japanese Patent Laid-Open No. 63-144953) or a flat plate-shaped cover. A method of performing polishing by separating the mount plate 2 having the polishing body 5 fixed to the lower surface side and the head portions surrounding the mount plate 2 via a gap (Japanese Patent Laid-Open No. 2-98927). It was taken.

[0005]

The above-mentioned conventional technique has many drawbacks as follows. That is, as described above, in the conventional polishing apparatus, as the pressing means during polishing, a predetermined pressure is applied by the pressure shaft 6 or the like, and the pressure is transmitted to the mount plate 2 to perform the polishing process. A uniform pressure is applied to the object to be polished 5 due to thermal stress deformation due to heat distribution generated in 2, deformation of the mount plate 2 due to nonuniformity of the pressing means, deformation of the surface plate 1, flatness accuracy of the mount plate 2 itself, and the like. However, there is a problem in that it cannot be applied, and cannot be applied to polishing processing that requires high flatness.

The present invention solves the above problems, and an object of the present invention is to provide a polishing apparatus capable of realizing a high flatness polishing process for an object to be polished.

[0007]

In order to achieve the above object, the polishing apparatus of the present invention is provided with a plurality of actuators capable of independently adjusting the pressing force at the lower part of the mount head, and the actuators for adjusting the pressing force are installed. It is characterized in that the mount plate is pressed via the.

[0008]

As shown in FIGS. 1 to 4, a plurality of actuators 7 capable of independently adjusting the pressing force are provided for one or more plural objects to be polished 5 fixed to the lower surface of the mount plate 2 one batch before. In the next batch, the mount plate 2 is pressed based on the information on the unevenness of the surface after polishing, so that the unevenness of the surface after polishing is independently adjusted. That is, high pressure is applied to the pressing surface of the mount plate 2 in the convex portion of the object 5 to be polished, and low pressure is applied to the concave portion to preferentially polish the convex portion. High flatness is realized by reducing the height difference from the concave portion.

[0009]

Embodiments will be described with reference to the drawings. Figure 1
It is a figure which shows one Example of this invention, and the code | symbol 1,2,3,6
Are a surface plate, a mount plate, a mount head, and a pressure shaft, which are similar to those used in the conventional polishing apparatus. As in the conventional case, the mount plate 2 is placed on the surface plate 1 with the object 5 to be polished fixed to the lower surface.
A plurality of actuators (for example, 17 actuators in the radial direction and the circumferential direction of the mount plate 2) are arranged in order on the mount plate 2 (FIG. 2).

The example shown in FIG. 1 is a pressure actuator 7.
Although the piezoelectric element 8 is used for the part, the hydraulic unit 9 may be used instead as shown in FIG. 3 or the ball screw 10 may be used as shown in FIG. In short, any mechanism can be adopted as long as it can independently adjust the pressing force independently.

[0011]

As described above, the present invention is an apparatus having means for pressurizing the mount plate by a plurality of independently adjustable pressure actuators, and the pressing force from the mount plate can be actively adjusted. Since it is a device, it is possible to realize polishing processing that is not affected by disturbance and can obtain high flatness.

[Brief description of drawings]

FIG. 1 is an overall front view showing an embodiment of a polishing device.

FIG. 2 is a perspective view showing an arrangement example of actuators of the polishing apparatus.

FIG. 3 is a front view of a main part showing another embodiment of the polishing apparatus.

FIG. 4 is a front view of a main part showing still another embodiment of the polishing apparatus.

FIG. 5 is an overall front view showing an example of a conventional polishing apparatus.

[Explanation of reference symbols] 1 surface plate 2 mount plate 3 mount head 4 polishing cloth 5 object to be polished 6 pressure shaft 7 pressure actuator 8 piezoelectric element 9 hydraulic unit 10 ball screw

Claims (1)

[Claims] 1. A polishing apparatus for polishing the surface of an object to be polished by using a relative sliding motion between the object to be polished and a polishing cloth,
A polishing apparatus comprising: a mount plate that holds an object to be polished and that transmits a processing pressure to the object to be polished;