JPH0754485A - After-bond type pc slab and placing method of concrete by use thereof - Google Patents

Abstract

PURPOSE:To prevent cracks in placing concrete and peeling off of concrete due to permeation of water. CONSTITUTION:An age hardening epoxy resin 3 with which a latent curing agent having a characteristic reacting by an activation-starting mechanism like heat, light, humidity, pressure, etc., is mixed, is applied on the surface of a PC slab 2. And further, a protective polyethylene sheet 4 is stuck on the surface to form an after-bond type PC slab 1. Concrete 5 is placed on the PC slab 1. The latent curing agent begins activating owing to the heat and pressure of the placed concrete and the concrete is unified with the PC slab 2 while absorbing cracks resulting from placing of concrete. In this way, cracks are prevented and hence, the durability is increased.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an after-bond type PC plate in which cracks and the like do not occur on the concrete side and the embedded type PC plate side even after a considerable period has elapsed due to the pouring of concrete, and a concrete pouring method using the same. .

[0002]

2. Description of the Related Art As shown in FIG. 6, an embedding type PC plate 8 having an uneven portion 9 on the surface of the pouring side is adopted in order to improve the strength of integration with the pouring concrete 5. Was there. Further, as shown in FIG. 7, in order to prevent the embedded PC plate 8 from cracking due to the temperature stress of the cast concrete 5 and the like, a back surface is flattened to form the edge cut portion 10 has been adopted.

[0003]

However, in the case of placing a large mass concrete using a buried PC plate, which has been increasing recently, as a mold, the above-mentioned prior art has the following problems. Occurs. First, in the structure shown in FIG. 6, the temperature stress of the cast concrete is large, and the tensile force thereof causes cracks in the embedded PC plate 8 to lower the durability. Moreover, although the one having the edge cut portion 10 as shown in FIG. 7 can absorb the temperature stress, water penetrates into the edge cut portion 10 and the embedded PC plate 8 is peeled off, so that the durability of the structure is improved. There arises a problem of deterioration.

The present invention solves the above problems, and is caused by the cracks in the placing concrete due to the displacement and temperature stress generated immediately after placing the concrete, the initial cracks immediately after the placing, or the changes in the outside temperature in four seasons. After the generation of various cracks such as cracks and cracks caused by the influence of light, moisture, etc., the integration and solidification of the PC plate and the cast concrete are completed. That is, specifically, after the concrete is poured, the uncured state is kept so that it can be freely deformed for a maximum of about one year, and water is prevented from entering between the cast concrete and the PC plate during that time. It is an object of the present invention to provide an after-bond type PC plate and a concrete pouring method using the PC plate, in which the above-mentioned problems are solved by imparting the property.

[0005]

In order to achieve the above-mentioned object, the present invention stacks and laminates a hardenable epoxy resin consisting of an epoxy resin containing a latent curing agent as a bonding agent on the surface of a PC plate. An embedded type PC plate formed by wearing, wherein the latent curing agent constitutes an after-bond type PC plate composed of a compound or a compounding means activated by heat, light, moisture and pressure. Further, more specifically, the PC plate is formed by forming irregularities having an undulating height t on its surface, and the time-hardening epoxy resin is formed by having a thickness at least equal to or higher than the height t. The after-bonded PC plate is characterized by stacking and sticking non-adhesive sheets on the surface of the time-hardening epoxy resin. In addition, after the above-mentioned time-hardening epoxy resin and the non-adhesive sheet before the start of activation are stacked and adhered on the surface of the PC plate, concrete is poured to heat the concrete,
The present invention is characterized by a concrete pouring method using an after-bond type PC plate in which the hard epoxy resin is activated and integrated by pouring pressure or the like.

[0006]

In general, when a curing agent is added to an epoxy resin, it reacts immediately, the viscosity of the system increases with time, and when the pot life is exceeded, it reaches a level where it cannot be used. As described above, the PC plate bonded with the quick-hardening resin cannot prevent the temperature deformation and the water immersion deformation that occur in a short period after curing. On the other hand, in the present invention, by applying a latent curing agent, it is applied that the epoxy resin maintains a stable and usable state for a long time as long as it is left at room temperature. By utilizing this property, the above-mentioned problems can be solved by placing concrete using an after-bond type PC plate in which a hard epoxy resin is stacked and adhered when a latent curing agent is mixed on the surface of the PC plate. That is, the latent hardener starts to be activated by heat, pressure, etc. generated by concrete pouring, and while absorbing the short-term generation of the various cracks mentioned above, the concrete and PC are poured.
The plates are integrated. By properly setting the type of the latent curing agent, it is possible to form a cast concrete that does not eventually cause cracks and has improved durability.

[0007]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a partial cross-sectional view showing a laminated state of an after-bond type PC plate and cast concrete of this embodiment, FIG. 2 is an enlarged partial cross-sectional view of FIG. 1, and FIG. 3 is a kind of latent curing agent and activation. FIG. 4 is a diagram showing an outline of the mechanism, FIG. 4 is an enlarged partial sectional view showing a sectional shape of the time-hardening epoxy resin mat attached to the PC plate, and FIG. 5 is an after-bond type PC plate using the time-hardening epoxy resin mat. It is sectional drawing which shows an example of a manufacturing method.

As shown in FIG. 1, the after-bond type PC plate 1 of this embodiment comprises a PC plate 2, a hard epoxy resin 3 made of an epoxy resin containing a latent curing agent, and a non-adhesive sheet. It is made by stacking and adhering a polyethylene sheet 4 as an example. The poured concrete 5 is poured and integrated in the form of the after-bond type PC plate having the above-mentioned structure.

As shown in FIG. 2, an uneven portion 6 having an undulating height t is formed on the surface of the PC plate 2, and the PC plate 2 and the hour-hardening epoxy resin 3 are adhered and the casting concrete 5 is integrated. Is trying to strengthen. The standard value of t is about 2 [mm], and the thickness T of the hour-hardening epoxy resin 3 is preferably the same value as t. Further, the polyethylene sheet 4 does not necessarily have to be attached, but it is preferable to attach the polyethylene sheet 4 in order to prevent dust and dirt from adhering to the surface of the time-hardening epoxy resin 3 during transportation or assembly.

Next, the types of latent curing agents and the mechanism of their activation will be described with reference to FIG. There are various types of latent curing agents depending on the means for initiating their activation (indicated as "means for removing the latch" in the figure), and the activation (curing) initiation mechanism is also different. "Means for removing the latch" include heat, light, moisture, pressure, etc. For example, when the "means for removing the latch" is heat, "Lewis acid complex" is applied, and the curing initiation mechanism is "ionic reaction". by.

Next, a method of adhering the time-hardening epoxy resin on the surface of the PC plate will be described. As shown in FIG. 5, in this embodiment, the time-hardening epoxy resin is a spiral wound mat-shaped one. The cross-sectional shape of the ribbon-shaped time-hardening epoxy resin 7 before being attached is shown in FIG. That is, when it is made of an epoxy resin containing a latent curing agent, the hard epoxy resin 3 is formed by adhering the polyethylene sheet 4 to the front and back surfaces. As shown in FIG. 5, the one-sided polyethylene sheet 4 is peeled off from the surface of the PC plate 2 having the uneven portion 6 formed thereon, and when exposed, the hard epoxy resin 3 is strongly pressed and moved along the surface. as a result,
The time-hardening epoxy resin 3 is attached to the PC plate 2, and the surface side thereof is covered with another polyethylene sheet 4 on one side. After that, the after-bond type PC plate 1 is formed. As described above, since the curing of the apoxy resin does not start in this state, it can be left alone until the time of setting, or it can be transported to the setting site for use. The method for attaching the time-hardening epoxy resin 3 is not limited to that shown in FIG. 5, and, for example, a method such as thick coating with a brush or spreading with a spatula to be attached may be employed.

[0012]

According to the present invention, the following remarkable effects are obtained. 1) Since the time-hardening epoxy resin does not start activation at room temperature, the after-bond type PC plate can be manufactured and stored in advance. Moreover, it is created as a mold of various shapes. 2) The after-bond type PC plate can be transported, manufactured at the factory, and used at the setting site. 3) The time-hardening epoxy resin has the property of starting activation under the action of "a means for removing the latch" such as heat, light, moisture, and pressure, so various cracks caused by concrete placement are absorbed and integrated. No cracks later. Therefore, durability can be improved. 4) It is not necessary to provide an edge cut portion as in the prior art, and water infiltration or peeling does not occur. Therefore, the durability of the structure can be improved. 5) After-bond type PC plate It is relatively easy to manufacture and mass production is possible. Also, concrete pouring work is easy.

[Brief description of drawings]

FIG. 1 is a sectional view showing a stacking structure of an after-bond type PC plate and a cast concrete according to an embodiment of the present invention.

FIG. 2 is an enlarged partial cross-sectional view showing the detailed structure of FIG.

FIG. 3 is a chart showing the types of latent curing agents for the time-hardening epoxy resin of this example and the mechanism of their activation.

FIG. 4 is a partial cross-sectional view showing a shape of a ribbon-shaped when-hardening epoxy resin before being attached.

FIG. 5 is a side sectional view showing an example of a method of manufacturing an after-bond type PC plate using a ribbon-shaped time-hardening epoxy resin.

FIG. 6 is a sectional view showing a concrete placing method using a conventional PC plate.

FIG. 7 is a sectional view showing a conventional method for placing concrete on a PC plate having an edge cut portion.

[Explanation of symbols]

 1 After-bond type PC plate 2 PC plate 3 Time-hardening epoxy resin 4 Polyethylene sheet 5 Casting concrete 6 Uneven portion 7 Ribbon-shaped time-hardening epoxy resin

Claims (4)

[Claims] 1. An embedded PC plate, comprising an epoxy resin containing a latent curing agent as a bonding agent and a hardened epoxy resin laminated on the surface of the PC plate, wherein the latent curing agent is used. Is an after-bond type PC plate characterized by comprising a compound or a compounding means activated by heat, light, moisture and pressure. 2. The PC plate is formed by forming irregularities having an undulating height t on its surface, and the time-hardening epoxy resin is formed by having a thickness at least equal to or higher than the height t. 1 after bond type PC version. 3. An after-bond type PC plate obtained by stacking and sticking non-adhesive sheets on the surface of the time-hardening epoxy resin. 4. The PC board surface is laminated with the time-hardening epoxy resin and optionally the non-adhesive sheet before activation is started, and then concrete is poured to heat and pour the concrete. A concrete pouring method using an after-bond type PC plate, characterized in that the hard epoxy resin is activated and integrated by setting pressure or the like.