JPH075264U - Airtight terminal - Google Patents

Abstract

(57) [Summary] [Objective] To provide an airtight terminal which has a smaller mounting volume and higher reliability than conventional ones, and which can omit the brazing or welding process of the ground terminal. [Construction] A lead terminal insertion hole 2 is provided at the bottom of a box-shaped metal base 1, and the lead terminal is inserted through the lead terminal insertion hole so as to penetrate an airtight space formed by the box-shaped metal base. In the sealed airtight terminal, the outer projection 13 is integrally provided on the outer surface of the bottom of the base, and a part of the projection is extruded inward from the outer direction to form the ground terminal projection 15 on the inner surface of the base. It is characterized by having done. [Effect] Since the external projection is integrally formed in advance and a part of the external projection is extruded to provide the projection for the ground terminal on the inner surface of the bottom of the base, it is not necessary to perform brazing and welding. Brings advantages.

Description

[Detailed description of the device]

[0001]

[Technical Field of Device]

 The present invention relates to an airtight terminal, and more particularly to a surface-mounting airtight terminal having a smaller mounting volume than the conventional one and having a ground terminal.

[0002]

[Prior art]

 As shown in FIG. 5, the conventional glass-sealed surface-mount airtight terminal is provided with a lead terminal insertion hole 2 on the side wall 11 of the metal box-shaped metal base 1, and a straight line is formed in the lead terminal insertion hole 2. The lead terminals 3 having a rectangular shape are inserted so as to penetrate an airtight space 4 formed by the box-shaped base 1 and sealed with glass 5. The lead terminal 3 is sealed with the glass 5 and then bent into a crank shape as shown in FIG.

On the other hand, the ground terminal 6 is likewise inserted into the ground terminal insertion hole 7 formed in the side wall 11, is attached by brazing or welding, and is bent into a crank shape like the lead terminal 3.

After mounting a circuit component or the like (not shown) in the airtight space 4 of the airtight terminal as described above and connecting it to the lead terminal 3 and the ground terminal 6, a cover (not shown) is covered and bonded. Thus, the circuit parts and the like are hermetically sealed.

In the case of the airtight terminal as described above, the outer horizontal part (outer part) of the lead terminal 3 and the ground terminal 6 bent in a crank shape is surface-mounted on a circuit board or the like by soldering or the like.

In such an airtight terminal, the outer parts 31 and 61 extend outward of the airtight terminal, and a clearance is generated between the side wall 11 and the outer parts 31 and 61. There is a drawback in that the occupied area of the circuit components that have been installed becomes large. Since the lead terminal 3 and the ground terminal 6 are bent in the shape of a crank, bending, deformation, and instability of the bending position accuracy occur, which is a major obstacle when mounting on a board. In addition, the number of steps increases due to the addition of brazing and welding steps, and when multiple ground terminals are required, the number of parts for the ground terminals increases, resulting in cost increase.

An airtight terminal as shown in FIG. 6 has also been developed. That is, the lead terminal insertion hole 2 and the ground terminal insertion hole 7 are formed in the bottom portion 12 of the box-shaped base 1, and the linear lead terminal 3 and the ground terminal 6 are formed in the lead terminal insertion hole 2 and the ground terminal insertion hole. It is also known that each of the electrodes 7 penetrates the airtight space 4, the lead terminal 3 is sealed with glass 5, and the ground terminal 6 is brazed or welded. In the case of such an airtight terminal, the lead terminal 3 and the ground terminal 6 are bent in a hook shape.

However, in order to prevent the lead terminal 3 from coming into contact with the bottom surface of the base 1 to cause a short circuit, a clearance is required in the same manner, and there is a drawback that the occupied volume becomes large, and the lead terminal 3 is bent into a hook shape as described above. As a result, bending, deformation, and instability in bending position accuracy occur, which is a major obstacle to board mounting. Furthermore, similar to the airtight terminal of Fig. 5, brazing and welding processes have been added to increase the number of steps, and when multiple ground terminals are required, the number of parts for the ground terminal increases, resulting in cost increase. Become.

[0009]

[The purpose of the device]

 The present invention has been made in view of the above problems, and it is an object of the present invention to provide an airtight terminal which has a smaller mounting volume and higher reliability than conventional ones, and which can omit the brazing or welding process of the ground terminal. To aim.

[0010]

[Means for solving problems]

 In order to solve the above problems, the airtight terminal according to the present invention is provided with a lead terminal insertion hole at the bottom of a box-shaped metal base, and the lead terminal is inserted so as to penetrate the airtight space formed by the box-shaped metal base. In an airtight terminal that is inserted into the lead terminal insertion hole and sealed with glass, an outer protrusion is integrally provided on the outer surface of the bottom of the base, and a part of the protrusion is pushed inward from the outer side to the base. The feature is that the ground terminal projection is formed on the inner surface.

According to the airtight terminal of the present invention, the external projection is integrally formed in advance, and a part of the external projection is pushed out to provide the projection for the ground terminal on the inner surface of the bottom of the base. The advantage is that there is no need for brazing and welding. Further, there is an advantage that the occupied volume becomes smaller than that of the conventional one. Further, since the external protrusion is pushed out to form the ground terminal, the volume of the airtight space can be increased and the lead terminal and the ground terminal can be easily recognized from the outside of the airtight terminal. Further, the reliability of solderability is improved as described later.

[0012]

【Example】

 FIG. 1 is a perspective view of a glass hermetic type surface mounting airtight terminal of one embodiment of the present invention seen from the bottom side, FIG. 2 is a sectional view, and FIG. 3 is a perspective view of the bottom side of the base. Is. As is clear from these figures, in the airtight terminal of the present invention, an outer projection 13 is formed on the bottom 12 of the box-shaped base 1, while the inner surface of the bottom corresponding to the outer projection of the bottom 12 is formed. 14 is provided with a ground terminal protrusion 15 (see FIG. 2). The ground terminal projection 15 is formed by pressing a part of the outer projection 13 formed integrally with the base 1 and pushing it out. For this reason, the outer protrusion 13 has a structure in which an extrusion hole 131 is formed.

The lead terminal insertion hole 2 is provided so as to penetrate the bottom portion 12, and the hook-shaped lead terminal 3 is inserted and sealed with glass 5. The glass 5 is provided over the entire outer surface 16 of the bottom portion 12 so that the outer surfaces 31 of the lead terminals 3 and the top surfaces of the outer protruding portions 13 are flush with the glass surface 51.

With such a structure, the ground terminal protrusion 15 is electrically connected to the base 1 and the outer protrusion 13 and can be used as a ground. On the other hand, the lead terminal 3 is insulated from the base 1 by the glass 5.

When the airtight terminal as described above is attached to the circuit board 8 or the like, it is generally performed by soldering. In this case, as shown in FIG. 4, since the ground terminal projecting portion 15 is formed by extrusion, an extrusion hole 131 is formed in the outer projecting portion 13, and the solder 9 is formed in the extrusion hole 131. Is filled, the solderability is improved and the reliability is increased.

Further, since the push-out hole 131 is formed in the ground terminal, there is an advantage that the lead terminal and the ground terminal can be easily distinguished.

1 to 3 show an example in which the outer protrusion 13 and the ground terminal protrusion 15 are formed at the corners of the rectangular box-shaped base 1, and the lead terminal insertion holes 2 are also provided at the corners. However, it is obvious that the present invention is not limited to this.

In the above-described embodiment, the lead terminal 3 is basically hook-shaped in cross section, and the outer portion 31 does not project to the outside of the base 1. Therefore, the occupied area can be reduced. Further, since the glass 5 is provided over the entire bottom rear surface of the base 1 (excluding the outer protruding portion 13 and the lead terminal outer portion 31 portion), the gap between the lead terminal 3, the ground terminal 6 and the base 1 is different from the conventional one. Clearance in is lost. For this reason, it is effective for making it light, thin and short.

[0019]

[Effect of device]

 As described above, according to the airtight terminal of the present invention, the outer protrusion is integrally formed in advance, and a part of the outer protrusion is pushed out to provide the protrusion for the ground terminal on the inner surface of the bottom of the base. Therefore, there is an advantage that there is no need for brazing and welding. Further, there is an advantage that the occupied volume is smaller than that of the conventional one. Further, since the external projection is pushed out to form the ground terminal, the volume of the airtight space can be made large, and the lead terminal and the ground terminal can be easily recognized from the outside of the airtight terminal. Further, the reliability of solderability is improved.

[Brief description of drawings]

FIG. 1 is a bottom perspective view of an embodiment of an airtight terminal according to the present invention.

FIG. 2 is a cross-sectional view of the embodiment of the hermetic terminal according to the present invention.

FIG. 3 is a bottom perspective view of the base of the airtight terminal according to the present invention.

FIG. 4 is an enlarged cross-sectional view when soldering the airtight terminal according to the present invention.

FIG. 5 is a cross-sectional view of a conventional airtight terminal.

FIG. 6 is a sectional view of a conventional airtight terminal.

[Explanation of symbols]

 1 Base 12 Bottom 13 Outer Projection 14 Bottom Inner Surface 15 Ground Terminal Projection 3 Lead Terminal 31 Outer Part 4 Airtight Space 5 Glass 6 Ground Terminal 8 Board 9 Solder

Claims (1)

[Scope of utility model registration request] 1. A lead terminal insertion hole is provided at the bottom of a box-shaped metal base, and the lead terminal is inserted through the lead terminal insertion hole so as to penetrate an airtight space formed by the box-shaped metal base. In the sealed airtight terminal, an outer projection is integrally provided on the outer surface of the bottom of the base, and a part of the projection is pressed inward from the outer direction to form a ground terminal projection on the inner surface of the base. Airtight terminal characterized by.