JPH0752052A - Super-abrasive grain electrodeposited cutting blade - Google Patents

Abstract

PURPOSE:To easily provide the desired cutting speed and the cutting length of a workpiece in a super abrasive grain electrodeposited cutting blade having a super abrasive grain electrodeposited layer electrodeposited on the outer circumferential part of a base metal by setting a chip channel ratio showing the electrodeposited condition of the abrasive grains in a decided range. CONSTITUTION:A circular cutting blade 10 is provided with an electrodeposited layer 4 on the outer circumferential edge part of a circular base metal 1, and the electrodeposited layer 4 is constituted so that super brasive grains 2a, 2b,... such as diamonds or CBN are electrodeposited through holding plating 3. In this case, all spaces between adjoining abrasive grains in the circumferential direction of the cutting blade (chip channel width) a1, a2,... are summed up, and the total is divided by the number of the all abrasive grains on the circumference so as to obtain the mean chip channel width T, and when the mean grain diameter of the abrasive grains is set (d), the electrodeposition is performed so that the chip channel ratio T/d is in the range of 0.2-5. Hereby the cutting speed and the life of the cutting blade can be improved, and in addition smooth discharge of chips can be performed.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a superabrasive electrodeposition cutting blade, and more particularly to diamond or C by electrodeposition on the outer periphery of a base metal
The present invention relates to a superabrasive grain electrodeposition cutting blade to which superabrasive grains such as BN are fixed.

[0002]

2. Description of the Related Art When cutting a hard brittle material such as a magnetic tile with a portable cutter or the like, a metal bond cutting blade is used from the viewpoint of life, but the cutting speed is slow and chipping (cracking or chipping) is likely to occur. In addition, diamond and CBN (Cubic Boron Nitride), which have extremely high hardness, are rapidly expanding in use under the name of superabrasive grains, and are integrated into a base metal by electrodeposition or the like. However, when an electrodeposited diamond cutting blade (hereinafter referred to as an electrodeposited cutting blade) was used, the cutting speed and chipping were improved, but the life was shortened, and it was not particularly used for dry cutting.

Japanese Examined Patent Publication No. 59-32267 discloses that staggered grooves are formed on the end surface of the base metal and the front and back surfaces of the base metal, and a large number of cemented carbide grains are electro-deposited in the grooves. It also describes a cutting blade in which cemented carbide particles are fixed by an adhesive also on the opposite surface of the base metal where no groove is formed.

Further, Japanese Patent Laid-Open No. 58-114863 discloses that
It describes an electrodeposited diamond grindstone, and a diamond abrasive grain having a grain size smaller than a normal grain size, for example, a mesh size of 200, is distributed at an extremely low density as compared with a normal grain size for electrodeposition to save diamond. We are aiming to extend the life of the product by using resources and reducing the wear area of the abrasive grains.

[0005]

[Problems to be Solved by the Invention] However, JP-B-59-3
In the invention described in Japanese Patent No. 2267, even if the electrodes are electrodeposited in a zigzag manner, the electrodeposited portion itself is the same as the conventional product, and the portion electrodeposited in one block becomes one blade to increase the number of blades. There is a limit. Therefore, since the number of blades is small as a whole, the cutting speed does not increase. Further, there is a drawback that the number of steps is increased, such as masking and groove processing for the zigzag configuration.

Further, in the invention described in Japanese Patent Laid-Open No. 58-114863, the relationship with the grinding speed is not clear, and the particle size of the abrasive grains is simply reduced, or the abrasive grains are roughly electrodeposited on the base metal. Only by doing so, it is expected that the grinding speed will decrease.

In view of the above, the present invention overcomes the above-mentioned problems of the prior art, and the abrasive grains are satisfactorily incorporated into the work material, so that high-temperature frictional heat is not generated and dry cutting is possible, and the cutting resistance is high. It is an object of the present invention to provide a superabrasive grain electrodeposition cutting blade that is small in size, can prolong the life of the abrasive grains, excretes cutting waste satisfactorily, and consequently can improve the cutting speed.

[0008]

To achieve the above object, the present invention provides a superabrasive grain electrodeposition cutting having a base metal and a superabrasive grain electrodeposition layer electrodeposited on the outer periphery of the base metal. In the blade, the tip channel ratio showing the electrodeposition state of the abrasive grains is -0.2 or more,
A superabrasive grain electrodeposition cutting blade of 5 or less is provided. It is particularly preferable that the chip channel ratio is 0 or more and 1.5 or less.

[0009]

According to the superabrasive electrodeposition cutting blade of the present invention having the above-mentioned structure, since the chip channel ratio is set within the predetermined range, the adjacent abrasive particles in the electrodeposition layer are arranged in the circumferential direction of the cutting blade. It is extremely unlikely that they will overlap with each other, and individual abrasive grains can act as one blade, and since adjacent abrasive grains are not too far apart in the same direction,
It is possible to obtain a desired cutting speed and a desired work material cutting length.
When the chip channel ratio is in the range of -0.2 to 5, it is possible to cut at a good cutting speed while maintaining the life of the superabrasive grain electrodeposition cutting blade to some extent. When the chip channel ratio is 0 to 1.5, the life of the superabrasive electrodeposition cutting blade can be further extended.

[0010]

EXAMPLE An example in which the superabrasive grain electrodeposition cutting blade according to the present invention is applied to a circular cutting blade will be described with reference to FIGS. 1, 4 and 6. The circular cutting blade 10 is composed of a circular base metal 1 and an electrodeposition layer 4 provided on the outer peripheral edge portion thereof. The electrodeposition layer 4 is formed by electrodeposition of superabrasive grains such as diamond and CBN. Their particle size is in the range of # 50 to # 60 in mesh size. Electrodeposition is performed by, for example, electroless nickel plating.

Then, the electrodeposition reduces the chip channel ratio to −
It is performed so as to be 0, 2 or more and 5 or less. Here, the definition of the chip channel ratio will be described with reference to FIG. Figure 2
(A) is an electrodeposition layer 4 in which the cutting blade is viewed from the direction of arrow II in FIG.
2B shows a circumferential end face of the electrodeposition layer 4 when the cutting blade is viewed from the axial direction. 2a, 2b,
.. are electrodeposited superabrasive grains, and 3 is holding plating. In these figures, the gap between the adjacent abrasive grains in the circumferential direction of the cutting blade, for example, the gap a1 in the circumferential direction between the abrasive grain 2a and the abrasive grain 2b electrodeposited immediately next to it is called the chip channel width. And these widths a1, a2, a3, a
A value obtained by adding all 4, ... And dividing by the number of all the abrasive grains on the circumference is taken as the average chip channel width T. In FIG. 2, when the abrasive grains 2c and 2d overlap each other in the circumferential direction, the interval a3 is calculated as negative, and when they do not overlap each other, the interval is calculated as positive. When the average grain size of the abrasive grains is d, T / d is defined as the chip channel ratio (r).

In the present invention, this chip channel ratio is −
It is a cutting blade electrodeposited so as to be 0.2 or more and 5,0 or less. If the chip channel ratio exceeds 5, the number of abrasive grains is too small, and the load acting on each abrasive grain becomes excessive. If the cutting speed is increased, the abrasive grains will fall off extremely and the life will be shortened. . In practice, if the upper limit of the chip channel ratio is set to 5, the cutting can be performed at a high cutting speed while maintaining the same life as the conventional one. In addition, the chip channel ratio
If it is less than 0.2, the abrasive grains are extremely overlapped as shown in FIGS. 3 and 5, and a large number of the abrasive grains 2 are overlapped with each other even if the abrasive grains 2 are slightly worn. As they come into contact with each other at the same time, the surface pressure on the individual abrasive grains is lowered, so that they cannot be bitten into the work material 5 and only friction occurs. As a result, the cutting speed is extremely reduced. The above range will be apparent from the experiment (FIG. 9) described later.

Next, the abrasive grain mesh size is # 50 / # 6.
A specific method of adjusting the chip channel ratio in the case of 0 will be described. A watt bath (nickel sulfate: 300 g / liter, nickel chloride: 50 g / liter, boric acid: 45 g / liter, brightening agent: 10 g / liter) is used as the plating bath to attach abrasive grains to the base metal. 3A
Electrolysis is performed for 60 minutes under the conditions of / dm2 and 50 ° C. The chip channel ratio can be adjusted by changing the plating time (electrolysis time). Then, ultrasonic cleaning (45 KHz) is performed for 1 minute in order to remove excess abrasive grains that have not been electrodeposited. Next, in order to ensure the adherence of the abrasive grains, a desired chip channel ratio was provided by electrolyzing as a holding plating under conditions of 4.5 A / dm2 and 50 ° C until the embedding rate became about 70%. An electrodeposited layer 4 is obtained. Here, the embedding rate is the rate of the abrasive grains embedded by plating. For example, when half of the average grain size of the abrasive grains is held by plating, the embedding rate is displayed as 50%. The chip channel ratio can also be adjusted by attaching masking tape or the like to the outer peripheral edge of the base metal. The embedding rate may be 55 to 100% of the abrasive grain size.

Next, an experiment for investigating the relationship between the chip channel ratio (r) and the life of the cutting blade will be described. # 50 /
A # 60 diamond abrasive grain having a diameter of 105 mm and a thickness of 1.
The outer peripheral portion of the base metal 1 of 0 mm was temporarily fixed by nickel electroplating, and the chip channel ratio r of the product of the present invention was adjusted to r = 0.56. As a comparative material, r = -0.82
Was adjusted so that After that, the embedding ratio was set to 70% of the average abrasive grain size by electroplating with nickel, and the abrasive grains were completely retained to prepare the cutting blade 10 shown in FIG. Figure 3
, The chip channel ratio (r) is -0.8.
In the comparative material of No. 2, there are many circumferential overlaps between the abrasive grains. On the other hand, in the material of the present invention having a chip channel ratio (r) of 0.56 shown in FIG. 4, there is almost no circumferential overlap between the abrasive grains.

Cutting load of 2.0 kg using the above cutting blade
f, a cutting experiment was carried out by a dry method using a porcelain tile (thickness: 9 mm, length: 200 mm) as a work material under the cutting conditions of a cutting speed of 12,000 rpm. A cutting blade (r = -0.82) as a comparative material and a cutting blade of the present invention (r =
The relationship between the cutting speed of 0.56) and the cutting length is shown in FIG.
As is clear from FIG. 7, the comparative material can cut the work material up to 23 m even if the cutting speed is slowed down to 8 mm / sec (the life is 23 m), but the product of the present invention can cut up to 120 m. Yes, it was found that the life was dramatically extended.

Next, under the above-mentioned conditions, various cutting blade test pieces having different chip channel ratios were produced. Then, under the same cutting conditions as described above, the relationship between the chip channel ratio and the cutting length (lifetime) and the relationship between the chip channel ratio and the average cutting speed were examined. The results of each experiment are shown in FIGS. 8 and 9. As is clear from FIG. 9, when the chip channel ratio was in the range of −0.2 to 5, it was possible to cut at the desired cutting speed while maintaining the life of the cutting blade. When the chip channel ratio was 7, the cutting blade was out of service life and could not be measured. Further, as is apparent from FIG. 8, it was found that the life of the cutting blade was particularly good when the chip channel ratio was 0 or more and 1.5 or less.

By analogy with the experimental results shown in FIGS. 9 and 8, when the chip channel ratio r is −0.2 or less, the abrasive grain overlapping region increases as shown in FIG.
When cutting the hard and brittle material such as porcelain tile when the cutting blade is rotating in the direction of arrow A at the time of cutting as shown in FIG. However, when the abrasive grains 2 are slightly worn, a large number of the abrasive grains 2 overlap and come into contact with the work material 5 at the same time, so that the surface pressure for each abrasive grain decreases, and the abrasive material 2 bites into the work material 5. It is considered that the ability is reduced and the frictional force with respect to the work material 5 is increased. Also, the chip channel ratio r is -0.2
When it is less than the above range, the overlapping area of the abrasive grains increases, and thus the grinding debris is likely to be clogged between the abrasive grains. Due to the decrease in surface pressure and the clogging of grinding dust, heat is generated between the abrasive grains 2 and the work material 5, and the deterioration of the abrasive grains 2 and the abnormal destruction of the work material 5 occur.
It is considered that only about 0% contributes to cutting and reaches the end of life. Therefore, from the experimental results, it is appropriate to set the lower limit of the chip channel ratio to -0.2.

Further, when the chip channel ratio is made larger than 0, even if the abrasive grains 2e, 2g, ... Are slightly worn, the tendency of the decrease of the surface pressure is weakened, and as shown in FIG. 2 g bites into the work material 5 while biting into the work material 5, and the next abrasive grain 2 f is the edge 3 a of the work material 3.
It is considered that it is easier to bite into, and further abrasive grains can be continuously cut without causing friction. Further, the grinding dust 6 can be located between the abrasive grains, and the smooth discharge is possible. The chain line 7 in FIG. 6 means the work surface of the work material 5 before grinding.

By setting the upper limit of the chip channel ratio to 5, it becomes possible to cut at a desired cutting speed while maintaining the life of the cutting blade as described above. Further, if the upper limit value is set to 1.5, the distance between the abrasive grains becomes more appropriate, and the impact force from the object to be cut that acts on each abrasive grain is further reduced. From the above, in order to increase the cutting speed while maintaining the general life required in this technical field, the chip channel ratio r is set to -0.2 or more and 5 or less. Further, in order to further extend the life of the cutting blade while maintaining a desired cutting speed, it is particularly preferable that the chip channel ratio r is 0 or more and 1.5 or less.

[0020]

According to the superabrasive grain electrodeposition cutting blade of the present invention described in detail above, the gap between the abrasive grains is set within a predetermined range, so that the abrasive grains bite into the work material. It becomes easier and the cutting speed and life of the cutting blade can be improved. Further, since the bite is smooth, frictional heat is unlikely to be generated, so expensive abrasive grains are effectively used, and dry cutting is also possible. Further, since the chip channel ratio is larger than that of the metal bond or the conventional electrodeposition cutting blade, the excretion of cutting waste is smoothed, a high cutting speed can be maintained, and chipping is reduced. And the machining of the base metal itself is unnecessary,
There is an advantage that the superabrasive grain electrodeposition cutting blade can be provided by a simple method of controlling the chip channel ratio.

[Brief description of drawings]

FIG. 1 is a plan view of a circular superabrasive grain electrodeposition cutting blade.

2 (A) is a schematic enlarged view of an electrodeposition layer at the outermost peripheral end face portion of the cutting blade as viewed in the direction of arrow II in FIG.
(B) is a schematic enlarged view of the electrodeposition layer in the outermost peripheral end face portion viewed from the axial direction of the cutting blade.

FIG. 3 is a schematic enlarged view showing an electrodeposited layer on the outermost peripheral end face portion having a chip channel ratio r of −0.82.

FIG. 4 shows a chip channel ratio r of 0.56 according to the present invention.
An enlarged schematic view showing the electrodeposited layer on the outermost peripheral end face portion

FIG. 5 is a schematic view showing a cutting state of a cutting blade having an electrodeposition layer having a chip channel ratio r of −0.82.

FIG. 6 shows a chip channel ratio r of 0.56 according to the present invention.
FIG. 6 is a schematic view showing a cutting state of a cutting blade having an electrodeposited layer.

FIG. 7 is a graph showing the relationship between the cutting speed and the cutting length of the product of the present invention and the comparative material.

FIG. 8 is a graph showing the relationship between chip channel ratio and cutting length.

FIG. 9 is a graph showing the relationship between chip channel ratio and average cutting speed.

[Explanation of symbols]

 1 base metal 2a, 2b, 2c, 2d, 2e super abrasive grain 3 holding plating 4 electrodeposition layer

Claims (2)

[Claims] 1. A superabrasive grain electrodeposition cutting blade having a base metal and a superabrasive grain electrodeposition layer electrodeposited on the outer periphery of the base metal, and a chip channel ratio indicating the electrodeposition state of the abrasive grains. Is -0.2 or more and 5 or less, a superabrasive electrodeposition cutting blade. 2. The chip channel ratio is 0 or more and 1.5.
The superabrasive grain electrodeposition cutting blade according to claim 1, wherein: