JPH0751839Y2 - Chip circuit component supply device - Google Patents

Description

[Detailed description of the device]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for picking up and supplying in a line chip-shaped circuit components stored in bulk in a hopper.

[0002]

2. Description of the Related Art A conventional component supply device of this type is
As shown in FIG. 6, the hopper 1 is formed by the base member 38 and the cylindrical body 41 standing upright from the base member 38, and the inclined surface 2 having a funnel-shaped inclination is formed on the bottom surface of the base member 38. The upper end of the component discharge pipe 49 is vertically slidably inserted through a through hole formed at the lowest central portion of the sloped surface 2. The upper end of the component discharge pipe 49 is opened obliquely. The slide member 37 protruding from the bottom of the base member 38 is slidably fitted in the recess of the guide member 36 fixed to the frame 35, whereby the hopper 1 is guided slidably up and down. Is reciprocated up and down by a drive mechanism (not shown).

As the hopper 1 is driven up and down in this way, the upper end of the component discharge pipe 49 is located at the hopper 1.
Reciprocate up and down relatively in the. Then, when the upper end of the component discharge pipe 49 rises from the bottom of the base member 38, the chip-shaped circuit components a, a ... In the hopper 1 are collapsed, and when the upper end of the component discharge pipe 49 is lowered, from the opening thereof. Every one chip-shaped circuit component a enters the component discharge pipe 49. In this way, the chip-shaped circuit components a that have entered the component discharge pipe 49 are lined up in a line and sequentially fed downward. At the lower end of the component discharge pipe 49, an escapement mechanism for releasing the chip-shaped circuit components a one by one to the pipe-shaped component transport paths 10, 10 ... Is provided. As a result, the chip-shaped circuit components a lined up in a line in the component discharge pipe 49 are delivered to the component transport path 10 one by one, and transported to a predetermined location through the component transport path 10.

[0004]

However, in such a conventional chip-shaped circuit component supply device,
A power for reciprocating the hopper 1 up and down with respect to the component discharge pipe 49 and a mechanism for transmitting the power to the hopper 1 are required, and the configuration of the apparatus becomes complicated as a whole. Further, since the control system of the device is complicated and the operation is troublesome, there is a problem that the device is expensive to manufacture and the operation is complicated. The object of the present invention is to solve the above-mentioned conventional problems,
When supplying chip-shaped circuit components that are attracted to magnets that have magnetic electrodes, it is possible to supply chip-shaped circuit components only by the vibration that occurs with the operation of the chip mounter, etc. without driving the hopper. It is to provide a possible chip-shaped circuit component supply device.

[0005]

In order to achieve the above-mentioned object, the present invention has a hopper 1 in which chip-shaped circuit components a, a ... Are contained in a bulk shape, and a bottom surface has a sloped surface 2 inclined like a funnel. In the chip-shaped circuit component supply device having the component discharge path 48 for discharging the chip-shaped circuit component a from the hopper 1, the sloped surface 2 inclined like the funnel.
The magnet 4 is arranged on the portion surrounded by
Chip-like circuit component a lowest portion of the provide a chip-like CC supplying device, characterized in that component discharge path 48 can pass is connected in a row.

[0006]

In the chip-shaped circuit component supply device according to the present invention, since the magnet 4 is arranged on the portion surrounded by the sloped surface 2 which inclines like a funnel, the chip-shaped circuit element inserted into the hopper 1 is inserted. The circuit component a is attracted to the magnet 4 to form a dense portion of the chip-shaped circuit component a on the portion surrounded by the inclined surface 2. Then, the chip-shaped circuit component a attracted to the magnet 4 is gradually dropped from the magnet 4 due to vibration or the like accompanying the operation of the chip mounter equipped with this chip-shaped circuit component supply device, and these are descended along the inclined surface 2. Then
It is discharged to the component discharge path 48 connected to the bottom thereof, and is sent in a line through the discharge path 48 .

[0007]

Embodiments of the present invention will now be described in detail with reference to the drawings. First, the embodiment shown in FIG. 1 and FIG. 2 will be described. In the component supply device, the hopper 1 is constituted by the cylindrical body 41 standing upright from the base member 38 as in the conventional device described above. The sloped surface 2 having a funnel-shaped slope is formed on the bottom surface of the base member 38,
The upper end of the component discharge path 48 is connected and fixed to this lowest through hole in the center of the bottom. The component discharge path 48 has a diameter through which the chip-shaped circuit component a can pass vertically, and the chip-shaped circuit component a that has entered the component discharge path 48 vertically drops therein. .

Partition plates 42 and 43, which are inclined toward the center, extend vertically from the opposing wall surfaces in the middle portion of the cylindrical body 41 of the hopper 1, and the chip-shaped circuit component a on the partition plates is once provided. It is designed so that it does not fall down. Therefore,
Below the partition plates 42 and 43, the chip-shaped circuit components a are sparsely present as compared with the above. Furthermore, this partition plate 4
A magnet 4 is provided between the parts 2, 43 and the sloped surface 2 of the hopper 1 and directly above the component discharge path 48. Hopper 1
The chip-shaped circuit parts a, a ...
However, if the chip-shaped circuit parts a that are adsorbed become excessive, the chip-shaped circuit parts a sequentially drop due to the excess due to vibration or the like. Therefore, as shown in the figure, the chip-shaped circuit components a, a ... Are sparse under the magnet 4, and the chip-shaped circuit component a that has fallen off the magnet 4 slides on the sloped surface 2 to sequentially discharge the component discharge paths. Four
Go into it from the top of No. 8. In this way, the chip-shaped circuit components a that have entered the component discharge path 48 are lined up in a line and sequentially fed downward.

An escapement mechanism for escaping the chip-shaped circuit components a one by one to the pipe-shaped component transport paths 10, 10 ... Is provided at the lower end side of the component discharge path 48. That is, the central axes of the lower end of the component discharge path 48 and the upper end of the component transport path 10 are laterally displaced. And
In the meantime, the slider 54 slides to the left and right in FIG. 2, and the through hole 64 formed in this slides the component discharge passage 48.
It reciprocates between the lower end of the component conveyance path and the upper end of the component conveyance path 10. As a result, the chip-shaped circuit components a lined up in a line in the component discharge path 48 are sent to the component transfer path 10 one by one,
Be transported.

Next, the embodiment shown in FIG. 3 will be described. In this embodiment, the partition plates 42 and 43 as described above are not provided in the intermediate portion of the hopper 1, but only the magnet 4 is provided. . In addition, the sloped surface 2 is narrowed, a raised wall is provided on the sloped surface 2, and the chip-shaped circuit component a is dropped from the magnet 4.
Restricts the drop port that falls toward the slope 2. When the chip-shaped circuit parts a to be put into the hopper 1 are sparse, the partition plates 42 and 43 as shown in FIGS. 1 and 2 are not always necessary.

Next, the embodiment shown in FIG. 4 will be described. In this embodiment, as shown in FIG. 3, the sloped surface 2 is narrowed and a raised wall is provided on the sloped surface 2 to form a chip-shaped circuit component a. Of the chip-shaped circuit component a, magnets 4 and 4'are arranged so as to oppose the drop openings of the chip-shaped circuit component a. It is desirable that a channel be formed. That is, the magnet 4,
The 4'opposing magnetic poles may have different polarities S, N. As a result, a screen of magnetic force that temporarily stagnates the chip-shaped circuit component a is formed at the drop opening to the sloped surface 2, and the drop of the chip-shaped circuit component a can be effectively regulated.

Next, the embodiment shown in FIG. 5 will be described. In this embodiment, instead of the partition plates 42 and 43 having the gradient shown in FIG. 1, a horizontal partition is provided in the center of the cylindrical body 41. A plate 44 is provided. Further, the magnet 4 is attached to the partition plate 44.
There are a total of three, one on each of the lower sides and one below each. It is to be noted that the sloped surface 2 is narrowed and a raised wall is provided on the sloped surface 2 to limit the drop opening through which the chip-shaped circuit component a falling from the magnet 4 falls toward the sloped surface 2.
Is the same as that shown in.

[0012]

As described above, according to the present invention, when the chip-shaped circuit components having the magnetic portion in the hopper 1 are taken out in a row and sent out, the vibrations that are inevitably generated during the operation of the device. Since the chip-shaped circuit parts can be sequentially supplied to the part discharge path side, there is no need to provide a mechanism for vertically moving the hopper as in the conventional case, and a chip-shaped circuit part supply device that has a simple structure and can be easily operated is provided. Can be provided.

[Brief description of drawings]

FIG. 1 is a half cross-sectional perspective view of a chip-shaped circuit component supply device according to a first embodiment of the present invention.

FIG. 2 is a vertical sectional front view of the chip-shaped circuit component supply device according to the first embodiment of the present invention.

FIG. 3 is a vertical sectional front view of a main part of a chip-shaped circuit component supply device according to a second embodiment of the present invention.

FIG. 4 is a vertical sectional front view of a main portion of a chip-shaped circuit component supply device according to a third embodiment of the present invention.

FIG. 5 is a vertical sectional front view of a chip-shaped circuit component supply device according to a fourth embodiment of the present invention.

FIG. 6 is a vertical sectional front view of a conventional component supply device.

[Explanation of symbols]

 1 Hopper 2 Gradient surface 4 Magnet 10 Component transport path 48 Component discharge path a Chip-shaped circuit component

Claims (1)

[Scope of utility model registration request] 1. A sloped surface in which chip-shaped circuit components (a), (a) ... Are accommodated in a bulk shape, and the bottom surface is inclined like a funnel.
A hopper (1) having (2) and a component discharge path (4 ) for discharging the chip-shaped circuit component (a) from the hopper (1).
8), a chip-shaped circuit component supply device having a magnet (4) is disposed on a portion surrounded by the funnel-shaped inclined surface (2), and the magnet (4) is provided at the lowest portion of the inclined surface (2). Component discharge path through which chip-shaped circuit components (a) can pass in a line
(48) is connected to the chip-shaped circuit component supply device.