JPH0751305B2 - Mold for molding - Google Patents
Mold for moldingInfo
- Publication number
- JPH0751305B2 JPH0751305B2 JP7466387A JP7466387A JPH0751305B2 JP H0751305 B2 JPH0751305 B2 JP H0751305B2 JP 7466387 A JP7466387 A JP 7466387A JP 7466387 A JP7466387 A JP 7466387A JP H0751305 B2 JPH0751305 B2 JP H0751305B2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- molding
- heat medium
- molded product
- medium passage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、たとえばレンズのような肉厚の不均一な成型
品を製造するために用いられる成型用金型に関するもの
である。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding die used for producing a molded product having a non-uniform thickness such as a lens.
従来の技術 従来、加熱溶融した熱可塑性樹脂を金型内に射出・充填
させて冷却し、成型品を得る射出成型型において、成型
用金型は、図３に示すような構造になっていた。すなわ
ち、射出成型を行うための第１金型２と第２金型３が設
けられ、この金型2,3によって成型空間４が規定され
る。そして金型２と３には成型空間４に臨んでサーキッ
ト型の熱媒体通路５が金型表面6,7から等距離に配置さ
れていた。2. Description of the Related Art Conventionally, in an injection molding die in which a thermoplastic resin that has been heated and melted is injected and filled in a mold and then cooled to obtain a molded product, the molding die has a structure as shown in FIG. . That is, a first mold 2 and a second mold 3 for performing injection molding are provided, and the molding space 4 is defined by the molds 2 and 3. A circuit-type heat medium passage 5 was arranged in the molds 2 and 3 facing the molding space 4 at an equal distance from the mold surfaces 6 and 7.
発明が解決しようとする問題点 しかし、このような構造のものでは、ヒケ・ソリという
欠陥をもった成型品を生じるという問題点があった。Problems to be Solved by the Invention However, with such a structure, there is a problem in that a molded product having a defect such as sink mark and warp is produced.
つまり金型2,3の温度を熱媒体を熱媒体通路５に通すこ
とによって制御するため、担当する表面6,7の面積が不
均一の場合、表面6,7が局部的な温度不均一を起し、ひ
いては成型品が一様な熱収縮を起こさないためである。That is, since the temperatures of the molds 2 and 3 are controlled by passing the heat medium through the heat medium passage 5, when the areas of the surfaces 6 and 7 in charge are uneven, the surfaces 6 and 7 are locally uneven in temperature. This is because the molded product does not undergo uniform heat shrinkage.
そこで本発明は、金型の表面温度を常に均一にして、ヒ
ケ・ソリのない成型品を射出成型で得るようにするもの
である。In view of this, the present invention is intended to obtain a molded product free from sink marks and warps by injection molding so that the surface temperature of the mold is always uniform.
問題点を解決するための手段 そして本発明を実現するための技術的手段として、金型
内の熱媒体通路を金型表面から不均一に配置するもので
ある。Means for Solving the Problems And, as a technical means for realizing the present invention, the heat medium passages in the mold are non-uniformly arranged from the mold surface.
すなわち、熱媒体通路が担当する金型表面の面積が大き
い所では金型表面から近い距離をおいて配置する。また
熱媒体通路の上流側から下流側に向い金型表面との距離
が小さくなるように配置するのである。That is, in a place where the area of the die surface covered by the heat medium passage is large, the heat medium passage is arranged at a short distance from the die surface. In addition, the heat medium passage is arranged so that the distance from the upstream side to the downstream side of the heat medium passage and the surface of the mold becomes small.
作用 したがってこの技術的手段による作用は次のようにな
る。つまり、金型内に配置された熱媒体通路はすべて金
型の表面に対して同等の熱的効果を有するため、成型品
の表面温度は均一になり、局部的な熱収縮は発生せず、
良質の成型品を得ることができる。Action Therefore, the action by this technical means is as follows. In other words, since all the heat medium passages arranged in the mold have the same thermal effect on the surface of the mold, the surface temperature of the molded product becomes uniform, and local heat shrinkage does not occur,
Good quality molded products can be obtained.
実施例 以下、本発明の一実施例を添付図面に基づいて説明す
る。第１図は、本発明の実施例における成型用金型１の
断面図である。射出成型を行うために第１金型２および
第２金型３が設けられ、この金型2,3によって成型空間
４が規定される。成型空間４は成型品の形態（本実施例
ではレンズ形断面を有する曲面状）に応じて選ばれる。
第１金型２と第２金型３の間にはノズル孔９が設けら
れ、これに連なってノズル流路８が形成されている。金
型２および金型３の内部には、金型表面６および７から
距離を調整して配置された冷却手段または加熱手段とし
ての熱媒体通路５が設けられている。Embodiment An embodiment of the present invention will be described below with reference to the accompanying drawings. FIG. 1 is a sectional view of a molding die 1 according to an embodiment of the present invention. A first mold 2 and a second mold 3 are provided to perform injection molding, and a molding space 4 is defined by the molds 2 and 3. The molding space 4 is selected according to the shape of the molded product (curved surface having a lens-shaped cross section in this embodiment).
A nozzle hole 9 is provided between the first mold 2 and the second mold 3, and a nozzle flow path 8 is formed continuously from the nozzle hole 9. Inside the mold 2 and the mold 3, there is provided a heat medium passage 5 as a cooling unit or a heating unit, which is arranged by adjusting the distance from the mold surfaces 6 and 7.
以上のように構成された成型用金型について、以下第１
図および第２図を用いてその動作を説明する。Regarding the molding die configured as described above, the first
The operation will be described with reference to the drawings and FIG.
第２図は、金型表面6,7の温度と射出成型のサイクルタ
イムとの関係を示すグラフである。射出成型のサイクル
タイムは射出開始時刻τ1，射出終了時刻τ2，冷却開始
時刻τ3、冷却終了時刻τ4とそれぞれ設定されており、
τ1〜τ4を１成型サイクルとする。FIG. 2 is a graph showing the relationship between the temperatures of the mold surfaces 6 and 7 and the cycle time of injection molding. The injection molding cycle time is set to injection start time τ 1 , injection end time τ 2 , cooling start time τ 3 , and cooling end time τ 4 , respectively.
Let τ 1 to τ 4 be one molding cycle.
時刻τ1からτ2までの間では第１図のノズル８に準備さ
れた熱可塑性樹脂がノズル孔９を介して成型空間４内に
射出される。このとき、熱可塑性樹脂の溶融点温度T1よ
り高温に金型温度を設定することにより、金型に熱を奪
われることなく熱可塑性樹脂は成型空間４に充填され
る。金型の表面7,8を加熱するためには熱媒体通路５に
高温スチームを流す。金型表面7,8は加熱されて一様な
温度上昇を行うので、成型空間４に充填された熱可塑性
樹脂の金型表面7,8に接する部分の温度は均一になる。Between times τ 1 and τ 2 , the thermoplastic resin prepared in the nozzle 8 of FIG. 1 is injected into the molding space 4 through the nozzle hole 9. At this time, by setting the mold temperature higher than the melting point temperature T 1 of the thermoplastic resin, the thermoplastic resin is filled in the molding space 4 without the heat being taken by the mold. In order to heat the surfaces 7 and 8 of the mold, high-temperature steam is passed through the heat medium passage 5. Since the mold surfaces 7 and 8 are heated and uniformly rise in temperature, the temperature of the portion of the thermoplastic resin filled in the molding space 4 in contact with the mold surfaces 7 and 8 becomes uniform.
時刻τ2では、熱媒体通路５に通じていたスチームを切
り、射出を完了させる。At time τ 2 , the steam communicating with the heat medium passage 5 is cut off to complete the injection.
時刻τ3からτ4の間では、金型2,3内に射出された熱可
塑性樹脂を成型空間４内で冷却固化させるため、熱媒体
通路５に温度T2の冷却液を流す。このとき、表面7,8の
温度は一様に低下するため、局部的な成型収縮を避ける
ことができる。Between times τ 3 and τ 4 , in order to cool and solidify the thermoplastic resin injected into the molds 2 and 3 in the molding space 4, the cooling liquid at the temperature T 2 is passed through the heat medium passage 5. At this time, the temperatures of the surfaces 7 and 8 are uniformly lowered, so that local molding shrinkage can be avoided.
時刻τ4からτ5の間では金型2,3の型開きを行って成型
品の取り出しを行い、その後熱媒体通路５に高温スチー
ムを流し、金型2,3の表面7,8の温度を上昇させて上記動
作を繰り返す。Between times τ 4 and τ 5, the molds 2 and 3 are opened and the molded product is taken out, and then high-temperature steam is flown through the heat medium passage 5 to cool the surfaces 7 and 8 of the molds 2 and 3. Is raised and the above operation is repeated.
このように、熱媒体通路５の金型内での位置を不均一に
することによって良質の成型品を得ることができる。In this way, by making the position of the heat medium passage 5 in the mold non-uniform, a good quality molded product can be obtained.
なお、上記の実施例では金型の加熱にスチームを用いた
が、金型全体を電気的な加熱手段を用いて加熱してもよ
い。Although steam was used to heat the mold in the above-mentioned embodiments, the entire mold may be heated using an electric heating means.
発明の効果 以上のように本発明は、成型空間に臨む金型表面付近に
不均一な距離をもって熱媒体通路を設けることによっ
て、金型の成型面温度の均一化をはかり、良質の成型品
を得ることができる。EFFECTS OF THE INVENTION As described above, according to the present invention, by providing the heat medium passage with a non-uniform distance in the vicinity of the mold surface facing the molding space, the molding surface temperature of the mold is made uniform, and a high-quality molded product is obtained. Obtainable.
第１図は本発明の一実施例を示す断面図、第２図は金型
表面の表面温度と射出成型とのサイクルタイムとの関係
を示すグラフ、第３図は従来の成型用金型を示す断面図
である。 １……成型用金型、４……成型空間、５……熱媒体通
路。FIG. 1 is a sectional view showing an embodiment of the present invention, FIG. 2 is a graph showing the relationship between the surface temperature of the mold surface and the cycle time of injection molding, and FIG. 3 is a conventional molding mold. It is sectional drawing shown. 1 ... Mold for molding, 4 ... Molding space, 5 ... Heat medium passage.
フロントページの続き (56)参考文献 特開 昭64−51913（ＪＰ，Ａ) 特開 昭62−95210（ＪＰ，Ａ) 特開 昭59−142108（ＪＰ，Ａ) 特開 昭62−130764（ＪＰ，Ａ) 特開 昭63−159227（ＪＰ，Ａ) 実開 昭61−56012（ＪＰ，Ｕ) 実開 昭62−19220（ＪＰ，Ｕ)Continuation of the front page (56) Reference JP-A-64-51913 (JP, A) JP-A-62-95210 (JP, A) JP-A-59-142108 (JP, A) JP-A-62-130764 (JP , A) JP-A-63-159227 (JP, A) Actually opened 61-56012 (JP, U) Actually opened 62-19220 (JP, U)
Claims (2)
型品の成型金型で、成型空間に臨む表面付近において配
置されたサーキット型の熱媒体通路が、成型品の厚みが
大なるところに比べて小なるところで前記表面に近づけ
たことを特徴とする成型用金型。1. A molding die for a molded product, which is thicker in the vicinity of the center and thinner in the vicinity than in the center, and a circuit type heat medium passage arranged near the surface facing the molding space is provided in a place where the thickness of the molded product is large. A molding die characterized in that it is brought closer to the surface at a position smaller than the above.
で、内周側より外周側の熱媒体通路を成型空間に臨む表
面付近において成型面に近づけて配置したことを特徴と
する特許請求の範囲第（１）項記載の成型用金型。2. A molding die of a molded product having an axially symmetric lens shape, characterized in that the heat medium passages from the inner peripheral side to the outer peripheral side are arranged close to the molding surface near the surface facing the molding space. The molding die according to claim (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7466387A JPH0751305B2 (en) | 1987-03-27 | 1987-03-27 | Mold for molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7466387A JPH0751305B2 (en) | 1987-03-27 | 1987-03-27 | Mold for molding |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63239026A JPS63239026A (en) | 1988-10-05 |
| JPH0751305B2 true JPH0751305B2 (en) | 1995-06-05 |
Family
ID=13553698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7466387A Expired - Fee Related JPH0751305B2 (en) | 1987-03-27 | 1987-03-27 | Mold for molding |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0751305B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101418473B1 (en) * | 2014-02-06 | 2014-07-22 | 나노몰텍주식회사 | Molding device for camera lens |
-
1987
- 1987-03-27 JP JP7466387A patent/JPH0751305B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101418473B1 (en) * | 2014-02-06 | 2014-07-22 | 나노몰텍주식회사 | Molding device for camera lens |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63239026A (en) | 1988-10-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |