JPH0750458A - Printed board - Google Patents
Printed boardInfo
- Publication number
- JPH0750458A JPH0750458A JP19277094A JP19277094A JPH0750458A JP H0750458 A JPH0750458 A JP H0750458A JP 19277094 A JP19277094 A JP 19277094A JP 19277094 A JP19277094 A JP 19277094A JP H0750458 A JPH0750458 A JP H0750458A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- circuit pattern
- circuit
- substrate
- conductor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0097—Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、絶縁性の基板表面に
銅箔等の回路パターンが形成されたプリント基板に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed board having a circuit pattern such as copper foil formed on the surface of an insulating board.
【０００２】[0002]
【従来の技術】従来、実開昭５８−１７０８６０号、実
開昭６０−１６９８５７号公報に開示されているよう
に、回路基板に対して電子部品を実装する際の熱によっ
て、回路基板が反ってしまうのを防止するため、プリン
ト基板のうちの回路パターンのない捨て基板部に導体層
を形成したものがある。この捨て基板部の導体層は、回
路基板部の回路パターン形成面とは逆の側に形成されて
いる。2. Description of the Related Art Conventionally, as disclosed in Japanese Utility Model Publication No. 58-170860 and Japanese Utility Model Publication No. 60-169857, the circuit board is warped by heat when mounting electronic parts on the circuit board. There is a printed circuit board in which a conductor layer is formed on a discarded circuit board portion having no circuit pattern in order to prevent such a situation. The conductor layer of the discarded board portion is formed on the side opposite to the circuit pattern forming surface of the circuit board portion.
【０００３】[0003]
【発明が解決しようとする課題】上記従来の技術の場
合、単に回路パターンが形成されていない側の捨て基板
部に導体層を形成しているだけなので、回路基板部の回
路パターン密度の異なる場合や両面に回路パターンがあ
る場合等に十分に反りを防止できないという問題があ
る。In the case of the above-mentioned conventional technique, since the conductor layer is simply formed on the discarded substrate portion on the side where the circuit pattern is not formed, the circuit pattern density of the circuit substrate portion is different. There is a problem that the warp cannot be sufficiently prevented when there are circuit patterns on both sides.
【０００４】さらに、絶縁基板に樹脂被膜や導電塗料に
よる回路を形成した後の加熱乾燥工程によって、絶縁基
板中の水分が抜けたり、絶縁基板中の樹脂が未硬化の場
合にこの工程で完全に硬化したりするが、このとき絶縁
基板自体が収縮し、銅箔等の回路パターンは収縮しない
ので、プリント基板は回路パターン側を凸にして反って
しまい、上記従来の技術ではこれを防止できない。Further, when moisture in the insulating substrate is removed or the resin in the insulating substrate is uncured by a heating and drying process after forming a circuit with a resin coating film or a conductive paint on the insulating substrate, this process is completely performed. Although it hardens, the insulating substrate itself shrinks at this time and the circuit pattern such as the copper foil does not shrink, so that the printed circuit board is warped with the circuit pattern side protruding, which cannot be prevented by the above-mentioned conventional technique.
【０００５】この発明は上記従来の技術に鑑みて為され
たもので、回路パターンが形成されたプリント基板の製
造工程途中における反りをなくしたプリント基板を提供
することを目的とする。The present invention has been made in view of the above conventional technique, and an object of the present invention is to provide a printed circuit board in which warpage is eliminated during the manufacturing process of the printed circuit board on which a circuit pattern is formed.
【０００６】[0006]
【課題を解決するための手段】この発明は、絶縁基板の
少なくとも一方の面に所定の回路パターンを形成した回
路基板部と、回路基板部以外の捨て基板部とを有し、回
路パターン形成面と同じ側の捨て基板の面に導体層を形
成し、上記回路基板の回路パターン形成部分以外に透孔
が形成され、回路基板部の回路パターン及び捨て基板部
の導体層を被って樹脂被膜を設けたプリント基板であ
る。上記透孔は、回路パターンの空きスペースに形成さ
れたものや分割用のミシン目であり、回路パターンに沿
って又は捨て基板の導体層に沿って形成されたものであ
る。The present invention has a circuit board portion having a predetermined circuit pattern formed on at least one surface of an insulating substrate, and a waste board portion other than the circuit board portion. A conductor layer is formed on the surface of the waste board on the same side as the above, a through hole is formed in a portion other than the circuit pattern forming portion of the circuit board, and a resin film is formed by covering the circuit pattern of the circuit board portion and the conductor layer of the waste substrate portion. It is a printed circuit board provided. The through holes are those formed in the empty space of the circuit pattern or perforations for division, and are formed along the circuit pattern or along the conductor layer of the discarded substrate.
【０００７】[0007]
【作用】この発明のプリント基板は、空きスペースに透
孔が形成され、絶縁基板内部の応力が分散また開放さ
れ、さらに、捨て基板部の導体層及び樹脂被膜が反りに
対して抵抗し、プリント基板が製造工程途中で反ってし
まうことがないようにしたものである。In the printed circuit board of the present invention, a through hole is formed in an empty space, the stress inside the insulating substrate is dispersed or released, and further, the conductor layer and the resin coating of the discarded substrate part resist warpage, and the printed circuit board is printed. This is to prevent the substrate from warping during the manufacturing process.
【０００８】[0008]
【実施例】以下、この発明の実施例について図面に基づ
いて説明する。この実施例のプリント基板１は、フェノ
ール樹脂等の絶縁基板２に銅箔の回路パターン３を形成
したもので、複数の回路の回路パターン３がミシン目４
をはさんで形成されている。さらに、絶縁基板２の側縁
部には、透孔であるミシン目４が設けられ、このミシン
目４の内側は回路パターン３が設けられた回路基板部５
であり、外側は回路パターン３が形成されていない捨て
基板部６である。Embodiments of the present invention will be described below with reference to the drawings. The printed circuit board 1 of this embodiment is formed by forming a circuit pattern 3 of copper foil on an insulating substrate 2 made of phenolic resin or the like.
It is formed by sandwiching. Further, a perforation 4 which is a through hole is provided at a side edge portion of the insulating substrate 2, and a circuit board portion 5 provided with a circuit pattern 3 inside the perforation 4.
The outer side is the discarded substrate portion 6 on which the circuit pattern 3 is not formed.
【０００９】回路基板部５には、表裏面に回路パターン
３が設けられている他、チップ抵抗等の電子素子７が表
側の回路パターン３に装着され、この電子素子７の装着
部を除いて回路パターン３の表面及び絶縁基板２の表面
は、ハンダレジストである樹脂被膜８で被われている。In addition to the circuit patterns 3 provided on the front and back surfaces of the circuit board portion 5, an electronic element 7 such as a chip resistor is mounted on the circuit pattern 3 on the front side, except for the mounting portion of the electronic element 7. The surface of the circuit pattern 3 and the surface of the insulating substrate 2 are covered with a resin film 8 which is a solder resist.
【００１０】また、捨て基板部６の表裏面にはマトリク
ス状に方形の銅箔９が設けられ、電子素子７が設けられ
ている表側の捨て基板表面の銅箔９は、捨て基板６の裏
面側の銅箔９より銅箔の島面積の密度が高く形成されて
いる。これは、回路基板部５の回路パターン３の表面積
の密度が回路基板部５の表側より裏側の方が高いので、
変形時の応力を相互に打ち消すように、銅箔の絶縁基板
１に対する面積比を調整しているものである。さらに、
捨て基板部６の表裏面にもハンダレジストである樹脂被
膜１０が設けられている。Further, rectangular copper foils 9 are provided in a matrix on the front and back surfaces of the waste substrate portion 6, and the copper foil 9 on the front surface of the waste substrate on which the electronic elements 7 are provided is the back surface of the waste substrate 6. The density of the island area of the copper foil is higher than that of the copper foil 9 on the side. This is because the surface area density of the circuit pattern 3 of the circuit board portion 5 is higher on the back side than on the front side of the circuit board portion 5,
The area ratio of the copper foil to the insulating substrate 1 is adjusted so that the stresses at the time of deformation cancel each other out. further,
The resin coating film 10 which is a solder resist is also provided on the front and back surfaces of the discarded substrate portion 6.
【００１１】また、絶縁基板２の回路パターン３が形成
されていない部分のうち比較的広い部分は、打ち抜かれ
て透孔１１が形成されている。透孔１１は、回路パター
ン３に沿って形成され、回路基板５の内部応力や回路パ
ターンによる応力を分散又は開放するように設けられて
いる。A relatively wide portion of the insulating substrate 2 where the circuit pattern 3 is not formed is punched to form a through hole 11. The through holes 11 are formed along the circuit pattern 3 and are provided so as to disperse or release the internal stress of the circuit board 5 and the stress due to the circuit pattern.
【００１２】この実施例のプリント基板１は、絶縁基板
２の表面に周知の方法で銅箔の回路パターン３を形成
し、その際同様の方法で捨て基板６にも銅箔９の方形パ
ターンを形成する。次に、必要に応じて絶縁基板１の表
裏面に印刷抵抗等を設け、この後電子素子７が装着され
る部分を除いて回路基板部５および捨て基板部６の表裏
面に樹脂被膜８，１０が施される。このようにして形成
されたプリント基板１は、電子機器に組み込まれる前に
電子素子７が装着され、ミシン目４に沿って捨て基板部
６が分割されて除去され、一枚毎の回路基板にされて所
定のコネクタ等が取り付けられ電子機器に組み込まれ
る。In the printed circuit board 1 of this embodiment, a circuit pattern 3 of copper foil is formed on the surface of the insulating substrate 2 by a known method, and a rectangular pattern of the copper foil 9 is also formed on the discarded substrate 6 by the same method. Form. Next, a printing resistor or the like is provided on the front and back surfaces of the insulating substrate 1 as required, and thereafter, the resin coatings 8, Ten is given. In the printed circuit board 1 thus formed, the electronic element 7 is mounted before being incorporated into an electronic device, and the discarded board portion 6 is divided and removed along the perforations 4 to form a circuit board for each sheet. Then, a predetermined connector or the like is attached and incorporated into an electronic device.
【００１３】この実施例のプリント基板１は、捨て基板
部６に回路基板部５の回路パターン３の表裏面での密度
の差を打ち消すように、逆の密度で銅箔９を表裏面に設
けたので、絶縁基板２と回路パターン３との熱膨張率、
収縮率の差により回路基板部５が反ろうとする力にたい
して、捨て基板部６により逆の方向に抵抗し、全体とし
てプリント基板１に反りが生じない。In the printed circuit board 1 of this embodiment, copper foils 9 are provided on the front and back surfaces of the waste board portion 6 in opposite densities so as to cancel the difference in density between the front and back surfaces of the circuit pattern 3 of the circuit board portion 5. Therefore, the coefficient of thermal expansion between the insulating substrate 2 and the circuit pattern 3,
The printed circuit board 1 is not warped as a whole by resisting the force of the circuit board portion 5 warping due to the difference in contraction rate in the opposite direction by the discarding board portion 6.
【００１４】しかも、回路基板部５のみならず捨て基板
部６の表裏面にも樹脂被膜１０が施されているので、上
記のプリント基板１の反りに対して、この樹脂被膜８，
１０が抵抗し、反りをほとんどなくすことができる。さ
らにこれによって、プリント基板１に樹脂被膜、導電塗
料による回路やスルーホールを形成する際の加熱乾燥に
よる絶縁基板の収縮に対しても、樹脂被膜８，１０が抵
抗して反りを防止する。さらに、電子素子を取り付ける
際のフローソルダー等による熱膨張及び収縮に対しても
全くプリント基板１には反りが生じない。Moreover, since the resin coating film 10 is applied not only to the circuit board portion 5 but also to the front and back surfaces of the discarding substrate portion 6, the resin coating film 8 against the warp of the printed circuit board 1 described above,
10 resists, and the warp can be almost eliminated. Further, as a result, the resin coatings 8 and 10 also resist warping against shrinkage of the insulating substrate due to heat drying when forming a resin coating, a circuit made of conductive paint, or a through hole on the printed circuit board 1. Further, the printed circuit board 1 does not warp at all even when it is subjected to thermal expansion and contraction due to a flow solder or the like when mounting an electronic element.
【００１５】また、絶縁基板２の空スペースには透孔１
１が形成され、絶縁基板２に熱応力が生じた際にも部分
的にその応力が分散または開放され反りを確実に防止し
ている。Further, the through hole 1 is provided in the empty space of the insulating substrate 2.
1 is formed, and even when a thermal stress is generated in the insulating substrate 2, the stress is partially dispersed or released and the warp is surely prevented.
【００１６】この発明のプリント基板は、捨て基板部の
片面だけに導体層を形成し、その上にさらに樹脂被膜を
施したものでも良い。この場合、回路基板部の回路パタ
ーンと同じ側の捨て基板部の表面に導体層を設け、さら
に回路基板部と捨て基板部の両面に樹脂被膜を施す。こ
れによっても加熱による絶縁基板の収縮を防止すること
ができ、プリント基板の反りをなくすことができる。The printed circuit board of the present invention may be one in which a conductor layer is formed only on one surface of the discarded board portion, and a resin coating is further applied thereon. In this case, a conductor layer is provided on the surface of the waste board portion on the same side as the circuit pattern of the circuit board portion, and a resin coating is further applied to both surfaces of the circuit board portion and the waste substrate portion. This also makes it possible to prevent the insulating substrate from shrinking due to heating and eliminate the warp of the printed circuit board.
【００１７】尚、この発明のプリント基板の捨て基板部
の導体層の形は方形以外に丸や菱形等適宜選択できるも
のである。さらに、樹脂被膜も、熱硬化性樹脂、紫外線
硬化性樹脂等適宜選定し得ることは言うまでもない。ま
た、透孔の形状も任意に設定可能である。The shape of the conductor layer of the waste board portion of the printed board of the present invention can be appropriately selected from circles, diamonds, etc. other than square. Further, it goes without saying that a thermosetting resin, an ultraviolet curable resin, or the like can be appropriately selected for the resin coating. Further, the shape of the through hole can be set arbitrarily.
【００１８】また、電子素子は絶縁基板の両側に設けら
れていても良く、回路パターンの回路は導箔の外、導電
塗料による回路パターンがさらに形成されていても良
い。Further, the electronic element may be provided on both sides of the insulating substrate, and the circuit of the circuit pattern may be formed by forming a circuit pattern of conductive paint on the outside of the conductive foil.
【００１９】[0019]
【発明の効果】この発明は、プリント基板の回路基板部
と捨て基板部に、回路パターン及び導体層を形成すると
共に、回路パターンの空きスペースに透孔を形成したの
で、回路基板の内部応力が分散され、熱がかかる工程で
のプリント基板の反りを有効に防止することができる。
また、樹脂被膜を施すことにより、プリント基板に導電
樹脂塗料を塗布したり被膜を形成したりする際の乾燥加
熱に対しても、樹脂被膜が絶縁基板の収縮に対して抵抗
し、反りを防止する。特に捨て基板部の表面にも樹脂被
膜を設けたので、回路基板部の反り及びねじれに対して
も有効にこれを防止する。従って、後の工程で電子素子
の自動装着も容易となり、チップ部品等が反りによって
外れたり、印刷抵抗等が導通不良を生じたり電気的特性
が変化したりすることがなくなる。According to the present invention, since the circuit pattern and the conductor layer are formed on the circuit board portion and the discarded board portion of the printed circuit board and the through holes are formed in the empty space of the circuit pattern, the internal stress of the circuit board is reduced. It is possible to effectively prevent warpage of the printed circuit board in the process of being dispersed and applying heat.
In addition, by applying a resin film, the resin film resists shrinkage of the insulating substrate and prevents warpage even when it is dried and heated when applying conductive resin paint to the printed circuit board or forming a film. To do. In particular, since the resin coating is also provided on the surface of the discarded board portion, it is possible to effectively prevent the warp and twist of the circuit board portion. Therefore, it becomes easy to automatically mount the electronic element in a later step, and the chip component and the like are prevented from coming off, the printing resistor and the like are not electrically connected, and the electrical characteristics are not changed.
【図１】この発明のプリント基板の一実施例の断面図で
ある。FIG. 1 is a sectional view of an embodiment of a printed circuit board of the present invention.
【図２】この実施例の部分破断平面図である。FIG. 2 is a partially cutaway plan view of this embodiment.
１ プリント基板 ２ 絶縁基板 ３ 回路パターン ４ ミシン目 ５ 回路基板部 ６ 捨て基板部 ８，１０ 樹脂被膜 ９ 銅箔 １１ 透孔 1 Printed Circuit Board 2 Insulating Board 3 Circuit Pattern 4 Perforation 5 Circuit Board Section 6 Discarded Board Section 8, 10 Resin Coating 9 Copper Foil 11 Through Hole
フロントページの続き (72)発明者 山藤 秀一 富山県上新川郡大沢野町下大久保3158番地 北陸電気工業株式会社内Front page continuation (72) Inventor Shuichi Yamato 3158 Shimookubo, Osawano-cho, Kamishinagawa-gun, Toyama Prefecture Hokuriku Electric Industry Co., Ltd.
Claims (2)
回路パターンを形成した回路基板部と、回路基板部以外
の捨て基板部とを有し、回路パターン形成面と同じ側の
捨て基板の面に導体層を形成し、上記回路基板の回路パ
ターン形成部分以外に透孔が形成され、回路基板部の回
路パターン及び捨て基板部の導体層を被って樹脂被膜を
設けたプリント基板。1. A surface of a waste substrate on the same side as the circuit pattern forming surface, which has a circuit board portion having a predetermined circuit pattern formed on at least one surface of an insulating substrate and a waste substrate portion other than the circuit board portion. A printed circuit board, wherein a conductor layer is formed on the circuit board, a through hole is formed in a portion other than the circuit pattern forming portion of the circuit board, and a resin film is provided so as to cover the circuit pattern of the circuit board portion and the conductor layer of the discarded substrate portion.
捨て基板の導体層に沿って形成されたものせある請求項
１記載のプリント基板。2. The printed circuit board according to claim 1, wherein the through hole is formed along the circuit pattern or along the conductor layer of the discarded substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6192770A JP2612844B2 (en) | 1994-07-25 | 1994-07-25 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6192770A JP2612844B2 (en) | 1994-07-25 | 1994-07-25 | Printed board |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63127799A Division JPH0716086B2 (en) | 1988-05-24 | 1988-05-24 | Printed board |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8286179A Division JP2761871B2 (en) | 1996-10-07 | 1996-10-07 | Printed board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0750458A true JPH0750458A (en) | 1995-02-21 |
| JP2612844B2 JP2612844B2 (en) | 1997-05-21 |
Family
ID=16296745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6192770A Expired - Lifetime JP2612844B2 (en) | 1994-07-25 | 1994-07-25 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2612844B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7863662B2 (en) | 2005-12-22 | 2011-01-04 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
-
1994
- 1994-07-25 JP JP6192770A patent/JP2612844B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01296690A (en) * | 1988-05-24 | 1989-11-30 | Hokuriku Electric Ind Co Ltd | Printed board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7863662B2 (en) | 2005-12-22 | 2011-01-04 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
| US8304321B2 (en) | 2005-12-22 | 2012-11-06 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
| US8350306B2 (en) | 2005-12-22 | 2013-01-08 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
| US8697534B2 (en) | 2005-12-22 | 2014-04-15 | Ngk Spark Plug Co., Ltd. | Capacitor to be incorporated in wiring substrate, method for manufacturing the capacitor, and wiring substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2612844B2 (en) | 1997-05-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6599617B2 (en) | Adhesion strength between conductive paste and lands of printed wiring board, and manufacturing method thereof | |
| CA1138087A (en) | Electrical circuit apparatus and method for making same | |
| JP2761871B2 (en) | Printed board | |
| JPH0716086B2 (en) | Printed board | |
| JPH0750458A (en) | Printed board | |
| JP2586745B2 (en) | Manufacturing method of printed wiring board | |
| JPH0923052A (en) | Manufacture of bendable flexible printed wiring board | |
| JPH08228066A (en) | Electronic-part loading substrate and manufacture thereof | |
| JP3340752B2 (en) | Manufacturing method of flexible printed wiring board | |
| JPH0223005Y2 (en) | ||
| JP3304220B2 (en) | Dividable printed circuit board | |
| KR950001266B1 (en) | Method of manufacturing aluminum circuit board | |
| JPH11274720A (en) | Manufacture of multilayer-laminated board | |
| JPH04328894A (en) | Printed wiring board | |
| JP2002171065A (en) | Manufacturing method for multi-layered printed wiring board | |
| JP3855303B2 (en) | Method for manufacturing printed wiring board | |
| JPS62189796A (en) | Manufacture of multilayer printed wiring board | |
| JPH09181453A (en) | Multilayer wiring board and its manufacturing method | |
| JPH0410753B2 (en) | ||
| JP3774932B2 (en) | Method for manufacturing printed wiring board | |
| JP3794064B2 (en) | Printed wiring board and manufacturing method thereof | |
| JP3752728B2 (en) | Printed circuit board manufacturing method and printed circuit board | |
| JP2002231756A (en) | Mounting structure for chip component | |
| JPH03283484A (en) | Large current circuit board | |
| JP2891938B2 (en) | How to connect electrical components |