JPH0748334Y2 - Electronic parts lead wire cutting device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial field of use] The present invention relates to a device for cutting lead wires of electronic components such as a hybrid integrated circuit device, and particularly for cutting two lines of lead wires provided in the electronic components. The present invention relates to an electronic component lead wire cutting device.

[Prior Art] In a hybrid integrated circuit device, as shown in FIG. 3, electrodes are arranged on both sides or one side of an edge of a substrate c, and a large number of pin-shaped lead wires b are fixed thereto. The lead wire b is a comb-teeth shape integrally fixed at a predetermined pitch via the lead frame d, and after the lead wire b is fixed to the substrate c, the lead wire b side of the lead frame b is cut, Separate into individual lead wires b.

In the case of cutting the lead wire d, conventionally, as shown in FIG.
A device as shown in the figure was used.

The apparatus of FIG. 3 straddles the rod-shaped receiving blade 1 having a rectangular cross section, attaches a lead wire b to both sides thereof, and inserts a cutting blade 2 having a linear blade tip directly below the receiving blade 1. It is a device for shearing the lead wire b between the cutting blade 2 and the receiving blade 1.
In FIG. 3, reference numeral 4 denotes a fixed blade behind the receiving blade 1 which receives a cutting force applied to the receiving blade 1.

Further, in the device of FIG. 4, only the tip side of the lead wire b is attached to the receiving blade 1, and the rotating disc-shaped cutting blade 2 is applied to the portion near the base end of the portion attached to the receiving blade 1. Is a device for cutting the lead wire b at a position directly above the receiving blade 1.

[Problems to be Solved by the Invention] In any of the above devices, when the cutting blade 2 hits the lead wire b, the lead wire b is bent at the lower side or the upper side of the receiving blade 1 (see the chain double-dashed line in FIG. 4). ), The tip of the lead wire b is bent or is cut obliquely.

In particular, in the case of FIG. 3, the cutting blade 2 hits the lead wire b,
Until the lead wire b is cut, the receiving blade 1 is pushed up and bent as shown by the chain double-dashed line. Therefore, especially, the central portion of the lead wire b is separated from the cutting blade 2 and becomes difficult to be cut, and an irregular cutting portion is formed.

In the case of FIG. 4, the cutting blade 2 hits the lead wire b,
Since the lead wire b is pushed inward until the lead wire b is cut, the distance between the tips of the two rows of lead wires b is displaced. Therefore, when the hybrid integrated circuit is mounted on a printed wiring board or the like, the position of the tip of the lead wire b does not match the position defined on the board.

An object of the present invention is to solve the above problems in the conventional lead wire cutting device.

[Means for Solving the Problem] The structure of the present invention will be described with reference to the reference numerals shown in FIG. 1 and FIG.
12 and the lead wire b of the electronic circuit device a
The blade 11 having a receiving blade 11 for receiving a cutting force of 12 has a width corresponding to the interval between the rows of the two lead wires b of the electronic circuit device a. A groove 13 which is long in the arrangement direction of the lead wire b and which intersects with the middle portion of the lead wire b to be cut is formed in a portion of the cutting blade 12 on both sides to which the b is attached and which contacts the cutting edge.

[Operation] Since the groove 13 is formed along the direction in which the lead wires b are arranged, the lead wires b are attached to the receiving blade 11 so as to cross over them. In this state, the cutting blade 12
Since the blade edge is cut, both sides of the cut portion of the lead wire b are supported by the receiving blade 11 at short intervals. Therefore, unlike the case where only one side of the cutting portion is supported, the force associated with the cutting of the cutting blade b can be received without the lead wire b being greatly deformed.

Further, since the receiving blade 11 can provide sufficient rigidity by integrating the upper and lower sides of the groove 13, only the upper part or the lower part of the groove 13 receives the cutting force of the cutting blade b and escapes. There is no such thing.

Further, the receiving blade 11 has a width corresponding to the interval between the two rows of the lead wires b of the electronic circuit device a, and the groove 13 as described above is formed on both surfaces of the receiving blade 11, so that By attaching the circuit device a to the receiving blade 11 only once, the lead wires b in two rows can be cut.

[Embodiment] Next, an embodiment of the present invention will be described with reference to FIGS. 1 and 2.

FIG. 1 shows, as the electronic component a, a hybrid integrated circuit device in which an electronic circuit is formed on an insulating substrate c and electronic components such as a semiconductor IC are mounted. The base end of the lead wire b is fixed to both sides of the substrate c near one side, and the tip end side of the lead wire b is integrally fixed to the lead frame d.

The receiving blade 11 has a width corresponding to the distance between the two rows of the lead wires b fixed to both sides of the substrate c, and as shown in FIG.
This is passed between the two rows of lead wires b of the electronic component a. As a result, the lead wire b of the electronic component a is attached to both sides of the receiving blade 11 so as to straddle it.

A groove 13 is formed on a side surface of the receiving blade 11 at a position where a cutting blade 12 described later abuts. The groove 13 is elongated along the longitudinal direction of the receiving blade 11, and the lead wires b attached to the side surfaces of the receiving blade 11 are arranged in the longitudinal direction of the groove 13 and each lead wire b is It contacts the side surface of the receiving blade 11 while crossing the groove 13. The grooves 13 are arranged on both sides of the receiving blade 11 so as to be offset from each other in the longitudinal direction.

Disc-shaped cutting blades 12 are arranged on both sides of the receiving blade 11, and in the illustrated embodiment, the cutting blades 12 are arranged in the longitudinal direction on both sides of the receiving blade 11 in correspondence with the position of the groove 13. Has been done. The cutting blade 12 moves in a direction (right and left in FIG. 2) perpendicular to the side surface of the receiving blade 11 while rotating about an axis 14 parallel to the side surface of the receiving blade 11, and inside the groove 13. The cutting edge cuts into. When the cutting blade 12 is cut into the groove 13 of the receiving blade 11, the groove 13 of the receiving blade 11 is relatively positioned with respect to the receiving blade 11 and the electronic component a.
Along the longitudinal direction (front and rear in FIG. 2).

As is apparent from the above configuration, in the above device, the cutting blade 12 is provided with the lead wire b of the electronic component a attached to the side surface of the receiving blade 11.
By cutting the blade edge of the above into the groove 13 of the receiving blade 11, the lead wire b at that portion is cut.

In addition, although the rotating disk-shaped blade is shown as the cutting blade 12 in the above-described embodiment, a flat blade that performs only reciprocating motion can be used, and in this case, the cutting edge of the cutting blade 12 is longer than the length of the groove 13. Of course, the length is shortened so that the cutting edge can cut into the groove 13. Further, the cutting blades 12 may not be arranged alternately on both sides of the receiving blade 11, but may be arranged opposite to each other on both sides.

As described above, the device of the present invention is effective for cutting the lead wire b of the hybrid integrated circuit device in which a large number of lead wires b are arranged, but it has, for example, two or one lead wire b. The same can be applied to a case where electronic components are arranged at regular intervals and these lead wires are simultaneously cut.

[Effects of the Invention] As described above, according to the present invention, the lead wire b can be supported in a stable state and can be cut by the cutting blade 12, and a cutting portion in a constant state can be obtained. It is possible to improve the cutting quality of the wire. Furthermore, since the lead wires b attached to the device a in two rows can be cut by only once attaching the electronic circuit device a to the receiving blade 11, the work of cutting the lead wires b can be easily performed.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention, FIG. 2 is a front view in which the receiving blade of the embodiment is vertically cut, and FIGS. 3 and 4 are perspective views showing a conventional example of a lead wire cutting device. It is a front view which cut | disconnected the receiving blade longitudinally. 11: Receiving blade, 12: Cutting blade, 13: Groove, a: Electronic component, b: Lead wire

Claims (1)

[Scope of utility model registration request] 1. An electronic component lead having a cutting blade (12) and a receiving blade (11) attached with a lead wire (b) of an electronic circuit device (a) and receiving a cutting force of the cutting blade (12). In the wire cutting device, the blade (11) has a width corresponding to the interval between the two rows of lead wires (b) of the electronic circuit device (a).
Cutting blade (1) on both sides to which the lead wire (b) of 1) is attached
A groove (13) which is long in the arrangement direction of the lead wire (b) and which intersects the middle portion of the lead wire (b) to be cut is formed in the portion where the cutting edge of 2) hits. Electronic device lead wire cutting device.