JPH0745919Y2 - Electronic device housing structure - Google Patents

Electronic device housing structure

Info

Publication number
JPH0745919Y2
JPH0745919Y2 JP1988128613U JP12861388U JPH0745919Y2 JP H0745919 Y2 JPH0745919 Y2 JP H0745919Y2 JP 1988128613 U JP1988128613 U JP 1988128613U JP 12861388 U JP12861388 U JP 12861388U JP H0745919 Y2 JPH0745919 Y2 JP H0745919Y2
Authority
JP
Japan
Prior art keywords
frame
housing
conductive
ground plane
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988128613U
Other languages
Japanese (ja)
Other versions
JPH0249099U (en
Inventor
由人 池田
彰一 三ツ木
草平 天野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Jeco Corp
Original Assignee
Seiko Epson Corp
Jeco Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, Jeco Corp filed Critical Seiko Epson Corp
Priority to JP1988128613U priority Critical patent/JPH0745919Y2/en
Publication of JPH0249099U publication Critical patent/JPH0249099U/ja
Application granted granted Critical
Publication of JPH0745919Y2 publication Critical patent/JPH0745919Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Elimination Of Static Electricity (AREA)
  • Accessory Devices And Overall Control Thereof (AREA)
  • Casings For Electric Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Description

【考案の詳細な説明】 (産業上の利用分野) 本考案は、マイクロコンピュータや記憶素子を内蔵した
電子装置に適した筐体の構造に関する。
DETAILED DESCRIPTION OF THE INVENTION (Industrial field of application) The present invention relates to a structure of a housing suitable for an electronic device including a microcomputer and a storage element.

(従来技術) 例えば、プリンタにあっては、印刷用紙を搬送しながら
印字を実行する印字機構と、外部装置から入力した信号
を解析して印字機構を制御するマイクロコンピュータや
記憶素子からなる制御回路を1つの筐体に内蔵させて構
成されている。
(Prior Art) For example, in a printer, a control circuit including a printing mechanism that executes printing while conveying a print sheet, a microcomputer that analyzes a signal input from an external device and controls the printing mechanism, and a storage element Is built in one housing.

このため、印刷用紙の搬送時に生じる摩擦により静電気
が発生して、これが制御回路に回り込んで誤動作を起こ
すという問題があり、通常、印字機構をアースに接続し
て静電気を速やかに逃す対策が採られている。
Therefore, there is a problem in that static electricity is generated due to the friction generated when the printing paper is conveyed, and this static electricity gets around to the control circuit and causes a malfunction.Usually, measures are taken to quickly discharge the static electricity by connecting the printing mechanism to the ground. Has been.

(解決すべき課題) 印刷機構と制御回路は電気的に離れているため、第4図
に示したように、印刷機構が組み付けられているフレー
ムAとシールドをなす地板Bの間を導電材料製の螺子C
やワイヤ等により接続することが行われているが、螺子
止作業やワイヤの接続の作業を要するという問題があ
る。
(Problems to be solved) Since the printing mechanism and the control circuit are electrically separated from each other, as shown in FIG. 4, a conductive material is used between the frame A on which the printing mechanism is assembled and the main plate B forming the shield. Screw C
However, there is a problem that screwing work and wire connection work are required.

本発明はこのような問題に鑑みてなされたものであっ
て、その目的とするところは特別な接続を要することな
く、機械装置部と電子回路部とのアース接続を行うこと
ができる筐体構造を提供することである。
The present invention has been made in view of such a problem, and the object thereof is a casing structure capable of performing a ground connection between a mechanical device section and an electronic circuit section without requiring a special connection. Is to provide.

(課題を解決するための手段) このような問題を解決するために本考案においては、少
なくとも一端が片持梁状となるように筐体の底部に組み
込まれた導電性地板と、導電性材料により構成され、前
記筐体に組み込まれたときに前記導電性地板の片持梁状
部に当接して前記片持梁部を弾性変形させる長さの脚部
を備えた、機械系を組み付けるフレーム部材とを備える
ようにした。
(Means for Solving the Problem) In order to solve such a problem, in the present invention, a conductive base plate incorporated in the bottom of a housing so that at least one end is cantilevered, and a conductive material. And a frame for assembling a mechanical system, the leg having a length that abuts on the cantilever portion of the conductive ground plate to elastically deform the cantilever portion when assembled in the housing. And a member.

(作用) フレームを筐体に組込むだけで脚部がアースとしての地
板に弾性的に接触して導電経路を構成するから、ワイヤ
接続が不要となる。
(Operation) Since the legs are elastically contacted with the ground plate serving as the ground to form the conductive path only by incorporating the frame into the housing, wire connection is not required.

(実施例) そこで以下に、本考案の詳細を図示した実施例に基づい
て説明する。
(Embodiment) Therefore, the details of the present invention will be described below based on the illustrated embodiment.

第1図は、本考案の位置実施例を示すものであって、図
中符号1はプラテンDやキャリッジE等の印字機構を組
み付けるための、金属材料により形成されたフレーム
で、下部には筐体2にセットしたとき後述する地板3に
当接する程度の長さLを有する導電性の脚部4、4、4
(第2図)を一体的に形成して構成されている。
FIG. 1 shows a position embodiment of the present invention. In the figure, reference numeral 1 is a frame made of a metal material for assembling a printing mechanism such as a platen D and a carriage E. The conductive legs 4, 4, 4 having a length L enough to abut a ground plate 3 described later when set on the body 2.
(FIG. 2) is integrally formed.

3は、前述の地板で、マイクロコンピュータや記憶素子
等の集積回路素子を実装した回路基板Fのシールド板を
兼ねており、回路基板Fと筐体2の底部との間に配設さ
れ、フレーム1の脚部先端が位置する箇所は弾性変形が
可能となるように筐体の底面2aから浮いた状態、つまり
片持梁状となるように支持されている。なお、図中符号
5は脚部4の先端を地板3まで通過させるために回路基
板Fに穿設した通孔を示す。
Reference numeral 3 denotes the above-mentioned base plate, which also serves as a shield plate of the circuit board F on which integrated circuit elements such as a microcomputer and a memory element are mounted, and is arranged between the circuit board F and the bottom of the housing 2 to form a frame. The position where the tip of the leg portion 1 is located is supported in a state of floating from the bottom surface 2a of the housing, that is, in a cantilever shape so as to be elastically deformable. Reference numeral 5 in the drawing denotes a through hole formed in the circuit board F so that the tip of the leg portion 4 can pass to the main plate 3.

この実施例において、筐体底部に地板3を配設固定し、
これの上に回路基板Fを積層する。この状態で、予め必
要な機構を組み付けたフレーム1を所定の位置に載置す
ると、複数の脚部4,4,4…の先端は、それぞれ地板3を
下方に弾性変形させた状態で接触する。これによりフレ
ーム1と地板3との間に導電関係が形成され、この状態
で、フレーム1を筐体2に螺子G等により固定すれば、
特別な配線作業を必要とする事なくフレーム1をアース
することになる。
In this embodiment, the main plate 3 is arranged and fixed on the bottom of the housing,
The circuit board F is laminated on this. In this state, when the frame 1 to which the necessary mechanism is assembled is placed at a predetermined position, the tips of the plurality of leg portions 4, 4, 4, ... Contact with the base plate 3 elastically deformed downward. . As a result, a conductive relationship is formed between the frame 1 and the main plate 3, and in this state, if the frame 1 is fixed to the housing 2 with the screw G or the like,
The frame 1 will be grounded without requiring any special wiring work.

このようにして構成された装置にあっては、印刷機構に
発生した静電気は、最寄の各脚部4,4,4…から最短距離
でもって地板3に逃されることになり、静電気による電
気回路部の誤動作を確実に防止する事ができる。
In the device configured as described above, static electricity generated in the printing mechanism is released to the main plate 3 with the shortest distance from the nearest legs 4, 4, 4, ... It is possible to reliably prevent malfunction of the circuit section.

第3図は、フレームの第2実施例を示すもので、フレー
ム本体7の下部に一体的に形成された脚部8の先端8aを
山形に形成したもので、この実施例によれば地板との導
電的接触をより一層良好にすることができる。
FIG. 3 shows a second embodiment of the frame, in which the tips 8a of the legs 8 integrally formed on the lower portion of the frame body 7 are formed in a mountain shape. Can be made even better.

なお、この実施例においてはプリンタに例を採って説明
したが、ファクシミリや電子複写機、光デスク装置等の
ように機械部と電子回路部を1つの筐体に内蔵する装置
に適用することにより同様の作用を奏することは明らか
である。
Although the printer has been described as an example in this embodiment, it can be applied to a device such as a facsimile, an electronic copying machine, an optical desk device, etc., in which a mechanical section and an electronic circuit section are built in one housing. It is clear that the same effect is achieved.

また、この実施例においては地板を下方に変形させてい
るが、第3図に示したように、地板9の脚部8との当接
部近傍を上方に変形させて、脚部8との当接により下方
に弾性変形させるようにしても同様の作用を奏すること
は明らかである。
Further, in this embodiment, the base plate is deformed downward, but as shown in FIG. 3, the vicinity of the contact portion of the base plate 9 with the leg portion 8 is deformed upward so that the base plate 9 is deformed. It is clear that the same effect can be obtained even if the elastic deformation is made downward by the contact.

(効果) 以上説明したように本考案においては、少なくとも一端
が片持梁状となるように筐体の底部に組み込まれた導電
性地板と、導電性材料により構成され、筐体に組み込ま
れたときに導電性地板の片持梁状部に当接して片持梁部
を弾性変形させる長さの脚部を備えた、機械系を組み付
けるフレーム部材とを備えたので、各部材に取付け孔の
加工や、導電部材の取付けを必要とすることなく、フレ
ームを筐体にセットするだけでフレームと地板とを導電
接続することができる。
(Effect) As described above, in the present invention, a conductive ground plane that is built into the bottom of the housing so that at least one end is cantilevered, and a conductive material that is built into the housing Since it is provided with a frame member for assembling a mechanical system, which is provided with a leg portion of a length that sometimes abuts the cantilever portion of the conductive ground plate and elastically deforms the cantilever portion, each member has a mounting hole. The frame and the ground plane can be conductively connected by simply setting the frame in the housing without the need for processing or mounting of the conductive member.

【図面の簡単な説明】[Brief description of drawings]

第1図は本考案の一実施例を示す装置の断面図、第2図
は本考案のフレームの一実施例を示す底部図、第3図は
本考案の他の実施例を示すフレームの正面図、及び第4
図は従来のアース接続の一例を示す断面図である。 1……フレーム、2……筐体 3……地板、4,4,4……脚部 F……回路基板
FIG. 1 is a sectional view of an apparatus showing an embodiment of the present invention, FIG. 2 is a bottom view showing an embodiment of a frame of the present invention, and FIG. 3 is a front view of a frame showing another embodiment of the present invention. Figure, and the fourth
The figure is a sectional view showing an example of a conventional ground connection. 1 ... frame, 2 ... housing 3 ... ground plate, 4,4,4 ... legs F ... circuit board

───────────────────────────────────────────────────── フロントページの続き (72)考案者 天野 草平 埼玉県行田市富士見町1丁目4番地1 ジ ェコー株式会社内 (56)参考文献 特開 昭60−35423(JP,A) 実開 昭57−46705(JP,U) ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor, Kushira, Amano 1-4-4, Fujimi-cho, Gyoda-shi, Saitama Prefecture Within GEKO Co., Ltd. (56) References JP-A-60-35423 (JP, A) -46705 (JP, U)

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】少なくとも一端が片持梁状となるように筐
体の底部に組み込まれた導電性地板と、導電性材料によ
り構成され、前記筐体に組み込まれたときに前記導電性
地板の片持梁状部に当接して前記片持梁部を弾性変形さ
せる長さの脚部を備えた、機械系を組み付けるフレーム
部材とからなる電子装置の筐体構造。
1. A conductive ground plane incorporated in the bottom of a casing so that at least one end is cantilevered, and a conductive ground plane made of a conductive material, the conductive ground plane of the conductive ground plane when assembled in the casing. A casing structure for an electronic device, comprising: a frame member for assembling a mechanical system, the leg member having a length that abuts on the cantilever portion to elastically deform the cantilever portion.
JP1988128613U 1988-09-29 1988-09-29 Electronic device housing structure Expired - Lifetime JPH0745919Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988128613U JPH0745919Y2 (en) 1988-09-29 1988-09-29 Electronic device housing structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988128613U JPH0745919Y2 (en) 1988-09-29 1988-09-29 Electronic device housing structure

Publications (2)

Publication Number Publication Date
JPH0249099U JPH0249099U (en) 1990-04-05
JPH0745919Y2 true JPH0745919Y2 (en) 1995-10-18

Family

ID=31382117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988128613U Expired - Lifetime JPH0745919Y2 (en) 1988-09-29 1988-09-29 Electronic device housing structure

Country Status (1)

Country Link
JP (1) JPH0745919Y2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4748899B2 (en) * 2001-09-04 2011-08-17 株式会社三共 Game machine
JP4748902B2 (en) * 2001-09-10 2011-08-17 株式会社三共 Game machine
JP4748903B2 (en) * 2001-09-12 2011-08-17 株式会社三共 Game machine

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58173037U (en) * 1982-05-12 1983-11-18 株式会社日立製作所 Anti-static device for tape recorder operating section
JPS5931799U (en) * 1982-08-24 1984-02-28 松下電器産業株式会社 Static electricity eliminator for electronic equipment
JPS6035423A (en) * 1984-06-07 1985-02-23 松下電器産業株式会社 High frequency heater

Also Published As

Publication number Publication date
JPH0249099U (en) 1990-04-05

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